市場調查報告書

半導體包裝市場 - 成長,趨勢,預測

Semiconductor Packaging Market - Growth, Trends, and Forecast (2020 - 2025)

出版商 Mordor Intelligence LLP 商品編碼 394608
出版日期 內容資訊 英文 128 Pages
商品交期: 2-3個工作天內
價格
半導體包裝市場 - 成長,趨勢,預測 Semiconductor Packaging Market - Growth, Trends, and Forecast (2020 - 2025)
出版日期: 2020年01月01日內容資訊: 英文 128 Pages
簡介

全球半導體包裝市場規模在2019年估算為282億美元,到2025年前預計將達到444億4000萬美元。

物聯網和人工智能的出現以及先進電子產品的普及正在推動整個消費電子產品和汽車行業的高端應用。為了解決需求的擴大,最新的半導體封裝技術的採用率不斷提升。

本報告提供全球半導體包裝市場相關調查分析,提供市場概要,市場動態,市場區隔,各地區的市場分析,競爭情形,主要企業等相關的系統性資訊。

目錄

第1章 簡介

  • 調查成果
  • 調查的前提條件
  • 市場定義

第2章 調查手法

第3章 摘要整理

第4章 市場動態

  • 市場概要
  • 市場推動要素與法規的簡介
  • 市場成長要素
  • 市場阻礙因素
  • 產業的魅力-波特的五力分析
    • 供應商談判力
    • 買主/消費者談判力
    • 新加入廠商的威脅
    • 替代產品的威脅
    • 競爭加劇
  • 價值鏈分析

第5章 市場細分化

  • 包裝各平台
    • 覆晶
    • 埋入晶粒
    • FI-WLP (Fan In Wafer Level Package)
    • FO-WLP (Fan Out Wafer Level Package)
  • 各終端用戶產業
    • 家電
    • 航太及防衛
    • 醫療設備
    • 通訊·電信
    • 汽車產業
    • 能源和照明
  • 各地區
    • 北美
    • 歐洲
    • 亞太地區
    • 南美
    • 中東·非洲地區

第6章 競爭情形

  • 企業簡介
    • ASE Group
    • Amkor Technology
    • Jcet/Stats Chippac Ltd.
    • Siliconware Precision Industries Co. Ltd. (Spil)
    • Powertech Technology, Inc.
    • Tianshui Huatian Technology Co. Ltd.
    • Fujitsu Ltd.
    • UTAC Group
    • Chipmos Technologies, Inc.
    • Chipbond Technology Corporation
    • Intel Corporation
    • Samsung Electronics Co. Ltd.
    • Unisem (M) Berhad
    • Interconnect Systems, Inc. (ISI)
    • Carsem

第7章 投資分析

第8章 市場機會及未來趨勢

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目錄
Product Code: 49165

Market Overview

The global semiconductor packaging market was valued at USD 28.2 billion in 2019 and is expected to be worth USD 44.44 billion by 2025, recording a CAGR of 7.96% over the forecast period (2020-2025). Owing to the growing demand across various end-user verticals of the packaging industry, the industry has witnessed a continuous transformation in terms of characteristics, integration, and energy efficiency of the product. Since packaging is in the early stage in the electronics value chain, the growth of the market studied is directly impacted by the growth of the semiconductor market.

  • The advent of IoT and artificial intelligence (AI) and the proliferation of sophisticated electronics are factors driving the high-end application segment across the consumer electronics and automotive industries that have increased the rate of adoption of the latest semiconductor packaging technologies, to meet the growing demand.
  • Semiconductor packaging technology has evolved to minimize the costs involved and enhance the overall efficacy of ICs. Vendors in the market are under constant pressure to deliver innovative solutions in terms of the size of the packaging, performance, and the "time-to-market" aspect.
  • Also, the emergence of 2.5D and 3D packaging mechanism, as of mid-2010, has made semiconductor manufacturers extend their flip-chip and wafer-level capabilities, owing to their enhanced functionality.

Scope of the Report

Semiconductor packaging is a casing containing one or more discrete semiconductor devices or integrated circuits made up metal, plastic, glass, or ceramic casing. Packaging must protect an electronic system from cooling, radio frequency noise emission, mechanical damage, and electrostatic discharge.

Key Market Trends

High Adoption Rate in Consumer Electronics Segment to Augment the Market Growth

  • The electronics market constantly demands higher power dissipation, faster speeds, and higher pin counts, along with smaller footprints and lower profiles. The miniaturization and integration of semiconductors have given rise to smaller, lighter, and more portable devices, like tablets, smartphones, and the emerging IoT devices.
  • Each new iteration of consumer electronics products is smarter, lighter, and more energy efficient than its predecessors. This advantage creates huge expectations among customers for the next iteration, which is a significant selling point for the producers of consumer electronics.
  • In addition to this, smartphones are one of the most significant contributors to semiconductor consumption in the consumer electronics segment. In recent years, the United States has witnessed consistent growth in smartphone sales. With this trend likely to continue, it is poised to drive the semiconductor demand, in turn, augmenting the packaging market growth.

North America Expected to Hold a Significant Share

  • Countries in the region, such as the United States lead the world in manufacturing, design, and research in the semiconductor industry. The United States is also the frontrunner in semiconductor packaging innovation, boasting of 80 wafer fabrication plants spread across 19 states. Apart from this, investments in the country by major players are set to fuel the semiconductor packaging market.
  • For instance, Intel Corporation in 2017 had planned to invest more than USD 7 billion to complete Fab 42, a semiconductor factory, which is expected to be ready in 3-4 years.
  • Apart from this, the United States is home to some of the major automotive players in the world, which are investing in the electric car segment. This is set to augment the demand for semiconductors in the automotive industry significantly. In turn, it is driving the semiconductor packaging market.
  • For instance, Toyota in 2018 announced CAD 1.4 billion in two factories in central Canada where it plans to build its largest hybrid hub in North America. The government is expected to support the investment with CAD 110 million in Cambridge and Woodstock.

Competitive Landscape

The competitive landscape of the market is moderately fragmented as there are various packaging solution providers for the semiconductor market. Companies are focusing on following a different path, shifting their focus away from performance and price.

  • December 2018 - Amkor Technology, Inc., a leading provider of outsourced semiconductor assembly and test (OSAT) services, announced the extension of its MEMS and Sensor package platforms to address the growing optical market.
  • January 2018 - ASE Group began the construction of its new factory building K25. The building is scheduled to be completed in the year 2020. This was done as a part of the expansion plan.

Reasons to Purchase this report:

  • The market estimate (ME) sheet in Excel format
  • Report customization as per the client's requirements
  • 3 months of analyst support

Table of Contents

1 INTRODUCTION

  • 1.1 Study Deliverables
  • 1.2 Study Assumptions
  • 1.3 Market Definition

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

  • 4.1 Market Overview
  • 4.2 Introduction to Market Drivers and Restraints
  • 4.3 Market Drivers
    • 4.3.1 Growing Consumption of Semiconductor Devices Across Industries
    • 4.3.2 Need for Miniaturization of Semiconductor Devices
  • 4.4 Market Restraints
    • 4.4.1 High Initial Investment and Increasing Complexity of Semiconductor IC Designs
  • 4.5 Industry Attractiveness - Porter's Five Force Analysis
    • 4.5.1 Bargaining Power of Suppliers
    • 4.5.2 Bargaining Power of Buyers/Consumers
    • 4.5.3 Threat of New Entrants
    • 4.5.4 Threat of Substitute Products
    • 4.5.5 Intensity of Competitive Rivalry
  • 4.6 Value Chain Analysis

5 MARKET SEGMENTATION

  • 5.1 By Packaging Platform
    • 5.1.1 Flip Chip
    • 5.1.2 Embedded Die
    • 5.1.3 Fan-in Wafer Level Packaging (Fi Wlp)
    • 5.1.4 Fan-out Wafer Level Packaging (Fo Wlp)
  • 5.2 By End-user Industry
    • 5.2.1 Consumer Electronics
    • 5.2.2 Aerospace & Defense
    • 5.2.3 Medical Devices
    • 5.2.4 Communications & Telecom
    • 5.2.5 Automotive Industry
    • 5.2.6 Energy & Lighting
  • 5.3 Geography
    • 5.3.1 North America
    • 5.3.2 Europe
    • 5.3.3 Asia-Pacific
    • 5.3.4 Latin America
    • 5.3.5 Middle East & Africa

6 COMPETITIVE LANDSCAPE

  • 6.1 Company Profiles
    • 6.1.1 ASE Group
    • 6.1.2 Amkor Technology
    • 6.1.3 Jcet/Stats Chippac Ltd.
    • 6.1.4 Siliconware Precision Industries Co. Ltd. (Spil)
    • 6.1.5 Powertech Technology, Inc.
    • 6.1.6 Tianshui Huatian Technology Co. Ltd.
    • 6.1.7 Fujitsu Ltd.
    • 6.1.8 UTAC Group
    • 6.1.9 Chipmos Technologies, Inc.
    • 6.1.10 Chipbond Technology Corporation
    • 6.1.11 Intel Corporation
    • 6.1.12 Samsung Electronics Co. Ltd.
    • 6.1.13 Unisem (M) Berhad
    • 6.1.14 Interconnect Systems, Inc. (ISI)
    • 6.1.15 Carsem

7 INVESTMENT ANALYSIS

8 MARKET OPPORTUNITIES AND FUTURE TRENDS