電子封裝市場 - COVID-19 的增長、趨勢、影響和預測 (2023-2028)

預測期內，電子封裝市場預計將以 18.51% 的複合年增長率增長。

對電視、機頂盒、MP3 播放器和數碼相機等產品的需求不斷增長，通常會為大規模生產提供電子封裝。

主要亮點

• 醫療保健領域使用的許多設備都依賴於半導體製造技術，預計這將對電子封裝市場產生影響。 例如，2022 年 1 月，LG 電子推出了其最新的醫療保健產品 MediPain，這是一種止痛家用設備。
• 物聯網、人工智能的興起以及復雜電子產品的激增正在推動消費電子和汽車行業的高端應用領域。 這些因素正在推動採用更先進的電子封裝技術來維持需求。 此外，Amkor Technology 和三星電子合作開發了尖端的 H-Cube 解決方案。 三星電子開發了 Hybrid-Substrate，這是最現代的 2.5D 封裝解決方案，專門為需要高性能、大面積封裝技術的 HPC、AI、數據中心和網絡設備的半導體創建。宣布開發 Cube 技術。
• 此外，全球 Wi-Fi 芯片組市場正在向 802.11ac 過渡，MIMO 是第五代 Wi-Fi。 高達 1.3GHz 的長距離通信速度增加了客戶對這項技術的採用，從而推動了需求。
• 市場的最新進展包括具有極簡美學的創新包裝解決方案、新穎、獨特、生動且令人難忘的設計，推動了市場增長。我來了。 2022年1月，Smurfit Kappa集團宣布投資3300萬美元擴大其在巴西的工廠產能。 這將使該公司能夠擴大其針對消費電子產品、易腐食品和藥品的上架包裝能力。
• 汽車行業在所研究的市場中也佔很大比重，這主要是由於越來越多地採用電動汽車 (EV) 和混合動力汽車。 由於電動和混合動力汽車大量使用存儲器件、處理器、模擬電路、分立功率器件、傳感器等，預計預測期內需求將快速增長。
• 根據 IBEF 的數據，到 2025 年，印度的電動汽車 (EV) 市場預計將達到 50,000 克朗（70.9 億美元）。 此外，根據 CEEW 能源金融中心的一項研究，到 2030 年，印度將有 2060 億美元的電動汽車機會。 這些新興市場的發展將進一步推動電子封裝市場的增長。
• 全球流行病的蔓延對電子封裝解決方案和消費電子產品封裝的銷售產生了負面影響。 手機和電腦行業推動了消費電子產品包裝需求。 在大流行期間，這些行業的生產並未受到停產、原材料短缺和供應鏈中斷的顯著影響。

主要市場趨勢

航空航天和國防工業對電子封裝的採用不斷增長

• 美國、法國和英國等發達國家以及俄羅斯、印度和中國等發展中國家的國防預算都在定期增加。 其中許多國家也將重點放在武器出口上。 因此，航空航天和國防市場的研發持續投資。
• 此外，俄羅斯最近將其軍費開支增加了 2.9%，達到 659 億美元，以支持英國和英國邊境沿線的軍隊。 這是俄羅斯連續第三年增長，最近軍費開支達到 GDP 的 4.1%。
• 此外，多種類型的軍事和航空航天設備（例如數據處理設備、數據顯示系統、計算機以及飛機制導和控制組件）都包含半導體器件。 例如，根據半導體行業協會的數據，2022 年 8 月全球半導體行業收入為 474 億美元，較 2021 年 8 月微增 0.1%。
• 海軍軍艦、艦載衛星通信頻道、武器控制系統、海岸警衛隊等是許多精密電子產品的用戶，需要軍用級電子和半導體組件封裝。 潮濕和惡劣的環境需要高質量的產品並推動研發投資。
• 由於這些因素，預計電子封裝在預測期內將出現顯著增長。

亞太地區見證了顯著的市場增長

• 由於汽車基礎設施的發展和電動汽車銷量的增加，預計亞太地區在預測期內將佔據最大的市場份額。 此外，由於中等收入階層的增加和年輕人數量的增加，汽車行業的需求有可能會增加。 據IBEF稱，2022年6月乘用車、三輪車、兩輪車和四輪車的總產量為2,081,148輛，有望推動未來研究市場的增長。
• 此外，中國被認為是世界電子中心，因為它大量生產和製造符合最高質量、性能和交付標準的電氣元件和電子產品。 這賦予了電子封裝市場巨大的增長潛力。
• 區域企業也在投資安裝可實現高效電子和半導體封裝的機器。 此外，2022 年 8 月，總部位於印度泰米爾納德邦的半導體製造商 Polymatech 將在該邦投資 10 億美元，以擴建其芯片組製造和封裝設施。
• 根據國家投資促進和促進局 (NIPFA) 的數據，印度對電子產品的需求顯著增加。 由於強有力的政策支持、多方利益相關者的大規模投資以及對電子產品的需求激增，電子製造業預計到 2025 年將達到 2200 億美元。
• 內需的顯著增長、技術進步和高質量產品的生產是中國工業增長的主要驅動力。 中國紙和紙板的大規模生產為電子包裝銷售創造了健康的環境。

競爭格局

電子封裝市場是分散的。 微系統幾乎用於每個行業，其中重要的部分包括消費電子產品、醫療保健設備、航空航天和國防以及通信。 隨著電子產品集成到其中，IC 等半導體器件已成為機器不可或缺的一部分，這極大地推動了電子封裝的發展。 未來，我們可以期待大公司和初創公司之間以創新為重點的收購和合作。

2022 年 2 月，Siemens Digital Industries Software 宣布與半導體封裝巨頭 Advanced Semiconductor Engineering (ASE) 和兩家新公司合作，從事多個複雜集成電路 (IC) 封裝的組裝和互連。我們宣布將在該平台上展開合作. 2021 年 5 月，英特爾宣布投資 35 億美元升級其新墨西哥工廠，以製造先進的半導體封裝技術，例如英特爾革命性的 3D 封裝技術 Foveros。 憑藉其革命性的 3D 封裝技術 Foveros，英特爾能夠使 CPU 的計算單元垂直堆疊而不是水平堆疊，從而在更小的封裝中提供更好的性能。

其他福利。

• Excel 格式的市場預測 (ME) 表
• 三個月的分析師支持

內容

第1章介紹

• 研究假設和市場定義
• 調查範圍

第2章研究方法論

第 3 章執行摘要

第4章市場動態

• 市場概覽
• 市場驅動因素
  • 對產品和消費者安全的興趣日益濃厚
  • 通過技術進步提高產品質量
• 市場製約因素
  • 電子封裝的高成本和熟練工人短缺阻礙了市場增長
• 行業吸引力 - 波特五力分析
  • 供應商的議價能力
  • 消費者的議價能力
  • 新進入者的威脅
  • 替代品的威脅
  • 競爭公司之間的敵對關係
• 技術快照

第 5 章市場細分

• 按材料
  • 塑料
  • 金屬
  • 玻璃
  • 其他材料
• 按最終用戶行業
  • 消費類電子產品
  • 航空航天與國防
  • 汽車
  • 醫療保健
  • 其他最終用戶行業
• 區域信息
  • 北美
    • 美國
    • 加拿大
  • 歐洲
    • 英國
    • 德國
    • 法國
    • 其他歐洲
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 其他亞太地區
  • 拉丁美洲
  • 中東和非洲

第6章競爭格局

• 公司簡介
  • AMETEK Inc.
  • Dordan Manufacturing Company
  • E. I. du Pont de Nemours and Company
  • GY Packaging, Plastiform Inc.
  • Kiva Container Corporation
  • Primex Design & Fabrication
  • Quality Foam Packaging Inc.
  • Sealed Air Corporation
  • The Box Co-Op
  • UFP Technologies, Inc.

第7章 投資分析

第8章 市場將來性

The Electronic Packaging Market is expected to register a CAGR of 18.51% over the forecast period. Electronic packaging is generally more suited for mass production due to the rising demand for products such as TVs, set-top boxes, MP3 players, and digital cameras.

Key Highlights

• Many devices used in the healthcare sector depend on semiconductor manufacturing technology, which, in turn, is expected to impact the electronic packaging market. For instance, in January 2022, LG Electronics launched its latest healthcare product, "MediPain," a pain relief home device.
• The rise of IoT and AI and the proliferation of complex electronics are driving the high-end application segment in the consumer electronics and automotive industries. Due to these factors, more advanced electronic packaging technologies are being adopted to sustain demand. Furthermore, Amkor Technology and Samsung Electronics collaborated to develop the cutting-edge H-Cube solution. Samsung Electronics has announced the development of Hybrid-Substrate Cube technology, its most contemporary 2.5D packaging solution explicitly created for semiconductors for HPC, AI, data center, and network instruments that demand high-performance and spacious area packaging technology.
• Further, the global wi-fi chipset market is experiencing the transition to the 5th wi-fi generation, the 802.11ac with MIMO. An increasing number of customers are likely to adopt the technology due to an improvement in speed up to 1.3 GHz over long distance, driving the demand.
• Some recent advances in the market contain innovative packaging solutions with a new, unique, vibrant, and memorable design with minimal aesthetics driving the market's growth. In January 2022, Smurfit Kappa Group announced the expansion of its plant capacity in Brazil by investing USD 33 million. This will help the company extend its capabilities for shelf-ready packaging for home appliances, fresh produce, and pharmaceutical products.
• Also, the automotive sector accounts for a significant portion of the market studied, mainly due to its increasing adoption of electric vehicles (EVs) and hybrid vehicles. As a large number of memory devices, processors, analog circuits, discrete power devices, and sensors are used in electric and hybrid cars, the demand is set to rise at a rapid rate over the forecast period.
• According to IBEF, India's electric vehicle (EV) market is expected to reach INR 50,000 crores (USD 7.09 billion) by 2025. Further, a CEEW Centre for Energy Finance study shows India's USD 206 billion in opportunities for electric vehicles by 2030. Such developments will further drive the market growth for electronic packaging.
• The global spread of the pandemic has harmed sales of electronic packaging solutions and consumer electronics packaging. The demand for consumer electronics packaging is driven by the mobile phone and computer industries. Even during the pandemic, the output of these industries was not significantly impacted by a halt in production, a scarcity of raw materials, and supply chain disruptions.

Key Market Trends

Aerospace and Defense Industry to Increasingly Adopt Electronic Packaging

• The defense budgets of developed nations, such as United States, France, United Kingdom, and many developing nations, such as Russia, India, China, etc., have been increasing regularly. Many of these nations are also into the export of weapons. It results in continued investment in R&D in the aerospace and defense market.
• Further, Russia recently increased its military spending by 2.9%, to USD 65.9 billion, as it supported its forces along the United Kingdomrainian border. This was Russia's third consecutive year of growth, with military spending was reached 4.1% of GDP recently.
• Moreover, several types of military and aerospace equipment, such as data processing units, data display systems, computers, and aircraft guidance-control assemblies, are loaded with semiconductor devices. For instance, according to the Semiconductor Industry Association, global semiconductor industry sales were USD 47.4 billion during August 2022, a slight increase of 0.1% over August 2021.
• Naval warships, satellite communication channels on board, weapon control systems, coastguards, etc., are the users of many sophisticated electronic products and require military-grade packaging of the electronic and semiconductor components. Humidity and harsh environment make it necessary for the requirement of high-quality products and facilitate the investment in R&D.
• Owing to these factors, electronic packaging is anticipated to witness significant growth over the forecast period.

Asia-Pacific to Experience Significant Market Growth

• The Asia-Pacific region is estimated to hold the largest market share during the forecast period owing to growing automotive infrastructure and increased sales of electric vehicles. Rising middle-class income and a large youth population may drive up demand in the automotive industry. According to IBEF, in June 2022, the total production of passenger vehicles, three-wheelers, two-wheelers, and quadricycles was 2,081,148 units, which will drive the studied market growth in the future.
• Further, China is considered the electronic hub worldwide because of the mass manufacturing and production of electrical components and electronic products to meet the highest quality, performance, and delivery standards. This gives significant growth potential to the electronic packaging market.
• Regional companies are also investing in installing machinery that enables productive electronic and semiconductor packaging. Further, in August 2022, Polymatech, a semiconductor manufacturing company based in Tamil Nadu, India, invested USD 1 billion in the state to expand its chipset manufacturing and packaging facility.
• According to National Investment Promotion & Facilitation Agency (NIPFA), India has seen a significant increase in demand for electronic products. The electronic manufacturing sector is anticipated to reach USS 220 billion by 2025 due to strong policy support, massive investments by multiple stakeholders, and a surge in demand for electronic products.
• Massive increases in domestic demand, technological advancements, and the production of high-quality products have been China's primary drivers of industry growth. Such large-scale production of paper and paperboard in China is creating a healthy environment for the sales of electronic packaging.

Competitive Landscape

The electronic packaging market is fragmented. Microsystems are used almost in every industry vertical, with some significant sections being consumer electronics, healthcare equipment, aerospace and defense, communications, etc. Semiconductor devices, such as ICs, have become an integral part of a machine as electronics are getting integrated into machines, which is, in turn, driving the growth of electronic packaging significantly. Moving forward, acquisitions and collaboration of large companies with startups are expected, focusing on innovation.

In February 2022 , Siemens Digital Industries Software announced that it is working with Advanced Semiconductor Engineering (ASE), a leading semiconductor packaging supplier, on two platforms for multiple complex integrated circuits (IC) package assemblies and interconnects. Back in May 2021 , the Intel Corporation announced an investment of USD 3.5 billion to upgrade its facilities in New Mexico to manufacture advanced semiconductor packaging technologies, such as Foveros, Intel's innovative 3D packaging technology. Intel can create CPUs with computation tiles stacked vertically instead of side-by-side, owing to Foveros' innovative 3D packaging technique, which offers better performance in a smaller package.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Rising Concern over Product and Consumer Safety
  • 4.2.2 Technological Advancements Drive the Product Quality
• 4.3 Market Restraints
  • 4.3.1 High Costs for Electronic Packaging and Lack of Skilled Professionals to Challenge the Market Growth
• 4.4 Industry Attractiveness - Porter's Five Forces Analysis
  • 4.4.1 Bargaining Power of Suppliers
  • 4.4.2 Bargaining Power of Consumers
  • 4.4.3 Threat of New Entrants
  • 4.4.4 Threat of Substitute Products
  • 4.4.5 Intensity of Competitive Rivalry
• 4.5 Technology Snapshot

5 MARKET SEGMENTATION

• 5.1 By Material
  • 5.1.1 Plastic
  • 5.1.2 Metal
  • 5.1.3 Glass
  • 5.1.4 Other Materials
• 5.2 By End User Industry
  • 5.2.1 Consumer Electronics
  • 5.2.2 Aerospace and Defense
  • 5.2.3 Automotive
  • 5.2.4 Healthcare
  • 5.2.5 Other End User Industries
• 5.3 By Geography
  • 5.3.1 North America
    • 5.3.1.1 United States
    • 5.3.1.2 Canada
  • 5.3.2 Europe
    • 5.3.2.1 United Kingdom
    • 5.3.2.2 Germany
    • 5.3.2.3 France
    • 5.3.2.4 Rest of the Europe
  • 5.3.3 Asia Pacific
    • 5.3.3.1 China
    • 5.3.3.2 India
    • 5.3.3.3 Japan
    • 5.3.3.4 Rest of the Asia Pacific
  • 5.3.4 Latin America
  • 5.3.5 Middle East & Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Company Profiles
  • 6.1.1 AMETEK Inc.
  • 6.1.2 Dordan Manufacturing Company
  • 6.1.3 E. I. du Pont de Nemours and Company
  • 6.1.4 GY Packaging, Plastiform Inc.
  • 6.1.5 Kiva Container Corporation
  • 6.1.6 Primex Design & Fabrication
  • 6.1.7 Quality Foam Packaging Inc.
  • 6.1.8 Sealed Air Corporation
  • 6.1.9 The Box Co-Op
  • 6.1.10 UFP Technologies, Inc.

7 INVESTMENT ANALYSIS

8 FUTURE OF THE MARKET