NEWS: 公告在東京證券交易所JASDAQ標準市場新上市

市場調查報告書

相位改變熱界面材料市場-成長,趨勢,COVID-19的影響,及預測(2021∼2026年)

Phase Change Thermal Interface Materials Market - Growth, Trends, COVID-19 Impact, and Forecasts (2021 - 2026)

出版商 Mordor Intelligence Pvt Ltd 商品編碼 391755
出版日期 內容資訊 英文 185 Pages
商品交期: 2-3個工作天內
價格
相位改變熱界面材料市場-成長,趨勢,COVID-19的影響,及預測(2021∼2026年) Phase Change Thermal Interface Materials Market - Growth, Trends, COVID-19 Impact, and Forecasts (2021 - 2026)
出版日期: 2021年04月21日內容資訊: 英文 185 Pages
簡介

相位改變熱界面材料的市場規模在預測期間內預計將以11%以上的年複合成長率擴大。

市場的主要推動力是不斷增長的消費電子行業、高成本的表面處理、電子產品的改進以及遊戲模塊行業不斷增長的需求。然而,縮小手機尺寸和開發非矽膠替代品預計將阻礙市場增長。

由於互聯網在新興國家的快速普及,預計計算機應用領域將主導市場並在預測期內增長。更換導熱矽脂有望成為未來的機遇。亞太地區主導著全球市場,從中國和日本等國家消費最多。

本報告提供相位改變熱界面材料市場相關調查,提供市場概要,以及各導電性類型,各黏合劑類型,各填充物類型,各終端用戶業界,各地區的趨勢,及加入此市場的主要企業簡介等資訊。

目錄

第1章 簡介

第2章 調查手法

第3章 摘要整理

第4章 市場動態

  • 促進因素
    • 成長中的消費電子產業
    • 表面處理成本高
    • 電子設備的增強功能
    • 電競模組行業需求增加
  • 阻礙因素
    • 手機體積縮小
    • 日本需求減少
    • 非有機矽替代品的發展
  • 產業的價值鏈分析
  • 波特的五力分析
  • 原料分析
  • 專利分析

第5章 市場區隔

  • 各導電性類型
    • 導電性
    • 非導電性
  • 各黏合劑類型
    • 石蠟
    • 非石蠟(有機)
    • 一起晶鹽
    • 鹽的水合物
  • 各填充物類型
    • 氧化鋁
    • 氮化硼
    • 氮化鋁
    • 氧化鋅
    • 其他
  • 各終端用戶業界
    • 電腦
    • 電氣·電子
    • 電訊
    • 汽車
    • 其他
  • 各地區
    • 亞太地區
    • 北美
    • 歐洲
    • 其他

第6章 競爭情形

  • 合併和收購,合資企業,合作,及協定
  • 市場佔有率分析
  • 主要企業採用的策略
  • 企業簡介
    • 3M
    • Aavid Thermalloy
    • AI Technology
    • Arctic Silver
    • Croda International PLC
    • Datum Phase Change Ltd
    • Dow
    • Enerdyne Thermal Solutions
    • GrafTech
    • Henkel AG &Co. KGaA
    • Honeywell International Inc.
    • Laird Technologies
    • Microtek Laboratories Inc.
    • NuSil Technology
    • Parker Chomerics
    • Phase Change Energy Solutions Inc.(PCES)
    • Specialty Silicone Products(SSP)
    • Stockwell Elastomerics
    • TCP Reliable Inc.
    • Wakefield-Vette

第7章 市場機會及趨勢

  • 市場機會
    • 導熱油脂的更換
    • 技術改進
    • 在筆記本電腦中的使用
    • 汽車行業使用量不斷增長
    • 雙相變熱界面材料
  • 市場未來的預測

本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

目錄
Product Code: 53820

The phase change thermal interface materials market is expected to register a CAGR of more than 11% during the forecast period. Major factors driving the market studied are the growing consumer electronics industry, high cost of surface finishing, augmented the functionality of electronic devices, and increasing demand from the gaming module industry. However, the reduction in the size of mobile handsets and the development of non-silicone substitutes are expected to hinder market growth.

  • The computer application segment dominated the market and is expected to grow during the forecast period, owing to the rapid internet penetration in the developing countries.
  • Replacement of thermal greases is likely to act as an opportunity in the future.
  • Asia-Pacific dominated the global market, with the largest consumption from the countries, such as China, and Japan.

Key Market Trends

The Growing Consumer Electronics Industry

  • Owing to the need to dissipate large amounts of heat from the semiconductor device junction to ambient surroundings, phase change thermal interface materials (PCTIMs) are penetrating the consumer electronics industry. PCTIMs are polymer-based systems, proven to address critical heating issues and provide long-term reliability performance.
  • In consumer electronics, PCTIM finds a wide range of applications, since it plays a major role in helping smoothen out temperature fluctuations. PCTIM is the only technology, which can curb temperature increase in semiconductor applications, without causing cost and space expenses.
  • Asia-Pacific is expected to remain at the forefront of the global demand for electronics. The demand for PCTIM in Asia-Pacific is witnessing high growth, owing to rapid internet penetration in the developing countries. Video-on-demand (VoD) and internet-only shows are growing in popularity, thereby increasing the demand for larger displays, like laptops and tablets.
  • The consumer electronics industry has reached maturity in North America and Europe. Lack of purchasing intent from the consumers, declining innovation, and security concerns are the reasons for the stall in the growth of the market. However, the Internet of Things (IoT) is expected to replace the traditional categories. Despite its slow growth, IoT, along with smart homes, is expected to spur the demand for PCTIMs in developed countries.

The Asia-Pacific Region is Expected to Dominate the Market

  • With over 30% of the global demand, Asia-Pacific is the most promising market for phase change thermal interface materials, which is likely to dominate the market in the near future. This domination can be attributed to the growing demand for electronics in the region.
  • China and Japan account for over 73% of the demand for phase change thermal interface materials, and China is the major shareholder of the market demand in the region.
  • An increase in the demand of China's electronic devices and domestically designed CPUs (Central Processing Units) and DSPs (Digital Signal Processors) has led to a significant increase in the demand for PCTIMs.
  • China has faced increasing challenges in information and network security, which has led the government to increase its investments in the development and deployment of domestic CPUs. The PCTIMs are required for the development of the domestic CPUs. Hence, the Chinese electronics industry may boost the market, during the forecast period.
  • Japan is a hub for R&D and technological advancements. Canon, Casio, Panasonic, Sony, and Toshiba are some of the major electronic companies based in the country. The demand from these players helps the market regain its pace, during the forecast period, due to the requirement of PCTIMs in electronic goods.
  • Furthermore, India and ASEAN countries are the growth wagons for the market demand in the region. The huge growth of Asia-Pacific is quite instrumental in the expansion of the phase change thermal interface materials market.

Competitive Landscape

The phase change thermal interface materials market is fragmented. The major companies include Croda International PLC, Parker Hannifin Corp., Laird, Aavid Thermalloy (Boyd Corporation), and Honeywell International Inc., among others.

Reasons to Purchase this report:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

  • 4.1 Drivers
    • 4.1.1 Growing Consumer Electronics Industry
    • 4.1.2 High Cost of Surface Finishing
    • 4.1.3 Augmented Functionality of Electronic Devices
    • 4.1.4 Increasing Demand from the Gaming Module Industry
  • 4.2 Restraints
    • 4.2.1 Reduction in Size of Mobile Handsets
    • 4.2.2 Reduced Demand in Japan
    • 4.2.3 Development of Non-silicone Substitutes
  • 4.3 Industry Value-Chain Analysis
  • 4.4 Porter's Five Forces Analysis
    • 4.4.1 Bargaining Power of Suppliers
    • 4.4.2 Bargaining Power of Consumers
    • 4.4.3 Threat of New Entrants
    • 4.4.4 Threat of Substitute Products and Services
    • 4.4.5 Degree of Competition
  • 4.5 Raw Material Analysis
  • 4.6 Patent Analysis

5 MARKET SEGMENTATION

  • 5.1 By Conductive Type
    • 5.1.1 Electrically Conductive
    • 5.1.2 Non-electrically Conductive
  • 5.2 By Binder Type
    • 5.2.1 Paraffin
    • 5.2.2 Non-paraffin (organic)
    • 5.2.3 Eutectic salts
    • 5.2.4 Salt hydrates
  • 5.3 By Filler Type
    • 5.3.1 Aluminum Oxide
    • 5.3.2 Boron Nitride
    • 5.3.3 Aluminum Nitride
    • 5.3.4 Zinc Oxide
    • 5.3.5 Other Filler Types
  • 5.4 By End-user Industry
    • 5.4.1 Computers
    • 5.4.2 Electrical and Electronics
    • 5.4.3 Telecommunication
    • 5.4.4 Automotive
    • 5.4.5 Other End-user Industries
  • 5.5 Geography
    • 5.5.1 Asia-Pacific
      • 5.5.1.1 China
      • 5.5.1.2 India
      • 5.5.1.3 Japan
      • 5.5.1.4 South Korea
      • 5.5.1.5 Rest of Asia-Pacific
    • 5.5.2 North America
      • 5.5.2.1 United States
      • 5.5.2.2 Canada
      • 5.5.2.3 Mexico
    • 5.5.3 Europe
      • 5.5.3.1 Germany
      • 5.5.3.2 United Kingdom
      • 5.5.3.3 Italy
      • 5.5.3.4 France
      • 5.5.3.5 Rest of Europe
    • 5.5.4 Rest of World
      • 5.5.4.1 Brazil
      • 5.5.4.2 Saudi Arabia
      • 5.5.4.3 South Africa
      • 5.5.4.4 Rest of the World

6 COMPETITIVE LANDSCAPE

  • 6.1 Mergers and Acquisitions, Joint Ventures, Collaborations, and Agreements
  • 6.2 Market Share Analysis**
  • 6.3 Strategies Adopted by Leading Players
  • 6.4 Company Profiles
    • 6.4.1 3M
    • 6.4.2 Aavid Thermalloy
    • 6.4.3 AI Technology
    • 6.4.4 Arctic Silver
    • 6.4.5 Croda International PLC
    • 6.4.6 Datum Phase Change Ltd
    • 6.4.7 Dow
    • 6.4.8 Enerdyne Thermal Solutions
    • 6.4.9 GrafTech
    • 6.4.10 Henkel AG & Co. KGaA
    • 6.4.11 Honeywell International Inc.
    • 6.4.12 Laird Technologies
    • 6.4.13 Microtek Laboratories Inc.
    • 6.4.14 NuSil Technology
    • 6.4.15 Parker Chomerics
    • 6.4.16 Phase Change Energy Solutions Inc. (PCES)
    • 6.4.17 Specialty Silicone Products (SSP)
    • 6.4.18 Stockwell Elastomerics
    • 6.4.19 TCP Reliable Inc.
    • 6.4.20 Wakefield-Vette

7 MARKET OPPORTUNITIES AND FUTURE TRENDS

  • 7.1 Opportunities
    • 7.1.1 Replacement of Thermal Greases
    • 7.1.2 Technological Improvements
    • 7.1.3 Use in Notebook Computers
    • 7.1.4 Growing Use in the Automotive Industry
    • 7.1.5 Dual Phase Change Thermal Interface Materials
  • 7.2 Future of the Market