SiC 晶圓市場 - COVID-19 的增長、趨勢、影響和預測 (2023-2028)

2021 年 SiC 晶圓市場價值為 7.2674 億美元，預計到 2027 年將達到 202.546 萬美元，在 2022-2027 年的預測期內復合年增長率為 19.04%。

碳化矽 (SiC) 因其寬帶隙而被用於高功率應用。 SiC 襯底通常用於高性能功率 IC。 SiC 可以承受比矽或氮化鎵 (GaN) 更高的溫度，並且可以提高電氣設備的性能。

主要亮點

• 在汽車行業，新型電動汽車以更短的充電時間、更佳的續航裡程和性能滿足了客戶的期望。 因此，汽車公司需要能夠在高溫下高效運行的電力電子設備，以便為他們的客戶提供上述優勢。 因此，使用SiC的功率模塊由於具有高導熱性、降低開關損耗、提高功率密度和增加帶寬等優點，採用寬帶隙SiC技術開發。
• 隨著各個國家/地區宣布限制銷售新的內燃機汽車，人們對 SiC 功率半導體的興趣正在增加。 作為其中的一部分，在所研究的市場中運營的公司正在增加投資以建立新的製造設施。
• 2021 年 4 月，寬帶隙化合物半導體領導者 II-VI Incorporated 將在中國建立 SiC 晶圓拋光製造基地，以服務於全球最大的電動汽車和清潔能源應用市場之一。宣布擴大規模 為滿足亞洲日益增長的市場需求，該公司在其位於中國福州的亞洲地區總部的一個超過 50,000 平方英尺的新潔淨室中安裝了一條導電 SiC 襯底的後端處理線。
• 但是，考慮到 SiC 晶圓市場，市場參與者生產了 100 毫米和 150 毫米晶圓。 此外，一些公司正著力開發200mm晶圓，可能在未來幾年內全面商業化。 因此，SiC 晶圓的商業尺寸小於 Si 晶圓。 為此，與硅基半導體相比，SiC基半導體在生產效率和生產速度方面受到限制。
• COVID-19 大流行從供需兩方面影響了整個半導體製造市場。 此外，全球半導體工廠的停產和關閉加劇了供應短缺。 這種影響也體現在SiC晶圓市場上。 然而，其中許多影響可能是短期的。 世界各國政府對汽車和半導體行業的支持措施可能會重振行業增長。

SiC 晶圓的市場趨勢

汽車和電動汽車終端用戶行業的強勁增長

• 傳統矽的功率處理限制有望為替代功率技術鋪平道路，例如用於電動汽車應用的碳化矽。 在許多應用中，碳化矽 (SiC) 是矽 (Si) 的最先進替代品。 此外，正在努力提高電動汽車 (EV) 的效率、增加續航裡程、降低整車重量並降低成本。 因此，隨著控制電子設備密度的增加，在電動汽車中採用碳化矽的想法誕生了。
• SiC 作為一種替代矽的創新技術被用於許多應用中。 在電動汽車中採用 SiC 晶圓提高了汽車的整體效率、續航裡程、重量和成本，並在控制電子設備中實現了更高的功率密度。
• 此外，政府對減少 CO2 排放和各主要汽車製造商的乘用車電氣化要求的變化導致市場對 SiC 晶圓的需求不斷增長。
• 汽車製造商正在開發全混合動力電動汽車 (HEV)、輕度混合動力電動汽車 (MHEV)、插電式混合動力電動汽車 (PHEV)、零排放純電動汽車 (BEV)、燃料電池電動汽車 (FCEV)、等，向市場推出了不同電氣化水平的車型。
• 例如，2021 年 2 月，福特向其位於德國科隆的電動汽車生產工廠投資 10 億美元。 這項投資符合該公司將其歐洲汽車工廠轉變為電動汽車製造的目標。

亞太地區佔據最大市場份額

• 亞太地區在全球半導體市場佔據主導地位，並受到政府政策的支持，使其成為全球碳化矽晶圓市場的重要區域。 此外，該地區的半導體產業由台灣、中國、日本和韓國主導，它們在全球半導體市場中佔有很大份額。 另一方面，泰國、越南、新加坡和馬來西亞等國家也對該地區的市場主導地位做出了重大貢獻。
• 中國是亞洲乃至全球最大的半導體市場。 根據半導體行業協會的數據，2021年中國將以1925億美元的芯片總銷售額引領半導體市場，同比增長27.1%。 許多主要芯片製造商也呼籲進行巨額投資，以建立新設施並擴大芯片生產。
• 2021 年 6 月，中國三安集成電路 (SananIC) 在湖南三安半導體的工廠開設了全國第一條垂直集成 SiC 生產線。 該公司耗資 25 億美元的最新製造工廠位於湖南長沙高新技術產業園區，處理從晶體生長到功率器件、封裝和測試的整個晶圓和器件製造過程。
• 此外，在電動汽車行業的需求推動下，日本公司正在大量投資以增加 SiC 功率半導體的產量。 例如，2022年1月，日本富士電機宣布，決定對旗下功率半導體生產基地之一的富士電機津輕半導體進行資本投資，以增加SiC功率半導體的產量。 量產計劃於 2024 年開始。
• 此外，總部位於東京的昭和電工株式會社將開始量產直徑為 6 英寸（150 毫米）的碳化矽單晶晶圓（SiC 晶圓），用作材料2022 年 SiC 外延片加工並安裝到 SiC 功率半導體上。3 月開始。

SiC晶圓市場競爭者分析

SiC 晶圓市場競爭激烈，由具有影響力的參與者組成。 由於佔據了很大的市場份額，這些參與者正專注於擴大其海外客戶群。 此外，通過戰略合作，我們正在努力增加市場份額並增強盈利能力。

其他好處

• Excel 格式的市場預測 (ME) 表
• 三個月的分析師支持

內容

第一章介紹

• 研究假設和市場定義
• 調查範圍

第二章研究方法論

第 3 章執行摘要

第 4 章市場洞察

• 市場概覽
• 產業吸引力 - 波特五力分析
  • 供應商的議價能力
  • 買家的議價能力
  • 新進入者的威脅
  • 替代品的威脅
  • 競爭公司之間的敵對關係
• 技術洞察力
• 評估 COVID-19 對市場的影響

第 5 章市場動態

• 市場驅動力
  • 電動汽車 (EV) 普及率的上升和 800V 高壓 EV 架構的趨勢推動了對 SiC 晶圓的需求
  • 電力電子開關和 LED 照明設備對 SiC 晶圓的高導熱性需求不斷增加
• 市場挑戰
  • 小型化、散熱和封裝等限制因素給芯片和基板供應帶來壓力

第 6 章市場細分

• 按晶圓尺寸
  • 2 英寸、3 英寸、4 英寸
  • 6 英寸
  • 8 英寸、12 英寸
• 通過申請
  • 電力
  • 射頻 (RF)
  • 其他應用
• 按最終用戶行業
  • 電信/通訊
  • 汽車/電動汽車 (EV)
  • 光伏/電源/儲能
  • 工業（UPS、電機驅動器等）
  • 其他最終用戶行業
• 區域信息
  • 北美
  • 歐洲
  • 亞太地區
  • 世界其他地方

第七章競爭格局

• 公司簡介
  • Wolfspeed Inc.
  • II-VI Incorporated
  • Xiamen Powerway Advanced Material Co. Ltd
  • STMicroelectronics（Norstel AB）
  • Showa Denko KK
  • Atecom Technology Co. Ltd
  • SK Siltron Co. Ltd
  • SiCrystal GmbH
  • TankeBlue Co. Ltd
  • Semiconductor Wafer Inc.

第八章市場份額分析

第九章投資分析

第 10 章投資分析市場的未來

The SiC Wafer Market was valued at USD 726.74 million in 2021, and it is expected to reach USD 2,025.46 million by 2027, registering a CAGR of 19.04% during the forecast period 2022-2027. Silicon carbide (SiC) is used for high-power applications owing to its wide bandgap. High-performance power ICs are often based on SiC substrates. SiC can tolerate high temperatures than silicon or gallium nitride (GaN) and improve electrical device performance.

Key Highlights

• In the automotive industry, new EVs have reduced charge time and increased range and performance to meet customer expectations. Hence, automotive companies require power electronic devices capable of effective and efficient operation at elevated temperatures to offer the advantages mentioned above to customers. Thus, power modules are being developed using wide-bandgap SiC technologies, owing to SiC-based technology's advantages, such as high thermal conductivity, reduced switching losses, higher power density, and increased bandwidth capability.
• There has been a growing interest in SiC power semiconductors, with many countries announcing limiting the sales of new internal combustion engine vehicles. As part of these efforts, companies operating in the market studied have been increasing their investments to set up new manufacturing facilities.
• In April 2021, II-VI Incorporated, a leading company operating in wide-bandgap compound semiconductors, announced that it expanded the SiC wafer finishing manufacturing footprint in China to serve one of the largest worldwide markets for EVs and clean energy applications. To meet the increasing market demand in Asia, the company established a backend processing line for conductive SiC substrates in more than 50,000 sq. ft of new cleanroom space at the company's Asia Regional Headquarters in Fuzhou, China.
• However, considering the SiC wafer market, market players have been producing 100 mm and 150 mm wafers. Some companies are focusing on creating 200 mm wafers that may be fully commercialized in the next few years. Hence, commercial sizes of SiC wafers are smaller than Si wafers. This, in turn, limits the efficiency and rate of production of SiC-based semiconductors compared to silicon-based semiconductors.
• The COVID -19 pandemic affected the overall semiconductor manufacturing market from the demand and supply sides. In addition, the global lockdowns and closure of semiconductor plants further fueled the supply shortage. The effects were also reflected in the SiC wafer market. However, many of these effects are likely to be short-term. Precautions by governments across the globe to support automotive and semiconductor sectors could help revive industry growth.

SiC Wafer Market Trends

Automotive and Electric Vehicles End-User Industry Segment to Grow Significantly

• The power-handling limitations of traditional silicon are expected to pave the way for alternative power technologies such as silicon carbide in applications for electric vehicles. Silicon carbide (SiC) is a cutting-edge technology that replaces silicon (Si) in various applications. Moreover, efforts were made to raise the efficiency and range of electric cars (EVs) while reducing the weight and cost of the complete vehicle. Thus, with the increasing power density of control electronics, the notion of employing SiC for EVs was formed.
• SiC is an innovative technology used to replace silicon in many applications. The adoption of SiC wafers in electric vehicles has increased the efficiency, range, weight, and cost of the entire vehicle, thereby increasing the power density of control electronics.
• Moreover, changing government requirements regarding the reduction of CO2 emissions coupled with the electrification of passenger vehicles by various major automakers are contributing to the growth of demand for SiC wafers in the market.
• Vehicle models with different electrification levels have been introduced to the market by automakers, including full hybrid electric vehicles (HEVs), mild-hybrid electric vehicles (MHEVs), plug-in hybrid electric vehicles (PHEVs), zero-emission battery electric vehicles (BEVs), and fuel-cell electric vehicle (FCEVs), among others.
• For instance, in February 2021, Ford invested USD 1 billion in an electric vehicle production facility in Cologne, Germany. The investment aligns with the company's aims to convert its European arm of automotive plants to manufacture electric vehicles.

Asia-Pacific Hold the Largest Market Share

• The Asia-Pacific is a prominent region in the global SiC wafer market, as the region dominates the global semiconductor market, which is also supported by government policies. Furthermore, the region's semiconductor industry is driven by Taiwan, China, Japan, and South Korea, which account for a significant share of the global semiconductor market. In contrast, others, like Thailand, Vietnam, Singapore, and Malaysia, contribute significantly to the region's dominance in the market.
• China is the largest semiconductor market in Asia and globally. As per the semiconductor industry association, China led the semiconductor market with a total chip sales of USD 192.5 billion in 2021, marking an increase of 27.1% year on year. The country is also attracting huge investments from many major chipmakers to expand chip production by launching new facilities.
• In June 2021, China-based Sanan Integrated Circuit (Sanan IC) opened the nation's first vertically integrated SiC line at its Hunan Sanan Semiconductor plant. Located in the Changsha high-tech industrial park in the Hunan province, the company's latest manufacturing fab, with a USD 2.5 billion investment, handles all wafer and device fabrication steps from crystal growth to power devices, packaging, and testing.
• Furthermore, Japanese companies are making heavy investments to increase the production of SiC power semiconductors driven by the demand from the EV industry. For instance, in January 2022, Japan-based Fuji Electric Co. Ltd announced the decision to invest capital in Fuji Electric Tsugaru Semiconductor Co. Ltd, one of its power semiconductor production bases, for an increase in the production of SiC power semiconductors. Mass production is planned to begin in fiscal 2024.
• Furthermore, in March 2022, Tokyo-headquartered Showa Denko KK launched the mass production of silicon carbide single crystal wafers (SiC wafers) with a diameter of 6 inches (150 mm), which are used as materials for SiC epitaxial wafers to be processed and installed into SiC power semiconductors.

SiC Wafer Market Competitor Analysis

The SiC wafer market is highly competitive and consists of some influential players. These players, with a noticeable share in the market, are concentrating on expanding their customer base across foreign countries. They leverage strategic collaborative actions to improve their market percentage and enhance their profitability.

• March 2022 - Showa Denko KK started the mass manufacturing of silicon carbide single crystal wafers (SiC wafers) with a diameter of 6 inches (150 mm), which would be processed and integrated into SiC-based power semiconductors.
• February 2022 - II-VI Incorporated announced that it had qualified its 1200 V silicon carbide MOSFET platform, on its high-quality SiC substrates, to stringent automotive standard requirements. Additionally, the company expanded its relationship with GE by signing a three-year technology access agreement (TAA) with GE Research to access the Lab's global-class SiC module technology and the team of experts to accelerate customer design-in engagement activities.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHT

• 4.1 Market Overview
• 4.2 Industry Attractiveness - Porter's Five Forces Analysis
  • 4.2.1 Bargaining Power of Suppliers
  • 4.2.2 Bargaining Power of Buyers
  • 4.2.3 Threat of New Entrants
  • 4.2.4 Threat of Substitute Products
  • 4.2.5 Intensity of Competitive Rivalry
• 4.3 Technology Insights
• 4.4 Assessment of the Impact of COVID-19 on the Market

5 MARKET DYNAMICS

• 5.1 Market Drivers
  • 5.1.1 Rising Penetration Rate of Electric Vehicles (EVs) and the Inclination Toward High-voltage 800V EV Architectures Propelling the Demand for SiC Wafers
  • 5.1.2 Increasing Demand for SiC Wafers in Power Electronics Switches and LED Lighting Devices due to its High Thermal Conductivity
• 5.2 Market Challenges
  • 5.2.1 Limiting Constraints such as Scalability, Heat Dissipation, and Packaging-related Pressure on the Die and Substrate Supply

6 MARKET SEGMENTATION

• 6.1 By Wafer Size
  • 6.1.1 2-, 3-, and 4-inch
  • 6.1.2 6-inch
  • 6.1.3 8- and 12-inch
• 6.2 By Application
  • 6.2.1 Power
  • 6.2.2 Radio Frequency (RF)
  • 6.2.3 Other Applications
• 6.3 By End-user Industry
  • 6.3.1 Telecom & Communications
  • 6.3.2 Automotive & Electric Vehicles (EVs)
  • 6.3.3 Photovoltaic/Power Supply/Energy Storage
  • 6.3.4 Industrial (UPS and Motor Drives, etc.)
  • 6.3.5 Other End-user Industries
• 6.4 By Geography
  • 6.4.1 North America
  • 6.4.2 Europe
  • 6.4.3 Asia-Pacific
  • 6.4.4 Rest of the World

7 COMPETITIVE LANDSCAPE

• 7.1 Company Profiles
  • 7.1.1 Wolfspeed Inc.
  • 7.1.2 II-VI Incorporated
  • 7.1.3 Xiamen Powerway Advanced Material Co. Ltd
  • 7.1.4 STMicroelectronics (Norstel AB)
  • 7.1.5 Showa Denko KK
  • 7.1.6 Atecom Technology Co. Ltd
  • 7.1.7 SK Siltron Co. Ltd
  • 7.1.8 SiCrystal GmbH
  • 7.1.9 TankeBlue Co. Ltd
  • 7.1.10 Semiconductor Wafer Inc.

8 MARKET SHARE ANALYSIS

9 INVESTMENT ANALYSIS

10 FUTURE OF THE MARKET