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市場調查報告書
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1436039

基板:全球市場佔有率分析、產業趨勢與統計、成長預測(2024-2029)

Global Substrate - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2024 - 2029)

出版日期: | 出版商: Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3個工作天內

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簡介目錄

預計2024年全球基板市場規模為41.3億美元,預計2029年將達52.4億美元,預測期間(2024-2029年)複合年成長率為4.88%。

全球主機板市場

COVID-19 的爆發擾亂了電子產業的供應鏈,阻礙了市場成長。由於可支配收入減少和消費者信心疲軟,消費者選擇購買食品和清潔用品等必需品,並避免大額購買穿戴式裝置等非必需品。

主要亮點

  • COVID-19 大流行以及由此導致的半導體元件短缺震驚了全球經濟和半導體產業。全世界和幾乎所有經濟部門首次受到影響,供應鏈中斷將繼續對今年及以後的產能產生負面影響。此外,COVID-19 的影響顯著增加了對醫療監測設備的需求,各種合作夥伴關係促進了市場成長。
  • 軟性混合電子(FHE)是一種新的電子電路製造方法,結合了印刷電子和傳統電子的優點。這種彈性和處理能力的結合是非常理想的,因為它可以減輕重量,實現新的外形尺寸,並保持資料記錄和藍牙連接等理想的功能。
  • 印刷基板(PCB)產業在過去幾年中經歷了顯著成長,這主要是由於消費性電子產品的持續發展以及所有電子和電氣設備對PCB的需求不斷增加。
  • 消費性電子產品需要新的、不同的 PCB 功能。開發涉及 PCB 或與其相連的附件的形狀。 PCB 板相機已顯著發展,照片和視訊成像以及耐用性是主要改進領域。這些小型相機可以輕鬆捕捉高解析度影像和影片。車載相機準備在未來幾年進一步發展,以創建強大的工業和消費性電子解決方案。
  • 依地區分類,台灣、日本、中國等亞太國家佔據了PCB形勢的較大佔有率。然而,台灣地區的PCB產量近年來一直在下降。根據台北印刷電路協會(TPCA)統計,台灣印刷基板市場曾經稱霸全球,市場佔有率非常大。假設政府創建了一個全球先進的 PCB 製造中心,並尋求 PCB 材料供應的自主權。那樣的話,海灣很可能能夠在未來三到五年內保持其技術優勢。

基板市場趨勢

工業用途在胎心率市場中佔有很大佔有率

  • 相容FHE的軟性機器人也在工業4.0時代被應用。機器人外骨骼旨在幫助失去運動技能的人恢復運動技能,並幫助移動和舉起物體(例如板條箱、紙箱和盒子)以減少職場傷害,這是早期軟性機器人。
  • FHE 最重要的應用之一是通訊,因為無線技術對於資料傳輸和系統控制 (IoT) 至關重要。 「物聯網」(IoT) 一詞指的是對日常生活抱持未來主義觀點的新想法。它連接大量智慧型設備(嵌入感測器和資訊發送器)以實現機器對機器的通訊。這需要在無需人工干預的情況下頻繁地向雲端交換資料和更新,從而實現智慧家庭、智慧醫療、智慧城市、工業和交通系統等領域的成功創新。
  • FHE 的另一個應用領域是環境形勢下的精密農業。研究人員使用基於幾丁聚醣的墨水將軟性應變感測器直接列印到水果上。這些感測器對水果具有良好的附著力並識別機械損傷。石墨烯帶可調諧感測器可以測量流經植物的水流量。此感測器的開發方法是將石墨烯薄膜滴在預先圖案化的聚二甲基矽氧烷(PDMS)表面上,並將圖案化的石墨烯表面轉移到目標膠帶上。
  • 另一個研究領域是開發具有多種感測功能的靈活可拉伸設備來監測植物健康狀況。此外,所報告的植物穿戴式裝置是透過整合溫度、濕度和應變感測器來設計的。透過在 PDMS基板上沉積金金屬薄膜開發了應變感測器。溫度和濕度感測器是在同一靈活的 PI/PDMS 平台上製造的。
  • 多功能農業監測感測器已被開發用於測量應變、電阻、溫度和光強度。該感測器採用 CMOS、可印刷電子裝置和轉印技術的組合製造,能夠感知葉子的水合作用、溫度、應變和光強度。與其他報告的感測器不同,這些可拉伸感測器可以與葉子一起生長,使其適合長期監測。

智慧消費電子和穿戴式裝置需求的激增預計將推動 SLP 市場

  • 消費性電子主要包括智慧型手機、智慧手環、健身設備、穿戴式裝置等。消費性電子產品需求的不斷成長預計將為 SLP 市場參與者提供前景。消費性電子應用中功耗的增加需要電池變得更大,電路板變得更小。
  • 如果沒有小而薄的 IC構裝基板,智慧型手機就不會存在。小型、薄型 IC構裝基板可實現多種電子設備以及連接所有設備的多層薄型 PCB 的功能。智慧型手機功能和電池容量的進步要求主機板更密、更小、更輕。據IBIDEN稱,他們已經實現了使用MSAP(改進的半自適應工藝)的精細佈線技術和使用填充通層疊結構的技術,該技術已經提供了傳統的全通孔堆疊結構(FVSS)。
  • Yoon 表示,扇出晶圓級封裝適用於高級產品中的高階應用處理器,這些產品是手機商的旗艦智慧型手機型號。 SLP 專為手機主機板而設計,可減少此類組件所需的空間。手機中的細間距插槽通常使用球柵陣列或覆晶封裝。
  • 軟性電子產品通常由安裝在聚酯或聚醚醚酮 (PEEK) 等軟塑膠基板上的電路組成。為了確保電觸點即使在多次彎曲循環後也保持完好,導電跡線必須由具有高疲勞強度的軟性金屬或導電聚酯製成。這項任務的理想材料通常是聚合物。
  • 軟性電子產品將透過健身追蹤器、智慧型手錶和小型即時醫療監測設備等產品積極參與這個不斷擴大的行業。由於每個人體的形狀略有不同,軟性電子產品特別適合這種環境。不再需要緊緊佩戴設備以確保接觸,靈活的電子設備使感測器能夠貼合皮膚的自然曲線。軟性電子產品的最新研究重點是醫療應用。除了計步器和卡路里計數器之外,還開發了血壓監測器、氧氣監測器、血糖值監測器,甚至血液酒精監測器。
  • 隨著科技的突飛猛進,高效、靈活的太陽能板可能成為現實。軟性太陽能電池板可以安裝在屋頂支架以外的表面上,例如電線杆、井殼、柵欄柱和其他類似結構。
  • 此外,據報道,蘋果供應商之一振鼎科技討論了其對智慧型手機、穿戴式裝置和其他需要超薄和輕量化外形的行動裝置的 SLP 需求的願景。 SLP 允許緊湊的設計而不犧牲運算效能。振鼎計劃在其中國工廠內再建一條SLP生產線。

基板產業概況

全球基板市場高度分散。世界各地的製造商都依靠高密度互連 (HDI) PCB 等設計將更多硬體放入有限的空間。 HDI PCB採用高性能無芯結構。與傳統 PCB 相比,它具有更高密度的走線、更小的雷射通孔、定位墊片以及其他功能。該行業的老牌企業利用其製造和研發能力來推動創新並保持市場競爭力。

  • 2022 年 10 月,PCB 接點功率元件製造商 Wurth Elektronik ICS 推出了新一代經過驗證的無鉛大電流接點。第二代PowerPlus,LF PowerPlus 2.0,具有相同的扭力和電流。 -與第一代相同的承載能力,但現在更容易加工且組裝效率更高。憑藉 LF PowerPlus 產品系列,Wurth Elektronik ICS 為壓接技術應用中的 PCB 接點提供可靠、有效的大電流接點。非常適合將元件固定或將電纜和組件連接到 PCB,特別是在需要高扭力或安裝空間有限的情況下。
  • 2022 年 9 月,基於微波和射頻的技術專家 TTM Technologies Inc. 的射頻和特殊元件業務部門與射頻 (RF) 和微波元件的主要純分銷商 RFMW 簽署了分銷協議。還有半導體。 TTM 將透過 RFMW 提供其全系列 RF&S 產品,包括著名的 Xinger 品牌產品線。識別和開發機會,提供技術銷售支持,並將分銷涵蓋分銷服務。 RFMW網路商店也提供 TTM 組件。

其他福利

  • Excel 格式的市場預測 (ME) 表
  • 3 個月分析師支持

目錄

第1章簡介

  • 研究假設和市場定義
  • 調查範圍

第2章調查方法

第3章執行摘要

第4章 全球PCB市場

  • 當前市場概覽 - 趨勢/動態/市場需求估計和預測
  • 推動市場成長的因素
  • PCB製造流程及技術需求
  • PCB 的技術進步(製造流程和材料的進步)
  • PCB所用材料及其規格/應用

第5章市場區隔

  • 依用途
    • 計算
    • 消費者
    • 工業/醫療
    • 通訊
    • 軍事/航太
  • 十大PCB廠商分析
  • 市場展望

第6章全球FHE 市場

  • 當前市場概覽 - 趨勢/動態/市場需求估計和預測
  • 推動市場成長的因素
  • FHE製造流程及技術要求
  • FHE 技術進步(製造流程和材料的進步)
  • FHE所使用的材質及其規格
  • FHE技術藍圖
  • 應用程式和用例
    • 汽車/航空
    • 穿戴式裝置和醫療監控
    • 消費品
    • 工業/環境
    • 智慧包裝和RFID
  • FHE 供應商分析
  • 市場展望

第7章 全球SLP市場

  • 當前市場概覽 - 趨勢/動態/市場需求估計和預測
  • 推動市場成長的因素
  • SLP製造程序及技術要求
  • SLP 的技術進步(製造流程和材料的進步)
  • SLP所用材料及其規格
  • SLP技術藍圖
  • 市場區隔
    • 依用途
      • 消費性電子產品
      • 通訊
      • 其他
  • SLP供應商分析
  • 市場展望

第8章 全球SIP市場

  • 當前市場概覽 - 趨勢/動態/市場需求估計和預測
  • 推動市場成長的因素
  • SIP製造流程及技術要求
  • SIP 的技術進步(製造流程和材料的進步)
  • SIP所用材料及其規格
  • SIP技術藍圖
  • 市場區隔
    • 依用途
      • 通訊/基礎設施(伺服器/基地台)
      • 汽車/交通
      • 行動消費者
      • 醫療/工業
      • 航太/國防
    • SIP供應商分析
    • 市場展望
簡介目錄
Product Code: 72251

The Global Substrate Market size is estimated at USD 4.13 billion in 2024, and is expected to reach USD 5.24 billion by 2029, growing at a CAGR of 4.88% during the forecast period (2024-2029).

Global Substrate - Market

Due to the COVID-19 outbreak, there was a disruption in the electronics industry's supply chain, which challenged market growth. With reduced disposable incomes and depressed consumer sentiment, consumers chose to buy necessities, like food and cleaning products, and avoid non-essential, big-ticket purchases, like wearable devices.

Key Highlights

  • The COVID-19 pandemic and the ensuing shortage of semiconductor components proved to be a shock to the global economy and the semiconductor industry; for the first time, the entire world and nearly all economic sectors were affected, and supply chain disruptions will continue to impact production capacities negatively even in and beyond the current year. Furthermore, due to COVID-19, the demand for healthcare monitoring devices increased significantly, and various partnerships have led to market growth.
  • Flexible hybrid electronics (FHE) is a novel electronic circuit manufacturing approach that combines the best of printed and conventional electronics. This combination of flexibility and processing capability is much desired since it reduces weight, enables new form factors, and maintains desirable functionality, such as data logging and Bluetooth connectivity.
  • The printed circuit board (PCB) industry has experienced significant growth in the last few years, primarily owing to the continuous development of consumer electronics devices and the increasing demand for PCBs in all electronics and electrical equipment.
  • Consumer electronics have been demanding new and different PCB functions. The development is related to the shape of the PCB or the accessory attached to it. PCB board cameras have developed significantly, with photo and video imaging and durability being the primary areas of improvement. These small cameras could take high-resolution images and videos with ease. Board cameras are poised to develop even further in the next few years, creating robust industry and consumer electronics solutions.
  • Geographically, Asia-Pacific countries, such as Taiwan, Japan, and China, occupy a significant share of the global PCB landscape. However, PCB production in Taiwan has been on a declining trend for a few years. According to the Taipei Printed Circuit Association (TPCA), Taiwan's printed circuit board market briefly dominated the world with a large marginal market share. Suppose the government creates a hub for sophisticated PCB manufacture on a global scale and pursues autonomy in the supply of PCB materials. In that case, Taiwan can preserve its technological edge for the coming three to five years.

Substrate Market Trends

In FHR Market, Industrial to Account for a Significant Share in the Market

  • Also, FHE-enabled soft robots have found applications in the Industry 4.0 era. Robotic exoskeletons designed to give mobility back to those who have lost it and assist with moving and lifting objects (e.g., crates, cartons, and boxes) to reduce workplace injury are early soft robotic applications.
  • One of the most critical uses for FHE is in communication, as wireless technology is essential for data transmission and system control (IoT). The term "Internet of Things" (IoT) refers to an emerging idea that encompasses a futuristic perspective on everyday life. It connects a vast array of intelligent devices (embedded with sensors and information transmitters) to enable machine-to-machine communication, which necessitates frequent data exchange and updates to the cloud without human intervention, allowing successful innovation in areas like smart homes, smart healthcare, smart cities, industry, and transportation systems.
  • Another application area for FHE is precision agriculture in the environmental landscape. Researchers printed a flexible strain sensor directly on the fruits using chitosan-based ink. These sensors provided good adhesion to the fruit and identified mechanical injuries. A graphene-on-tape adjustable sensor can measure water flow through plants. The sensor is developed by dropping a graphene film on a pre-patterned polydimethylsiloxane (PDMS) surface and then transferring the patterned graphene surface onto a target tape.
  • Another research area is developing a flexible and stretchable device with multiple sensing capabilities for plant health monitoring. Further, the reported plant wearable is designed by integrating temperature, humidity, and strain sensors. The strain sensors were developed by depositing a thin gold metal film on the PDMS substrate. The temperature and humidity sensors were fabricated on the same flexible PI/PDMS platform.
  • A multifunctional agricultural monitoring sensor is being developed to measure strain, impedance, temperature, and light intensity. The sensor is fabricated by combining CMOS, printable electronics, and transfer printing techniques, leading to hydration, temperature, strain, and light illuminance sensing capabilities on leaves. Unlike other reported sensors, these stretchable sensors can grow with the leaves, making them compatible with long-term monitoring.

Surge in Demand for Smart Consumer Electronics and Wearable Devices is Expected to Drive the SLP Market

  • Consumer electronics mostly include smartphones, smart bands, fitness devices, and wearables. Increasing demand for consumer electronics is expected to provide prospects for players in the SLP market. Due to the increasing power consumption in consumer electronics applications, batteries need to get bigger, while boards need to get smaller.
  • Smartphones would not exist without the compact, thin IC packaging substrates Compact, thin IC packaging substrates enable multiple electronic devices to function, as does the multilayer, thin PCB that connects all the devices. The advancement of smartphone functions and battery capacity requires higher densities and smaller, lighter motherboards. According to IBIDEN, it has achieved a micro-wiring technology employing the Modified Semi-Adaptive Process (MSAP) and a technique using the filled-via stack-up structure they have been offering in conventional full-via stacked structures (FVSS).
  • According to Yoon, fan-out wafer-level packaging is for high-end application processors going into premium products, the flagship smartphone models for handset vendors. SLP is meant for the motherboard of phones, reducing the space needed for such assemblies. Ball grid arrays or flip-chip packages are typically used for fine-pitch slots in a phone.
  • Flexible electronics typically consist of electrical circuits installed on a flexible plastic substrate, such as polyester or polyether ether ketone (PEEK). For the electrical contact to remain intact even after numerous flexing cycles, the conductive traces must either be made of a flexible metal with high fatigue strength or conductive polyester. The ideal material for the job is often a polymer.
  • Flexible electronics will actively participate in this expanding industry with fitness trackers, smartwatches, and tiny, real-time medical monitoring devices. Since every human body is slightly distinct in shape, flexible electronics are especially well adapted to this environment. Instead of being compelled to wear equipment too tightly to ensure contact, sensors may now conform to the skin's natural curves thanks to flexible electronics. Medical applications have been the focus of recent research in flexible electronics. Blood pressure monitors, oxygen monitors, glucose meters, and even blood-alcohol meters are being created in addition to step counters and calorie counters.
  • Efficient, flexible solar panels might become a reality as technology progresses exponentially. Flexible solar panels can be installed on surfaces other than roof-mounted racks, such as telephone poles, well casings, fence posts, and other similar structures.
  • Furthermore, Zhen Ding Technology, reportedly among the suppliers of Apple, has discussed its vision of SLP demand for smartphones, wearables, and other mobile devices requiring an ultra-thin and lightweight profile. The use of SLP enables compact design without sacrificing computing performance. Zhen Ding plans to build additional SLP production lines at its factory site in China.

Substrate Industry Overview

The global substrate market is highly fragmented. Manufacturers globally have depended on designs, such as high-density interconnect (HDI) PCBs, to place more hardware in limited space. HDI PCBs use high-performance and coreless construction. Compared to traditional PCBs, they sport more densely packed wiring, miniaturized laser vias, capture pads, and other features. The industry's established players are leveraging their manufacturing capabilities and research and development capabilities to drive innovation and sustain their competitive position in the market.

  • In October 2022, the manufacturer of Powerelements for PCB contacting, Wurth Elektronik ICS, launched a new generation of its tried-and-true lead-free high-current contacts: the second PowerPlus generation, LF PowerPlus 2.0, has the same torque and current-carrying capacity as the first generation but is now even easier to process and more effective to assemble. Wurth Elektronik ICS provides reliable and effective high-current contacts for PCB contact in press-fit technology applications with the LF PowerPlus product family. They are perfect for fastening elements or attaching cables and components to the PCB, especially when high torques are needed or there is limited installation space.
  • In September 2022, TTM Technologies Inc.'s Radio Frequency & Specialty Components Business Unit, a microwave and RF-based technology specialist, signed a distribution agreement with RFMW, a pure play premier distributor for radio frequency ("RF") and microwave components and semiconductors. TTM will make available through RFMW the entirety of its line of RF&S goods, including its well-known Xinger brand product lineup. Opportunities will be identified and developed, technical sales support will be provided, and distribution will be included in the distribution services. The RFMW online store will also provide the TTM components.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 GLOBAL PCB MARKET

  • 4.1 Current Market Overview - Trends/Dynamics/Market Demand Estimates and Projections
  • 4.2 Factors Driving Market Growth
  • 4.3 PCB Manufacturing Process and Technical Requirements
  • 4.4 Technological Advancements in PCBs (Manufacturing Process and Materials Advancements)
  • 4.5 Materials Used for PCBs along with their Specifications and Applications

5 MARKET SEGMENTATION

  • 5.1 By Application
    • 5.1.1 Computing
    • 5.1.2 Consumer
    • 5.1.3 Industrial/Medical
    • 5.1.4 Communication
    • 5.1.5 Automotive
    • 5.1.6 Military/Aerospace
  • 5.2 Analysis of Top 10 PCB Vendors
  • 5.3 Market Outlook

6 GLOBAL FLEXIBLE HYBRID ELECTRONICS (FHE) MARKET

  • 6.1 Current Market Overview - Trends/Dynamics/Market Demand Estimates & Projections
  • 6.2 Factors Driving the Market Growth
  • 6.3 FHE Manufacturing Process and Technical Requirements
  • 6.4 Technological Advancement in FHE (Manufacturing Process and Materials Advancements)
  • 6.5 Materials Used for FHEs along with their Specifications
  • 6.6 Technological Roadmap of FHE
  • 6.7 Applications and Use Cases
    • 6.7.1 Automotive and Aeronautical
    • 6.7.2 Wearable and Healthcare Monitoring
    • 6.7.3 Consumer Goods
    • 6.7.4 Industrial/Environmental
    • 6.7.5 Smart Packaging and RFID
  • 6.8 Analysis of FHE Vendors
  • 6.9 Market Outlook

7 GLOBAL SUBSTRATE LIKE PCB (SLP) MARKET

  • 7.1 Current Market Overview - Trends/Dynamics/Market Demand Estimates and Projections
  • 7.2 Factors Driving the Market Growth
  • 7.3 SLP Manufacturing Process and Technical Requirements
  • 7.4 Technological Advancement in SLP (Manufacturing Process and Materials Advancements)
  • 7.5 Materials Used for SLP with their Specifications
  • 7.6 Technological Roadmap of SLP
  • 7.7 MARKET SEGMENTATION
    • 7.7.1 By Application
      • 7.7.1.1 Consumer Electronics
      • 7.7.1.2 Automotive
      • 7.7.1.3 Communication
      • 7.7.1.4 Other Applications
  • 7.8 Analysis of SLP Vendors
  • 7.9 Market Outlook

8 GLOBAL SYSTEM-IN-PACKAGE (SIP) MARKET

  • 8.1 Current Market Overview - Trends/Dynamics/Market Demand Estimates and Projections
  • 8.2 Factors Driving the Market Growth
  • 8.3 SIP Manufacturing Process and Technical Requirements
  • 8.4 Technological Advancement in SIP (Manufacturing Process and Materials Advancements)
  • 8.5 Materials Used for SIP along with their Specifications
  • 8.6 Technological Roadmap of SIP
  • 8.7 MARKET SEGMENTATION
    • 8.7.1 By Application
      • 8.7.1.1 Telecom and Infrastructure (Servers and Base Stations)
      • 8.7.1.2 Automotive and Transportation
      • 8.7.1.3 Mobile and Consumer
      • 8.7.1.4 Medical and Industrial
      • 8.7.1.5 Aerospace and Defense
    • 8.7.2 Analysis of SIP Vendors
    • 8.7.3 Market Outlook