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市場調查報告書
商品編碼
1190711

導電膠市場 - 增長、趨勢、COVID-19 影響和預測 (2023-2028)

Electrically Conductive Adhesives Market - Growth, Trends, and Forecasts (2023 - 2028)
出版日期: | 出版商: Mordor Intelligence | 英文 150 Pages | 商品交期: 2-3個工作天內

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簡介目錄

預計在 2022 年至 2027 年的預測期內，全球導電膠市場的複合年增長率將低於 6%。

COVID-19 大流行對市場產生了負面影響。 但是，現在估計市場已達到大流行前的水平。

*推動市場的主要因素是電力電子領域應用的擴展。

*在預測期內，電力電子產品中越來越多地使用單組分和兩組分環氧粘合劑預計將推動市場增長。

*亞太地區預計將主導全球市場，其中最大的消費來自中國、日本和印度。

導電膠市場趨勢

環氧樹脂部分主導市場

*導電膠是含有純銀、銅、鋁、鐵等填料成分的粘合劑，具有優異的導電性、優異的附著力和優異的物理強度。

*用於需要熱固化和熱焊接的電路組裝應用和工藝。

*Epoxy 系列導電膠廣泛應用於觸控面板、塗層、RFID 芯片接合和 LED 安裝等各種應用領域。

*這些粘合劑可實現與傳統焊接類似的電氣連續性，無需熱應力，並且可以粘附到許多焊料無法粘附的導電聚合物上。

*環氧樹脂具有保質期長、常溫保存、固化溫度低等優點，比其他類型更通用。

*預計2022年消費電子市場收入將達到15066.93億美元。 2022-2026 年的複合年增長率預計為 1.82%。

*因此，基於上述因素，環氧樹脂部分有望在預測期內主導市場。

亞太地區引領市場

*預計在預測期內，全球導電膠市場將由亞太地區主導。 由於中國、印度和日本等國家的高需求，導電粘合劑市場正在增長。

*最大的導電膠生產商位於亞太地區。 生產導電粘合劑的領先公司包括 Henkel AG & Co. KGaA、3M、Dow、Aremco 和 HB Fuller Company。

*中國的“中國製造2025”政策設定了具體目標，即到2020年將集成電路生產的自給率提高到40%，到2025年提高到70%。 因此，預計未來導電膠在電路芯片上的應用範圍將會擴大。

*此外，在東盟國家，電子元件製造商正在積極投資生產設施。

*這些因素以及政府的支持預計將主導亞太地區的全球市場。

導電膠市場競爭分析

全球導電膠市場是分散的，大多數參與者只佔有很小的市場份額。 主要公司包括 Henkel AG & Co. KGaA、3M、Dow、Permabond.com 和 HB Fuller Company。

其他好處

  • Excel 格式的市場預測 (ME) 表
  • 三個月的分析師支持

內容

第一章介紹

  • 調查先決條件
  • 調查範圍

第二章研究方法論

第 3 章執行摘要

第四章市場動態

  • 司機
    • 擴大在電力電子領域的應用
    • 其他司機
  • 約束因素
    • 其他抑製劑
  • 工業價值鏈分析
  • 波特的五力分析
    • 新進入者的威脅
    • 買家的議價能力
    • 供應商的議價能力
    • 替代品的威脅
    • 競爭程度

第 5 章市場細分

  • 化學類型
    • 環氧樹脂
    • 矽膠
    • 聚氨酯
    • 亞克力
    • 其他化學類型
  • 類型
    • 各向同性
    • 各向異性
  • 申請
    • 太陽能電池
    • 車載電子產品
    • LED 照明
    • 印刷線路板
    • 液晶顯示器
    • 其他用途
  • 按地區
    • 亞太地區
      • 中國
      • 印度
      • 日本
      • 韓國
      • 其他亞太地區
    • 北美
      • 美國
      • 加拿大
      • 墨西哥
    • 歐洲
      • 德國
      • 英國
      • 法國
      • 意大利
      • 其他歐洲
    • 南美洲
      • 巴西
      • 阿根廷
      • 其他南美洲
    • 中東和非洲
      • 沙特阿拉伯
      • 南非
      • 其他中東和非洲地區

第六章競爭格局

  • 併購、合資企業、合作、合同
  • 市場份額 (%)**/排名分析
  • 主要參與者採用的策略
  • 公司簡介
    • 3M
    • Aremco
    • Creative Materials Inc.
    • Dow
    • HB Fuller Company
    • Henkel AG & Co. KGaA
    • HITEK Electronic Materials Ltd
    • Master Bond Inc.
    • MG Chemicals
    • Panacol-Elosol GmbH
    • Parker Hannifin Corp.
    • Permabond

第7章 市場機會未來動向

簡介目錄
Product Code: 69622

The electrically conductive adhesives market is expected to record a CAGR of less than 6% globally during the forecast period 2022-2027.

The COVID-19 pandemic had a negative impact on the market. However, the market is now estimated to have reached pre-pandemic levels.

* The major factor driving the market studied is increasing application in power electronics.

* Increasing applications of single-part and two-part epoxy adhesives in power electronics are expected to drive market growth during the forecast period.

* Asia-Pacific is expected to dominate the global market with the most significant consumption from China, Japan, and India.

Electrically Conductive Adhesives Market Trends

Epoxy Segment to Dominate the Market

* Electrically conductive adhesives are adhesives that have filler components like pure silver, copper, aluminum, or iron, which provide excellent electrical conductivity, superior adhesion, and good physical strength.

* These adhesives are used in circuit assembly applications and processes where heat curing or hot soldering can be altered.

* The epoxy segment of electrically conductive adhesives is widely used in various applications like touch panels, coating, and bonding RFID chips, mounting LEDs, and others.

* These adhesives provide electrical continuity similar to traditional soldering without the heat stress, and they adhere to many conductive polymers where adhesion with solder is not possible.

* Epoxy offers the advantages of extended shelf life, room temperature storage, and much lower cure temperatures, which is increasing its application compared to other types.

* Revenue from the consumer electronics market is likely to reach USD 1,056,693 million in 2022. The market is expected to observe a CAGR of 1.82% from 2022-2026.

* Hence, based on the aforementioned factors, the epoxy segment is expected to dominate the market over the forecast period.

Asia-Pacific Region to Dominate the Market

* Asia-Pacific is expected to dominate the global market for electrically conductive adhesives during the forecast period. Due to the high demand from countries like China, India, and Japan, the market for electrically conductive adhesives has been growing.

* The largest producers of electrically conductive adhesives are located in Asia-Pacific. Some of the leading companies for the production of electrically conductive adhesives are Henkel AG & Co. KGaA, 3M, Dow, Aremco, and HB Fuller Company.

* The "Made in China 2025" policy, incorporated by China, set specific targets to increase self-sufficiency in integrated circuits production to 40% in 2020 and 70% by 2025. This is expected to increase the scope of application for electrically conductive adhesives in circuit chips over the coming years.

* ASEAN countries have also been observing the influx of electronics producing companies investing in the region for production facilities.

* The aforementioned factors, coupled with government support, are expected to result in the Asia-Pacific region dominating the global market.

Electrically Conductive Adhesives Market Competitive Analysis

The global electrically conductive adhesives market is fragmented, with most players accounting for a marginal share in the market. Some of the major companies include Henkel AG & Co. KGaA, 3M, Dow, Permabond.com, and HB Fuller Company, among others.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

  • 4.1 Drivers
    • 4.1.1 Increasing Application in Power Electronics
    • 4.1.2 Other Drivers
  • 4.2 Restraints
    • 4.2.1 Other Restraints
  • 4.3 Industry Value Chain Analysis
  • 4.4 Porter's Five Forces Analysis
    • 4.4.1 Threat of New Entrants
    • 4.4.2 Bargaining Power of Buyers
    • 4.4.3 Bargaining Power of Suppliers
    • 4.4.4 Threat of Substitute Products
    • 4.4.5 Degree of Competition

5 MARKET SEGMENTATION

  • 5.1 Chemistry Type
    • 5.1.1 Epoxy
    • 5.1.2 Silicone
    • 5.1.3 Polyurethane
    • 5.1.4 Acrylic
    • 5.1.5 Other Chemistry Types
  • 5.2 Type
    • 5.2.1 Isotropic
    • 5.2.2 Anisotropic
  • 5.3 Application
    • 5.3.1 Solar Cells
    • 5.3.2 Automotive Electronics
    • 5.3.3 LED Lighting
    • 5.3.4 Printed Circuit Boards
    • 5.3.5 LCD Displays
    • 5.3.6 Other Applications
  • 5.4 Geography
    • 5.4.1 Asia-Pacific
      • 5.4.1.1 China
      • 5.4.1.2 India
      • 5.4.1.3 Japan
      • 5.4.1.4 South Korea
      • 5.4.1.5 Rest of Asia-Pacific
    • 5.4.2 North America
      • 5.4.2.1 US
      • 5.4.2.2 Canada
      • 5.4.2.3 Mexico
    • 5.4.3 Europe
      • 5.4.3.1 Germany
      • 5.4.3.2 United Kingdom
      • 5.4.3.3 France
      • 5.4.3.4 Italy
      • 5.4.3.5 Rest of Europe
    • 5.4.4 South America
      • 5.4.4.1 Brazil
      • 5.4.4.2 Argentina
      • 5.4.4.3 Rest of South America
    • 5.4.5 Middle-East and Africa
      • 5.4.5.1 Saudi Arabia
      • 5.4.5.2 South Africa
      • 5.4.5.3 Rest of Middle-East and Africa

6 COMPETITIVE LANDSCAPE

  • 6.1 Mergers and Acquisitions, Joint Ventures, Collaborations, and Agreements
  • 6.2 Market Share (%)**/Ranking Analysis
  • 6.3 Strategies Adopted by Leading Players
  • 6.4 Company Profiles
    • 6.4.1 3M
    • 6.4.2 Aremco
    • 6.4.3 Creative Materials Inc.
    • 6.4.4 Dow
    • 6.4.5 HB Fuller Company
    • 6.4.6 Henkel AG & Co. KGaA
    • 6.4.7 HITEK Electronic Materials Ltd
    • 6.4.8 Master Bond Inc.
    • 6.4.9 MG Chemicals
    • 6.4.10 Panacol-Elosol GmbH
    • 6.4.11 Parker Hannifin Corp.
    • 6.4.12 Permabond

7 MARKET OPPORTUNITIES AND FUTURE TRENDS