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市場調查報告書

3D IC的全球市場:分析與預測

Global 3D IC Market Research Report - Forecast to 2022

出版商 Market Research Future 商品編碼 542512
出版日期 內容資訊 英文 78 Pages
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3D IC的全球市場:分析與預測 Global 3D IC Market Research Report - Forecast to 2022
出版日期: 2017年05月20日 內容資訊: 英文 78 Pages
簡介

本報告提供全球3D IC (3D積體電路) 市場相關分析,市場基本結構,及各零組件、產品、應用、地區的市場趨勢,市場促進、阻礙因素,市場佔有率,競爭情形和主要企業簡介等系統性資訊。

第1章 摘要整理

第2章 市場動態

  • 市場成長的推動要素
  • 市場課題
  • 3D IC的供應鏈
  • 波特的五力分析

第3章 全球3D IC市場:各技術

  • 3D IC技術種類市場
    • 市場:各細分區隔
  • 3D IC封裝 & 整合種類
    • 包裝的3D系統 (3D SiP)
    • 3D晶圓等級包裝 (3D WLP)
    • 2.5D & 3D內插器
    • 3D異種整合

第4章 全球3D IC市場:各零件

  • 簡介
  • 市場:各細分區隔
    • 矽穿孔電極 (TSV)
    • 玻璃貫通電極 (TGV)

第5章 全球3D IC市場:各產品

  • 簡介
  • 市場:各細分區隔
    • CMOS影像感測器
    • 3D記憶體
    • MEMS & 感測器
    • LED

第6章 全球3D IC市場:各應用領域

  • 簡介
  • 市場:各細分區隔
    • IT/通訊
    • 家電
    • 工業
    • 航太 & 防衛
    • 汽車
    • 醫療

第7章 全球3D IC市場:各地區

  • 簡介
  • 市場:各地區
    • 北美
    • 歐洲
    • 亞太地區
    • 中東、非洲

第8章 競爭情形

  • 簡介
  • 競爭情形
  • 市場佔有率分析
  • 企業簡介
    • Xilinx Inc.
    • Tezzaron Semiconductor Corporation
    • Business Strategy
    • BeSang Inc.
    • Monolithic 3D Inc.
    • United Microelectronics Corporation
    • 3M Company
    • Intel Corporation
    • IBM Corporation

第9章 附錄

第10章 調查手法

圖表

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目錄

Market Scenario:

The growing semiconductor & microelectronics industry is developing a trend for vertically stacked integrated circuits (ICs) which is emerging as viable solution for providing high performance, increased functionality and reducing power consumption to fulfill electronic device requirements. These ICs are in great demand by military & aerospace, medical and consumer electronics industries to fulfill need of integrating disparate technologies which includes logic, memory, RF, sensor in small forms for industrial applications.

The global 3D IC's market is a very dynamic market and is expected to witness stable growth over the forecast period. The growth of the 3D IC's market is influenced by the increasing demand for advanced electronic products with a smaller form factor, and superior functionality has driven semiconductor industry to develop more innovative advanced packaging technologies and high demand for 3D packaging using TSVs driving 3D IC development. However, technical limitation and IC/package co-design are the factors hindering the growth of the 3D IC's market.

The global 3D IC's market is estimated to grow from USD 4,045.9 million in 2016 to USD 10,476.6 million by 2023, growing at a CAGR of 17.18% from 2017 to 2023.

Objective Study of 3D IC's Market:

  • To provide detailed analysis of the market structure along with forecast of the various segments and sub-segments of the global 3D IC's market.
  • To provide insights about factors affecting the market growth.
  • To analyze the global 3D IC's market based porter's five force analysis etc.
  • To provide historical and forecast revenue of the market segments and sub-segments with respect to four main geographies and their countries- North America, Europe, Asia, and Rest of the World (ROW).
  • To provide country level analysis of the market with respect to the current market size and future prospective.
  • To provide country level analysis of the market for segment by type, end-users and region.
  • To provide strategic profiling of key players in the market, comprehensively analyzing their core competencies, and drawing a competitive landscape for the market.
  • To track and analyze competitive developments such as joint ventures, strategic alliances, mergers and acquisitions, new product developments, and research and developments in the global 3D IC's market.

Segments

For the purpose of this study, Market Research Future has segmented the market of 3D IC's into technology, components, products, application and region.

Technology-

  • 3D Stacked ICs
  • 3D Monolithic ICs

Components-

  • Through Silicon Vias (TSVs)
  • Through Glass Vias (TGVs)
  • Others

Product-

  • CMOS Image Sensors
  • 3D Memory
  • MEMS & Sensors
  • Light Emitting Diodes (LEDs)

Applications-

  • IT/Telecommunications
  • Consumer Electronics
  • Industrial
  • Aerospace & Defence
  • Automotive
  • Medical

Region

  • North-America
  • Europe
  • Asia-Pacific
  • RoW

Key Players

The key players in the global 3D IC market include Xilinx Inc., Tezzaron Semiconductor Corporation, and BeSang Inc., Monolithic 3D Inc., United Microelectronics Corporation, 3M Company, Intel Corporation, and IBM Corporation among others.

Regional Analysis-

North America is the leading economy in 3D IC's market followed by Europe. However, Asia-Pacific is the fastest growing economy in the market majorly due to maturing production sector in India and China and largest production of semiconductor industry Also, Middle East & Africa has a slow growth majorly due to growing industrialization and presence of automobile industries in this region.

In 2016, North America is estimated to generate the largest revenue of USD 988.75 million followed by Europe with USD 1084.70 million generated in 2016. This trend is projected to change by 2022, where Asia-pacific would raise its revenue to USD 4200.02 million from USD 1568.12 million in year 2016. Asia-Pacific is predicted to show a high revenue growth at a CAGR of 17.85% from 2016 to 2023. Middle East & Africa is expected to grow with slow growth rate of 11.09% during forecast period 2016 to 2022.

Key Findings-

  • Global 3D IC's technology market has reached USD 4,045.87 million in 2016 and is projected to exhibit USD 10,476.60 million by the end of 2023 with a growing CAGR of 17.18%.
  • By technology, 3D ICs market is dominated by 3D stacked ICs which has generated USD 3,442.07 million in 2016 and projected to reach USD 8,656.95 million by the end of 2022 with 16.62% CAGR. Whereas, monolithic 3D ICs is expected to be the fastest growing market with 20.18% CAGR during forecast period 2016-2022. The high demand for cost saving and high performance logical chips is driving the 3D ICs market in the near future.
  • Global 3D ICs component market is dominated by through silicon vias (TSVs) which has generated USD 2,570.92 million in 2016 and projected to reach USD 7,332.03 million by the end of 2022. It also expected to be the fastest growing market with 19.08% CAGR during forecast period 2016-2022.
  • By product segment of 3D IC's market, CMOS image sensors has generated highest revenue of USD 1,430.63 million in 2016 and projected to reach USD 3,740.94 million by the end of forecast period 2022.
  • Globally, 3D IC market by applications is dominated by IT/Telecommunication industry and has generated USD 994.27 million in 2016 and is projected to reach USD 1,996.48 million by the end of 2022. Followed by consumer electronics and industrial application which are growing with 23.65% CAGR and 13.42% CAGR respectively during forecast period 2016-2022.
  • By region, in 2016, North America is estimated to generate the largest revenue of USD 988.75 million and expected to reach USD 3,126.80 million by 2022, 21.15% CAGR followed by Europe. Asia-Pacific is growing with a CAGR of 17.85% thereby would increase its revenue from USD 1,568.12 million to USD 4,200.02 million by 2023.

Table of Contents

Table of Contents:

1 Executive Summary

2 Market Dynamics

  • 2.1 Market Drivers
  • 2.2 Market Challenges
  • 2.3 3D ICs Supply Chain
  • 2.4 Porter's Five Forces Analysis

3 Global 3D ICs Market, By Technology

  • 3.1 3D IC Technology Type Market
    • 3.1.1 Market by Sub-segment
      • 3.1.1.1 3D Stacked ICs
      • 3.1.1.2 Monolithic 3D ICs
  • 3.2 3D IC Packaging & Integration Type
      • 3.2.1.1 3D system in package (3D Sip)
      • 3.2.1.2 3D wafer level package (3D WLP)
      • 3.2.1.3 2.5D & 3D interposer
      • 3.2.1.4 3D Heterogeneous Integration

4 Global 3D IC Market, By Component

  • 4.1 Introduction
  • 4.2 Market by Sub-Segment
    • 4.2.1 through Silicon Vias (TSVs)
    • 4.2.2 through Glass Vias (TGVs)

5 Global 3D IC Market, by Products

  • 5.1 Introduction
  • 5.2 Market by Sub-Segment
    • 5.2.1 CMOS Image Sensors
    • 5.2.2 3D Memory
    • 5.2.3 MEMS & Sensors
    • 5.2.4 Light Emitting Diodes (LEDs)

6 Global 3D ICs Market, By Applications

  • 6.1 Introduction
  • 6.2 Market by Sub-Segment
    • 6.2.1 IT/Telecommunications
    • 6.2.2 Consumer Electronics
    • 6.2.3 Industrial
    • 6.2.4 Aerospace & Defence
    • 6.2.5 Automotive
    • 6.2.6 Medical

7 Global 3D ICs Market, By Region

  • 7.1 Introduction
  • 7.2 Market by Regions
    • 7.2.1 North America
    • 7.2.2 Europe
    • 7.2.3 Asia-Pacific
    • 7.2.4 Middle East & Africa

8 Competitive Landscape

  • 8.1 Introduction
  • 8.2 Competitive Scenario
  • 8.3 Market Share Analysis
  • 8.4 Company Profiles
    • 8.4.1 Xilinx Inc.
      • 8.4.1.1 Company Overview
      • 8.4.1.2 Product/Services Offering
      • 8.4.1.3 Strategy
      • 8.4.1.4 SWOT Analysis
    • 8.4.2 Tezzaron Semiconductor Corporation
      • 8.4.2.1 Company Overview
      • 8.4.2.2 Product/Services Offering
      • 8.4.2.3 Business Strategy
      • 8.4.2.4 SWOT Analysis
    • 8.4.3 BeSang Inc.
      • 8.4.3.1 Company Overview
      • 8.4.3.2 Product/Services Offering
      • 8.4.3.3 Business Strategy
      • 8.4.3.4 SWOT Analysis
    • 8.4.4 Monolithic 3D Inc.
      • 8.4.4.1 Company Overview
      • 8.4.4.2 Product/Services Offering
      • 8.4.4.3 Business Strategy
      • 8.4.4.4 SWOT Analysis
    • 8.4.5 United Microelectronics Corporation
      • 8.4.5.1 Company Overview
      • 8.4.5.2 Product/Services Offering
      • 8.4.5.3 Business Strategy
      • 8.4.5.4 SWOT Analysis
    • 8.4.6 3M Company
      • 8.4.6.1 Overview
    • 8.4.7 Intel Corporation
      • 8.4.7.1 Company Overview
      • 8.4.7.2 Product/Services Offering
    • 8.4.8 IBM Corporation
      • 8.4.8.1 Company Overview

List of Tables

List of Tables:

  • TABLE 1 GLOBAL 3D IC MARKET BY TECHNOLOGY TYPE, 2016-2022 (USD MILLION)
  • TABLE 2 GLOBAL 3D STACKED ICS MARKET, 2016-2022 (USD MILLION)
  • TABLE 3 GLOBAL MONOLITHIC 3D ICS MARKET, 2016-2022 (USD MILLION)
  • TABLE 4 GLOBAL 3D IC MARKET, BY COMPONENT, 2016-2022 (USD MILLION)
  • TABLE 5 GLOBAL THROUGH SILICON VIAS (TSV) IN 3D IC MARKET, 2016-2022 (USD MILLION)
  • TABLE 6 GLOBAL THROUGH GLASS VIAS (TGV) IN 3D IC MARKET, 2016-2022 (USD MILLION)
  • TABLE 7 GLOBAL 3D IC MARKET, BY PRODUCT, 2016-2022 (USD MILLION)
  • TABLE 8 GLOBAL CMOS IMAGE SENSORS (CIS) IN 3D IC MARKET, 2016-2022 (USD MILLION)
  • TABLE 9 GLOBAL 3D MEMORY IN 3D IC MARKET, 2016-2022 (USD MILLION)
  • TABLE 10 GLOBAL MEMS & SENSORS IN 3D IC MARKET, 2016-2022 (USD MILLION)
  • TABLE 11 GLOBAL LIGHT EMITTING DIODES (LEDS) IN 3D IC MARKET, 2016-2022 (USD MILLION)
  • TABLE 12 GLOBAL 3D IC MARKET, BY APPLICATIONS, 2016-2022 (USD MILLION)
  • TABLE 13 GLOBAL IT/TELECOMMUNICATIONS MARKET IN 3D IC, 2016-2022 (USD MILLION)
  • TABLE 14 GLOBAL CONSUMER ELECTRONICS MARKET IN 3D IC, 2016-2022 (USD MILLION)
  • TABLE 15 GLOBAL INDUSTRIAL MARKET IN 3D IC, 2016-2022 (USD MILLION)
  • TABLE 16 GLOBAL AEROSPACE & DEFENSE MARKET IN 3D IC, 2016-2022 (USD MILLION)
  • TABLE 17 GLOBAL AUTOMOTIVE MARKET IN 3D IC, 2016-2022 (USD MILLION)
  • TABLE 18 GLOBAL MEDICAL MARKET IN 3D IC, 2016-2022 (USD MILLION)
  • TABLE 19 GLOBAL 3D ICS MARKET, BY REGION, 2016-2022 (USD MILLION)
  • TABLE 20 NORTH AMERICA 3D IC MARKET BY COUNTRY, 2016-2022 (USD MILLION)
  • TABLE 21 NORTH AMERICA 3D IC MARKET BY TECHNOLOGY TYPE, 2016-2022 (USD MILLION)
  • TABLE 22 NORTH AMERICA 3D IC MARKET BY COMPONENT, 2016-2022 (USD MILLION)
  • TABLE 23 NORTH AMERICA 3D IC MARKET BY PRODUCT, 2016-2022 (USD MILLION)
  • TABLE 24 NORTH AMERICA 3D IC MARKET BY APPLICATION, 2016-2022 (USD MILLION)
  • TABLE 25 EUROPE 3D IC MARKET BY COUNTRY, 2016-2022 (USD MILLION)
  • TABLE 26 EUROPE 3D IC MARKET BY TECHNOLOGY TYPE, 2016-2022 (USD MILLION)
  • TABLE 27 EUROPE 3D IC MARKET BY COMPONENT, 2016-2022 (USD MILLION)
  • TABLE 28 EUROPE 3D IC MARKET BY PRODUCT, 2016-2022 (USD MILLION)
  • TABLE 29 EUROPE 3D IC MARKET BY APPLICATION, 2016-2022 (USD MILLION)
  • TABLE 30 ASIA-PACIFIC 3D IC MARKET BY COUNTRY, 2016-2022 (USD MILLION)
  • TABLE 31 ASIA-PACIFIC 3D IC MARKET BY TECHNOLOGY TYPE, 2016-2022 (USD MILLION)
  • TABLE 32 ASIA-PACIFIC 3D IC MARKET BY COMPONENT, 2016-2022 (USD MILLION)
  • TABLE 33 ASIA-PACIFIC 3D IC MARKET BY PRODUCT, 2016-2022 (USD MILLION)
  • TABLE 34 ASIA-PACIFIC 3D IC MARKET BY APPLICATION, 2016-2022 (USD MILLION)
  • TABLE 35 MIDDLE EAST & AFRICA 3D IC MARKET BY TECHNOLOGY TYPE, 2016-2022 (USD MILLION)
  • TABLE 36 MIDDLE EAST & AFRICA 3D IC MARKET BY COMPONENT, 2016-2022 (USD MILLION)
  • TABLE 37 MIDDLE EAST & AFRICA 3D IC MARKET BY PRODUCT, 2016-2022 (USD MILLION)
  • TABLE 38 MIDDLE EAST & AFRICA 3D IC MARKET BY APPLICATION, 2016-2022 (USD MILLION)

List of Figures

List of Figures:

  • FIGURE 1 GLOBAL 3D ICS MARKET: DRIVERS & CHALLENGES
  • FIGURE 2 GLOBAL 3D IC SUPPLY CHAIN
  • FIGURE 3 GLOBAL 3D IC MARKET: PORTER'S FIVE FORCES ANALYSIS
  • FIGURE 4 GLOBAL 3D IC MARKET BY TECHNOLOGY TYPE, 2016-2022 (USD MILLION)
  • FIGURE 5 GLOBAL 3D STACKED ICS MARKET, 2016 & 2022 (USD MILLION)
  • FIGURE 6 GLOBAL MONOLITHIC 3D ICS MARKET, 2016 & 2022 (USD MILLION)
  • FIGURE 7 GLOBAL 3D IC MARKET, BY COMPONENT, 2016-2022 (USD MILLION)
  • FIGURE 8 GLOBAL THROUGH SILICON VIAS (TSV) IN 3D IC MARKET, 2016 & 2022 (USD MILLION)
  • FIGURE 9 GLOBAL THROUGH GLASS VIAS (TGV) IN 3D IC MARKET, 2016 & 2022 (USD MILLION)
  • FIGURE 10 GLOBAL 3D IC MARKET, BY PRODUCT, 2016-2022 (USD MILLION)
  • FIGURE 11 GLOBAL CMOS IMAGE SENSORS (CIS) IN 3D IC MARKET, 2016 & 2022 (USD MILLION)
  • FIGURE 12 GLOBAL 3D MEMORY IN 3D IC MARKET, 2016 & 2022 (USD MILLION)
  • FIGURE 13 GLOBAL MEMS & SENSORS IN 3D IC MARKET, 2016 & 2022 (USD MILLION)
  • FIGURE 14 GLOBAL LIGHT EMITTING DIODES (LEDS) IN 3D IC MARKET, 2016 & 2022 (USD MILLION)
  • FIGURE 15 GLOBAL 3D IC MARKET, BY APPLICATIONS, 2016-2022 (USD MILLION)
  • FIGURE 16 GLOBAL IT/TELECOMMUNICATIONS MARKET IN 3D IC, 2016 & 2022 (USD MILLION)
  • FIGURE 17 GLOBAL CONSUMER ELECTRONICS MARKET IN 3D IC, 2016 & 2022 (USD MILLION)
  • FIGURE 18 GLOBAL INDUSTRIAL MARKET IN 3D IC, 2016 & 2022 (USD MILLION)
  • FIGURE 19 GLOBAL AEROSPACE & DEFENSE MARKET IN 3D IC, 2016 & 2022 (USD MILLION)
  • FIGURE 20 GLOBAL AUTOMOTIVE MARKET IN 3D IC, 2016 & 2022 (USD MILLION)
  • FIGURE 21 GLOBAL MEDICAL MARKET IN 3D IC, 2016 & 2022 (USD MILLION)
  • FIGURE 22 GLOBAL 3D IC MARKET, BY REGION, 2016-2022 (USD MILLION)
  • FIGURE 23 NORTH AMERICA 3D IC MARKET BY COUNTRY, 2016-2022 (USD MILLION)
  • FIGURE 24 NORTH AMERICA 3D IC MARKET BY TECHNOLOGY TYPE, 2016 & 2022 (%)
  • FIGURE 25 NORTH AMERICA 3D IC MARKET BY COMPONENT, 2016 & 2022 (%)
  • FIGURE 26 NORTH AMERICA 3D IC MARKET BY PRODUCT, 2016 & 2022 (%)
  • FIGURE 27 NORTH AMERICA 3D IC MARKET BY APPLICATION, 2016 & 2022 (%)
  • FIGURE 28 EUROPE 3D IC MARKET BY COUNTRY, 2016-2022 (USD MILLION)
  • FIGURE 29 EUROPE 3D IC MARKET BY TECHNOLOGY TYPE, 2016 & 2022 (%)
  • FIGURE 30 EUROPE 3D IC MARKET BY COMPONENT, 2016 & 2022 (%)
  • FIGURE 31 EUROPE 3D IC MARKET BY PRODUCT, 2016 & 2022 (%)
  • FIGURE 32 EUROPE 3D IC MARKET BY APPLICATION, 2016 & 2022 (%)
  • FIGURE 33 ASIA-PACIFIC 3D IC MARKET BY COUNTRY, 2016-2022 (USD MILLION)
  • FIGURE 34 ASIA-PACIFIC 3D IC MARKET BY TECHNOLOGY TYPE, 2016 & 2022 (%)
  • FIGURE 35 ASIA-PACIFIC 3D IC MARKET BY COMPONENT, 2016 & 2022 (%)
  • FIGURE 36 ASIA-PACIFIC 3D IC MARKET BY PRODUCT, 2016 & 2022 (%)
  • FIGURE 37 ASIA-PACIFIC 3D IC MARKET BY APPLICATION, 2016 & 2022 (%)
  • FIGURE 38 MIDDLE EAST & AFRICA 3D IC MARKET BY TECHNOLOGY TYPE, 2016 & 2022 (%)
  • FIGURE 39 MIDDLE EAST & AFRICA 3D IC MARKET BY COMPONENT, 2016 & 2022 (%)
  • FIGURE 40 MIDDLE EAST & AFRICA 3D IC MARKET BY PRODUCT, 2016 & 2022 (%)
  • FIGURE 41 MIDDLE EAST & AFRICA 3D IC MARKET BY APPLICATION, 2016 & 2022 (%)
  • FIGURE 42 GLOBAL 3D ICS MARKET, COMPETITIVE SECENARIO, 2016
  • FIGURE 43 GLOBAL 3D IC KEY PLAYERS MARKET SHARE, 2016 (%)
  • FIGURE 44 GLOBAL 3D ICS MARKET STRUCTURE
  • FIGURE 45 MRFR RESEARH PROCESS
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