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市場調查報告書

3D IC及2.5D IC封裝的全球市場 - 2022年為止的預測:Logic,成像·光電,記憶體,MEMS/感測器,LED,電力

3D IC and 2.5D IC Packaging Market by Application (Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, Power), Packaging Technology (3D Wafer-Level Chip-Scale Packaging, 3D TSV, 2.5D), End-User Industry, and Region - Global Forecast to 2022

出版商 MarketsandMarkets 商品編碼 421115
出版日期 內容資訊 英文 175 Pages
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3D IC及2.5D IC封裝的全球市場 - 2022年為止的預測:Logic,成像·光電,記憶體,MEMS/感測器,LED,電力 3D IC and 2.5D IC Packaging Market by Application (Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, Power), Packaging Technology (3D Wafer-Level Chip-Scale Packaging, 3D TSV, 2.5D), End-User Industry, and Region - Global Forecast to 2022
出版日期: 2017年01月06日 內容資訊: 英文 175 Pages
簡介

一般認為3D IC及2.5D IC封裝市場將在2022年之前擴大到1,704億6000萬美元的規模。市場預測在2016年∼2022年間,將以年複合成長率 (CAGR) 38.30%的速度成長。

本報告提供全球3D IC及2.5D IC封裝市場相關調查分析,提供您市場概要,產業趨勢,各市場區隔的市場分析,競爭情形,主要企業等相關的系統性資訊。

第1章 簡介

第2章 調查手法

第3章 摘要整理

第4章 重要考察

  • 3D IC及2.5D IC封裝市場機會
  • 記憶體用3D IC及2.5D IC封裝市場:各終端用戶產業
  • 家用電器產品用3D IC及2.5D IC封裝市場:各封裝技術
  • 3D IC及2.5D IC封裝市場各地區概述
  • 亞太地區的3D IC及2.5D IC封裝市場:各國

第5章 3D IC及2.5D IC封裝的全球市場:概要

  • 簡介
  • 市場區隔
  • 市場動態
    • 推動因素
    • 阻礙因素
    • 機會
    • 課題

第6章 3D IC及2.5D IC封裝的全球市場:產業趨勢

  • 簡介
  • 供應鏈分析
  • 技術趨勢
  • 波特的五力分析

第7章 3D IC及2.5D IC封裝的全球市場:各封裝技術

  • 簡介
  • 3D WLCSP
  • 3D TSV
  • 2.5D

第8章 3D IC及2.5D IC封裝的全球市場:各用途

  • 簡介
  • Logic
  • 成像·光電
  • 記憶體
  • MEMS/感測器
  • LED
  • 電力,類比·混合信號,RF,光電

第9章 3D IC及2.5D IC封裝的全球市場:各終端用戶產業

  • 簡介
  • 家用電器產品
  • 通訊
  • 工業部門
  • 汽車
  • 軍事·航太
  • 智慧技術
  • 醫療設備

第10章 3D IC及2.5D IC封裝的全球市場:各地區

  • 簡介
  • 亞太地區
  • 北美
  • 歐洲
  • 其他

第11章 競爭情形

  • 概要
  • 主要企業
  • 競爭情形與趨勢

第12章 企業簡介

  • 簡介
  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
  • SAMSUNG ELECTRONICS CO., LTD.
  • 東芝
  • ASE GROUP
  • AMKOR TECHNOLOGY
  • UNITED MICROELECTRONICS CORP.
  • STMICROELECTRONICS NV
  • BROADCOM LTD.
  • INTEL CORPORATION
  • JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

第13章 附錄

目錄
Product Code: SE 4844

3D IC and 2.5D IC packaging market is projected to grow at a CAGR of 38.30% between 2016 and 2022

The 3D IC and 2.5D IC packaging market has entered the growth phase and is expected to grow further in the coming years. The market is expected to be worth USD 170.46 billion in 2022, at a CAGR of 38.30% between 2016 and 2022. The drivers for this market are the increasing need for advanced architecture in electronic products, rising trend of miniaturization of electronic devices, and growing market for tablets, smartphones, and gaming devices. The main restraint for this market is created by the thermal issues caused by higher levels of integration.

3D TSV in 3D IC and 2.5D IC packaging market is estimated to grow at the highest CAGR during the forecast period

The 3D TSV market is expected to grow at the highest CAGR during the forecast period. The major factors driving the 3D IC and 2.5D IC packaging market for 3D TSV include highest interconnect density and greater space efficiencies in 3D TSV compared to all other types of advanced packaging such as 3D WLCSP and 2.5 D.

Logic market held the largest share of the 3D IC and 2.5D IC packaging market in 2015

The demand for 3D IC and 2.5D IC packages in logic is growing because of the high product availability. An increasing number of manufacturers in this market offer innovative products with advanced packaging. For instance, Intel Corp. (U.S.) is driving the market for advanced packaging in field programmable gate arrays (FPGA). Global companies started introducing 3D logic ICs in different programmable logics to ensure operational efficiency with added convenience and increased productivity.

APAC is expected to be the fastest-growing market for 3D IC and 2.5D IC packaging during the forecast period

The market in APAC is expected to grow at the highest CAGR because there is a high demand for 3D IC and 2.5D IC packaging technology from the growing consumer electronics sector in this region, particularly for smartphones and tablets. The presence of major 3D IC and 2.5D IC packaging manufacturers and suppliers in this region helps to decrease the time to market for 3D IC and 2.5D IC packaging products. This makes the integration of 3D IC and 2.5D IC packaging technology in the APAC region much easier.

Breakdown of Profiles of Primary Participants:

  • By Company: Tier 1 - 45 %, Tier 2 - 32%, and Tier 3 - 23%
  • By Designation: C-Level Executives - 25%, Directors - 32%, and Others - 43%
  • By Region: North America - 25%, Europe - 37%, APAC - 28%, and RoW - 10%

The major players profiled in this report include:

  • Taiwan Semiconductor Manufacturing Company Limited (Taiwan)
  • Samsung Electronics Co., Ltd. (South Korea)
  • Toshiba Corp. (Japan)
  • Pure Storage Inc. (U.S.)
  • ASE Group (Taiwan)
  • Amkor Technology (U.S.)
  • United Microelectronics Corp. (Taiwan)
  • STMicroelectronics NV (Switzerland)
  • Broadcom Ltd. (Singapore)
  • Intel Corporation. (U.S.)
  • Jiangsu Changing Electronics Technology Co., Ltd. (China)

Research Coverage:

The study segments in the 3D IC and 2.5D IC packages market report are packaging technology which includes 3D wafer-level chip-scale packaging (WLCSP), 3D TSV, and 2.5D; application which includes logic, imaging and optoelectronics, memory, MEMS/sensors, LED, power, analog and mixed signal, RF, and photonics. The study also covers end-user industry and geographic forecast of the market size for various segments with regard to four main regions, namely, Asia-Pacific, North America, Europe, and RoW.

Reasons to Buy the Report:

The report would help the market leaders/new entrants in this market in the following ways:

  • 1. This report segments the 3D IC and 2.5D IC packages market comprehensively and provides the closest approximations of the overall market size and those of the subsegments across different applications and regions.
  • 2. The report helps stakeholders to understand the pulse of the market and provides them information on key market drivers, restraints, challenges, and opportunities.
  • 3. This report would help stakeholders to understand their competitors better and gain more insights to enhance their position in the business. The competitive landscape section includes competitor ecosystem, new product developments, partnerships, and mergers and acquisitions in the market.

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. OBJECTIVES OF THE STUDY
  • 1.2. MARKET DEFINITION
  • 1.3. STUDY SCOPE
    • 1.3.1. MARKETS COVERED
    • 1.3.2. YEARS CONSIDERED FOR THE STUDY
  • 1.4. CURRENCY
  • 1.5. LIMITATIONS
  • 1.6. STAKEHOLDERS

2. RESEARCH METHODOLOGY

  • 2.1. RESEARCH DATA
    • 2.1.1. SECONDARY DATA
      • 2.1.1.1. List of major secondary sources
      • 2.1.1.2. Key data from secondary sources
    • 2.1.2. PRIMARY DATA
      • 2.1.2.1. KEY DATA FROM PRIMARY SOURCES
      • 2.1.2.2. Breakdown of primaries
    • 2.1.3. SECONDARY AND PRIMARY RESEARCH
      • 2.1.3.1. Key industry insights
  • 2.2. MARKET SIZE ESTIMATION
  • 2.3. BOTTOM-UP APPROACH
  • 2.4. APPROACH FOR CAPTURING THE MARKET SHARE BY BOTTOM-UP ANALYSIS (DEMAND SIDE)
  • 2.5. TOP-DOWN APPROACH
    • 2.5.1. APPROACH FOR CAPTURING THE MARKET SHARE BY TOP-DOWN ANALYSIS (SUPPLY SIDE)
  • 2.6. MARKET BREAKDOWN AND DATA TRIANGULATION
  • 2.7. RESEARCH ASSUMPTIONS

3. EXECUTIVE SUMMARY

4. PREMIUM INSIGHTS

  • 4.1. 3D IC AND 2.5D IC PACKAGING MARKET OPPORTUNITIES
  • 4.2. 3D IC AND 2.5D IC PACKAGING MARKET FOR MEMORY APPLICATION, BY END-USER INDUSTRY
  • 4.3. CONSUMER ELECTRONICS 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY
  • 4.4. GEOGRAPHIC SNAPSHOT OF THE 3D IC AND 2.5D IC PACKAGING MARKET
  • 4.5. 3D IC AND 2.5D IC PACKAGING MARKET IN APAC, BY COUNTRY

5. MARKET OVERVIEW

  • 5.1. INTRODUCTION
  • 5.2. MARKET SEGMENTATION
    • 5.2.1. BY PACKAGING TECHNOLOGY
    • 5.2.2. BY APPLICATION
    • 5.2.3. BY END-USER INDUSTRY
    • 5.2.4. BY REGION
  • 5.3. MARKET DYNAMICS
    • 5.3.1. DRIVERS
      • 5.3.1.1. Increasing need for advanced architecture in electronic products
      • 5.3.1.2. Rising trend of miniaturization of electronics devices
      • 5.3.1.3. Growing market for smartphones, tablets, and gaming devices
    • 5.3.2. RESTRAINTS
      • 5.3.2.1. Higher level of integration results in thermal issues
      • 5.3.2.2. High unit cost of 3D IC and 2.5D IC packages
    • 5.3.3. OPPORTUNITIES
      • 5.3.3.1. Growing adoption of high-end computing, servers, and data centers
    • 5.3.4. CHALLENGES
      • 5.3.4.1. Effective supply chain management

6. INDUSTRY TRENDS

  • 6.1. INTRODUCTION
  • 6.2. SUPPLY CHAIN ANALYSIS
  • 6.3. TECHNOLOGY TRENDS
  • 6.4. PORTER'S FIVE FORCES ANALYSIS
    • 6.4.1. THREAT OF NEW ENTRANTS
    • 6.4.2. THREAT 0F SUBSTITUTES
    • 6.4.3. BARGAINING POWER OF BUYERS
    • 6.4.4. BARGAINING POWER OF SUPPLIERS
    • 6.4.5. INTENSITY OF COMPETITIVE RIVALRY

7. MARKET, BY PACKAGING TECHNOLOGY

  • 7.1. INTRODUCTION
  • 7.2. 3D WAFER-LEVEL CHIP-SCALE PACKAGING (WLCSP)
  • 7.3. 3D TSV
  • 7.4. 2.5D

8. MARKET, BY APPLICATION

  • 8.1. INTRODUCTION
  • 8.2. LOGIC
  • 8.3. IMAGING & OPTOELECTRONICS
  • 8.4. MEMORY
  • 8.5. MEMS/SENSORS
  • 8.6. LED
  • 8.7. POWER, ANALOG & MIXED SIGNAL, RF, PHOTONICS

9. MARKET, BY END-USER INDUSTRY

  • 9.1. INTRODUCTION
  • 9.2. CONSUMER ELECTRONICS
  • 9.3. TELECOMMUNICATION
  • 9.4. INDUSTRIAL SECTOR
  • 9.5. AUTOMOTIVE
  • 9.6. MILITARY & AEROSPACE
  • 9.7. SMART TECHNOLOGIES
  • 9.8. MEDICAL DEVICES

10. GEOGRAPHIC ANALYSIS

  • 10.1. INTRODUCTION
  • 10.2. APAC
    • 10.2.1. CHINA
    • 10.2.2. JAPAN
    • 10.2.3. TAIWAN
    • 10.2.4. SOUTH KOREA
    • 10.2.5. REST OF APAC
  • 10.3. NORTH AMERICA
    • 10.3.1. U.S.
    • 10.3.2. CANADA
    • 10.3.3. MEXICO
  • 10.4. EUROPE
    • 10.4.1. U.K.
    • 10.4.2. GERMANY
    • 10.4.3. FRANCE
    • 10.4.4. REST OF EUROPE
  • 10.5. REST OF THE WORLD
    • 10.5.1. MIDDLE EAST & AFRICA
    • 10.5.2. SOUTH AMERICA

11. COMPETITIVE LANDSCAPE

  • 11.1. OVERVIEW
  • 11.2. KEY PLAYERS IN THE 3D IC AND 2.5D IC PACKAGING MARKET
  • 11.3. COMPETITIVE SITUATIONS AND TRENDS
    • 11.3.1. PARTNERSHIPS, AGREEMENTS, JOINT VENTURES, AND COLLABORATIONS
    • 11.3.2. NEW PRODUCT LAUNCHES AND DEVELOPMENTS
    • 11.3.3. INVESTMENTS AND EXPANSIONS
    • 11.3.4. ACQUISITIONS

12. COMPANY PROFILES (Business Overview, Products & Services, Key Insights, Recent Developments, SWOT Analysis, Ratio Analysis, MnM View)*

  • 12.1. INTRODUCTION
  • 12.2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED (TAIWAN)
  • 12.3. SAMSUNG ELECTRONICS CO., LTD. (SOUTH KOREA)
  • 12.4. TOSHIBA CORP. (JAPAN)
  • 12.5. ASE GROUP (TAIWAN)
  • 12.6. AMKOR TECHNOLOGY (U.S.)
  • 12.7. UNITED MICROELECTRONICS CORP. (TAIWAN)
  • 12.8. STMICROELECTRONICS NV (SWITZERLAND).
  • 12.9. BROADCOM LTD. (SINGAPORE)
  • 12.10. INTEL CORPORATION. (U.S.)
  • 12.11. JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD (CHINA)

*Details on Business Overview, Products & Services, Key Insights, Recent Developments, SWOT Analysis, MnM View might not be captured in case of unlisted companies.

13. APPENDIX

  • 13.1. INSIGHTS OF INDUSTRY EXPERTS
  • 13.2. QUESTIONNAIRE
  • 13.3. KNOWLEDGE STORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
  • 13.4. INTRODUCING RT: REAL TIME MARKET INTELLIGENCE
  • 13.5. AVAILABLE CUSTOMIZATIONS
  • 13.6. RELATED REPORT
  • 13.7. AUTHOR DETAILS

LIST OF TABLES

  • TABLE 1: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2013-2022 (USD MILLION)
  • TABLE 2: 3D IC AND 2.5D IC PACKAGING MARKET FOR 3D WLCSP, BY END-USER INDUSTRY, 2013-2022 (USD MILLION)
  • TABLE 3: 3D IC AND 2.5D IC PACKAGING MARKET FOR 3D TSV, BY END-USER INDUSTRY, 2013-2022 (USD MILLION)
  • TABLE 4: 3D IC AND 2.5D IC PACKAGING MARKET FOR 2.5D, BY END-USER INDUSTRY, 2013-2022 (USD MILLION)
  • TABLE 5: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2013-2022 (USD MILLION)
  • TABLE 6: 3D IC AND 2.5D IC WAFER (12" EQ.) MARKET, BY APPLICATION, 2013-2022 (THOUSAND UNITS)
  • TABLE 7: 3D IC AND 2.5D IC PACKAGING MARKET FOR LOGIC APPLICATION, BY END-USER INDUSTRY, 2013-2022 (USD MILLION)
  • TABLE 8: 3D IC AND 2.5D IC PACKAGING MARKET FOR IMAGING & OPTOELECTRONICS APPLICATION, BY END-USER INDUSTRY, 2013-2022 (USD MILLION)
  • TABLE 9: 3D IC AND 2.5D IC PACKAGING MARKET FOR MEMORY, BY END-USER INDUSTRY, 2013-2022 (USD MILLION)
  • TABLE 10: 3D IC AND 2.5D IC PACKAGING MARKET FOR MEMS/SENSORS, BY END-USER INDUSTRY, 2013-2022 (USD MILLION)
  • TABLE 11: 3D IC AND 2.5D IC PACKAGING MARKET FOR LED, BY END-USER INDUSTRY, 2013-2022 (USD MILLION)
  • TABLE 12: 3D IC AND 2.5D IC PACKAGING MARKET FOR POWER, ANALOG & MIXED SIGNAL, RF, PHOTONICS, BY END-USER INDUSTRY, 2013-2022 (USD MILLION)
  • TABLE 13: 3D IC AND 2.5D IC PACKAGING MARKET, BY END-USER INDUSTRY, 2013-2022 (USD MILLION)
  • TABLE 14: 3D IC AND 2.5D IC PACKAGING MARKET FOR CONSUMER ELECTRONICS, BY APPLICATION, 2013-2022 (USD MILLION)
  • TABLE 15: 3D IC AND 2.5D IC PACKAGING MARKET FOR CONSUMER ELECTRONICS, BY PACKAGING TECHNOLOGY, 2013-2022 (USD MILLION)
  • TABLE 16: 3D IC AND 2.5D IC PACKAGING MARKET FOR CONSUMER ELECTRONICS, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 17: 3D IC AND 2.5D IC PACKAGING MARKET FOR TELECOMMUNICATION, BY APPLICATION, 2013-2022 (USD MILLION)
  • TABLE 18: 3D IC AND 2.5D IC PACKAGING MARKET FOR TELECOMMUNICATION, BY PACKAGING TECHNOLOGY, 2013-2022 (USD MILLION)
  • TABLE 19: 3D IC AND 2.5D IC PACKAGING MARKET FOR TELECOMMUNICATION, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 20: 3D IC AND 2.5D IC PACKAGING MARKET FOR INDUSTRIAL SECTOR, BY APPLICATION, 2013-2022 (USD MILLION)
  • TABLE 21: 3D IC AND 2.5D IC PACKAGING MARKET FOR INDUSTRIAL SECTOR, BY PACKAGING TECHNOLOGY, 2013-2022 (USD MILLION)
  • TABLE 22: 3D IC AND 2.5D IC PACKAGING MARKET FOR INDUSTRIAL SECTOR, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 23: 3D IC AND 2.5D IC PACKAGING MARKET FOR AUTOMOTIVE, BY APPLICATION, 2013-2022 (USD MILLION)
  • TABLE 24: 3D IC AND 2.5D IC PACKAGING MARKET FOR AUTOMOTIVE, BY PACKAGING TECHNOLOGY, 2013-2022 (USD MILLION)
  • TABLE 25: 3D IC AND 2.5D IC PACKAGING MARKET FOR AUTOMOTIVE, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 26: 3D IC AND 2.5D IC PACKAGING MARKET FOR MILITARY & AEROSPACE, BY APPLICATION, 2013-2022 (USD MILLION)
  • TABLE 27: 3D IC AND 2.5D IC PACKAGING MARKET FOR MILITARY & AEROSPACE, BY PACKAGING TECHNOLOGY, 2013-2022 (USD MILLION)
  • TABLE 28: 3D IC AND 2.5D IC PACKAGING MARKET FOR MILITARY & AEROSPACE, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 29: 3D IC AND 2.5D IC PACKAGING MARKET FO R SMART TECHNOLOGIES, BY APPLICATION, 2013-2022 (USD MILLION)
  • TABLE 30: 3D IC AND 2.5D IC PACKAGING MARKET FOR SMART TECHNOLOGIES, BY PACKAGING TECHNOLOGY, 2013-2022 (USD MILLION)
  • TABLE 31: 3D IC AND 2.5D IC PACKAGING MARKET FOR SMART TECHNOLOGIES, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 32: 3D IC AND 2.5D IC PACKAGING MARKET FOR MEDICAL DEVICES, BY APPLICATION, 2013-2022 (USD MILLION)
  • TABLE 33: 3D IC AND 2.5D IC PACKAGING MARKET FOR MEDICAL DEVICES, BY PACKAGING TECHNOLOGY, 2013-2022 (USD MILLION)
  • TABLE 34: 3D IC AND 2.5D IC PACKAGING MARKET FOR MEDICAL DEVICES, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 35: 3D IC AND 2.5D IC PACKAGING MARKET, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 36: 3D IC AND 2.5D IC PACKAGING MARKET IN APAC, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 37: 3D IC AND 2.5D IC PACKAGING MARKET IN APAC, BY END-USER INDUSTRY, 2013-2022 (USD MILLION)
  • TABLE 38: 3D IC AND 2.5D IC PACKAGING MARKET FOR CONSUMER ELECTRONICS IN APAC, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 39: 3D IC AND 2.5D IC PACKAGING MARKET FOR TELECOMMUNICATION IN APAC, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 40: 3D IC AND 2.5D IC PACKAGING MARKET FOR INDUSTRIAL SECTOR IN APAC, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 41: 3D IC AND 2.5D IC PACKAGING MARKET FOR AUTOMOTIVE IN APAC, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 42: 3D IC AND 2.5D IC PACKAGING MARKET FOR MILITARY & AEROSPACE IN APAC, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 43: 3D IC AND 2.5D IC PACKAGING MARKET FOR SMART TECHNOLOGIES IN APAC, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 44: 3D IC AND 2.5D IC PACKAGING MARKET FOR MEDICAL DEVICES IN APAC, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 45: 3D IC AND 2.5D IC PACKAGING MARKET IN NORTH AMERICA, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 46: 3D IC AND 2.5D IC PACKAGING MARKET IN NORTH AMERICA, BY END-USER INDUSTRY, 2013-2022 (USD MILLION)
  • TABLE 47: CONSUMER ELECTRONICS 3D IC AND 2.5D IC PACKAGING MARKET IN NORTH AMERICA, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 48: 3D IC AND 2.5D IC PACKAGING MARKET FOR TELECOMMUNICATION IN NORTH AMERICA, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 49: 3D IC AND 2.5D IC PACKAGING MARKET FOR INDUSTRIAL SECTOR IN NORTH AMERICA, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 50: AUTOMOTIVE 3D IC AND 2.5D IC PACKAGING MARKET IN NORTH AMERICA, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 51: MILITARY & AEROSPACE 3D IC AND 2.5D IC PACKAGING MARKET IN NORTH AMERICA, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 52: 3D IC AND 2.5D IC PACKAGING MARKET FOR SMART TECHNOLOGIES IN CANADA EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD
  • TABLE 53: 3D IC AND 2.5D IC PACKAGING MARKET FOR SMART TECHNOLOGIES IN NORTH AMERICA, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 54: 3D IC AND 2.5D IC PACKAGING MARKET FOR MEDICAL DEVICES IN NORTH AMERICA, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 55: 3D IC AND 2.5D IC PACKAGING MARKET IN EUROPE, BY END-USER INDUSTRY, 2013-2022 (USD MILLION)
  • TABLE 56: 3D IC AND 2.5D IC PACKAGING MARKET IN EUROPE, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 57: 3D IC AND 2.5D IC PACKAGING MARKET FOR CONSUMER ELECTRONICS IN EUROPE, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 58: 3D IC AND 2.5D IC PACKAGING MARKET FOR TELECOMMUNICATION IN EUROPE, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 59: 3D IC AND 2.5D IC PACKAGING MARKET IN EUROPE FOR INDUSTRIAL SECTOR, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 60: 3D IC AND 2.5D IC PACKAGING MARKET FOR AUTOMOTIVE IN EUROPE, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 61: 3D IC AND 2.5D IC PACKAGING MARKET FOR MILITARY & AEROSPACE IN EUROPE, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 62: 3D IC AND 2.5D IC PACKAGING MARKET FOR SMART TECHNOLOGIES IN EUROPE, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 63: 3D IC AND 2.5D IC PACKAGING MARKET FOR MEDICAL DEVICES IN EUROPE, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 64: 3D IC AND 2.5D IC PACKAGING MARKET IN ROW, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 65: 3D IC AND 2.5D IC PACKAGING MARKET IN ROW, BY END-USER INDUSTRY, 2013-2022 (USD MILLION)
  • TABLE 66: 3D IC AND 2.5D IC PACKAGING MARKET FOR CONSUMER ELECTRONICS IN ROW, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 67: 3D IC AND 2.5D IC PACKAGING MARKET FOR TELECOMMUNICATION IN ROW, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 68: 3D IC AND 2.5D IC PACKAGING MARKET FOR INDUSTRIAL SECTOR IN ROW, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 69: 3D IC AND 2.5D IC PACKAGING MARKET FOR AUTOMOTIVE IN ROW, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 70: 3D IC AND 2.5D IC PACKAGING MARKET FOR MILITARY & AEROSPACE IN ROW, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 71: 3D IC AND 2.5D IC PACKAGING MARKET FOR SMART TECHNOLOGIES IN ROW, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 72: 3D IC AND 2.5D IC PACKAGING MARKET FOR MEDICAL DEVICES IN ROW, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 73: PARTNERSHIPS, AGREEMENTS, JOINT VENTURES, AND COLLABORATIONS (2014-2016)
  • TABLE 74: NEW PRODUCT LAUNCHES AND DEVELOPMENTS (2013-2016)
  • TABLE 75: INVESTMENTS AND EXPANSIONS (2013-2016)
  • TABLE 76: ACQUISITIONS (2015-2016)

LIST OF FIGURES

  • FIGURE 1: 3D IC AND 2.5D IC PACKAGING MARKET SEGMENTATION
  • FIGURE 2: 3D IC AND 2.5D IC PACKAGING MARKET: RESEARCH DESIGN
  • FIGURE 3: MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH
  • FIGURE 4: MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH
  • FIGURE 5: DATA TRIANGULATION
  • FIGURE 6: 3D IC AND 2.5D IC PACKAGING MARKET FOR MEMORY APPLICATION EXPECTED TO GROW AT THE HIGHEST RATE BETWEEN 2016 AND 2022
  • FIGURE 7: MEMORY SHIPMENT MARKET IS EXPECTED TO GROW AT THE HIGHEST CAGR BETWEEN 2016 AND 2022
  • FIGURE 8: MARKET FOR 3D TSV PACKAGING TECHNOLOGY EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD
  • FIGURE 9: MARKET FOR SMART TECHNOLOGIES INDUSTRY EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD
  • FIGURE 10: APAC ACCOUNTED FOR THE LARGEST MARKET SHARE IN 2015
  • FIGURE 11: 3D IC AND 2.5D IC PACKAGING MARKET TO PROVIDE ATTRACTIVE OPPORTUNITIES DURING THE FORECAST PERIOD
  • FIGURE 12: 3D IC AND 2.5D IC PACKAGING MARKET FOR MEMORY APPLICATION IN AUTOMOTIVE INDUSTRY TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD
  • FIGURE 13: MARKET FOR 3D TSV TECHNOLOGY FOR CONSUMER ELECTRONICS INDUSTRY EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD
  • FIGURE 14: 3D IC AND 2.5D IC PACKAGING MARKET IN CHINA EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD
  • FIGURE 15: CHINESE MARKET EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD
  • FIGURE 16: GEOGRAPHIC SEGMENTATION OF THE 3D IC AND 2.5D IC PACKAGING MARKET
  • FIGURE 17: RISING TREND OF MINIATURIZATION OF ELECTRONIC DEVICES IS THE MAJOR DRIVER FOR THE 3D IC AND 2.5D IC PACKAGING MARKET
  • FIGURE 18: SHIPMENTS OF SMARTPHONES WORLDWIDE, 2013-2019 (MILLION UNITS)
  • FIGURE 19: SUPPLY CHAIN: 3D IC AND 2.5D IC PACKAGING MARKET
  • FIGURE 20: KEY TECHNOLOGY TRENDS IN THE 3D IC AND 2.5D IC PACKAGING MARKET
  • FIGURE 21: PORTER'S FIVE FORCES ANALYSIS (2015)
  • FIGURE 22: PORTER'S FIVE FORCES ANALYSIS FOR THE 3D IC AND 2.5D IC PACKAGING MARKET, 2015
  • FIGURE 23: IMPACT OF THREAT OF NEW ENTRANTS CONSIDERED TO BE LOW
  • FIGURE 24: IMPACT OF THREAT OF SUBSTITUTES CONSIDERED TO BE MEDIUM
  • FIGURE 25: IMPACT OF BARGAINING POWER OF BUYERS CONSIDERED TO BE MEDIUM
  • FIGURE 26: IMPACT OF BARGAINING POWER OF SUPPLIERS CONSIDERED TO BE HIGH
  • FIGURE 27: IMPACT OF INTENSITY OF COMPETITIVE RIVALRY CONSIDERED TO BE MEDIUM
  • FIGURE 28: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY
  • FIGURE 29: MARKET FOR 3D TSV EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD
  • FIGURE 30: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION
  • FIGURE 31: 3D IC AND 2.5D IC PACKAGING MARKET FOR MEMORY EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD
  • FIGURE 32: MARKET FOR IMAGING & OPTOELECTRONICS IN AUTOMOTIVE INDUSTRY EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD
  • FIGURE 33: MARKET FOR LED IN SMART TECHNOLOGIES INDUSTRY EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD
  • FIGURE 34: 3D IC AND 2.5D IC PACKAGING MARKET, BY END-USER INDUSTRY
  • FIGURE 35: 3D IC AND 2.5D IC PACKAGING MARKET FOR SMART TECHNOLOGIES EXPECTED TO GROW AT THE HIGHEST RATE DURING FORECAST PERIOD
  • FIGURE 36: MARKET FOR MEMORY APPLICATION IN TELECOMMUNICATION INDUSTRY EXPECTED TO GROW AT THE HIGHEST RATE DURING FORECAST PERIOD
  • FIGURE 37: MARKET FOR TELECOMMUNICATION INDUSTRY IN APAC EXPECTED TO GROW AT THE HIGHEST RATE DURING FORECAST PERIOD
  • FIGURE 38: MARKET FOR MEMORY APPLICATION IN INDUSTRIAL SECTOR EXPECTED TO GROW AT THE HIGHEST RATE DURING FORECAST PERIOD
  • FIGURE 39: MARKET FOR MEMORY IN AUTOMOTIVE INDUSTRY EXPECTED TO GROW AT THE HIGHEST RATE DURING FORECAST PERIOD
  • FIGURE 40: MARKET FOR AUTOMOTIVE INDUSTRY IN NORTH AMERICA EXPECTED TO GROW AT THE HIGHEST RATE DURING FORECAST PERIOD
  • FIGURE 41: MARKET FOR MILITARY AND AEROSPACE INDUSTRY IN APAC TO GROW AT THE HIGHEST RATE DURING FORECAST PERIOD
  • FIGURE 42: MARKET FOR MEMORY APPLICATION IN SMART TECHNOLOGIES EXPECTED TO GROW AT THE HIGHEST RATE DURING FORECAST PERIOD
  • FIGURE 43: MARKET FOR 3D TSV IN MEDICAL DEVICES INDUSTRY EXPECTED TO GROW AT THE HIGHEST RATE DURING FORECAST PERIOD
  • FIGURE 44: 3D IC AND 2.5D IC PACKAGING MARKET IN APAC EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD
  • FIGURE 45: APAC: 3D IC AND 2.5D IC PACKAGING MARKET SNAPSHOT
  • FIGURE 46: 3D IC AND 2.5D IC PACKAGING MARKET IN CHINA EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD
  • FIGURE 47: 3D IC AND 2.5D IC PACKAGING MARKET FOR TELECOMMUNICATION IN CHINE EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD.
  • FIGURE 48: CHINESE 3D IC AND 2.5D IC PACKAGING MARKET IN MILITARY & AEROSPACE EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD
  • FIGURE 49: NORTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET SNAPSHOT
  • FIGURE 50: 3D IC AND 2.5D IC PACKAGING MARKET IN NORTH AMERICA FOR SMART TECHNOLOGIES EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD
  • FIGURE 51: 3D IC AND 2.5D IC PACKAGING MARKET FOR TELECOMMUNICATION IN CANADA EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD.
  • FIGURE 52: EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET SNAPSHOT
  • FIGURE 53: 3D IC AND 2.5D IC PACKAGING MARKET IN FRANCE EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD
  • FIGURE 54: 3D IC AND 2.5D IC PACKAGING MARKET FOR MILITARY & AEROSPACE IN FRANCE EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD
  • FIGURE 55: ROW: 3D IC AND 2.5D IC PACKAGING MARKET SNAPSHOT
  • FIGURE 56: 3D IC AND 2.5D IC PACKAGING MARKET FOR INDUSTRIAL SECTOR IN SOUTH AMERICA EXPECTED TO GROW AT A HIGHEST RATE DURING THE FORECAST PERIOD
  • FIGURE 57: 3D IC AND 2.5D IC PACKAGING MARKET FOR MEDICAL DEVICES IN SOUTH AMERICA EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD
  • FIGURE 58: COMPANIES ADOPTED NEW PRODUCT LAUNCHES/DEVELOPMENTS AND COLLABORATIONS AS THE KEY GROWTH STRATEGIES BETWEEN 2012-2016
  • FIGURE 59: RANKING ANALYSIS FOR THE TOP 5 PLAYERS IN THE 3D IC AND 2.5D IC PACKAGING MARKET
  • FIGURE 60: BATTLE FOR MARKET SHARE: PARTNERSHIPS, AGREEMENTS, JOINT VENTURES, AND COLLABORATIONS WERE THE KEY STRATEGIES ADOPTED
  • FIGURE 61: GEOGRAPHIC REVENUE MIX OF THE TOP 5 MARKET PLAYERS
  • FIGURE 62: TSMC LTD. (TAIWAN): COMPANY SNAPSHOT
  • FIGURE 63: TSMC LTD. (TAIWAN): SWOT ANALYSIS
  • FIGURE 64: SAMSUNG ELECTRONICS CO., LTD. (SOUTH KOREA): COMPANY SNAPSHOT
  • FIGURE 65: SAMSUNG ELECTRONICS CO., LTD. (SOUTH KOREA): SWOT ANALYSIS
  • FIGURE 66: TOSHIBA CORP. (JAPAN): COMPANY SNAPSHOT
  • FIGURE 67: TOSHIBA CORP. (JAPAN): SWOT ANALYSIS
  • FIGURE 68: ASE GROUP (TAIWAN): COMPANY SNAPSHOT
  • FIGURE 69: ASE GROUP (TAIWAN): COMPANY SNAPSHOT
  • FIGURE 70: AMKOR TECHNOLOGY (U.S.): COMPANY SNAPSHOT
  • FIGURE 71: AMKOT TECHNOLOGY (U.S.): SWOT ANALYSIS
  • FIGURE 72: UNITED MICROELECTRONICS CORP. (TAIWAN): COMPANY SNAPSHOT
  • FIGURE 73: STMICROELECTRONICS NV (SWITZERLAND): BUSINESS OVERVIEW
  • FIGURE 74: BROADCOM LTD (SINGAPORE): COMPANY SNAPSHOT
  • FIGURE 75: INTEL CORPORATION (U.S.): BUSINESS OVERVIEW
  • FIGURE 76: JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD. (CHINA): COMPANY SNAPSHOT
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