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市場調查報告書

HMC (混合記憶體立方體)、HBM (寬帶記憶體)的全球市場的預測 ∼2023年:記憶體的各類型 (HMC、HBM)、各產品種類 (GPU、CPU、APU、FPGA、ASIC)、各用途 (圖形、高性能運算、網路、資料中心)、各地區

Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market by Memory Type (HMC and HBM), Product type (GPU, CPU, APU, FPGA, ASIC), Application (Graphics, High-performance Computing, Networking, Data Centers), and Geography - Global Forecast to 2023

出版商 MarketsandMarkets 商品編碼 356156
出版日期 內容資訊 英文 136 Pages
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HMC (混合記憶體立方體)、HBM (寬帶記憶體)的全球市場的預測 ∼2023年:記憶體的各類型 (HMC、HBM)、各產品種類 (GPU、CPU、APU、FPGA、ASIC)、各用途 (圖形、高性能運算、網路、資料中心)、各地區 Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market by Memory Type (HMC and HBM), Product type (GPU, CPU, APU, FPGA, ASIC), Application (Graphics, High-performance Computing, Networking, Data Centers), and Geography - Global Forecast to 2023
出版日期: 2018年03月06日 內容資訊: 英文 136 Pages
簡介

全球HMC、HBM的市場,預計2018年達9億2270萬美元,2022年達38億4250萬美元,以33.02%的年複合成長率 (CAGR) 成長。市場成長的主要原因,是高頻寬、省電力、高擴充性記憶體的需求增加,及人工智能 (AI)的普及,電子設備的小型化等。另一方面,設計的困難成為市場成長的瓶頸。

本報告提供全球HMC (混合記憶體立方體) 及HBM (寬帶記憶體)的市場調查,產品定義與市場概要,產業結構與價值鏈,市場規模的變化與預測,市場成長的影響因素,各記憶體/產品類型、各用途、各地區的詳細趨勢,競爭環境,主要企業簡介等彙整。

第1章 簡介

第2章 調查手法

第3章 摘要整理

第4章 重要考察

第5章 市場概要

  • 簡介
  • 市場動態
    • 成長推動因素
      • 頻寬高,消耗功率少,擴充性高的記憶體的需求增加
      • 人工智能 (AI)的普及
      • 電子設備小型化的發展
    • 阻礙成長要素
      • 集積等級的上升伴隨的熱處理問題
    • 市場機會
      • 雲端基礎、服務的需求增加
      • 巨量資料的成長
    • 課題
      • HMC、HBM的設計的複雜
      • 生態系統的開發
  • 價值鏈分析

第6章 HMC、HBM市場:記憶體的各類型

  • 簡介
  • HMC (混合記憶體立方體)
  • HBM (寬帶記憶體)

第6章 HMC、HBM市場:各類型產品

  • 簡介
  • CPU (中央處理器)
  • FPGA (現場可程式化閘陣列)
  • GPU (影像處理單位)
  • ASIC (特定用途的積體電路)
  • APU (Accelerated Processing Unit)

第8章 HMC、HBM市場:各用途

  • 簡介
  • HPC (高性能運算)
  • 網路
  • 資料中心
  • 圖形

第9章 地區分析

  • 簡介
  • 北美 (美國,加拿大,墨西哥)
  • 歐洲 (英國,德國,法國等)
  • 亞太地區 (中國,日本,韓國,台灣等)
  • 其他的國家 (RoW:中東、非洲,南美)

第10章 競爭環境

  • 概要
  • 排行榜分析
  • 競爭方案
    • 產品開發、銷售
    • 事業聯盟、合作,協定
    • 企業收購
    • 投資、事業擴張

第11章 企業簡介 (產業概要,主要產品與服務,近幾年趨勢,SWOT分析,MnM的見解)

  • 代表性企業
    • MICRON
    • SAMSUNG
    • SK HYNIX
    • ADVANCED MICRO DEVICES
    • INTEL
    • XILINX
    • 富士通
    • NVIDIA
    • IBM
    • OPEN-SILICON
  • 其他主要企業
    • ARIRA
    • CADENCE
    • MARVELL
    • CRAY
    • RAMBUS
    • ARM

第12章 附錄

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目錄
Product Code: SE 4220

"The HMC and HBM market is estimated to grow at a CAGR of 33.02% between 2018 and 2023."

The HMC and HBM market is emerging and is expected to grow further in the coming years. The market for HMC and HBM is likely to be valued at USD 922.7 million in 2018 and USD 3,842.5 million by 2023, at a CAGR of 33.02% between 2018 and 2023. The factors that drive the market growth include the growing need for high-bandwidth, low power consuming, and highly scalable memories; increasing adoption of artificial intelligence; and rising trend of miniaturization of electronic devices. However, thermal issues caused by high level of integration restrict the growth of the HMC and HBM market.

"Market for HBM expected to grow at the higher CAGR during the forecast period."

Currently, the major application of HBM is graphics. With improved specifications, HBM has started gaining traction in high-performance computing, cloud computing, and networking; the adoption of the HBM technology in these applications is further expected to increase in the coming years. Moreover, HBM is priced at a lower cost than HMC; this has encouraged companies to integrate HBM in their high-end products.

"Market for CPU accounted for the largest share in 2017."

The high market share of CPUs is due to their significant adoption in high-performance computing, especially in data centers. HMCs have been developed for this particular application to support advanced and intensive real-time operation. CPU plays a critical role in deterring how content can be handled. More the applications and content utility more processing capability is required in CPU. Therefore, advanced CPUs widely adopt the HMC and HBM technology to increase the performance of CPUs for servers rather than increasing the number of CPUs. The leading player in the CPU market, Intel (US) offers processors with inbuilt HMC, serving a large market of HPC and data centers.

"Market for graphics application expected to grow at the highest CAGR during the forecast period."

A majority of the products available in the market with the HBM technology are GPU products. HBM was initially adopted in GPUs specifically for graphics applications. For instance, AMD (US) developed the HBM technology along with SK Hynix (South Korea) to be used in GPUs. Along with GPUs, APUs have also been introduced in the market that are increasingly being used for gaming applications. The increasing adoption of HMC and HBM in gaming is largely due to the increasing requirements to process more pixels for larger screens and support higher compute rates for more stabilization to support high-end gaming.

"Market in North America accounted for the largest share in 2017."

The high adoption of HMC and HBM memories in North America is largely attributed to the growth in high-performance computing (HPC) applications that require high-bandwidth memory solutions for fast data processing. The demand for HPC in North America is growing owing to the increasing market for AI, machine learning, and cloud computing. In addition, major HPC-based CPU and processor providers, such as Intel, are based in North American countries. Other key tech companies such as Google, Amazon, and Microsoft are headquartered in the US and have served to drive the demand for high-performing CPUs in servers and supercomputers.

Breakdown of Profiles of Primary Participants:

  • By Company: Tier 1 = 32%, Tier 2 = 51%, and Tier 3 = 17%
  • By Designation: C-level Executives = 27%, Directors = 41%, and Others = 32%
  • By Region: North America = 40%, Europe = 16%, APAC = 38%, and RoW = 6%

Major players profiled in this report include:

  • Micron (US)
  • Samsung (South Korea)
  • SK Hynix (South Korea)
  • Intel (US)
  • AMD (US)
  • Fujitsu (Japan
  • IBM (US)
  • NVIDIA (US)
  • Xilinx (US)
  • Open-Silicon (US)

Research Coverage:

The study segments in the HMC and HBM market report include memory type-HMC and HBM; product type- graphics processing unit, central processing unit, accelerated processing unit, field-programmable gate array, application-specific integrated circuit. The study also covers applications and geographic forecast of the market size for various segments with regard to four main regions-North America, Europe, APAC, and RoW.

Reasons to Buy the Report:

The report would help the market leaders/new entrants in this market in the following ways:

  • 1. This report segments the HCM and HBM market comprehensively and provides the closest approximations of the overall market size and those of the subsegments across different applications and regions.
  • 2. The report gives the detailed analysis of the HMC and HBM market with the help of competitive landscape and value chain analysis, including the key companies in the market and their relations in the ecosystem.
  • 3. The report helps stakeholders understand the pulse of the market and provides them the information on key drivers, restraints, challenges, and opportunities pertaining to the HMC and HBM market.

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. STUDY OBJECTIVES
  • 1.2. DEFINITION
  • 1.3. STUDY SCOPE
    • 1.3.1. MARKETS COVERED
    • 1.3.2. GEOGRAPHIC SCOPE
    • 1.3.3. YEARS CONSIDERED FOR THE STUDY
  • 1.4. CURRENCY
  • 1.5. LIMITATIONS
  • 1.6. STAKEHOLDERS

2. RESEARCH METHODOLOGY

  • 2.1. RESEARCH DATA
    • 2.1.1. SECONDARY DATA
      • 2.1.1.1. Secondary sources
    • 2.1.2. PRIMARY DATA
      • 2.1.2.1. Primary sources
      • 2.1.2.2. Key industry insights
      • 2.1.2.3. Breakdown of primary interviews
    • 2.1.3. SECONDARY AND PRIMARY RESEARCH
  • 2.2. MARKET SIZE ESTIMATION
    • 2.2.1. BOTTOM-UP APPROACH
      • 2.2.1.1. Approach for capturing the market size by bottom-up analysis (demand side)
    • 2.2.2. TOP-DOWN APPROACH
      • 2.2.2.1. Approach for capturing the market share by top-down analysis (supply side)
  • 2.3. DATA TRIANGULATION
  • 2.4. ASSUMPTIONS

3. EXECUTIVE SUMMARY

4. PREMIUM INSIGHTS

  • 4.1. HMC AND HBM MARKET OVERVIEW
  • 4.2. HMC MARKET, BY APPLICATION
  • 4.3. HMC AND HBM MARKET IN APAC
  • 4.4. GEOGRAPHIC SNAPSHOT OF THE HMC AND HBM MARKET
  • 4.5. HMC AND HBM MARKET IN APAC, BY COUNTRY

5. MARKET OVERVIEW

  • 5.1. INTRODUCTION
  • 5.2. MARKET DYNAMICS
    • 5.2.1. DRIVERS
      • 5.2.1.1. Growing need for high-bandwidth, low power consuming, and highly scalable memories
      • 5.2.1.2. Increasing adoption of artificial intelligence
      • 5.2.1.3. Rising trend of miniaturization of electronic devices
    • 5.2.2. RESTRAINTS
      • 5.2.2.1. Thermal issues caused by high levels of integration
    • 5.2.3. OPPORTUNITIES
      • 5.2.3.1. High demand for cloud-based services
      • 5.2.3.2. Growing Big Data
    • 5.2.4. CHALLENGES
      • 5.2.4.1. Design complexities associated with HMC and HBM
      • 5.2.4.2. Ecosystem development
  • 5.3. VALUE CHAIN ANALYSIS

6. HMC AND HBM MARKET, BY MEMORY TYPE

  • 6.1. INTRODUCTION
  • 6.2. HYBRID MEMORY CUBE (HMC)
  • 6.3. HIGH-BANDWIDTH MEMORY (HBM)

7. HMC AND HBM MARKET, BY PRODUCT TYPE

  • 7.1. INTRODUCTION
  • 7.2. CENTRAL PROCESSING UNIT
  • 7.3. FIELD-PROGRAMMABLE GATE ARRAY
  • 7.4. GRAPHICS PROCESSING UNIT
  • 7.5. APPLICATION-SPECIFIC INTEGRATED CIRCUIT
  • 7.6. ACCELERATED PROCESSING UNIT

8. HMC AND HBM MARKET, BY APPLICATION

  • 8.1. INTRODUCTION
  • 8.2. HIGH-PERFORMANCE COMPUTING (HPC)
  • 8.3. NETWORKING
  • 8.4. DATA CENTERS
  • 8.5. GRAPHICS

9. GEOGRAPHIC ANALYSIS

  • 9.1. INTRODUCTION
  • 9.2. NORTH AMERICA
    • 9.2.1. US
    • 9.2.2. CANADA
    • 9.2.3. MEXICO
  • 9.3. EUROPE
    • 9.3.1. UK
    • 9.3.2. GERMANY
    • 9.3.3. FRANCE
    • 9.3.4. REST OF EUROPE
  • 9.4. APAC
    • 9.4.1. CHINA
    • 9.4.2. JAPAN
    • 9.4.3. SOUTH KOREA
    • 9.4.4. TAIWAN
    • 9.4.5. REST OF APAC
  • 9.5. ROW
    • 9.5.1. MIDDLE EAST AND AFRICA
    • 9.5.2. SOUTH AMERICA

10. COMPETITIVE LANDSCAPE

  • 10.1. OVERVIEW
  • 10.2. RANKING ANALYSIS
  • 10.3. COMPETITIVE SCENARIO
    • 10.3.1. PRODUCT DEVELOPMENTS AND LAUNCHES
    • 10.3.2. PARTNERSHIPS, AGREEMENTS, AND COLLABORATIONS
    • 10.3.3. ACQUISITIONS
    • 10.3.4. INVESTMENTS AND EXPANSIONS

11. COMPANY PROFILES (Business Overview, Products Offered, Recent Developments, SWOT Analysis, and MnM View)*

  • 11.1. KEY PLAYERS
    • 11.1.1. MICRON
    • 11.1.2. SAMSUNG
    • 11.1.3. SK HYNIX
    • 11.1.4. ADVANCED MICRO DEVICES
    • 11.1.5. INTEL
    • 11.1.6. XILINX
    • 11.1.7. FUJITSU
    • 11.1.8. NVIDIA
    • 11.1.9. IBM
    • 11.1.10. OPEN-SILICON
  • 11.2. OTHER KEY COMPANIES
    • 11.2.1. ARIRA
    • 11.2.2. CADENCE
    • 11.2.3. MARVELL
    • 11.2.4. CRAY
    • 11.2.5. RAMBUS
    • 11.2.6. ARM

*Details on Business Overview, Products Offered, Recent Developments, SWOT Analysis, and MnM View might not be captured in case of unlisted companies.

12. APPENDIX

  • 12.1. INSIGHTS OF INDUSTRY EXPERTS
  • 12.2. DISCUSSION GUIDE
  • 12.3. KNOWLEDGE STORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
  • 12.4. INTRODUCING RT: REAL-TIME MARKET INTELLIGENCE
  • 12.5. AVAILABLE CUSTOMIZATIONS
  • 12.6. RELATED REPORTS
  • 12.7. AUTHOR DETAILS

LIST OF TABLES

  • TABLE 1: HMC AND HBM MARKET, BY MEMORY TYPE, 2016-2023 (USD MILLION)
  • TABLE 2: HBM2 VS. HMC (GEN3)
  • TABLE 3: HMC MARKET, BY APPLICATION, 2016-2023 (USD MILLION)
  • TABLE 4: HBM MARKET, BY APPLICATION, 2016-2023 (USD MILLION)
  • TABLE 5: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 6: HMC AND HBM MARKET FOR CENTRAL PROCESSING UNIT, BY APPLICATION, 2016-2023 (USD MILLION)
  • TABLE 7: HMC AND HBM MARKET FOR CENTRAL PROCESSING UNIT, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 8: HMC AND HBM MARKET FOR FIELD-PROGRAMMABLE GATE ARRAY, BY APPLICATION, 2016-2023 (USD MILLION)
  • TABLE 9: HMC AND HBM MARKET FOR FIELD-PROGRAMMABLE GATE ARRAY, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 10: HMC AND HBM MARKET FOR GRAPHICS PROCESSING UNIT, BY APPLICATION, 2016-2023 (USD MILLION)
  • TABLE 11: HMC AND HBM MARKET FOR GRAPHICS PROCESSING UNIT MARKET, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 12: HMC AND HBM MARKET FOR APPLICATION-SPECIFIC INTEGRATED CIRCUIT, BY APPLICATION, 2016-2023 (USD MILLION)
  • TABLE 13: HMC AND HBM, MARKET FOR APPLICATION-SPECIFIC INTEGRATED CIRCUIT, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 14: HMC AND HBM MARKET FOR ACCELERATED PROCESSING UNIT MARKET, BY APPLICATION, 2016-2023 (USD MILLION)
  • TABLE 15: HMC AND HBM MARKET FOR ACCELERATED PROCESSING UNIT, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 16: HMC AND HBM MARKET, BY APPLICATION, 2016-2023 (USD MILLION)
  • TABLE 17: HMC AND HBM MARKET FOR HIGH-PERFORMANCE COMPUTING, BY MEMORY TYPE, 2016-2023 (USD MILLION)
  • TABLE 18: HMC AND HBM MARKET FOR HIGH-PERFORMANCE COMPUTING, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 19: HMC AND HBM MARKET FOR NETWORKING APPLICATIONS, BY MEMORY TYPE, 2016-2023 (USD MILLION)
  • TABLE 20: HMC AND HBM MARKET FOR NETWORKING, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 21: HMC AND HBM MARKET FOR DATA CENTER APPLICATIONS, BY MEMORY TYPE, 2016-2023 (USD MILLION)
  • TABLE 22: HMC AND HBM MARKET FOR DATA CENTER APPLICATIONS, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 23: HMC AND HBM MARKET FOR GRAPHICS, BY MEMORY TYPE, 2016-2023 (USD MILLION)
  • TABLE 24: HMC AND HBM MARKET FOR GRAPHICS, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 25: HMC AND HBM MARKET, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 26: NORTH AMERICA: HMC AND HBM MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 27: NORTH AMERICA: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 28: NORTH AMERICA: GRAPHICS PROCESSING UNIT MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 29: NORTH AMERICA: CENTRAL PROCESSING UNIT MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 30: NORTH AMERICA: ACCELERATED PROCESSING UNIT MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 31: NORTH AMERICA: FIELD-PROGRAMMABLE GATE ARRAY MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 32: NORTH AMERICA: APPLICATION-SPECIFIC INTEGRATED CIRCUIT MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 33: US: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 34: CANADA: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 35: MEXICO: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 36: EUROPE: HMC AND HBM MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 37: EUROPE: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 38: EUROPE: GRAPHICS PROCESSING UNIT MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 39: EUROPE: CENTRAL PROCESSING UNIT MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 40: EUROPE: ACCELERATED PROCESSING UNIT MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 41: EUROPE: FIELD-PROGRAMMABLE GATE ARRAY MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 42: EUROPE: APPLICATION-SPECIFIC INTEGRATED CIRCUIT MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 43: UK: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 44: GERMANY: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 45: FRANCE: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 46: ROE: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 47: APAC: HMC AND HBM MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 48: APAC: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 49: APAC: GRAPHICS PROCESSING UNITS MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 50: APAC: CENTRAL PROCESSING UNITS MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 51: APAC: ACCELERATED PROCESSING UNITS MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 52: APAC: FIELD-PROGRAMMABLE GATE ARRAYS MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 53: APAC: APPLICATION-SPECIFIC INTEGRATED CIRCUITS MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 54: CHINA: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 55: JAPAN: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 56: SOUTH KOREA: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 57: TAIWAN: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 58: ROA: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 59: ROW: HMC AND HBM MARKET, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 60: ROW: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 61: ROW: GRAPHICS PROCESSING UNITS MARKET, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 62: ROW: CENTRAL PROCESSING UNITS MARKET, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 63: ROW: ACCELERATED PROCESSING UNITS MARKET, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 64: ROW: FIELD-PROGRAMMABLE GATE ARRAYS MARKET, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 65: ROW: APPLICATION-SPECIFIC INTEGRATED CIRCUITS MARKET, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 66: MIDDLE EAST AND AFRICA: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 67: SOUTH AMERICA: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 68: RANKING ANALYSIS OF THE TOP 5 PLAYERS IN THE HMC AND HBM MARKET
  • TABLE 69: PRODUCT DEVELOPMENTS AND LAUNCHES, 2016-2017
  • TABLE 70: PARTNERSHIPS, AGREEMENTS, AND COLLABORATIONS, 2015-2017
  • TABLE 71: ACQUISITIONS, 2015
  • TABLE 72: INVESTMENTS AND EXPANSIONS, 2013-2014

LIST OF FIGURES

  • FIGURE 1: HMC AND HBM MARKET SEGMENTATION
  • FIGURE 2: RESEARCH FLOW
  • FIGURE 3: HMC AND HBM MARKET: RESEARCH DESIGN
  • FIGURE 4: BOTTOM-UP APPROACH
  • FIGURE 5: TOP-DOWN APPROACH
  • FIGURE 6: DATA TRIANGULATION
  • FIGURE 7: HBM TO REGISTER THE HIGHER CAGR IN THE HMC & HBM MARKET DURING THE FORECAST PERIOD
  • FIGURE 8: MARKET FOR APU TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 9: CPU MARKET FOR HIGH-PERFORMANCE COMPUTING TO ACCOUNT FOR THE LARGEST MARKET SHARE DURING THE FORECAST PERIOD
  • FIGURE 10: HMC AND HBM MARKET FOR GRAPHICS APPLICATIONS TO GROW AT THE HIGHEST CAGR DURING 2018-2023
  • FIGURE 11: NORTH AMERICA TO ACCOUNT FOR THE LARGEST MARKET SHARE IN 2017
  • FIGURE 12: HIGH-PERFORMANCE COMPUTING APPLICATIONS TO DRIVE THE MARKET FOR HMC AND HBM
  • FIGURE 13: HMC MARKET FOR GRAPHICS APPLICATIONS TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 14: CPU SEGMENT HELD THE LARGEST SHARE OF THE HMC AND HBM MARKET IN APAC IN 2017
  • FIGURE 15: HMC AND HBM MARKET IN APAC TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 16: HMC AND HBM MARKET IN SOUTH KOREA TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 17: GROWING NEED FOR HIGH-BANDWIDTH, LOW POWER CONSUMING, AND HIGHLY SCALABLE MEMORIES IS DRIVING THE GROWTH OF THE HMC AND HBM MARKET
  • FIGURE 18: BIG DATA VOLUME, 2014-2020 (ZETTABYTES)
  • FIGURE 19: VALUE CHAIN: HMC AND HBM MARKET, 2017
  • FIGURE 20: HBM TO REGISTER THE HIGHEST GROWTH RATE IN THE HMC & HBM MARKET DURING THE FORECAST PERIOD
  • FIGURE 21: ACCELERATED PROCESSING UNIT SEGMENT TO GROW AT THE HIGHEST CAGR IN THE HMC AND HBM MARKET DURING THE FORECAST PERIOD
  • FIGURE 22: HIGH-PERFORMANCE COMPUTING, THE LARGEST APPLICATION SEGMENT IN THE CENTRAL PROCESSING UNIT MARKET
  • FIGURE 23: MARKET FOR APU IN APAC TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 24: HMC AND HBM MARKET FOR GRAPHICS TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 25: APU HMC AND HBM MARKET FOR HIGH-PERFORMANCE COMPUTING TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 26: GEOGRAPHIC SNAPSHOT: APAC COUNTRIES TO REGISTER HIGHEST GROWTH DURING THE FORECAST PERIOD (2018-2023)
  • FIGURE 27: APAC MARKET TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 28: MARKET SNAPSHOT: NORTH AMERICA
  • FIGURE 29: APU SEGMENT TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD IN THE US
  • FIGURE 30: MARKET SNAPSHOT: EUROPE
  • FIGURE 31: ACCELERATED PROCESSING UNIT SEGMENT TO GROW AT THE HIGHEST RATE IN THE ROE MARKET DURING THE FORECAST PERIOD
  • FIGURE 32: MARKET SNAPSHOT: APAC
  • FIGURE 33: CENTRAL PROCESSING UNITS SEGMENT TO HOLD LARGEST SHARE OF THE MARKET IN CHINA
  • FIGURE 34: COMPANIES ADOPTED PRODUCT DEVELOPMENTS AND LAUNCHES AS THE KEY GROWTH STRATEGY OVER THE LAST FIVE YEARS (2013-2017)
  • FIGURE 35: MICRON: COMPANY SNAPSHOT
  • FIGURE 36: SAMSUNG: COMPANY SNAPSHOT
  • FIGURE 37: SK HYNIX: COMPANY SNAPSHOT
  • FIGURE 38: AMD: COMPANY SNAPSHOT
  • FIGURE 39: INTEL: COMPANY SNAPSHOT
  • FIGURE 40: XILINX: COMPANY SNAPSHOT
  • FIGURE 41: FUJITSU: COMPANY SNAPSHOT
  • FIGURE 42: NVIDIA: COMPANY SNAPSHOT
  • FIGURE 43: IBM: COMPANY SNAPSHOT
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