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市場調查報告書

化合物半導體的全球市場 - 至2024年的預測:GaN,GaAs,InP,SiGe,SiC,GaP

Compound Semiconductor Market by Type (GaN, GaAs, InP, SiGe, SiC, GaP), Product (LED, RF, Optoelectronics, Power Electronics), Application, Geography - Global Forecast to 2024

出版商 MarketsandMarkets 商品編碼 310574
出版日期 內容資訊 英文 174 Pages
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化合物半導體的全球市場 - 至2024年的預測:GaN,GaAs,InP,SiGe,SiC,GaP Compound Semiconductor Market by Type (GaN, GaAs, InP, SiGe, SiC, GaP), Product (LED, RF, Optoelectronics, Power Electronics), Application, Geography - Global Forecast to 2024
出版日期: 2019年02月27日內容資訊: 英文 174 Pages
簡介

化合物半導體市場,預測將從2019年的372億美元,擴大到2024年530億美元的規模。市場在2019年∼2024年間,預計將以年複合成長率 (CAGR) 7.3%的速度成長。

本報告提供全球化合物半導體市場相關調查分析,市場概要,產業趨勢,各市場區隔的市場分析,競爭情形,主要企業等相關的系統性資訊。

第1章 簡介

第2章 調查手法

第3章 摘要整理

第4章 重要考察

  • 化合物半導體市場的富有魅力的成長機會
  • 化合物半導體市場:各用途,各地區
  • 化合物半導體市場成長率:各國

第5章 市場概要

  • 簡介
  • 市場動態
    • 促進因素
    • 阻礙因素
    • 機會
    • 課題
  • 化合物半導體的價值鏈
  • GaN-on-Si技術趨勢
  • GaN-on-Si的最近的發展

第6章 化合物半導體的全球市場:各類型

  • 簡介
  • 氮化鎵 (GaN)
  • 鎵砷 (GaAs)
  • 碳化矽(SiC)
  • 磷化銦 (InP)
  • 矽鍺(SiGe)
  • 鎵磷 (GaP)

第7章 化合物半導體的全球市場:各產品

  • 簡介
  • LED
  • 光電
  • RF電力
  • RF交換器
  • 其他RF設備
  • 電力電子技術

第8章 化合物半導體的全球市場:各用途

  • 簡介
  • 一般照明
  • 通訊
  • 軍事,防衛,航太
  • 汽車
  • 電力供給
  • 數據通訊
  • 消費者顯示器
  • 商業
  • 其他

第9章 化合物半導體的全球市場:各地區

  • 簡介
  • 北美
  • 歐洲
  • 亞太地區
  • 中東
  • 其他

第10章 競爭情形

  • 概要
  • 市場企業的排行榜分析
  • 競爭領導製圖
  • 發展

第11章 企業簡介

  • 簡介
  • 主要企業
    • 日亞化學工業
    • SAMSUNG ELECTRONICS
    • OSRAM
    • QORVO
    • SKYWORKS
    • CREE
    • GAN SYSTEMS
    • INFINEON
    • 三菱電機
    • NXP
    • ON SEMICONDUCTOR
  • 其他主要企業
    • ANALOG DEVICES
    • BROADCOM
    • EPC
    • LUMENTUM
    • MACOM
    • MICROSEMI
    • NEOPHOTONICS
    • 瑞薩電子
    • ROHM
    • SAN'AN
    • STMICROELECTRONICS
    • EXAGAN
    • VISIC TECHNOLOGIES
    • TRANSPHORM

第12章 附錄

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目錄
Product Code: SE 2588

"High adoption of compound semiconductors by leading manufacturers to drive overall growth of compound semiconductor market"

The compound semiconductor market is expected to grow from USD 37.2 billion in 2019 to USD 53.0 billion by 2024, at a CAGR of 7.3%. The compound semiconductor market is driven by various factors, such as increase in government and stakeholder funding, rise in demand and implementation of GaN and SiC in the semiconductor industry, and high use of compound semiconductors in LED applications. However, high material and fabrication costs associated with compound semiconductor can hinder the growth of the market.

"Based on product, power electronics to witness growth at highest CAGR during forecast period"

Power electronics possess high growth rate in the compound semiconductor market during the forecast period. This is mainly due to increasing demand for SiC and gallium nitride (GaN) power semiconductors in applications such as hybrid and electric vehicles, power supplies and photovoltaic (PV) inverters. The market is driven by increasing sales of hybrid and electric vehicles. China is among the potential country for this market with demand for Schottky barrier diodes, MOSFETs, junction gate field-effect transistors (JFETs), and other SiC discretes. Increasing demand for both battery electric vehicles (BEVs) and plug-in hybrid electric vehicles (PHEVs) will increase significantly in the coming years as governments of various countries aim to reduce air pollution. China, India, France, and other countries have already announced plans to ban cars with internal combustion engines in the coming decades, replacing them with cleaner vehicles. It results in high growth potential for compound semiconductor-based power electronics.

"Based on application, power supply and automotive are fastest growing applications"

Power supply and automotive is expected to grow at a higher rate than other applications. This is mainly due to the increasing importance of GaN and SiC devices in the power electronics market. SiC-based power devices can operate at higher temperatures with higher thermal conductivity, higher breakdown voltage at lower on-stage resistance, faster switching speed, lower conduction and switching on-state loss. GaN is also gaining importance in power electronics. Many players are taking efforts to introduced GaN devices. For instance, PowerSphyr, and GaN Systems have entered a strategic agreement to bring GaN-based wireless power systems to market for high powered applications across consumer, industrial, and automotive sectors worldwide. Automotive is the fastest growing application for SiC power devices including growth for segments such as charging infrastructure and EV/HEV. Increasing adoption of EV/EHV is driven by factors such as favorable government policies and subsidies, heavy investments from automakers in EVs, growing concern about environmental pollution, and increased vehicle range per charge. China is among the most important countries for the growth of the EV market. Hence, the growth of the EV market opens doors for GaN and SiC power electronics, which further provides opportunities for SiC and GaN players.

"APAC to record highest growth rate during forecast period"

APAC is the leading market for compound semiconductors. APAC has become a global focal point for large investments and business expansions, thereby providing opportunities for compound semiconductors in consumer devices, general lighting, and commercial applications. Growing adoption of compound semiconductor telecommunications and lighting devices in this region would lead to high demand for compound semiconductors. From the industry perspective, APAC has high growth in industry activities in terms of growing number of foundries, wafer, and fabrication, assembly, testing, and packaging facilities in several Asian countries such as China, Taiwan, and South Korea. Telecommunication and general lighting applications currently dominate the market in APAC; however, power supply and automotive are the fastest growing application for the compound semiconductor market in APAC.

In-depth interviews were conducted with chief executive officers (CEOs), marketing directors, other innovation and technology directors, and executives from various key organizations operating in the compound semiconductor marketplace.

  • By Company Type, Tier 1 = 50%, Tier 2 = 29%, and Tier 3 = 21%
  • By Designation, C-Level Executives = 62%, Directors = 25%, and Others = 13%
  • By Region, North America = 33%, Europe = 12%, APAC = 45%, and RoW = 10%

The compound semiconductor market comprises major players, namely, Nichia (Japan), Samsung Electronics (South Korea), OSRAM (Germany), Qorvo (US), Skyworks (US), Cree (US), GaN Systems (Canada), Infineon (Germany), Mitsubishi Electric (Japan), NXP Semiconductors (Netherlands), ON Semiconductor (US), Analog Devices (US), Broadcom (US), Efficient Power Conversion (US), Lumentum (US), NeoPhotonics (US), San'an Optoelectronics (China), and STMicroelectronics (Switzerland).

The study includes an in-depth competitive analysis of these key players in the compound semiconductor market, with their company profiles, recent developments, and key market strategies.

Research Coverage:

The report defines, describes, and forecasts the compound semiconductor market based on type, product, application, and geography. It provides detailed information regarding the major factors (drivers, restraints, opportunities, and challenges) influencing the growth of the compound semiconductor market. It also analyzes the competitive developments such as collaborations, agreements, contracts, partnerships, mergers and acquisitions, and product launches carried out by the key players to grow in the market.

Key Benefits of Buying the Report:

The report will help the market leaders/new entrants in this market with information on the closest approximations of the revenue numbers for the overall compound semiconductor market and the subsegments. This report will help stakeholders understand the competitive landscape and gain more insights to better position their businesses and to plan suitable go-to-market strategies. The report also helps stakeholders understand the pulse of the market and provides them with information on key market drivers, restraints, challenges, and opportunities.

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. STUDY OBJECTIVES
  • 1.2. DEFINITION
  • 1.3. STUDY SCOPE
    • 1.3.1. MARKETS COVERED
    • 1.3.2. GEOGRAPHIC SCOPE
  • 1.4. YEARS CONSIDERED
  • 1.5. CURRENCY
  • 1.6. STAKEHOLDERS

2. RESEARCH METHODOLOGY

  • 2.1. RESEARCH DATA
    • 2.1.1. SECONDARY DATA
      • 2.1.1.1. Key data from secondary sources
    • 2.1.2. PRIMARY DATA
      • 2.1.2.1. Key industry insights
      • 2.1.2.2. Breakdown of primaries
  • 2.2. MARKET SIZE ESTIMATION
    • 2.2.1. BOTTOM-UP APPROACH
      • 2.2.1.1. Approach for capturing market size by bottom-up analysis (demand side)
    • 2.2.2. TOP-DOWN APPROACH
      • 2.2.2.1. Approach for capturing market size by top-down analysis (supply side)
  • 2.3. MARKET BREAKDOWN AND DATA TRIANGULATION
  • 2.4. RESEARCH ASSUMPTIONS

3. EXECUTIVE SUMMARY

4. PREMIUM INSIGHTS

  • 4.1. ATTRACTIVE GROWTH OPPORTUNITIES IN COMPOUND SEMICONDUCTOR MARKET
  • 4.2. COMPOUND SEMICONDUCTOR MARKET, BY APPLICATION AND REGION
  • 4.3. COMPOUND SEMICONDUCTOR MARKET GROWTH RATES, BY COUNTRY

5. MARKET OVERVIEW

  • 5.1. INTRODUCTION
  • 5.2. MARKET DYNAMICS
    • 5.2.1. DRIVERS
      • 5.2.1.1. Increase in government and stakeholder funding
      • 5.2.1.2. Rise in demand and implementation of GaN and SiC in semiconductor industry
      • 5.2.1.3. High use of compound semiconductors in LED applications
    • 5.2.2. RESTRAINTS
      • 5.2.2.1. High material and fabrication costs associated with compound semiconductors
    • 5.2.3. OPPORTUNITIES
      • 5.2.3.1. Growing automotive, telecom, and power industries
      • 5.2.3.2. Rising demand for high speed and advanced devices in datacom applications
      • 5.2.3.3. Increasing demand for compound semiconductors in military, defense, and aerospace
      • 5.2.3.4. Emerging technologies revolutionizing semiconductors industry
    • 5.2.4. CHALLENGES
      • 5.2.4.1. Compound semiconductors are complex to design
  • 5.3. COMPOUND SEMICONDUCTOR VALUE CHAIN
  • 5.4. TRENDS OF GAN ON SILICON TECHNOLOGY
  • 5.5. RECENT DEVELOPMENTS FOR GAN ON SILICON

6. COMPOUND SEMICONDUCTOR MARKET, BY TYPE

  • 6.1. INTRODUCTION
  • 6.2. GALLIUM NITRIDE (GAN)
    • 6.2.1. INCREASING USAGE OF GAN IN GENERAL LIGHTING, SIGNAGE, AND AUTOMOTIVE TO DRIVE GAN LED MARKET
  • 6.3. GALLIUM ARSENIDE (GAAS)
    • 6.3.1. HIGH ELECTRON MOBILITY IN GAAS PROVIDES OPPORTUNITY FOR HIGH SPEED DEVICES
  • 6.4. SILICON CARBIDE (SIC)
    • 6.4.1. INCREASING ADOPTION OF EV PROVIDES AMPLE OPPORTUNITIES FOR SIC POWER ELECTRONICS MARKET
  • 6.5. INDIUM PHOSPHIDE (INP)
    • 6.5.1. HIGHER ELECTRON VELOCITY DRIVES INP DEVICE MARKET GROWTH FOR TELECOM AND DATACOM APPLICATIONS
  • 6.6. SILICON GERMANIUM (SIGE)
    • 6.6.1. OPTOELECTRONICS AND RF SUPPORT SIGE MARKET GROWTH
  • 6.7. GALLIUM PHOSPHIDE (GAP)
    • 6.7.1. LOW POWER LEDS IS KEY APPLICATION OF GAP

7. COMPOUND SEMICONDUCTOR MARKET, BY PRODUCT

  • 7.1. INTRODUCTION
  • 7.2. LED
    • 7.2.1. DECREASING PRICES OF LED AND FAVORABLE GOVERNMENT INITIATIVES DRIVE LED MARKET GROWTH
  • 7.3. OPTOELECTRONICS
    • 7.3.1. INCREASING DEMAND FOR HIGH-SPEED DATA TRANSFER DEVICES CREATES OPPORTUNITY FOR OPTOELECTRONICS MARKET
  • 7.4. RF POWER
    • 7.4.1. INCREASING TRENDS FOR ADOPTION OF LTE AND 5G TO PROVIDE OPPORTUNITIES FOR RF POWER MARKET
  • 7.5. RF SWITCHING
    • 7.5.1. TELECOMMUNICATIONS AND MILITARY & DEFENSE ARE IMPORTANT APPLICATIONS OF RF SWITCHING MARKET
  • 7.6. OTHER RF DEVICES
  • 7.7. POWER ELECTRONICS
    • 7.7.1. INCREASING IMPORTANCE OF GAN AND SIC DEVICES IN POWER SUPPLY, UPS, AND WIRELESS CHARGING PROVIDES OPPORTUNITY FOR POWER ELECTRONICS SEGMENT

8. COMPOUND SEMICONDUCTOR MARKET, BY APPLICATION

  • 8.1. INTRODUCTION
  • 8.2. GENERAL LIGHTING
    • 8.2.1. INCREASING PENETRATION OF LEDS IN GENERAL LIGHTING APPLICATIONS PROVIDES OPPORTUNITY FOR GAN AND GAN-ON-SILICON LED MARKET
  • 8.3. TELECOMMUNICATIONS
    • 8.3.1. INCREASING ADOPTION OF COMPOUND SEMICONDUCTORS FOR TELECOM INFRASTRUCTURE AND COMMUNICATION DEVICES DRIVES THE MARKET
  • 8.4. MILITARY, DEFENSE, AND AEROSPACE
    • 8.4.1. HIGH POWER CAPABILITY OF GAN MAKES IT SUITABLE MATERIAL FOR ITS ADOPTION IN MILITARY & DEFENSE APPLICATIONS
  • 8.5. AUTOMOTIVE
    • 8.5.1. INCREASING IMPORTANCE OF ADVANCED POWER SEMICONDUCTOR DEVICES IN AUTOMOTIVE APPLICATION DRIVES SIC AND GAN POWER ELECTRONICS MARKET
  • 8.6. POWER SUPPLY
    • 8.6.1. WIRELESS CHARGING TO PROVIDE OPPORTUNITY FOR GAN AND SIC DEVICES MARKET
  • 8.7. DATACOM
    • 8.7.1. INCREASING DEMAND FOR HIGH-SPEED TRANSCEIVERS IN DATA CENTER DRIVES COMPOUND SEMICONDUCTOR MARKET GROWTH
  • 8.8. CONSUMER DISPLAYS
    • 8.8.1. DEMAND FOR GAN LEDS FOR BACKLIGHTING PLAYS AN IMPORTANT ROLE FOR CONSUMER DISPLAY APPLICATION
  • 8.9. COMMERCIAL
    • 8.9.1. INCREASING IMPORTANCE OF DIGITAL SIGNAGE PROVIDES OPPORTUNITY FOR COMPOUND SEMICONDUCTOR-BASED LED MARKET
  • 8.10. OTHERS

9. GEOGRAPHIC ANALYSIS

  • 9.1. INTRODUCTION
  • 9.2. NORTH AMERICA
    • 9.2.1. US
      • 9.2.1.1. Rising adoption of compound semiconductors in military and defense to boost compound semiconductor market growth
    • 9.2.2. CANADA
      • 9.2.2.1. Rising trends of electric vehicles and solar energy to boost compound semiconductor market
    • 9.2.3. MEXICO
      • 9.2.3.1. Increasing government initiatives in 5G and renewable energy sources drives compound semiconductor market growth
  • 9.3. EUROPE
    • 9.3.1. GERMANY
      • 9.3.1.1. Germany to dominate European compound semiconductor market owing to growing automotive industry and need for electric vehicles
    • 9.3.2. UK
      • 9.3.2.1. Growing initiatives from UK government and private players to augment compound semiconductor market growth
    • 9.3.3. FRANCE
      • 9.3.3.1. Telecom and automotive industries to provide opportunities for compound semiconductor market
    • 9.3.4. ITALY
      • 9.3.4.1. Growing automotive industry in Italy provides opportunities for compound semiconductor market for LED and power electronics segments
    • 9.3.5. REST OF EUROPE
  • 9.4. APAC
    • 9.4.1. CHINA
      • 9.4.1.1. Increasing trends of 5G and EV to drive compound semiconductor market growth
    • 9.4.2. JAPAN
      • 9.4.2.1. Growth is driven by rising adoption of compound semiconductor devices in telecommunications, lighting, and automotive applications
    • 9.4.3. SOUTH KOREA
      • 9.4.3.1. Compound semiconductor market growth mainly driven by telecommunications application
    • 9.4.4. REST OF APAC
  • 9.5. ROW
    • 9.5.1. SOUTH AMERICA
      • 9.5.1.1. GaN and GaAs markets expected to grow significantly
    • 9.5.2. MIDDLE EAST AND AFRICA
      • 9.5.2.1. Telecommunications application provides growth prospects for compound semiconductor market

10. COMPETITIVE LANDSCAPE

  • 10.1. OVERVIEW
  • 10.2. RANKING ANALYSIS OF MARKET PLAYERS
  • 10.3. COMPETITIVE LEADERSHIP MAPPING
    • 10.3.1. VISIONARY LEADERS
    • 10.3.2. DYNAMIC DIFFERENTIATORS
    • 10.3.3. INNOVATORS
    • 10.3.4. EMERGING PLAYERS
  • 10.4. DEVELOPMENTS
    • 10.4.1. PRODUCT LAUNCHES/DEVELOPMENTS
    • 10.4.2. AGREEMENTS, COLLABORATIONS, PARTNERSHIPS, AND CONTRACTS
    • 10.4.3. ACQUISITIONS
    • 10.4.4. EXPANSIONS

11. COMPANY PROFILES (Business overview, Products offered, Recent developments, MNM view, SWOT analysis)*

  • 11.1. INTRODUCTION
  • 11.2. KEY PLAYERS
    • 11.2.1. NICHIA
    • 11.2.2. SAMSUNG ELECTRONICS
    • 11.2.3. OSRAM
    • 11.2.4. QORVO
    • 11.2.5. SKYWORKS
    • 11.2.6. CREE
    • 11.2.7. GAN SYSTEMS
    • 11.2.8. INFINEON
    • 11.2.9. MITSUBISHI ELECTRIC
    • 11.2.10. NXP
    • 11.2.11. ON SEMICONDUCTOR
  • 11.3. OTHER KEY PLAYERS
    • 11.3.1. ANALOG DEVICES
    • 11.3.2. BROADCOM
    • 11.3.3. EPC
    • 11.3.4. LUMENTUM
    • 11.3.5. MACOM
    • 11.3.6. MICROSEMI
    • 11.3.7. NEOPHOTONICS
    • 11.3.8. RENESAS ELECTRONICS
    • 11.3.9. ROHM
    • 11.3.10. SAN'AN
    • 11.3.11. STMICROELECTRONICS
    • 11.3.12. EXAGAN
    • 11.3.13. VISIC TECHNOLOGIES
    • 11.3.14. TRANSPHORM

*Business overview, Products offered, Recent developments, MNM view, SWOT analysis might not be captured in case of unlisted companies.

12. APPENDIX

  • 12.1. DISCUSSION GUIDE
  • 12.2. KNOWLEDGE STORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
  • 12.3. AVAILABLE CUSTOMIZATIONS
  • 12.4. RELATED REPORTS
  • 12.5. AUTHOR DETAILS

LIST OF TABLES

  • TABLE 1: COMPOUND SEMICONDUCTOR MARKET, BY TYPE, 2015-2024 (USD MILLION)
  • TABLE 2: GAN SEMICONDUCTOR DEVICE MARKET, BY PRODUCT, 2015-2024 (USD MILLION)
  • TABLE 3: GAN SEMICONDUCTOR DEVICE MARKET, BY APPLICATION, 2015-2024 (USD MILLION)
  • TABLE 4: GAN LED MARKET, BY APPLICATION, 2015-2024 (USD MILLION)
  • TABLE 5: GAN OPTOELECTRONICS MARKET, BY APPLICATION, 2015-2024 (USD MILLION)
  • TABLE 6: GAN RF DEVICE MARKET, BY APPLICATION, 2015-2024 (USD MILLION)
  • TABLE 7: GAN POWER ELECTRONICS MARKET, BY APPLICATION, 2015-2024 (USD MILLION)
  • TABLE 8: GAAS SEMICONDUCTOR DEVICE MARKET, BY PRODUCT, 2015-2024 (USD MILLION)
  • TABLE 9: GAAS SEMICONDUCTOR DEVICE MARKET, BY APPLICATION, 2015-2024 (USD MILLION)
  • TABLE 10: GAAS LED MARKET, BY APPLICATION, 2015-2024 (USD MILLION)
  • TABLE 11: GAAS OPTOELECTRONICS MARKET, BY APPLICATION, 2015-2024 (USD MILLION)
  • TABLE 12: GAAS RF DEVICE MARKET, BY APPLICATION, 2015-2024 (USD MILLION)
  • TABLE 13: SIC DEVICE MARKET, BY APPLICATION, 2015-2024 (USD MILLION)
  • TABLE 14: INP SEMICONDUCTOR DEVICE MARKET, BY PRODUCT, 2015-2024 (USD MILLION)
  • TABLE 15: INP SEMICONDUCTOR DEVICE MARKET, BY APPLICATION, 2015-2024 (USD MILLION)
  • TABLE 16: INP OPTOELECTRONICS DEVICE MARKET, BY APPLICATION, 2015-2024 (USD MILLION)
  • TABLE 17: INP RF DEVICE MARKET, BY APPLICATION, 2015-2024 (USD MILLION)
  • TABLE 18: SIGE SEMICONDUCTOR DEVICE MARKET, BY PRODUCT, 2015-2024 (USD MILLION)
  • TABLE 19: SIGE SEMICONDUCTOR DEVICE MARKET, BY APPLICATION, 2015-2024 (USD MILLION)
  • TABLE 20: SIGE OPTOELECTRONICS DEVICE MARKET, BY APPLICATION, 2015-2024 (USD MILLION)
  • TABLE 21: SIGE RF DEVICE MARKET, BY APPLICATION, 2015-2024 (USD MILLION)
  • TABLE 22: GAP LED MARKET, BY APPLICATION, 2015-2024 (USD MILLION)
  • TABLE 23: COMPOUND SEMICONDUCTOR MARKET, BY PRODUCT, 2015-2024 (USD MILLION)
  • TABLE 24: COMPOUND SEMICONDUCTOR MARKET FOR LEDS, BY TYPE, 2015-2024 (USD MILLION)
  • TABLE 25: COMPOUND SEMICONDUCTOR MARKET FOR LEDS, BY APPLICATION, 2015-2024 (USD MILLION)
  • TABLE 26: COMPOUND SEMICONDUCTOR MARKET FOR OPTOELECTRONICS, BY TYPE, 2015-2024 (USD MILLION)
  • TABLE 27: COMPOUND SEMICONDUCTOR MARKET FOR OPTOELECTRONICS, BY APPLICATION, 2015-2024 (USD MILLION)
  • TABLE 28: COMPOUND SEMICONDUCTOR MARKET FOR RF POWER, BY TYPE, 2015-2024 (USD MILLION)
  • TABLE 29: COMPOUND SEMICONDUCTOR MARKET FOR RF SWITCHING, BY TYPE, 2015-2024 (USD MILLION)
  • TABLE 30: COMPOUND SEMICONDUCTOR MARKET FOR OTHER RF DEVICES, BY TYPE, 2015-2024 (USD MILLION)
  • TABLE 31: COMPOUND SEMICONDUCTOR MARKET FOR POWER ELECTRONICS, BY TYPE, 2015-2024 (USD MILLION)
  • TABLE 32: COMPOUND SEMICONDUCTOR MARKET FOR POWER ELECTRONICS, BY APPLICATION, 2015-2024 (USD MILLION)
  • TABLE 33: COMPOUND SEMICONDUCTOR MARKET, BY APPLICATION, 2015-2024 (USD MILLION)
  • TABLE 34: COMPOUND SEMICONDUCTOR MARKET FOR GENERAL LIGHTING APPLICATIONS, BY TYPE, 2015-2024 (USD MILLION)
  • TABLE 35: COMPOUND SEMICONDUCTOR MARKET FOR GENERAL LIGHTING APPLICATIONS, BY REGION, 2015-2024 (USD MILLION)
  • TABLE 36: COMPOUND SEMICONDUCTOR MARKET FOR TELECOMMUNICATIONS APPLICATIONS, BY TYPE, 2015-2024 (USD MILLION)
  • TABLE 37: COMPOUND SEMICONDUCTOR MARKET FOR TELECOMMUNICATIONS APPLICATION, BY REGION, 2015-2024 (USD MILLION)
  • TABLE 38: COMPOUND SEMICONDUCTOR MARKET FOR MILITARY, DEFENSE, & AEROSPACE APPLICATIONS, BY TYPE, 2015-2024 (USD MILLION)
  • TABLE 39: COMPOUND SEMICONDUCTOR MARKET FOR MILITARY, DEFENSE, & AEROSPACE APPLICATION, BY REGION, 2015-2024 (USD MILLION)
  • TABLE 40: COMPOUND SEMICONDUCTOR MARKET FOR AUTOMOTIVE APPLICATIONS, BY TYPE, 2015-2024 (USD MILLION)
  • TABLE 41: COMPOUND SEMICONDUCTOR MARKET FOR AUTOMOTIVE APPLICATION, BY REGION, 2015-2024 (USD MILLION)
  • TABLE 42: COMPOUND SEMICONDUCTOR MARKET FOR POWER SUPPLY APPLICATIONS, BY TYPE, 2015-2024 (USD MILLION)
  • TABLE 43: COMPOUND SEMICONDUCTOR MARKET FOR POWER SUPPLY APPLICATION, BY REGION, 2015-2024 (USD MILLION)
  • TABLE 44: COMPOUND SEMICONDUCTOR MARKET FOR DATACOM APPLICATIONS, BY TYPE, 2015-2024 (USD MILLION)
  • TABLE 45: COMPOUND SEMICONDUCTOR MARKET FOR DATACOM APPLICATION, BY REGION, 2015-2024 (USD MILLION)
  • TABLE 46: COMPOUND SEMICONDUCTOR MARKET FOR CONSUMER DISPLAYS APPLICATIONS, BY TYPE, 2015-2024 (USD MILLION)
  • TABLE 47: COMPOUND SEMICONDUCTOR MARKET FOR CONSUMER DISPLAY APPLICATION, BY REGION, 2015-2024 (USD MILLION)
  • TABLE 48: COMPOUND SEMICONDUCTOR MARKET FOR COMMERCIAL APPLICATIONS, BY TYPE, 2015-2024 (USD MILLION)
  • TABLE 49: COMPOUND SEMICONDUCTOR MARKET FOR COMMERCIAL APPLICATION, BY REGION, 2015-2024 (USD MILLION)
  • TABLE 50: COMPOUND SEMICONDUCTOR MARKET FOR OTHER APPLICATIONS, BY TYPE, 2015-2024 (USD MILLION)
  • TABLE 51: COMPOUND SEMICONDUCTOR MARKET FOR OTHER APPLICATIONS, BY REGION, 2015-2024 (USD MILLION)
  • TABLE 52: COMPOUND SEMICONDUCTOR MARKET, BY REGION, 2015-2024 (USD MILLION)
  • TABLE 53: COMPOUND SEMICONDUCTOR MARKET IN NORTH AMERICA, BY COUNTRY, 2015-2024 (USD MILLION)
  • TABLE 54: COMPOUND SEMICONDUCTOR MARKET IN NORTH AMERICA, BY APPLICATION, 2015-2024 (USD MILLION)
  • TABLE 55: COMPOUND SEMICONDUCTOR MARKET IN EUROPE, BY COUNTRY, 2015-2024 (USD MILLION)
  • TABLE 56: COMPOUND SEMICONDUCTOR MARKET IN EUROPE, BY APPLICATION, 2015-2024 (USD MILLION)
  • TABLE 57: COMPOUND SEMICONDUCTOR MARKET IN APAC, BY COUNTRY, 2015-2024 (USD MILLION)
  • TABLE 58: COMPOUND SEMICONDUCTOR MARKET IN APAC, BY APPLICATION, 2015-2024 (USD MILLION)
  • TABLE 59: COMPOUND SEMICONDUCTOR MARKET IN ROW, BY REGION, 2015-2024 (USD MILLION)
  • TABLE 60: COMPOUND SEMICONDUCTOR MARKET IN ROW, BY APPLICATION, 2015-2024 (USD MILLION)
  • TABLE 61: PRODUCT LAUNCHES, 2018-2019
  • TABLE 62: AGREEMENTS, COLLABORATIONS, PARTNERSHIPS, AND CONTRACTS, 2017-2018
  • TABLE 63: ACQUISITIONS, 2018
  • TABLE 64: EXPANSIONS, 2018

LIST OF FIGURES

  • FIGURE 1: COMPOUND SEMICONDUCTOR MARKET: RESEARCH DESIGN
  • FIGURE 2: RESEARCH FLOW OF MARKET SIZE ESTIMATION
  • FIGURE 3: COMPOUND SEMICONDUCTOR MARKET: BOTTOM-UP APPROACH
  • FIGURE 4: TOP-DOWN APPROACH TO ARRIVE AT MARKET SIZE
  • FIGURE 5: DATA TRIANGULATION
  • FIGURE 6: ASSUMPTIONS FOR RESEARCH STUDY
  • FIGURE 7: POWER SUPPLY AND AUTOMOTIVE TO GROW AT HIGH RATE IN COMPOUND SEMICONDUCTOR MARKET DURING FORECAST PERIOD
  • FIGURE 8: SILICON CARBIDE (SIC) TO WITNESS HIGHEST CAGR IN COMPOUND SEMICONDUCTOR MARKET DURING FORECAST PERIOD
  • FIGURE 9: LED TO HOLD LARGEST SIZE OF COMPOUND SEMICONDUCTOR MARKET BY 2024
  • FIGURE 10: APAC TO HOLD LARGEST SHARE OF COMPOUND SEMICONDUCTOR MARKET BY 2024
  • FIGURE 11: INCREASING ADOPTION OF COMPOUND SEMICONDUCTORS INCLUDING GAN, GAAS AND SIC TO DRIVE GROWTH OF COMPOUND SEMICONDUCTOR MARKET DURING FORECAST PERIOD
  • FIGURE 12: TELECOMMUNICATIONS AND APAC WERE LARGEST SHARE HOLDERS OF COMPOUND SEMICONDUCTOR IN 2018
  • FIGURE 13: CHINA, JAPAN, AND US TO GROW AT HIGHEST RATE IN COMPOUND SEMICONDUCTOR MARKET DURING FORECAST PERIOD
  • FIGURE 14: COMPOUND SEMICONDUCTOR VALUE CHAIN ANALYSIS
  • FIGURE 15: VALUE CHAIN ANALYSIS FOR GAN ON SILICON TECHNOLOGY
  • FIGURE 16: COMPOUND SEMICONDUCTOR MARKET, BY TYPE
  • FIGURE 17: GAN TO HOLD LARGEST SIZE OF COMPOUND SEMICONDUCTOR MARKET DURING FORECAST PERIOD
  • FIGURE 18: LED TO HOLD LARGEST SIZE OF GAN SEMICONDUCTOR DEVICE MARKET DURING FORECAST PERIOD
  • FIGURE 19: AUTOMOTIVE EXPECTED TO BE FASTEST GROWING APPLICATION FOR GAN LED MARKET DURING FORECAST PERIOD
  • FIGURE 20: TELECOMMUNICATIONS TO HOLD LARGEST SIZE OF GAN RF MARKET DURING FORECAST PERIOD
  • FIGURE 21: RF POWER TO HOLD LARGEST SIZE OF GAAS SEMICONDUCTOR DEVICE MARKET DURING FORECAST PERIOD
  • FIGURE 22: TELECOMMUNICATIONS TO DOMINATE GAAS RF MARKET DURING THE FORECAST PERIOD
  • FIGURE 23: AUTOMOTIVE TO BE FASTEST GROWING APPLICATION FOR SIC DEVICE MARKET DURING THE FORECAST PERIOD
  • FIGURE 24: OPTOELECTRONICS TO HOLD LARGEST SIZE OF INP SEMICONDUCTOR DEVICE MARKET DURING FORECAST PERIOD
  • FIGURE 25: TELECOMMUNICATIONS AND DATACOM TO DRIVE INP DEVICE MARKET GROWTH
  • FIGURE 26: RF POWER TO DOMINATE SIGE SEMICONDUCTOR DEVICE MARKET DURING FORECAST PERIOD
  • FIGURE 27: COMPOUND SEMICONDUCTOR MARKET, BY PRODUCT
  • FIGURE 28: LED TO HOLD LARGEST SIZE OF COMPOUND SEMICONDUCTOR MARKET DURING FORECAST PERIOD
  • FIGURE 29: GAN TO HOLD LARGEST SIZE OF COMPOUND SEMICONDUCTOR MARKET DURING FORECAST PERIOD
  • FIGURE 30: INP TO HOLD LARGEST SIZE FOR OPTOELECTRONICS DURING FORECAST PERIOD
  • FIGURE 31: GAAS TO HOLD LARGEST SIZE FOR RF POWER DURING FORECAST PERIOD
  • FIGURE 32: GAAS TO HOLD LARGEST SIZE FOR RF SWITCHING DURING FORECAST PERIOD
  • FIGURE 33: GAAS TO HOLD LARGEST SIZE FOR OTHER RF DEVICES DURING FORECAST PERIOD
  • FIGURE 34: SIC TO HOLD LARGEST SIZE FOR POWER ELECTRONICS DURING FORECAST PERIOD
  • FIGURE 35: TELECOMMUNICATIONS TO HOLD LARGEST SIZE COMPOUND SEMICONDUCTOR MARKET DURING FORECAST PERIOD
  • FIGURE 36: GAN TO LEAD GENERAL LIGHTING MARKET DURING FORECAST PERIOD
  • FIGURE 37: APAC TO DOMINATE COMPOUND SEMICONDUCTOR MARKET FOR GENERAL LIGHTING APPLICATION DURING FORECAST PERIOD
  • FIGURE 38: GAAS TO DOMINATE COMPOUND SEMICONDUCTOR MARKET FOR TELECOMMUNICATIONS APPLICATION DURING FORECAST PERIOD
  • FIGURE 39: APAC TO GROW AT HIGEST RATE IN COMPOUND SEMICONDUCTOR MARKET FOR TELECOMMUNICATIONS APPLICATION DURING FORECAST PERIOD
  • FIGURE 40: GAN MARKET TO GROW AT HIGHEST RATE FOR MILITARY, DEFENSE, & AEROSPACE APPLICATION DURING FORECAST PERIOD
  • FIGURE 41: NORTH AMERICA TO LEAD COMPOUND SEMICONDUCTOR MARKET FOR MILITARY, DEFENSE & AEROSPACE APPLICATION DURING FORECAST PERIOD
  • FIGURE 42: SIC TO GROW AT THE HIGHEST CAGR FOR AUTOMOTIVE APPLICATION DURING FORECAST PERIOD
  • FIGURE 43: GAN MARKET TO GROW AT HIGHEST RATE FOR POWER SUPPLY APPLICATION DURING FORECAST PERIOD
  • FIGURE 44: APAC TO DOMINATE COMPOUND SEMICONDUCTOR MARKET DURING FORECAST PERIOD
  • FIGURE 45: NORTH AMERICA: SNAPSHOT OF COMPOUND SEMICONDUCTOR MARKET
  • FIGURE 46: US TO DOMINATE THE COMPOUND SEMICONDUCTOR MARKET IN NORTH AMERICA
  • FIGURE 47: EUROPE: SNAPSHOT OF COMPOUND SEMICONDUCTOR MARKET
  • FIGURE 48: GERMANY TO HOLD THE LARGEST SIZE OF THE COMPOUND SEMICONDUCTOR MARKET IN EUROPE
  • FIGURE 49: APAC: SNAPSHOT OF COMPOUND SEMICONDUCTOR MARKET
  • FIGURE 50: CHINA TO DOMINATE COMPOUND SEMICONDUCTOR MARKET IN APAC DURING FORECAST PERIOD
  • FIGURE 51: SOUTH AMERICA TO LEAD COMPOUND SEMICONDUCTOR MARKET IN ROW DURING FORECAST PERIOD
  • FIGURE 52: ORGANIC AND INORGANIC STRATEGIES ADOPTED BY COMPANIES OPERATING IN COMPOUND SEMICONDUCTOR MARKET
  • FIGURE 53: RANKING ANALYSIS OF MARKET PLAYERS, 2018
  • FIGURE 54: COMPOUND SEMICONDUCTOR MARKET (GLOBAL) COMPETITIVE LEADERSHIP MAPPING (2018)
  • FIGURE 55: NICHIA: COMPANY SNAPSHOT
  • FIGURE 56: SAMSUNG ELECTRONICS: COMPANY SNAPSHOT
  • FIGURE 57: OSRAM: COMPANY SNAPSHOT
  • FIGURE 58: QORVO: COMPANY SNAPSHOT
  • FIGURE 59: SKYWORKS: COMPANY SNAPSHOT
  • FIGURE 60: CREE: COMPANY SNAPSHOT
  • FIGURE 61: INFINEON: COMPANY SNAPSHOT
  • FIGURE 62: MITSUBISHI ELECTRIC: COMPANY SNAPSHOT
  • FIGURE 63: NXP: COMPANY SNAPSHOT
  • FIGURE 64: ON SEMICONDUCTOR: COMPANY SNAPSHOT
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