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市場調查報告書

系統級封裝 (SIP)的全球市場 至2023年的預測:各技術、種類、手法 (覆晶,打線接合)、設備 (RF前端,RF放大器)、用途、地區

System in Package Market by Packaging Technology (2D IC, 2.5D IC, 3D IC), Package Type (BGA, SOP), Packaging Method (Flip Chip, Wire Bond), Device (RF Front-End, RF Amplifier), Application (Consumer Electronics, Communications) - Global Forecast to 2023

出版商 MarketsandMarkets 商品編碼 302720
出版日期 內容資訊 英文 156 Pages
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系統級封裝 (SIP)的全球市場 至2023年的預測:各技術、種類、手法 (覆晶,打線接合)、設備 (RF前端,RF放大器)、用途、地區 System in Package Market by Packaging Technology (2D IC, 2.5D IC, 3D IC), Package Type (BGA, SOP), Packaging Method (Flip Chip, Wire Bond), Device (RF Front-End, RF Amplifier), Application (Consumer Electronics, Communications) - Global Forecast to 2023
出版日期: 2017年11月30日 內容資訊: 英文 156 Pages
簡介

全球系統級封裝 (SIP) 市場,預計2017年達57億9000萬美元,2023年達90億7000萬美元,以9.4%的年複合成長率 (CAGR) 成長。市場成長的主要原因,是電子設備的小型化需求,及IoT的普及等。另一方面,集中、合併了許多零件,結果也產生熱處理的問題。各封裝技術中,3D IC封裝今後將大幅成長。

本報告提供全球SIP (系統級封裝)市場相關分析,技術概要和市場最新形勢,主要市場促進、阻礙因素,市場趨勢預測 (過去2年、今後8年份),各封裝技術/種類/手法、各設備、各用途、各地區的詳細趨勢,市場競爭的狀態,主要企業簡介等調查。

第1章 簡介

第2章 分析方法

第3章 摘要整理

第4章 重要考察

第5章 市場分析

  • 簡介
  • 市場動態
    • 促進因素
      • 電子設備的小型化需求的增加
      • IoT (物聯網)的影響
      • 市場投入時間縮短
    • 阻礙因素
      • 隨著產品整合等級的上升,發生熱處理問題
    • 市場機會
      • 高度5G基礎設施的開發中,高頻 (RF) 零件的利用預測
    • 課題
      • 供應鏈的有效率的管理
  • 價值鏈分析
  • 技術比較
    • 互相比較:SIP (系統級封裝) 和SOC (系統晶片)
    • SIP的市場趨勢
    • SOC的市場趨勢

第6章 SIP市場:各封裝技術

  • 簡介
  • 2D IC封裝技術
  • 2.5D IC封裝技術
  • 3D IC封裝技術

第7章 SIP市場:封裝的各類型

  • 簡介
  • 球柵陣列 (BGA)
    • PBGA (塑膠球柵陣列)
    • SBGA (超級球柵陣列)
    • FBGA (高密度球閘陣列)
    • FCBGA (覆晶球柵陣列)
    • 其他
  • 表面黏著技術 (SMT) 封裝
    • LGA (平面網格陣列)
    • CCGA (陶瓷柱柵陣列)
    • 其他
  • 針腳柵格陣列 (PGA)
    • PGA (覆晶針柵陣列)
    • CPGA (陶瓷針柵陣列)
    • 其他
  • 扁平封裝 (FP)
    • QFN (四方平面無引腳)
    • UTQFN (超薄型QFN)
    • 其他
  • 小型封裝
    • TSOP (薄型小輪廓構裝)
    • TSSOP (薄型縮小小輪廓構裝)
    • 其他

第8章 SIP市場:各封裝手法

  • 簡介
  • 打線接合,粘晶
  • 覆晶
  • FOWLP (扇出晶圓級構裝)
  • 封裝手法比較:打線接合/覆晶/FOWLP
  • 各手法的優點與弱點:打線接合,覆晶,FOWLP
  • 各封裝手法的趨勢

第9章 SIP市場:各設備

  • 簡介
  • 電源管理IC (PMIC)
  • 微機電(MEMS)
  • RF前端
  • RF功率放大器
  • 基頻處理器
  • 應用處理器
  • 其他

第10章 SIP市場:各用途

  • 簡介
  • 家電產品
  • 通訊
  • 各種工業
  • 汽車、運輸機器
  • 航太、防衛
  • 醫療
  • 新領域,其他

第11章 SIP市場:各地區

  • 簡介
  • 亞太地區 (中國、台灣,日本,韓國等)
  • 北美 (美國,加拿大,墨西哥)
  • 歐洲 (德國,法國等)
  • 其他的國家 (RoW:中東、非洲,南美)

第12章 競爭環境

  • 簡介
  • 各企業的市場定位分析
  • 競爭方案
    • 圍繞市場佔有率的戰鬥
    • 產品銷售、開發
    • 協定,事業協定、聯盟,合資企業
    • 企業合併、收購 (M&A)

第13章 企業簡介

  • AMKOR TECHNOLOGY
  • ASE GROUP
  • CHIPBOND TECHNOLOGY
  • CHIPMOS TECHNOLOGIES
  • FATC
  • INTEL
  • JCET
  • POWERTECH TECHNOLOGY
  • SAMSUNG ELECTRONICS
  • SPIL
  • TEXAS INSTRUMENTS
  • UNISEM
  • UTAC (GLOBAL A&T ELECTRONICS)

第14章 附錄

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目錄
Product Code: SE 2384

"System in package market expected to grow at a significant rate between 2017 and 2023"

The system in package market is expected to grow from USD 5.79 billion in 2017 to USD 9.07 billion by 2023, at a CAGR of 9.4% during 2017-2023. The key factors driving the growth of the system in package market are the development strategies such as product launches and developments, mergers and acquisitions, expansions, agreements, collaborations, joint ventures, and partnerships implemented by the players operating in the system in package market, growing demand for miniaturization of electronic devices, and impact of Internet of Things (IoT). However, the major restraining factors for the growth of this market is the higher level of integration that leads to thermal issues.

"3D IC expected to grow at the highest CAGR of the system in package market on the basis of packaging technology during the forecast period"

The 3D IC market is expected to grow at the highest CAGR during the forecast period. The compact structure of 3D IC packaging technology further increases its demand in various smart technologies. Moreover, the major factors driving the system in package market for 3D IC packaging technology include the highest interconnect density and greater space efficiencies in 3D IC compared with all other types of packaging technology such as 2D and 2.5 D.

"Consumer electronics application expected to hold the largest share of the overall system in package market in 2017"

Smartphones and tablets are observed to have the highest adoption among all the consumer electronic devices owing to their small form factor and better performance requirements to operate at a higher bandwidth. As a result, many ICs need to be incorporated into a single chip module for reducing the board space while considering cost and the overall time-to-market. In addition, consumer electronics products, such as mobile phones, tablets, netbook PCs, digital video cameras, and gaming controllers are adopting the advanced architecture. These products address features that increase the demand for miniaturized electronic devices with improved performance in consumer electronics. Owing to these factors, the consumer electronics application expected to hold the largest share of the overall system in package market in 2017.

"System in package market in APAC expected to hold the largest share in 2017"

The overall system in package market in APAC is expected to hold the largest share in 2017, and because of the presence of major IC packaging and wafer suppliers in this region. This makes the integration of 2D, 2.5D, and 3D IC packaging technology in APAC much easier.

The break-up of the profiles of primary participants for the report has been given below.

  • By Company Type: Tier 1 = 45%, Tier 2 = 30%, and Tier 3 = 25%
  • By Designation: C-Level Executives = 40% and Managers = 60%
  • By Region: Americas = 35%, APAC = 45%, Europe = 15%, and RoW = 5%

ASE Group (Taiwan), Amkor Technology (US), SPIL (Taiwan), Powertech Technology (Taiwan), UTAC (Global A&T Electronics) (Singapore), Intel (US), Samsung Electronics (South Korea), JCET (China), Chipmos Technologies (Taiwan), Chipbond Technology (Taiwan), KYEC (Taiwan), Texas Instruments (US), Signetics (South Korea), Unisem (Malaysia), Carsem (Malaysia), FATC (Taiwan), Inari Amertron Berhad (Malaysia), Ardentec (Taiwan), Alchip (Taiwan), Hana-Micron (South Korea), OSE (Taiwan), Greatek Electronics (Taiwan), Tainshui Huatian Technology (China), AOI Electronics (Japan), Lingsen Precision Industry (Taiwan), Nepes (South Korea), Tongfu Microelectronics (China), and Sigurd Microelectronics (Taiwan) are the key players operating in the system in package market.

Research Coverage:

The research report on the system in package market covers the market segmented on the basis of the following segments: packaging technology, package type, packaging method, device, application, and geography. The market has been segmented on the basis of packaging technology into 2D, 2.5D, and 3D IC. Based on package type, the system in package market has been classified into ball grid array, surface mount package, pin grid array, flat package, and small outline package. The market has been segmented on the basis of packaging method into wire bond and die attach, flip chip, and fan-out wafer level packaging. Based on device, the system in package market has been classified into RF front-end, RF power amplifier, PMIC, MEMS, application processor, baseband processor, and others. The market on the basis of application has been segmented into consumer electronics, communications, automotive & transportation, industrial, aerospace & defense, healthcare, and emerging and others.

Key Benefits of Buying the Report:

  • Illustrative segmentation, analysis, and forecast for the market on the basis of packaging technology, package type, packaging method, device, application, and geography have been conducted to give the overall view of the system in package market.
  • The value chain analysis is provided to provide an in-depth insight into the system in package market.
  • The major drivers, restraints, opportunities, and challenges for the system in package market have been detailed in this report.
  • The report includes a detailed competitive landscape, in-depth DIVE analysis, and revenue of the key players.

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. OBJECTIVES OF THE STUDY
  • 1.2. DEFINITION
  • 1.3. MARKET SEGMENTATION
    • 1.3.1. MARKETS COVERED
    • 1.3.2. GEOGRAPHIC SCOPE
    • 1.3.3. YEARS CONSIDERED FOR THE STUDY
  • 1.4. CURRENCY
  • 1.5. LIMITATIONS
  • 1.6. MARKET STAKEHOLDERS

2. RESEARCH METHODOLOGY

  • 2.1. RESEARCH DATA
    • 2.1.1. SECONDARY DATA
      • 2.1.1.1. Secondary sources
    • 2.1.2. PRIMARY DATA
      • 2.1.2.1. Primary sources
      • 2.1.2.2. Key industry insights
      • 2.1.2.3. Breakdown of primaries
  • 2.2. MARKET SIZE ESTIMATION
    • 2.2.1. BOTTOM-UP APPROACH
    • 2.2.2. TOP-DOWN APPROACH
  • 2.3. MARKET BREAKDOWN AND DATA TRIANGULATION
  • 2.4. RESEARCH ASSUMPTIONS

3. EXECUTIVE SUMMARY

4. PREMIUM INSIGHTS

  • 4.1. ATTRACTIVE OPPORTUNITIES IN THE SIP MARKET
  • 4.2. SIP MARKET, BY PACKAGING TECHNOLOGY
  • 4.3. SIP MARKET, BY REGION AND APPLICATION
  • 4.4. SIP MARKET, BY REGION
  • 4.5. SIP MARKET SIZE, BY PACKAGING METHOD, 2017-2023
  • 4.6. SIP MARKET, BY PACKAGE TYPE

5. MARKET OVERVIEW

  • 5.1. INTRODUCTION
  • 5.2. MARKET DYNAMICS
    • 5.2.1. DRIVERS
      • 5.2.1.1. Growing demand for miniaturization of electronic devices
      • 5.2.1.2. Impact of Internet of Things (IoT)
      • 5.2.1.3. Reduced time-to-market
    • 5.2.2. RESTRAINTS
      • 5.2.2.1. Higher level of integration leads to thermal issues
    • 5.2.3. OPPORTUNITIES
      • 5.2.3.1. Potential use of RF components in developing advanced 5G infrastructure
    • 5.2.4. CHALLENGES
      • 5.2.4.1. Effective supply chain management
  • 5.3. VALUE CHAIN ANALYSIS
  • 5.4. COMPARISON OF TECHNOLOGY
    • 5.4.1. BENCHMARKING OF SIP AND SOC
    • 5.4.2. MARKET TRENDS FOR SIP
    • 5.4.3. MARKET TRENDS FOR SOC

6. SIP MARKET, BY PACKAGING TECHNOLOGY

  • 6.1. INTRODUCTION
  • 6.2. 2D IC PACKAGING TECHNOLOGY
  • 6.3. 2.5D IC PACKAGING TECHNOLOGY
  • 6.4. 3D IC PACKAGING TECHNOLOGY

7. SIP MARKET, BY PACKAGE TYPE

  • 7.1. INTRODUCTION
  • 7.2. BALL GRID ARRAY (BGA)
    • 7.2.1. PLASTIC BALL GRID ARRAY (PBGA)
    • 7.2.2. SUPER BALL GRID ARRAY (SBGA)
    • 7.2.3. FINE PITCH BALL GRID ARRAY (FBGA)
    • 7.2.4. FLIP CHIP BALL GRID ARRAY (FCBGA)
    • 7.2.5. OTHERS
  • 7.3. SURFACE MOUNT PACKAGE
    • 7.3.1. LAND GRID ARRAY (LGA)
    • 7.3.2. CERAMIC COLUMN GRID ARRAY (CCGA)
    • 7.3.3. OTHERS
  • 7.4. PIN GRID ARRAY (PGA)
    • 7.4.1. FLIP CHIP PIN GRID ARRAY (PGA)
    • 7.4.2. CERAMIC PIN GRID ARRAY (CPGA)
    • 7.4.3. OTHERS
  • 7.5. FLAT PACKAGE (FP)
    • 7.5.1. QUAD FLAT NO-LEADS (QFN)
    • 7.5.2. ULTRA THIN QUAD FLAT NO-LEADS (UTQFN)
    • 7.5.3. OTHERS
  • 7.6. SMALL OUTLINE PACKAGE
    • 7.6.1. THIN SMALL OUTLINE PACKAGE (TSOP)
    • 7.6.2. THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
    • 7.6.3. OTHERS

8. SIP MARKET, BY PACKAGING METHOD

  • 8.1. INTRODUCTION
  • 8.2. WIRE BOND AND DIE ATTACH
  • 8.3. FLIP CHIP
  • 8.4. FAN-OUT WAFER LEVEL PACKAGING (FOWLP)
  • 8.5. COMPARISON OF WIRE BOND, FLIP CHIP, AND FOWLP PACKAGING METHODS
  • 8.6. ADVANTAGES AND LIMITATIONS OF WIRE BOND, FLIP CHIP, AND FOWLP PACKAGING METHODS
  • 8.7. TRENDS IN EACH PACKAGING METHOD

9. SIP MARKET, BY DEVICE

  • 9.1. INTRODUCTION
  • 9.2. POWER MANAGEMENT INTEGRATED CIRCUIT (PMIC)
  • 9.3. MICROELECTROMECHANICAL SYSTEMS (MEMS)
  • 9.4. RF FRONT-END
  • 9.5. RF POWER AMPLIFIER
  • 9.6. BASEBAND PROCESSOR
  • 9.7. APPLICATION PROCESSOR
  • 9.8. OTHERS

10. SIP MARKET, BY APPLICATION

  • 10.1. INTRODUCTION
  • 10.2. CONSUMER ELECTRONICS
  • 10.3. COMMUNICATIONS
  • 10.4. INDUSTRIAL
  • 10.5. AUTOMOTIVE & TRANSPORTATION
  • 10.6. AEROSPACE & DEFENSE
  • 10.7. HEALTHCARE
  • 10.8. EMERGING & OTHERS

11. SIP MARKET, BY GEOGRAPHY

  • 11.1. INTRODUCTION
  • 11.2. APAC
    • 11.2.1. CHINA AND TAIWAN
    • 11.2.2. JAPAN
    • 11.2.3. SOUTH KOREA
    • 11.2.4. REST OF APAC
  • 11.3. NORTH AMERICA
    • 11.3.1. US
    • 11.3.2. CANADA
    • 11.3.3. MEXICO
  • 11.4. EUROPE
    • 11.4.1. GERMANY
    • 11.4.2. FRANCE
    • 11.4.3. REST OF EUROPE
  • 11.5. ROW
    • 11.5.1. MIDDLE EAST AND AFRICA
    • 11.5.2. SOUTH AMERICA

12. COMPETITIVE LANDSCAPE

  • 12.1. INTRODUCTION
  • 12.2. RANKING ANALYSIS OF MARKET PLAYERS
  • 12.3. COMPETITIVE SCENARIO
    • 12.3.1. BATTLE FOR THE MARKET SHARE
    • 12.3.2. PRODUCT LAUNCHES AND DEVELOPMENTS
    • 12.3.3. AGREEMENTS, COLLABORATIONS, PARTNERSHIPS, AND JOINT VENTURES
    • 12.3.4. ACQUISITIONS AND EXPANSIONS

13. COMPANY PROFILES (Overview, Service offered, Strength of Product Portfolio, Business Strategy Excellence, Recent Developments, and Key Relationships)*

  • 13.1. AMKOR TECHNOLOGY
  • 13.2. ASE GROUP
  • 13.3. CHIPBOND TECHNOLOGY
  • 13.4. CHIPMOS TECHNOLOGIES
  • 13.5. FATC
  • 13.6. INTEL
  • 13.7. JCET
  • 13.8. POWERTECH TECHNOLOGY
  • 13.9. SAMSUNG ELECTRONICS
  • 13.10. SPIL
  • 13.11. TEXAS INSTRUMENTS
  • 13.12. UNISEM
  • 13.13. UTAC (GLOBAL A&T ELECTRONICS)

*Details on Overview, Service offered, Strength of Product Portfolio, Business Strategy Excellence, Recent Developments, and Key Relationships* might not be captured in case of unlisted companies.

14. APPENDIX

  • 14.1. DISCUSSION GUIDE
  • 14.2. KNOWLEDGE STORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
  • 14.3. INTRODUCING RT: REAL-TIME MARKET INTELLIGENCE
  • 14.4. AVAILABLE CUSTOMIZATIONS
  • 14.5. RELATED REPORTS
  • 14.6. AUTHOR DETAILS

LIST OF TABLES

  • TABLE 1: recent iot acquisition
  • TABLE 2: sip MARKET, BY packaging technology, 2015-2023 (USD MILLION)
  • TABLE 3: sip market, BY package type, 2015-2023 (USD MILLION)
  • TABLE 4: sip market for bga, by PACKAGE SUBTYPE, 2015-2023 (USD MILLION)
  • TABLE 5: sip market for smt, by PACKAGE SUBTYPE, 2015-2023 (USD MILLION)
  • TABLE 6: sip market for pga, by PACKAGE SUBTYPE, 2015-2023 (USD MILLION)
  • TABLE 7: sip market for fp, by PACKAGE SUBTYPE, 2015-2023 (USD MILLION)
  • TABLE 8: sip market for sop, by PACKAGE SUBTYPE, 2015-2023 (USD MILLION)
  • TABLE 9: sip MARKET, BY packaging method, 2015-2023 (USD MILLION)
  • TABLE 10: sip MARKET for wire bond and die attach, BY device, 2015-2023 (USD MILLION)
  • TABLE 11: sip MARKET for flip chip, BY device, 2015-2023 (USD MILLION)
  • TABLE 12: sip MARKET for FOWLP, BY device, 2015-2023 (USD MILLION)
  • TABLE 13: sip market, BY device, 2015-2023 (Billion units)
  • TABLE 14: sip market, BY device, 2015-2023 (USD MILLION)
  • TABLE 15: sip market size for pmic, BY application, 2015-2023 (USD MILLION)
  • TABLE 16: sip market size for pmic, BY packaging method, 2015-2023 (USD MILLION)
  • TABLE 17: sip market size for mems, BY application, 2015-2023 (USD MILLION)
  • TABLE 18: sip market size for MEMS, BY packaging method, 2015-2023 (USD MILLION)
  • TABLE 19: sip market size for rf front-end, BY application, 2015-2023 (USD MILLION)
  • TABLE 20: sip market size for RF Front-end, BY packaging method, 2015-2023 (USD MILLION)
  • TABLE 21: sip market size for rf power amplifier, BY application, 2015-2023 (USD MILLION)
  • TABLE 22: sip market size for RF power amplifier, BY packaging method, 2015-2023 (USD MILLION)
  • TABLE 23: sip market size for baseband processor, BY application, 2015-2023 (USD MILLION)
  • TABLE 24: sip market size for baseband processor, BY packaging method, 2015-2023 (USD MILLION)
  • TABLE 25: sip market size for application processor, BY application, 2015-2023 (USD MILLION)
  • TABLE 26: sip market size for application processor, BY packaging method, 2015-2023 (USD MILLION)
  • TABLE 27: sip market size for others, BY application, 2015-2023 (USD MILLION)
  • TABLE 28: sip market size for others, BY packaging method, 2015-2023 (USD MILLION)
  • TABLE 29: sip market, BY application, 2015-2023 (USD MILLION)
  • TABLE 30: sip market for consumer electronics, BY device, 2015-2023 (USD MILLION)
  • TABLE 31: sip market for consumer electronics, BY region, 2015-2023 (USD MILLION)
  • TABLE 32: sip market for communications, BY device, 2015-2023 (USD MILLION)
  • TABLE 33: sip market for communications, BY region, 2015-2023 (USD MILLION)
  • TABLE 34: sip market for industrial, BY device, 2015-2023 (USD MILLION)
  • TABLE 35: sip market for industrial, BY region, 2015-2023 (USD MILLION)
  • TABLE 36: sip market for automotive & transportation, BY device, 2015-2023 (USD MILLION)
  • TABLE 37: sip market for automotive & transportation, BY region, 2015-2023 (USD MILLION)
  • TABLE 38: sip market for aerospace & defense, BY device, 2015-2023 (USD MILLION)
  • TABLE 39: sip market for aerospace & defense, BY region, 2015-2023 (USD MILLION)
  • TABLE 40: sip market for healthcare, BY device, 2015-2023 (USD MILLION)
  • TABLE 41: sip market for healthcare, BY region, 2015-2023 (USD MILLION)
  • TABLE 42: sip market for EMERGING & others, BY device, 2015-2023 (USD MILLION)
  • TABLE 43: sip market for emerging & others, BY region, 2015-2023 (USD MILLION)
  • TABLE 44: sip MARKET, BY geography, 2015-2023 (USD MILLION)
  • TABLE 45: sip MARKET size in apac, BY country, 2015-2023 (USD MILLION)
  • TABLE 46: sip MARKET size in apac, BY application, 2015-2023 (USD MILLION)
  • TABLE 47: sip MARKET size in north america, BY country, 2015-2023 (USD MILLION)
  • TABLE 48: sip MARKET size in north america, BY application, 2015-2023 (USD MILLION)
  • TABLE 49: sip MARKET size in europe, BY country, 2015-2023 (USD MILLION)
  • TABLE 50: sip MARKET size in europe, BY application, 2015-2023 (USD MILLION)
  • TABLE 51: sip MARKET size in row, BY country, 2015-2023 (USD MILLION)
  • TABLE 52: sip MARKET size in row, BY application, 2015-2023 (USD MILLION)
  • TABLE 53: Ranking of TOP 5 PLAYERS IN THE Sip MARKET, 2016
  • TABLE 54: 10 key product Launches, pRODUCT developments, AND TECHNOLOGY DEVELOPMENTS
  • TABLE 55: 10 key agreements, COLLABORATIONS, PARTNERSHIPS, AND joint ventures
  • TABLE 56: 5 key acquisitions and expansions

LIST OF FIGURES

  • FIGURE 1: SIP MARKET SEGMENTATION
  • FIGURE 2: SIP MARKET: RESEARCH DESIGN
  • FIGURE 3: RESEARCH FLOW OF MARKET SIZE ESTIMATION
  • FIGURE 4: MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH
  • FIGURE 5: MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH
  • FIGURE 6: DATA TRIANGULATION
  • FIGURE 7: SIP MARKET FOR 3D IC PACKAGING TECHNOLOGY EXPECTED TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 8: SIP MARKET FOR FOWLP PACKAGING METHOD EXPECTED TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 9: RF FRONT-END DEVICE EXPECTED TO HOLD THE LARGEST SIZE OF SIP MARKET FOR PACKAGING METHODS IN 2017
  • FIGURE 10: SIP MARKET FOR HEALTHCARE APPLICATION EXPECTED TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 11: APAC EXPECTED TO HOLD THE LARGEST MARKET SHARE IN 2017
  • FIGURE 12: INCREASING DEMAND FOR MINIATURIZATION ALONG WITH HIGH-PERFORMANCE ELECTRONIC DEVICES DRIVES THE GROWTH OF THE SIP MARKET
  • FIGURE 13: 2D IC PACKAGING TECHNOLOGY EXPECTED TO HOLD THE LARGEST MARKET SIZE DURING THE FORECAST PERIOD
  • FIGURE 14: CONSUMER ELECTRONICS APPLICATION AND RF FRONT-END DEVICE EXPECTED TO HOLD THE LARGEST SHARE OF THE SIP MARKET BY 2023
  • FIGURE 15: SIP MARKET IN ROW EXPECTED TO GROW AT THE HIGHEST CAGR DURING 2017-2023
  • FIGURE 16: FOWLP PACKAGING EXPECTED TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 17: BGA PACKAGING EXPECTED TO HOLD THE LARGEST SIZE OF THE SIP MARKET DURING THE FORECAST PERIOD
  • FIGURE 18: VALUE CHAIN ANALYSIS OF THE SIP MARKET
  • FIGURE 19: SIP MARKET, BY PACKAGING TECHNOLOGY
  • FIGURE 20: SIP MARKET FOR 3D IC PACKAGING TECHNOLOGY EXPECTED TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 21: STRUCTURE OF 2D IC PACKAGING TECHNOLOGY
  • FIGURE 22: STRUCTURE OF 2.5D IC PACKAGING TECHNOLOGY
  • FIGURE 23: STRUCTURE OF 3D IC PACKAGING TECHNOLOGY
  • FIGURE 24: SIP MARKET, BY PACKAGE TYPE
  • FIGURE 25: SIP MARKET FOR SOP PACKAGING EXPECTED TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 26: SIP MARKET, BY PACKAGING METHOD
  • FIGURE 27: SIP MARKET FOR FOWLP PACKAGING METHOD EXPECTED TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 28: SIP MARKET, BY DEVICE
  • FIGURE 29: SIP MARKET FOR MEMS EXPECTED TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 30: AUTOMOTIVE & TRANSPORTATION APPLICATION MARKET FOR MEMS EXPECTED TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 31: SIP MARKET, BY APPLICATION
  • FIGURE 32: SIP MARKET FOR HEALTHCARE APPLICATION EXPECTED TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 33: APAC MARKET FOR HEALTHCARE APPLICATION EXPECTED TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 34: SIP MARKET IN APAC EXPECTED TO HOLD THE LARGEST SIZE IN 2017
  • FIGURE 35: APAC: SNAPSHOT OF SIP MARKET
  • FIGURE 36: NORTH AMERICA: SNAPSHOT OF SIP MARKET
  • FIGURE 37: EUROPE: SNAPSHOT OF SIP MARKET
  • FIGURE 38: COMPANIES ADOPTED AGREEMENTS, COLLABORATIONS, PARTNERSHIPS, JOINT VENTURES AS KEY GROWTH STRATEGIES BETWEEN JANUARY 2013 AND OCTOBER 2017
  • FIGURE 39: SIP MARKET EVALUATION FRAMEWORK
  • FIGURE 40: AMKOR TECHNOLOGY: COMPANY SNAPSHOT
  • FIGURE 41: ASE GROUP: COMPANY SNAPSHOT
  • FIGURE 42: CHIPBOND TECHNOLOGY: COMPANY SNAPSHOT
  • FIGURE 43: CHIPMOS TECHNOLOGIES: COMPANY SNAPSHOT
  • FIGURE 44: FATC: COMPANY SNAPSHOT
  • FIGURE 45: INTEL: COMPANY SNAPSHOT
  • FIGURE 46: JCET: COMPANY SNAPSHOT
  • FIGURE 47: POWERTECH TECHNOLOGY: COMPANY SNAPSHOT
  • FIGURE 48: SAMSUNG ELECTRONICS: COMPANY SNAPSHOT
  • FIGURE 49: SPIL: COMPANY SNAPSHOT
  • FIGURE 50: TEXAS INSTRUMENTS: COMPANY SNAPSHOT
  • FIGURE 51: UNISEM: COMPANY SNAPSHOT
  • FIGURE 52: UTAC: COMPANY SNAPSHOT
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