紫外線 (UV) 硬化黏劑的全球市場:各類型·各用途 (2014年∼2024年)
Global UV Curing Adhesives Market, 2014-2024: By Type, and By Application
|紫外線 (UV) 硬化黏劑的全球市場:各類型·各用途 (2014年∼2024年) Global UV Curing Adhesives Market, 2014-2024: By Type, and By Application|
|出版日期: 2020年11月01日||內容資訊: 英文||
本報告提供全球紫外線 (UV) 硬化型黏劑的市場相關分析，提供整體市場結構和近來情勢，主要的推動及阻礙市場要素，全球整體及各地區市場趨勢預測 (過去·今後5年份)，各類型·各用途詳細趨勢及市場佔有率結構，主要企業的簡介與業績等調查。
Global UV Curing Adhesives Market, 2014-2024: By Type (Water-Based Adhesive, Solvent-Based Adhesive, Hot Melt Adhesive, and Pressure Sensitive Adhesive), and By Application (Packaging, Construction, Automotive, Electronics & Electrical, Furniture & Laminates, Medical, and Others).
UV curing adhesives are solvent free one component adhesive which cure quickly on exposure of UV wavelength of light. These adhesive are ideal for many applications in which glass or plastic which are able to convey UV light is bonded to itself or metals and other substrates. These adhesives offered so many features over other types of adhesives as they are fast curing and stable in difficult environments. It can be cured with a wide variety of light sources, such as point, pulse, and high density lamps. Cure time is dependent on several parameters and can be adjusted by changing the light intensity or distance of the light from the assembly.
UV curing adhesives can be categories into water-based adhesive, solvent-based adhesive, hot melt adhesive, and pressure sensitive adhesive. UV curing adhesives has wide spectrum of end use industry application such as, packaging, construction, automotive, electronics & electrical, furniture & laminates, medical, and others. These are widely used in the manufacturing of glass, optical, medical, and electronics products. UV curable adhesives are also ideal for manual assembly processes. Because they will not cure until exposed to light users can make fine adjustments to alignment before bonding. These adhesive are used in the manufacturing of medical items and instruments including syringes, catheters, blood filters, and others. UV curing adhesives are widely used in the electronic industry for potting, encapsulation, wire tacking, coil termination, circuit protection and assembly.
The global UV curing adhesive market research report sheds light on the market circumstances by carrying out primary and secondary research for more than 320 hours. As per the report, the global UV curing adhesive market is growing at a fast pace and increasing its geographical footprint rapidly. The global UV curing adhesive market is valued at US $ xxx million dollars in 2019 which is forecast to grow at CAGR of xx% and reach a massive US $ xxx million dollars by the end of 2024 in value.
The growth is comparatively higher in APAC region due rising demand from end use industry. The major growth driver for UV curing adhesive market is the rising manufacturing of electronics products and medical items. Rising demand form glass industry and construction industry due to growing urbanization is expected to drive the growth of UV curing adhesive market globally.
UV curing adhesive enjoy wide usage across all major regions in the world including Europe, APAC, North America, Middle East, Africa, and Latin America. These regions serve large number of manufacturers and supplier and are hence responsible for the growth of UV curing adhesive market globally. The companies that lead global UV curing adhesive market are 3M, H.B. Fuller, Henkel AG & Co. KGaA, DowDuPont, Sika AG, Arkema, Huntsman Corporation, Avery Dennison, Wacker Chemie AG, Royal Adhesives and Sealants, Franklin International, LORD Corporation, and Illinois Tool Works.
The research process includes the market segmentation of the global UV curing adhesive market, identifying the growth determinants of every market segment and market forecasts. All the market forecasts are done in accordance with the inputs taken from the global UV curing adhesive market industry experts from across the global industry. Market Krystal conducts more than 40 interview hours dedicated for this study, the same are mentioned below: