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1014792

封裝天線（AiP/AoP）專利情況分析（2021）

Antenna in Package (AiP/AoP) Patent Landscape Analysis 2021

出版日期: 2021年06月18日 | 出版商:

KnowMade | 英文 PDF > 80 Slides, Excel File | 商品交期: 最快1-2個工作天內

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簡介
目錄

簡介

5G 系統封裝需要在一個模塊中集成無源元件和其他系統組件，此外還需要射頻、模擬和數位功能。這些系統呈現出異構集成的趨勢，這在 5G 中變得越來越重要。收發器靠近前端模塊對於減小尺寸和損耗也很重要，這是通過將天線集成到射頻模塊中來實現的。同時還建模了一種散熱解決方案，以將有源組件保持在可接受的熱條件下。

毫米波天線封裝解決方案需要在收發器 IC 和天線之間互連，以在感興趣的頻率範圍內實現低插入損耗和可接受的回波損耗。另一個重要的要求是外形，為了滿足這一要求，業界已經從傳統的引線鍵合和倒裝芯片互連等互連技術轉向稱為扇出封裝和IC嵌入的新技術，過渡正在進行中。如今，這些方法對 RF 行業變得越來越重要，並用於天線集成模塊。

本報告調查了封裝天線（AiP/AoP）的專利情況、公開專利的時間發展、包括專利申請國家、主要專利受讓人和行業在內的知識產權趨勢我們提供了有關新進入者、AiP的信息主要參與者的專利組合等。

本報告中提到的公司：

SJ Semiconductor、SMIC、TSMC、Intel、Samsung Electro Mechanics、Samsung Electronics、Huawei、Mediatek、AAC Technologies、Oppo Mobile、IBM、SPIL、Vivo Mobile、ASE、Fraunhofer、Qualcomm、Murata、Texas Instruments、NCAP、Broadcom、Powertech Technology、Sony、Fujikura、Saint Gobain、AT＆S、Shanghai Xianfang Semiconductor、GlobalFoundries、Boeing、LG Electronics、CETC、Ericsson、Spreadtrum Communication、Raytheon、Bosch、Novaco Microelectronics Technologies、JCET、STATS ChipPAC、Chengdu T Ray Technology、Microsilicon Technology、Guangdong Xinhua Microelectronic Technology、Tsinghua University、TDK Epcos、New Kojinpeng Private、Hanyang University、Micron Technology、A*STAR、Core、National Chung Shan Institute of Science＆Technology、Skyworks、Kyocera、Dupont Electronics、Institute of Microelectronics-Chinese Academy of Sciences、Forehope Electronic Ningbo、Dongwoo Fine-Chem、LS Mtron、Shanghai Amphenol Airwave Communication Electronics、Chunghwa Precision Test Technology、Innolux、Imec、Ve ga Grieshaber、Chengdu Ruishi Intelligent Technology、Nepes、Xiamen Yun Tian Semiconductor Technology、Guangdong Fozhixin Microelectronics Technology Research、Nanjing Qinheng Microelectronics、Qingdao Geer Intelligent Sensor、JCAP等。

Since 2017, Knowmade has been following the intellectual property (IP) trends related to RF front-end devices and their packaging. Recently, Knowmade witnessed increasing patenting activity related to PAMiD modules, RF front-end modules, RF filters and switch integration, and antennas for 5G and their packaging.

Packaging of 5G systems requires the integration of RF, analog and digital functions along with passives and other system components in a single module. These systems exemplify the heterogeneous integration trend which becomes more important for 5G. Proximity of the transceiver and front-end module is also important, to reduce size and loss. This is achieved by integrating antennas with the RF module as well as simultaneous modeling of a heat dissipation solution to keep active components in acceptable thermal conditions.

In the mm-wave antenna-in-package solutions, interconnections between transceiver ICs and antennas should result in low insertion loss and acceptable return loss over the frequency range of interest. The other key requirement is the form factor, and to meet it the industry is progressively moving from conventional interconnect techniques such as wire-bonding and flip-chip interconnections to emerging techniques referred to as Fan-Out packaging or IC-embedding. Flip-chip and Fan-out interconnections were originally developed for high-performance computing or mobile processor applications, but their fine pitch and low electrical parasitic have pushed RF players to use them in their RF/mm-wave modules. Today, these approaches are getting more and more critical for the RF industry and are used in antenna-integrated modules.

In this report, Knowmade analyzes the patent landscape related to antenna integrated in package (AiP, AoP). The AiP patent landscape is led by major semiconductor foundries and OSATs, SJ Semiconductor (SJSemi) being the main patent assignee, and it includes any links in the supply chain. Foundries/OSATs (SJSemi/SMIC, TSMC, SEMCO, ASE, SPIL) as well as IDMs/fabless (MediaTek, Qualcomm, Murata, TI, Skyworks) and OEMs (Huawei, Vivo mobile, Oppo mobile) have filed AiP-related patents to protect their structures/designs or manufacturing methods.

Understanding of the current IP players' activities

Knowmade has identified more than 140 different entities that have filed patent applications related to AiP. The report provides a clear overview of the most active assignees as well as a presentation of IP newcomers. Furthermore, a patent segmentation reveals the technical position, e.g. WLP, Fan-Out, Flip Chip or antenna type, of each of the main players.

SJSemi, Intel and TSMC have the most significant enforceable portfolio; together they own one third of all granted patents. Over the last few years, SJSemi, TSMC, Samsung, MediaTek, Huawei, AAC Technologies and NCAP have been increasing their patenting activity.

The IP newcomers of the last 2 years are mainly Chinese companies that focus on a wafer-level packaging approach for integrated antenna: Vivo Mobile, OPPO Mobile, Shanghai Xianfang Semiconductor (subsidiary of NCAP), Powertech Technology, Microsilicon Technology, T-Ray Technology, Sky Semiconductor Technology, Xinhua Microelectronics and Unisoc.

Focus on the main IP players' IP portfolios

The report provides a detailed analysis of the main IP players: SJSemi/SMIC, TSMC, Samsung Electro-Mechanics, Huawei, MediaTek, IBM, ASE, SPIL, NCAP, Qualcomm, and Murata. For each player, we highlight their strengths and weaknesses and provide information about their technology developments. Finally, a description and analysis of their key patents is provided.

The IP white-spaces are shrinking

The patents describe a variety of solutions to design or manufacture antenna systems in package, and not many patents are focused on critical technological bricks. The AiP patent landscape attests to well-mastered packaging solutions that are already available on the market and where the IP "white-spaces" will be quickly limited. Each player has developed and protected its own AiP structures/designs, each providing a solution to answer the different requirements of next-generation handset RF packages. The patents mainly claim specific AiP structures/designs or processes/methods for making them. Asserting owned patents against infringing products is easier with patents claiming an AiP structure/design, and patent litigation on such aspects will thus be inevitable in a growing 5G market.

Report's main assets

Understanding the key players' patented technologies and current IP strategies and strengths: More than 140 patent applicants are involved in the antenna in package patent landscape. This report reveals the IP position of key players through a detailed analysis of their patent portfolios. We also provide an understanding of these players' patented technologies, their IP strategy, and their capability to limit other firms' activity.

Analyzing IP players' developed technologies: This report provides an understanding of the IP players' recent technical developments. The main AiP approaches are sorted, and IP players and key patents are presented for each segment.

Identifying and understanding IP players' key patents related to AiP: This report highlights the main IP players' key patents related to AiP with a selection of the most influential/blocking patents.

Useful Excel patent database

This report also includes an Excel database with the 1,500+ patents and patent applications analyzed in this study. This useful patent database allows for multi-criteria searches and includes patent publication numbers, hyperlinks to the original documents, priority date, title, abstract, patent assignees, patent's current legal status, and technological segments.

Companies mentioned in this report (non-exhaustive list):

SJ Semiconductor, SMIC, TSMC, Intel, Samsung Electro Mechanics, Samsung Electronics, Huawei, Mediatek, AAC Technologies, Oppo Mobile, IBM, SPIL, Vivo Mobile, ASE, Fraunhofer, Qualcomm, Murata, Texas Instruments, NCAP, Broadcom, Powertech Technology, Sony, Fujikura, Saint Gobain, AT&S, Shanghai Xianfang Semiconductor, GlobalFoundries, Boeing, LG Electronics, CETC, Ericsson, Spreadtrum Communication, Raytheon, Bosch, Novaco Microelectronics Technologies, JCET, STATS ChipPAC, Chengdu T Ray Technology, Microsilicon Technology, Guangdong Xinhua Microelectronic Technology, Tsinghua University, TDK Epcos, New Kojinpeng Private, Hanyang University, Micron Technology, A*STAR, Core, National Chung Shan Institute of Science & Technology, Skyworks, Kyocera, Dupont Electronics, Institute of Microelectronics - Chinese Academy of Sciences, Forehope Electronic Ningbo, Dongwoo Fine-Chem, LS Mtron, Shanghai Amphenol Airwave Communication Electronics, Chunghwa Precision Test Technology, Innolux, Imec, Vega Grieshaber, Chengdu Ruishi Intelligent Technology, Nepes, Xiamen Yun Tian Semiconductor Technology, Guangdong Fozhixin Microelectronics Technology Research, Nanjing Qinheng Microelectronics, Qingdao Geer Intelligent Sensor, JCAP, etc.

INTRODUCTION

Context and challenges
Market data
AiP technical approaches

SCOPE OF THE REPORT METHODOLOGY

Scope of the report
Key features of the report
Why study the patent landscape
Main patent assignees cited in this report
Objectives of the report
Methodology for patent search and selection
Terminology

EXECUTIVE SUMMARY

IP LANDSCAPE OVERVIEW

Time evolution of patent publications
Main patent assignees
IP position and IP activity of main players
Geographic coverage of main players' AiP patent portfolio
Time evolution of patent publications for main players
Newcomers in the AiP patent landscape
IP leadership of main players
Patent segmentation per AiP technical approach

WLP, Fan Out WLP, 3 D stacking, Other

Main patent assignees per AiP approach
Fan Out packaging IP players vs Market players
Time evolution of patent publications per AiP approach

Patent segmentation per package integrated antenna structures

Patch antenna, Dipole antenna, Monopole antenna, Microstrip antenna, Yagi antenna, Vivaldi antenna, Slot antenna

Main patent assignees per package integrated antenna structures

Air cavity related patents
Stacked antenna related patents
Main IP collaborations (co owned patents and IP transfers)

IP PROFILE OF KEY PLAYERS

Patent portfolio overview, key patents, and recent patenting activity
- SMIC SJSemi
- TSMC
- Samsung Electro Mechanics
- Huawei
- MediaTek
- IBM
- ASE
- SPIL
- NCAP
- Qualcomm
- Murata