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Antenna in Package (AiP/AoP) Patent Landscape Analysis 2021

出版商 KnowMade 商品編碼 1014792
出版日期 內容資訊 英文 PDF > 80 Slides, Excel File
商品交期: 最快1-2個工作天內
封裝天線(AiP/AoP)專利情況分析(2021) Antenna in Package (AiP/AoP) Patent Landscape Analysis 2021
出版日期: 2021年06月18日內容資訊: 英文 PDF > 80 Slides, Excel File

5G 系統封裝需要在一個模塊中集成無源元件和其他系統組件,此外還需要射頻、模擬和數位功能。這些系統呈現出異構集成的趨勢,這在 5G 中變得越來越重要。收發器靠近前端模塊對於減小尺寸和損耗也很重要,這是通過將天線集成到射頻模塊中來實現的。同時還建模了一種散熱解決方案,以將有源組件保持在可接受的熱條件下。

毫米波天線封裝解決方案需要在收發器 IC 和天線之間互連,以在感興趣的頻率範圍內實現低插入損耗和可接受的回波損耗。另一個重要的要求是外形,為了滿足這一要求,業界已經從傳統的引線鍵合和倒裝芯片互連等互連技術轉向稱為扇出封裝和IC嵌入的新技術,過渡正在進行中。如今,這些方法對 RF 行業變得越來越重要,並用於天線集成模塊。



SJ Semiconductor、SMIC、TSMC、Intel、Samsung Electro Mechanics、Samsung Electronics、Huawei、Mediatek、AAC Technologies、Oppo Mobile、IBM、SPIL、Vivo Mobile、ASE、Fraunhofer、Qualcomm、Murata、Texas Instruments、NCAP、Broadcom、Powertech Technology、Sony、Fujikura、Saint Gobain、AT&S、Shanghai Xianfang Semiconductor、GlobalFoundries、Boeing、LG Electronics、CETC、Ericsson、Spreadtrum Communication、Raytheon、Bosch、Novaco Microelectronics Technologies、JCET、STATS ChipPAC、Chengdu T Ray Technology、Microsilicon Technology、Guangdong Xinhua Microelectronic Technology、Tsinghua University、TDK Epcos、New Kojinpeng Private、Hanyang University、Micron Technology、A*STAR、Core、National Chung Shan Institute of Science&Technology、Skyworks、Kyocera、Dupont Electronics、Institute of Microelectronics-Chinese Academy of Sciences、Forehope Electronic Ningbo、Dongwoo Fine-Chem、LS Mtron、Shanghai Amphenol Airwave Communication Electronics、Chunghwa Precision Test Technology、Innolux、Imec、Ve ga Grieshaber、Chengdu Ruishi Intelligent Technology、Nepes、Xiamen Yun Tian Semiconductor Technology、Guangdong Fozhixin Microelectronics Technology Research、Nanjing Qinheng Microelectronics、Qingdao Geer Intelligent Sensor、JCAP等。



  • 背景和挑戰
  • 市場數據
  • AiP 的技術方法


  • 調查範圍
  • 報表主要功能
  • 為什麼要研究專利情況
  • 本報告引用的主要專利權人
  • 報告目的
  • 專利檢索及各檢索方法
  • 期限


IP 情況概覽

  • 專利出版物的時間演變
  • 主要專利權人
  • 主要公司的知識產權地位和知識產權活動
  • 主要公司 AiP 專利組合的地理範圍
  • 主要公司專利出版物的時間演變
  • AIP專利形勢新人
  • 大公司的知識產權領導地位
  • 通過 AiP 技術方法進行專利細分

WLP、fanout WLP、3D stacking等

  • 基於 AiP 方法的主要專利受讓人
  • 扇出封裝 IP 企業與市場企業
  • 每種 AiP 方法的專利公佈時間推移
  • 每個封裝集成天線結構的專利分割


  • 封裝集成天線結構主要專利權人
  • 空腔相關專利
  • 多層天線相關專利
  • 重大知識產權合作(共有專利、知識產權轉讓)

主要公司的 IP 概況

  • 專利組合、主要專利和近期專利活動概覽
    • SMIC SJSemi
    • TSMC
    • Samsung Electro Mechanics
    • Huawei
    • MediaTek
    • IBM
    • ASE
    • SPIL
    • NCAP
    • Qualcomm
    • Murata


Knowmade 演示

Product Code: KM21004

Report's Key Features:

  • PDF with > 80 slides
  • Excel file > 660 patent families + hyperlink to updated online database (legal status, documents etc.)
  • IP trends, including time-evolution of published patents, countries of patent filings, etc.
  • Ranking of main patent assignees.
  • Newcomers in the AiP IP landscape.
    • Main technologies IP analysis:
    • Flip Chip
    • Fan Out
    • Wafer Level Packaging
    • Air cavity antenna
    • Stacked antenna
  • Focus on AiP patent portfolios of key players: SJSemi/SMIC, TSMC, Samsung Electro-Mechanics, Huawei, MediaTek, IBM, ASE, SPIL, NCAP, Qualcomm, Murata.
  • Key players' IP position and relative strength of their patent portfolios

Antenna integration becomes more and more advantageous at higher frequencies

Since 2017, Knowmade has been following the intellectual property (IP) trends related to RF front-end devices and their packaging. Recently, Knowmade witnessed increasing patenting activity related to PAMiD modules, RF front-end modules, RF filters and switch integration, and antennas for 5G and their packaging.

Packaging of 5G systems requires the integration of RF, analog and digital functions along with passives and other system components in a single module. These systems exemplify the heterogeneous integration trend which becomes more important for 5G. Proximity of the transceiver and front-end module is also important, to reduce size and loss. This is achieved by integrating antennas with the RF module as well as simultaneous modeling of a heat dissipation solution to keep active components in acceptable thermal conditions.

In the mm-wave antenna-in-package solutions, interconnections between transceiver ICs and antennas should result in low insertion loss and acceptable return loss over the frequency range of interest. The other key requirement is the form factor, and to meet it the industry is progressively moving from conventional interconnect techniques such as wire-bonding and flip-chip interconnections to emerging techniques referred to as Fan-Out packaging or IC-embedding. Flip-chip and Fan-out interconnections were originally developed for high-performance computing or mobile processor applications, but their fine pitch and low electrical parasitic have pushed RF players to use them in their RF/mm-wave modules. Today, these approaches are getting more and more critical for the RF industry and are used in antenna-integrated modules.

In this report, Knowmade analyzes the patent landscape related to antenna integrated in package (AiP, AoP). The AiP patent landscape is led by major semiconductor foundries and OSATs, SJ Semiconductor (SJSemi) being the main patent assignee, and it includes any links in the supply chain. Foundries/OSATs (SJSemi/SMIC, TSMC, SEMCO, ASE, SPIL) as well as IDMs/fabless (MediaTek, Qualcomm, Murata, TI, Skyworks) and OEMs (Huawei, Vivo mobile, Oppo mobile) have filed AiP-related patents to protect their structures/designs or manufacturing methods.

Understanding of the current IP players' activities

Knowmade has identified more than 140 different entities that have filed patent applications related to AiP. The report provides a clear overview of the most active assignees as well as a presentation of IP newcomers. Furthermore, a patent segmentation reveals the technical position, e.g. WLP, Fan-Out, Flip Chip or antenna type, of each of the main players.

SJSemi, Intel and TSMC have the most significant enforceable portfolio; together they own one third of all granted patents. Over the last few years, SJSemi, TSMC, Samsung, MediaTek, Huawei, AAC Technologies and NCAP have been increasing their patenting activity.

The IP newcomers of the last 2 years are mainly Chinese companies that focus on a wafer-level packaging approach for integrated antenna: Vivo Mobile, OPPO Mobile, Shanghai Xianfang Semiconductor (subsidiary of NCAP), Powertech Technology, Microsilicon Technology, T-Ray Technology, Sky Semiconductor Technology, Xinhua Microelectronics and Unisoc.

Focus on the main IP players' IP portfolios

The report provides a detailed analysis of the main IP players: SJSemi/SMIC, TSMC, Samsung Electro-Mechanics, Huawei, MediaTek, IBM, ASE, SPIL, NCAP, Qualcomm, and Murata. For each player, we highlight their strengths and weaknesses and provide information about their technology developments. Finally, a description and analysis of their key patents is provided.

The IP white-spaces are shrinking

The patents describe a variety of solutions to design or manufacture antenna systems in package, and not many patents are focused on critical technological bricks. The AiP patent landscape attests to well-mastered packaging solutions that are already available on the market and where the IP "white-spaces" will be quickly limited. Each player has developed and protected its own AiP structures/designs, each providing a solution to answer the different requirements of next-generation handset RF packages. The patents mainly claim specific AiP structures/designs or processes/methods for making them. Asserting owned patents against infringing products is easier with patents claiming an AiP structure/design, and patent litigation on such aspects will thus be inevitable in a growing 5G market.

Report's main assets

Understanding the key players' patented technologies and current IP strategies and strengths: More than 140 patent applicants are involved in the antenna in package patent landscape. This report reveals the IP position of key players through a detailed analysis of their patent portfolios. We also provide an understanding of these players' patented technologies, their IP strategy, and their capability to limit other firms' activity.

Analyzing IP players' developed technologies: This report provides an understanding of the IP players' recent technical developments. The main AiP approaches are sorted, and IP players and key patents are presented for each segment.

Identifying and understanding IP players' key patents related to AiP: This report highlights the main IP players' key patents related to AiP with a selection of the most influential/blocking patents.

Useful Excel patent database

This report also includes an Excel database with the 1,500+ patents and patent applications analyzed in this study. This useful patent database allows for multi-criteria searches and includes patent publication numbers, hyperlinks to the original documents, priority date, title, abstract, patent assignees, patent's current legal status, and technological segments.

Companies mentioned in this report (non-exhaustive list):

SJ Semiconductor, SMIC, TSMC, Intel, Samsung Electro Mechanics, Samsung Electronics, Huawei, Mediatek, AAC Technologies, Oppo Mobile, IBM, SPIL, Vivo Mobile, ASE, Fraunhofer, Qualcomm, Murata, Texas Instruments, NCAP, Broadcom, Powertech Technology, Sony, Fujikura, Saint Gobain, AT&S, Shanghai Xianfang Semiconductor, GlobalFoundries, Boeing, LG Electronics, CETC, Ericsson, Spreadtrum Communication, Raytheon, Bosch, Novaco Microelectronics Technologies, JCET, STATS ChipPAC, Chengdu T Ray Technology, Microsilicon Technology, Guangdong Xinhua Microelectronic Technology, Tsinghua University, TDK Epcos, New Kojinpeng Private, Hanyang University, Micron Technology, A*STAR, Core, National Chung Shan Institute of Science & Technology, Skyworks, Kyocera, Dupont Electronics, Institute of Microelectronics - Chinese Academy of Sciences, Forehope Electronic Ningbo, Dongwoo Fine-Chem, LS Mtron, Shanghai Amphenol Airwave Communication Electronics, Chunghwa Precision Test Technology, Innolux, Imec, Vega Grieshaber, Chengdu Ruishi Intelligent Technology, Nepes, Xiamen Yun Tian Semiconductor Technology, Guangdong Fozhixin Microelectronics Technology Research, Nanjing Qinheng Microelectronics, Qingdao Geer Intelligent Sensor, JCAP, etc.



  • Context and challenges
  • Market data
  • AiP technical approaches


  • Scope of the report
  • Key features of the report
  • Why study the patent landscape
  • Main patent assignees cited in this report
  • Objectives of the report
  • Methodology for patent search and selection
  • Terminology



  • Time evolution of patent publications
  • Main patent assignees
  • IP position and IP activity of main players
  • Geographic coverage of main players' AiP patent portfolio
  • Time evolution of patent publications for main players
  • Newcomers in the AiP patent landscape
  • IP leadership of main players
  • Patent segmentation per AiP technical approach

WLP, Fan Out WLP, 3 D stacking, Other

  • Main patent assignees per AiP approach
  • Fan Out packaging IP players vs Market players
  • Time evolution of patent publications per AiP approach
  • Patent segmentation per package integrated antenna structures

Patch antenna, Dipole antenna, Monopole antenna, Microstrip antenna, Yagi antenna, Vivaldi antenna, Slot antenna

  • Main patent assignees per package integrated antenna structures
  • Air cavity related patents
  • Stacked antenna related patents
  • Main IP collaborations (co owned patents and IP transfers)


  • Patent portfolio overview, key patents, and recent patenting activity
    • SMIC SJSemi
    • TSMC
    • Samsung Electro Mechanics
    • Huawei
    • MediaTek
    • IBM
    • ASE
    • SPIL
    • NCAP
    • Qualcomm
    • Murata