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市場調查報告書

全球智慧和智能包裝市場:2020-2030年

Smart and Intelligent Packaging 2020-2030

出版商 IDTechEx Ltd. 商品編碼 813705
出版日期 內容資訊 英文 258 Slides
商品交期: 最快1-2個工作天內
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全球智慧和智能包裝市場:2020-2030年 Smart and Intelligent Packaging 2020-2030
出版日期: 2019年10月02日內容資訊: 英文 258 Slides
簡介

本報告研究全球智慧包裝市場,彙整市場定義和概要、導入智慧包裝技術的推動因素分析、各種實現技術趨勢和評估、案例研討、按技術區分的市場規模推移和預測、主要企業簡介等情報。

第1章 摘要整理和結論

第2章 智慧包裝:成長推動因素

  • 智慧包裝需求
  • 零售產業問題
  • 醫療保健問題
  • 以更好的方式使用更多人類感官

第3章 末端使用者回饋

  • 末端使用者需求:智慧包裝推動因素
  • 末端使用者的智慧包裝回饋:應用需求
  • 末端使用者的智慧包裝看法:技術需求
  • P&G和印刷電子
  • Diage和印刷電子
  • Amcor
  • Colgate-Palmolive Group
  • Unilever

第4章 RFID:智慧包裝的NFC和RAIN

  • RFID
  • RFID技術:整體樣貌
  • 被動式RFID
  • 偏好的RFID頻率
  • 被動RFID系統
  • 電池輔助被動/半主動標籤
  • 電池輔助被動 (BAP) RFID感測器案例
  • 主動式RFID
  • RTLS
  • 無晶片/印刷RFID
  • 被動RFID技術:按工作頻率
  • 被動HF和UHF標籤解剖
  • 連接HF/NFC線圈的課題
  • 被動式RFID的威脅:機器視覺、其他

第5章 印刷、軟性、有機電子

  • 印刷、軟性、有機電子主要技術組件之說明和分析
  • 市場潛力和盈利能力
  • 目前市場規模
  • 市場投入策略:優缺點
  • 價值鏈、其他

第6章 顯示器

  • 電致變色顯示器
  • AC電激發光顯示器
  • 熱致變色顯示器

第7章 印刷LED照明

第8章 印刷軟性電池

第9章 印刷感測器

第10章 邏輯

  • 軟性/印刷電晶體電路各種類型
  • 為什麼是印刷電晶體?
  • 半導體選項比較
  • 仍存在課題
  • 半導體選項
  • 既有TFT技術:基於矽
  • 金屬氧化物半導體
  • 金屬氧化物製造流程
  • 但可以利用金屬氧化物半導體印刷嗎?
  • Evonik解決方案:可加工的金屬氧化物
  • iXensic最新進展
  • 有機半導體
  • OTFT活動性炒作:真實檢驗
  • 全印刷TFT
  • 次世代印刷電子技術研究組合 (JAPERA) 的全印刷TFT
  • S2S自動印刷OTFT
  • Roll-to-roll印刷有機TFT
  • Merck有機TFT
  • 碳奈米管和石墨烯電晶體
  • 軟性/印刷電晶體 RFID的最新進展、其他

第11章 QR碼

第12章 電容/INK STRIPE IDENTIFICATION

  • 無電晶體RFID:HidE (Hidden Electronic Product Code)
  • Printechnologics的印刷ID
  • 雷達ID 60GHz
  • Inksure:SARcode案例
  • Touchcode:T-ink / Printechnologics
  • Touchcode應用概念
  • Touchcode進步
  • TicTag
  • Prismade Labs

第13章 RFID感測器

  • RFID感測器:主要選擇
  • 透過IC標籤的RFID標籤感測器
  • 被動UHF RFID 感測器:Powercast□Vanguard ID Systems的共同開發
  • 被動UHF RFID 感測器:RFMicron□Smartrac
  • GE/ Kemsense:基於傳統型RFID標籤的生物感測器
  • 化學無損RFID感測器標籤
  • 失敗教訓

第14章 化學品智慧包裝技術

  • 食品劣化
  • 微生物腐敗
  • 化學和酵素活性
  • 氧化劣化/酸敗
  • 水分/蒸氣移動
  • 保存期限判定
  • 食品劣化
  • 時間溫度指示器(TTI)
  • 化學時間溫度指示器(TTI)案例
  • 新鮮度指示器み
  • 成熟度指示器み
  • 時間指示器み、其他

第15章 智慧包裝應用:傳統RFID

  • 拖板/箱裝標籤
  • 零售服飾、物品級別
  • 防偽RFID
  • 日本經濟產業省的標籤目標
  • Coca-Cola Freestyle Machine、其他

第16章 智慧泡殼包裝

  • 用藥不順應課題
  • 目前解決方案
  • 印刷電子/ RFID解決方案
  • 智慧泡殼包裝、其他

第17章 智慧包裝:案例研討

第18章 電子智慧包裝:市場預測

  • RAIN (UHF RFID) 智慧包裝
    • 標籤數預測
    • 平均價格預測
    • 市場規模預測
  • NFC (HF RFID) 智慧包裝
    • 標籤數預測
    • 平均價格預測
    • 市場規模預測
  • 電子智慧包裝
    • 總數預測
    • 市場規模預測
  • 課題和市場機會

第19章 附錄:企業簡介

第20章 附錄:術語表

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目錄

Smart (or intelligent) packaging for goods is packaging which goes beyond the basic function of passively containing and protecting the product by adding useful functionality with real benefits for the consumer.

This comprehensive IDTechEx Research report covers the upcoming requirements and drivers for smart packaging; feedback from Fast Moving Consumer Goods (FMCG) brands with their views of smart packaging; assessment of enabling technologies; smart packaging case studies; key players; and forecasts of electronic smart packaging.

This analysis is done on a global basis, from assessing the rise of QR codes in China to the latest electronic smart labels based on novel semiconductors and other components that are enabling a radical change in the $400 billion+ packaging industry.

IDTechEx concludes how the global demand for electronic smart packaging features will be a $895 million market in 2030 versus $55 million in 2020 (and more if the infrastructure, software and services are also included). Based on an impartial analysis, IDTechEx expects that almost 21 billion packages sold in 2030 will feature an electronic feature to enhance the package.

Why Smart and Intelligent Packaging?

Smart and intelligent packaging can offer many different benefits to the brand, retailer and consumer. For example, it addresses the need for brands to reconnect with the customer or face potential oblivion from competing products. Other drivers include counterfeiting to the ageing population's need for better drug delivery devices.

There are many current and developing emerging technologies which are driving change in the smart packaging segment, often with very different purposes, which include:

  • RFID for wireless item identification (usually invisible to the consumer)
  • Electronic Articles Surveillance (EAS) for anti theft (usually invisible to the consumer)
  • QR codes for identification (increasingly used for payments)
  • Data loggers for temperature, shock, vibration, etc monitoring
  • Interactive smart packaging including illumination, sound, measuring (such as smart blister packs) and much more
  • Chemical indicators: temperature, frozen chemical visual indicators
  • Internal active packaging: whereby the package interacts with the contents to keep it fresher for longer, for example
  • External active packaging: whereby the package releases aromas, for example, to entice consumers

Drivers for Smart Packaging

There are prominent drivers for smart packaging, including the ageing population, more wealthy consumers, requirement for more data on products purchased, entertainment value, need to distinguish products amidst greater competition and tougher legislation.

Smart packaging can also solve big challenges such as monitoring patients not taking medication at the correct times when needed or informing that the medicines or foods are still safe to consume.

Across that backdrop there are other significant impending changes, from increasing home delivery of products and groceries which may change the value of the product packaging in the decision and sales process to many new enabling technologies from machine vision systems to identify items to the increasing adoption of RFID to printed electronics labels. Of course, sustainability is also a high priority for brands.

Global, Detailed Assessment of Smart Packaging

This report from IDTechEx covers the full picture and opportunities - in addition to the challenges. To gain very high volume, and therefore lowest costs, by selling across all industries, basic hardware platforms must be developed. These are discussed. The detailed market forecasts, statistics for associated industries, pros and cons, technology choices and lessons of success and failure provide a lucid, compact analysis.

The report is structured as follows:

  • Executive summary, including key conclusions and forecasts

The need for Smart Packaging and brand perspectives This section covers the drivers for smart packaging, end user requirements and voice of the customer based on feedback from global FMCG firms on their perspectives on smart packaging

  • RFID: NFC and RAIN for Smart Packaging
  • NFC and RAIN technologies, prices and their application to packaging
  • Printed, Flexible and Organic Electronics
  • Assessment of enabling technologies including displays, flexible/printed batteries, printed sensors and flexible logic circuits
  • QR codes
  • Failures and successes, analysis of use of QR codes in China
  • Capacitive ink strip / identification systems
  • Analysis of novel identification systems relevant to smart packaging
  • RFID Sensors
  • NFC and RAIN sensor systems, passive or with battery
  • Chemical smart packaging technologies
  • Review of chemical smart packaging technologies including time temperature and freshness indicators
  • Smart Packaging Applications: RFID
  • Applications and case studies of RFID smart packaging
  • Smart Blister Packs
  • Assessment of smart blister packs for monitoring medication compliance'
  • Smart Packaging Case Studies
  • Case studies and applications of printed electronics in smart packaging
  • Electronic Smart Packaging Forecasts
  • Forecasts and conclusions of electronic smart packaging. Forecasts are given in terms of number of units, average sales price and total market value for each of the following: NFC, RAIN RFID, Light-up/display based electronic smart packaging, audio smart packaging

Opportunities in Smart Packaging

The report identifies and assesses the many challenges still to be addressed, including the value of tagging products in the highest volume versus cost, sustainable profitable applications beyond one-off projects, environmental impact and unmet needs including the lack of integrators and complete product designers. Applicable technologies are assessed with details of the key players.

All of these opportunities and trends, including detailed ten year forecasts, are covered in this IDTechEx report "Smart and Intelligent Packaging 2020-2030". The report reveals many ways in which brands can create a sharp increase in market share, customer satisfaction and profitability. It covers case studies of successes and failures and why.

Analyst access from IDTechEx

All report purchases include up to 30 minutes telephone time with an expert analyst who will help you link key findings in the report to the business issues you're addressing. This needs to be used within three months of purchasing the report.

Table of Contents

1. EXECUTIVE SUMMARY AND CONCLUSIONS

  • 1.1.What is Smart Packaging?
  • 1.2.Why Smart Packaging - Logistical and Safety Reasons
  • 1.3.Why Smart Packaging - Increasing Sales and Better Merchandising
  • 1.4.Smart Packaging - Status
  • 1.5.Smart Packaging: Things Are Changing
  • 1.6.EAS tags
  • 1.7.QR Codes
  • 1.8.Unique ID with no silicon chip
  • 1.9.Chipless RFID or Flexible/Printed IC Passive tags
  • 1.10.RAIN (UHF RFID) Smart Packaging
  • 1.11.RAIN (UHF RFID) Smart Packaging 2020-2030
  • 1.12.RAIN (UHF RFID) tags 2020-2030 - numbers million
  • 1.13.RAIN (UHF RFID) tags 2020-2030 - avg sale price $cents
  • 1.14.RAIN (UHF RFID) tags 2020-2030 - market value $M
  • 1.15.NFC (HF RFID) Smart Packaging
  • 1.16.NFC (HF RFID) tags 2020-2030 - numbers million
  • 1.17.NFC (HF RFID) tags 2020-2030 - avg sale price $cents
  • 1.18.NFC (HF RFID) tags 2020-2030 - market value $M
  • 1.19.NFC (HF RFID) Smart Packaging Forecast Reasoning
  • 1.20.Electronic Smart Packaging beyond RFID
  • 1.21.Electronic Smart Packaging Total Forecast 2020-2030 Numbers million
  • 1.22.Electronic Smart Packaging Total Forecast 2020-2030 Market value $M
  • 1.23.Challenges and Opportunities

2. SMART PACKAGING DRIVERS

  • 2.1.The need for smart packaging
  • 2.2.Problems in the retail industry
  • 2.3.Problems in healthcare
  • 2.4.Using more of the human senses and in a better way

3. END-USER FEEDBACK

  • 3.1.End User Needs: Drivers for Smart Packaging
  • 3.2.End User Feedback on Smart Packaging - Application Needs
  • 3.3.End User Views on Smart Packaging - Technical Needs
  • 3.4.P&G and printed electronics
  • 3.5.Diageo and printed electronics
  • 3.6.Amcor
  • 3.7.Colgate-Palmolive Group
  • 3.8.Unilever

4. RFID: NFC AND RAIN FOR SMART PACKAGING

  • 4.1.RFID
  • 4.2.RFID Technologies: The Big Picture
  • 4.3.Passive RFID
  • 4.4.Favourite RFID frequencies
  • 4.5.Passive RFID Systems
  • 4.6.Battery Assisted Passive /Semi Active tags
  • 4.7.Examples of Battery Assisted Passive (BAP) RFID sensors
  • 4.8.Active RFID
  • 4.9.Real Time Locating Systems (RTLS)
  • 4.10.Chipless/printed RFID
  • 4.11.Passive RFID: Technologies by Operating Frequency
  • 4.12.Anatomy of passive HF and UHF tags
  • 4.13.Challenges in contacting HF/NFC coils
  • 4.14.Threats to passive RFID: machine vision?
  • 4.15.Might Packaging Become Irrelevant with Online Retailing?

5. PRINTED, FLEXIBLE AND ORGANIC ELECTRONICS

  • 5.1.Description and analysis of the main technology components of printed, flexible and organic electronics
  • 5.2.Market potential and profitability
  • 5.3.Current market size
  • 5.4.Go to Market Strategies: Pros and Cons
  • 5.5.The value chain is unbalanced
  • 5.6.But many have shifted to provide complete solutions
  • 5.7.Many enabling printed electronic technologies are an enabler but not an obvious product
  • 5.8.Creating successful new products is hard
  • 5.9.Cost reduction has been more commercially successful...
  • 5.10....but if it is the only differentiator suppliers can struggle
  • 5.11.Competing on more than cost has been the most successful
  • 5.12.Keep It Simple, Stupid

6. DISPLAYS

  • 6.1.Electrochromic displays
    • 6.1.1.Electrochromic displays
    • 6.1.2.Ynvisible Electrochromic Displays
  • 6.2.AC Electroluminescent displays
    • 6.2.1.AC Electroluminescent displays
    • 6.2.2.AC electroluminescent displays
    • 6.2.3.EL technology
    • 6.2.4.AC Electroluminescent (EL) Displays
  • 6.3.Thermochromic displays
    • 6.3.1.Thermochromic Displays

7. PRINTED LED LIGHTING

  • 7.1.Printed LED lighting
  • 7.2.Nth Degree - Printed LEDs

8. PRINTED, FLEXIBLE BATTERIES

  • 8.1.Introduction to batteries
  • 8.2.Comparison of Power Options
  • 8.3.Applications

9. PRINTED SENSORS

  • 9.1.Applications of printed batteries
  • 9.2.Types of sensors that can be printed
  • 9.3.Sensors: Technology Readiness
  • 9.4.Capacitive pressure/force sensor
  • 9.5.Fluid level sensor

10. LOGIC

  • 10.1.Types of Flexible or Printed Transistor Circuits
  • 10.2.Why Print Transistors
  • 10.3.Semiconductor Choices Compared
  • 10.4.But challenges persist...
  • 10.5.Semiconductor choices
  • 10.6.Incumbent TFT technologies- silicon based
  • 10.7.Metal Oxide Semiconductors
  • 10.8.Metal Oxide production process
  • 10.9.But can Metal Oxide Semiconductors be printed?
  • 10.10.Evonik's solution processible metal oxide
  • 10.11.Latest progress with iXensic
  • 10.12.And even at room temperature with deep UV annealing
  • 10.13.Organic semiconductors
  • 10.14.OTFT Mobility hype: reality check
  • 10.15.All printed TFTs
  • 10.16.JAPERA all printed TFT
  • 10.17.S2S automatic printed OTFT
  • 10.18.Roll-to-roll printed organic TFTs
  • 10.19.Merck's Organic TFT
  • 10.20.Carbon nanotubes and graphene transistors
  • 10.21.Latest progress with flexible/printed transistor RFID
  • 10.22.Flexible or printed transistors for logic, creating smart systems
  • 10.23.Mediocre TFTs can do many functions
  • 10.24.Current work in developing flexible transistor RFID and Smart Packaging
  • 10.25.IMEC / Holst Centre Roadmap
  • 10.26.Benefits of flexible logic
  • 10.27.Save on IC attach cost?
  • 10.28.Logic Based Systems
  • 10.29.Lessons from the Silicon Chip: need for modularity
  • 10.30.Thin, flexible 'NFC' ICs come to market for simple wireless barcodes
  • 10.31.Printed electronics components
  • 10.32.PragmatIC's wine temperature sensing label
  • 10.33.Logic and Smart System Forecast 2018-2030 $ millions
  • 10.34.Company profiles related to this chapter

11. QR CODES

  • 11.1.QR Codes: Failure in Europe and America, Huge Success in China
  • 11.2.QR Codes: where next?
  • 11.3.Will NFC or RAIN Impact QR Codes?

12. CAPACITIVE / INK STRIPE IDENTIFICATION

  • 12.1.RFID without transistors Hidden Electronic Product Code (HidE)
  • 12.2.Printechnologics printed ID
  • 12.3.Radar ID 60GHz
  • 12.4.Inksure - SARcode Example
  • 12.5.Touchcode: T-ink / Printechnologics
  • 12.6.Touchcode Application Concepts
  • 12.7.Touchcode Progress
  • 12.8.TicTag
  • 12.9.Prismade Labs

13. RFID SENSORS

  • 13.1.RFID Sensors: main choices
  • 13.2.RFID tag sensor from IC-TAG
  • 13.3.Passive UHF RFID sensor co-developed by Powercast and Vanguard ID Systems
  • 13.4.Passive UHF RFID Sensor: RFMicron and Smartrac
  • 13.5.GE/ Kemsense: BioSensors on conventional RFID labels
  • 13.6.Chemical powerless RFID sensor tag
  • 13.7.Lessons from Failures

14. CHEMICAL SMART PACKAGING TECHNOLOGIES

  • 14.1.Food degradation
  • 14.2.Microbial Spoilage
  • 14.3.Chemical and Enzymatic Activity
  • 14.4.Oxidative Deterioration/Rancidity
  • 14.5.Moisture/Vapour Migration
  • 14.6.Determining Shelf Life
  • 14.7.Food Degradation
  • 14.8.Time Temperature Indicators (TTIs)
  • 14.9.Chemical TTIs
  • 14.10.Chemical Time Temperature Indicators
  • 14.11.Examples of Chemical Time Temperature Indicators (TTIs
  • 14.12.Freshness Indicators
  • 14.13.Ripeness Indicators
  • 14.14.Time Indicators

15. SMART PACKAGING APPLICATIONS - CONVENTIONAL RFID

  • 15.1.Pallet/ case tagging
  • 15.2.Retail apparel, item level
  • 15.3.Retail Apparel Payback
  • 15.4.RFID for anti-counterfeiting - it's the law!
  • 15.5.METI, Japan, target 100 billion tags/year by 2025
  • 15.6.IDTechEx view on the METI announcement
  • 15.7.RFID provides more consumer engagement and use data
  • 15.8.Coca-Cola Freestyle Machine
  • 15.9.RFID provides more consumer engagement and use data

16. SMART BLISTER PACKS

  • 16.1.The Problem: Medication Non-Compliance
  • 16.2.The Problem: Medication Non-Compliance - Statistics
  • 16.3.The Current Solution
  • 16.4.The Printed Electronics / RFID Solutions
  • 16.5.Smart Blister Packs
  • 16.6.Smart Blister Packs - Not a Big Success Yet
  • 16.7.Things are Changing & More Players Enter
  • 16.8.Smart Blister Packs: Outlook

17. SMART PACKAGING CASE STUDIES

  • 17.1.Batteries with integral battery tester
  • 17.2.Light up Packaging: Bombay Sapphire, KENT Gold, Copoya Rum
  • 17.3.Place mats - McDonalds
  • 17.4.Interactive tablecloth - Hallmark
  • 17.5.Beer package game - VTT Technology
  • 17.6.Cookie heater pack - T-Ink
  • 17.7.Theft detection - Swedish Postal Service and Deutsche Post

18. FORECASTS: ELECTRONIC SMART PACKAGING

  • 18.1.RAIN (UHF RFID) Smart Packaging
  • 18.2.RAIN (UHF RFID) Smart Packaging 2020-2030
  • 18.3.RAIN (UHF RFID) tags 2020-2030 - numbers million
  • 18.4.RAIN (UHF RFID) tags 2020-2030 - avg sale price $cents
  • 18.5.RAIN (UHF RFID) tags 2020-2030 - market value $M
  • 18.6.NFC (HF RFID) Smart Packaging
  • 18.7.NFC (HF RFID) tags 2020-2030 - numbers million
  • 18.8.NFC (HF RFID) tags 2020-2030 - avg sale price $cents
  • 18.9.NFC (HF RFID) tags 2020-2030 - market value $M
  • 18.10.NFC (HF RFID) Smart Packaging Forecast Reasoning
  • 18.11.Electronic Smart Packaging beyond RFID
  • 18.12.Electronic Smart Packaging Total Forecast 2020-2030 Numbers million
  • 18.13.Electronic Smart Packaging Total Forecast 2020-2030 Market value $M
  • 18.14.Challenges and Opportunities

19. APPENDIX: COMPANY PROFILES

20. APPENDIX: GLOSSARY

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