市場調查報告書

半導體包裝材料的全球市場的預測

GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET FORECAST 2017-2025

出版商 Inkwood Research 商品編碼 580746
出版日期 內容資訊 英文 123 Pages
商品交期: 2-3個工作天內
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半導體包裝材料的全球市場的預測 GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET FORECAST 2017-2025
出版日期: 2017年11月17日內容資訊: 英文 123 Pages
簡介

本報告提供半導體包裝材料的全球市場調查,市場概要,各技術、材料、地區/國家的市場趨勢,市場規模的變化與預測,市場促進、阻礙因素以及市場機會、課題分析,競爭情形,主要企業的簡介等系統性資訊。

第1章 調查範圍

第2章 調查手法

第3章 摘要整理

  • 市場概要
  • 分析結果

第4章 市場動態

  • 市場定義和範圍
  • 促進因素
  • 阻礙因素
  • 市場機會
  • 課題

第5章 半導體包裝材料的全球市場:各技術

  • SOP
  • GA
  • QFN
  • QFP
  • DIP
  • 其他

第6章 半導體包裝材料的全球市場:各材料

  • 有機基板
  • 導線架
  • 鍵合線
  • 半導體用封裝樹脂
  • 陶瓷封裝
  • 粘晶材料
  • 焊球
  • 其他材料

第7章 市場分析

  • 波特的五力分析
  • 市場機會分析
  • 價值鏈分析

第8章 地區分析

  • 中國
  • 台灣
  • 韓國
  • 日本
  • 美國
  • 歐洲
  • 其他地區

第9章 競爭情形

  • 主要企業分析
  • 企業簡介
    • AMKOR TECHNOLOGY
    • APPLIED MATERIALS
    • ASM PACIFIC TECHNOLOGY (ASMPT)
    • BASF SE
    • CARSEM, INC
    • DUPONT
    • HENKEL
    • EVERGREEN SEMICONDUCTOR MATERIALS
    • 日立化成
    • HONEYWELL
    • JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.
    • 京瓷
    • LG INNOTEK
    • 三井高科技
    • PLATFORM SPECIALTY PRODUCTS CORPORATION
    • 住友化學
    • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    • 田中貴金屬
    • 凸版印刷
    • TORAY INDUSTRIES
    • XIAMEN YONGHONG ELECTRONICS

圖表清單

目錄
Product Code: 11178

KEY FINDINGS

The global semiconductor packaging materials market was valued $21.34 billion in 2016 and is anticipated to reach $32.81 billion by 2025, growing at an estimated CAGR of 4.96% over the forecast period of 2017-2025. The market growth is mainly driven by a growing demand for smart devices, widespread use of semiconductor IC'S in IOT field and the several technological advancements in semiconductor technology.

MARKET INSIGHTS

The global semiconductor packaging material market segmentation is chiefly done on the basis of packaging technology and the materials used. The packaging technology includes Grid Array (GA) Packages, Small Outline (SO) Packages, Flat No-Leads Packages, Dual In-Line Package (DIP), Quad Flat Packages (QFP), and Other Technologies. The packaging material types are sub-divided into lead frames, organic substrates, bonding wires, ceramic package, encapsulation resins, DIE attach materials and solder balls.

REGIONAL INSIGHTS

Region-wise, the Global Semiconductor Packaging Materials Market has been segmented into seven major regions, i.e., Taiwan, China, South Korea, United States, Japan, Europe and Rest of world. The Chinese market dominated the global semiconductor market in the year 2016, closely followed by Taiwan. Over the years, the semiconductor packaging material market has witnessed considerable progress in the Chinese market due to several contributory factors like high production capacity and easy availability of inexpensive raw materials.

COMPETITIVE INSIGHTS

Applied Materials, Amkor Technology, Asm Pacific Technology (ASMPT), Carsem Inc, BASF Se, Dupont, Henkel, Hitachi Chemical, Evergreen Semiconductor Materials, Honeywell, Kyocera, Jiangsu Changjiang Electronics Technology Co Ltd, LG Innotek, Platform Specialty Products Corporation, Mitsui High-Tec Inc, Sumitomo Chemical Co. Ltd, Tanaka Holdings Co. Ltd, Taiwan Semiconductor Manufacturing Company Ltd, Toppan Printing, Xiamen Yonghong Electronics and Toray Industries Corporation are some of the noted companies in the global semiconductor packaging market.

Table of Contents

1. RESEARCH SCOPE

  • 1.1. STUDY GOALS
  • 1.2. SCOPE OF THE MARKET STUDY
  • 1.3. WHO WILL FIND THIS REPORT USEFUL?
  • 1.4. STUDY AND FORECASTING YEARS

2. RESEARCH METHODOLOGY

  • 2.1. SOURCES OF DATA
    • 2.1.1. SECONDARY DATA
    • 2.1.2. PRIMARY DATA
  • 2.2. TOP-DOWN APPROACH
  • 2.3. BOTTOM-UP APPROACH
  • 2.4. DATA TRIANGULATION

3. EXECUTIVE SUMMARY

  • 3.1. MARKET SUMMARY
  • 3.2. KEY FINDINGS

4. MARKET DYNAMICS

  • 4.1. MARKET DEFINITION AND SCOPE
  • 4.2. MARKET DRIVERS
    • 4.2.1. RISING DEMAND FOR SMART DEVICES
    • 4.2.2. GROWING AUTOMOTIVE SEMICONDUCTOR MARKET
    • 4.2.3. INCREASING USAGE OF SEMICONDUCTOR IC'S IN IOT FIELD
    • 4.2.4. GROWING TECHNOLOGICAL ADVANCEMENTS IN SEMICONDUCTOR TECHNOLOGY
  • 4.3. MARKET RESTRAINTS
    • 4.3.1. STRICT MATERIAL SPECIFICATIONS SET DOWN BY PACKAGING ASSEMBLERS AND TESTERS
    • 4.3.2. VOLATILE FOREIGN EXCHANGE MARKET
    • 4.3.3. SEMICONDUCTOR CONSUMPTION HIGH IN A PARTICULAR REGION AS COMPARED TO OTHERS
    • 4.3.4. CYCLIC NATURE OF SEMICONDUCTOR INDUSTRY
  • 4.4. MARKET OPPORTUNITIES
    • 4.4.1. SHIFTING FOCUS FROM COPPER TO GOLD AS BONDING WIRE MATERIAL
    • 4.4.2. LEAD-FREE PACKAGING DEMAND ON A RISE
    • 4.4.3. GROWING ADOPTION OF FLIP-CHIP PACKAGING SOLUTIONS
  • 4.5. MARKET CHALLENGES
    • 4.5.1. HIGH DEPENDENCY ON SEMICONDUCTOR INDUSTRY
    • 4.5.2. HIGH CAPITAL REQUIRED FOR INITIAL SETUP

5. SEMICONDUCTOR PACKAGING TECHNOLOGY

  • 5.1. SMALL OUTLINE (SO) PACKAGES
  • 5.2. GRID ARRAY (GA) PACKAGES
  • 5.3. FLAT NO-LEADS PACKAGES
  • 5.4. QUAD FLAT PACKAGES (QFP)
  • 5.5. DUAL IN-LINE PACKAGE (DIP)
  • 5.6. OTHER TECHNOLOGIES

6. MARKET BY TYPE OF MATERIALS

  • 6.1. ORGANIC SUBSTRATES
  • 6.2. LEAD FRAMES
  • 6.3. BONDING WIRES
  • 6.4. ENCAPSULATION RESINS
  • 6.5. CERAMIC PACKAGES
  • 6.6. DIE ATTACH MATERIALS
  • 6.7. SOLDER BALLS
  • 6.8. OTHER MATERIALS

7. KEY ANALYTICS

  • 7.1. PORTER'S FIVE FORCE ANALYSIS
    • 7.1.1. THREAT OF NEW ENTRANTS
    • 7.1.2. THREAT OF SUBSTITUTE
    • 7.1.3. BARGAINING POWER OF SUPPLIERS
    • 7.1.4. BARGAINING POWER OF BUYERS
    • 7.1.5. INTENSITY OF COMPETITIVE RIVALRY
  • 7.2. OPPORTUNITY MATRIX
  • 7.3. VALUE CHAIN ANALYSIS

8. GEOGRAPHICAL ANALYSIS

  • 8.1. CHINA
  • 8.2. TAIWAN
  • 8.3. SOUTH KOREA
  • 8.4. JAPAN
  • 8.5. UNITED STATES
  • 8.6. EUROPE
  • 8.7. REST OF WORLD

9. COMPETITIVE LANDSCAPE

  • 9.1. KEY COMPANY ANALYSIS
  • 9.2. COMPANY PROFILES
    • 9.2.1. AMKOR TECHNOLOGY
    • 9.2.2. APPLIED MATERIALS
    • 9.2.3. ASM PACIFIC TECHNOLOGY (ASMPT)
    • 9.2.4. BASF SE
    • 9.2.5. CARSEM, INC
    • 9.2.6. DUPONT
    • 9.2.7. HENKEL
    • 9.2.8. EVERGREEN SEMICONDUCTOR MATERIALS
    • 9.2.9. HITACHI CHEMICAL
    • 9.2.10. HONEYWELL
    • 9.2.11. JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.
    • 9.2.12. KYOCERA
    • 9.2.13. LG INNOTEK
    • 9.2.14. MITSUI HIGH-TEC INC.
    • 9.2.15. PLATFORM SPECIALTY PRODUCTS CORPORATION
    • 9.2.16. SUMITOMO CHEMICAL CO. LTD.
    • 9.2.17. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    • 9.2.18. TANAKA HOLDINGS CO., LTD.
    • 9.2.19. TOPPAN PRINTING
    • 9.2.20. TORAY INDUSTRIES CORPORATION
    • 9.2.21. XIAMEN YONGHONG ELECTRONICS

TABLE LIST

  • TABLE 1: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY GEOGRAPHY, 2017-2025 (IN $ BILLION)
  • TABLE 2: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY TYPE OF MATERIALS, 2017-2025 (IN $ BILLION)
  • TABLE 3: GLOBAL ORGANIC SUBSTRATES MARKET, BY REGION, 2017-2025 (IN $ BILLION)
  • TABLE 4: GLOBAL LEAD FRAMES MARKET, BY REGION, 2017-2025 (IN $ BILLION)
  • TABLE 5: GLOBAL BONDING WIRES MARKET, BY REGION, 2017-2025 (IN $ BILLION)
  • TABLE 6: GLOBAL ENCAPSULATION RESINS MARKET, BY REGION, 2017-2025 (IN $ BILLION)
  • TABLE 7: GLOBAL CERAMIC PACKAGES MARKET, BY REGION, 2017-2025 (IN $ BILLION)
  • TABLE 8: GLOBAL DIE ATTACH MATERIALS MARKET, BY REGION, 2017-2025 (IN $ BILLION)
  • TABLE 9: GLOBAL SOLDER BALLS MARKET, BY REGION, 2017-2025 (IN $ BILLION)
  • TABLE 10: GLOBAL OTHER MATERIALS MARKET, BY REGION, 2017-2025 (IN $ BILLION)
  • TABLE 11: OPPORTUNITY MATRIX OF SEMICONDUCTOR PACKAGING MATERIALS MARKET
  • TABLE 12: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY GEOGRAPHY, 2017-2025, (IN $ BILLION)
  • TABLE 13: COMPANIES PRODUCING SEMICONDUCTORS IN CHINA BASED ON WAFER SIZE
  • TABLE 14: CHINA-HEADQUARTERED COMPANIES SUPPLYING SEMICONDUCTOR PACKAGING MATERIALS
  • TABLE 15: TOP SUPPLIERS IN EACH SEGMENT IN JAPAN
  • FIGURE LIST
  • FIGURE 1: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY TYPE OF MATERIALS, 2016 & 2025 (IN $ BILLION)
  • FIGURE 2: NUMBER OF WORLDWIDE SMARTPHONE USERS, 2015-2020 (IN BILLION)
  • FIGURE 3: NUMBER OF TABLET USERS ACROSS THE WORLD, 2015-2020, (IN BILLIONS)
  • FIGURE 4: WEARABLE DEVICES MARKET ESTIMATES, 2014-2018 (IN $ BILLION)
  • FIGURE 5: GLOBAL AUTOMOTIVE SEMICONDUCTOR MARKET, 2017-2025 ($ MILLION)
  • FIGURE 6: FLUCTUATING EXCHANGE RATES BETWEEN USD AND THE JAPANESE YEN, 2012 TO 2016
  • FIGURE 7: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY ORGANIC SUBSTRATES, 2017-2025 (IN $ BILLION)
  • FIGURE 8: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY LEAD FRAMES, 2017-2025 (IN $ BILLION)
  • FIGURE 9: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY BONDING WIRES, 2017-2025 (IN $ BILLION)
  • FIGURE 10: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY ENCAPSULATION RESINS, 2017-2025 (IN $ BILLION)
  • FIGURE 11: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY CERAMIC PACKAGES, 2017-2025 (IN $ BILLION)
  • FIGURE 12: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY DIE ATTACH MATERIALS, 2017-2025 (IN $ BILLION)
  • FIGURE 13: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY SOLDER BALLS, 2017-2025 (IN $ BILLION)
  • FIGURE 14: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY OTHER MATERIALS, 2017-2025 (IN $ BILLION)
  • FIGURE 15: PORTER'S FIVE FORCE MODEL OF SEMICONDUCTOR PACKAGING MATERIALS MARKET
  • FIGURE 16: VALUE CHAIN OF SEMICONDUCTOR PACKAGING MATERIALS MARKET
  • FIGURE 17: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, GEOGRAPHICAL OUTLOOK, 2016 & 2025 (IN %)
  • FIGURE 18: CHINA SEMICONDUCTOR PACKAGING MATERIALS MARKET, 2017-2025 (IN $ BILLION)
  • FIGURE 19: TAIWAN SEMICONDUCTOR PACKAGING MATERIALS MARKET, 2017-2025 (IN $ BILLION)
  • FIGURE 20: SOUTH KOREA SEMICONDUCTOR PACKAGING MATERIALS MARKET, 2017-2025 (IN $ BILLION)
  • FIGURE 21: JAPAN SEMICONDUCTOR PACKAGING MATERIALS MARKET, 2017-2025 (IN $ BILLION)
  • FIGURE 22: UNITED STATES SEMICONDUCTOR PACKAGING MATERIALS MARKET, 2017-2025 (IN $ BILLION)
  • FIGURE 23: EUROPE SEMICONDUCTOR PACKAGING MATERIALS MARKET, 2017-2025 (IN $ BILLION)
  • FIGURE 24: REST OF WORLD SEMICONDUCTOR PACKAGING MATERIALS MARKET, 2017-2025 (IN $ BILLION)
  • FIGURE 25: KEY PLAYERS IN THE SEMICONDUCTOR PACKAGING MATERIALS MARKET, 2016
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