表紙
市場調查報告書
商品編碼
974962

全球半導體晶圓拋光及研磨設備市場(2020年∼2024年)

Global Semiconductor Wafer Polishing and Grinding Equipment Market 2020-2024

出版日期: | 出版商: TechNavio (Infiniti Research Ltd.) | 英文 120 Pages | 訂單完成後即時交付

價格
  • 全貌
  • 簡介
  • 目錄
簡介

全球半導體晶圓拋光及研磨設備的市場規模在2020年∼2024年間,預測將成長到2億8,972萬美元,在預測期間內預計將以3%的年複合成長率推移。該市場成長的主要因素有長期客戶的獎勵折扣,增加的資本支出和小型化的組件。

本報告提供半導體晶圓拋光及研磨設備市場調查,提供市場概要,市場成長要素及阻礙因素分析,各用途·各終端用戶·各地區的市場規模的變化與預測,供應商分析,市場機會等全面性資訊。

目錄

摘要整理

市場形勢

市場規模

  • 市場定義
  • 市場區隔分析
  • 市場規模2019
  • 市場預測:從2019年∼2024年的預測

波特的五力分析

各用途市場市場區隔

  • 市場區隔
  • 各用途比較
  • 300mm-市場規模與預測(2020年∼2024年)
  • 200mm-市場規模與預測(2020年∼2024年)
  • 150mm-市場規模與預測(2020年∼2024年)
  • 各用途的市場機會

各終端用戶市場區隔

  • 市場區隔
  • 各終端用戶比較
  • 晶圓代工廠-市場規模與預測(2020年∼2024年)
  • 記憶體廠商-市場規模與預測(2020年∼2024年)
  • IDM-市場規模與預測(2020年∼2024年)
  • 各終端用戶市場機會

客戶形勢

  • 客戶形勢

各地區形勢

  • 各地區市場區隔
  • 各地區比較
  • 亞太地區-市場規模與預測(2020年∼2024年)
  • 北美-市場規模與預測(2020年∼2024年)
  • 歐洲-市場規模與預測(2020年∼2024年)
  • 南美-市場規模與預測(2020年∼2024年)
  • 中東·非洲-市場規模與預測(2020年∼2024年)
  • 主要的主要國家
  • 地區的市場機會
  • 市場推動因素
  • 市場課題
  • 市場趨勢

業者情勢

  • 業者情勢
  • 創造性破壞狀況
  • 競爭模式

供應商分析

  • 交易廠商
  • 供應商的市場定位
  • Amtech Systems Inc.
  • Applied Materials Inc.
  • DISCO Corp.
  • Ebara Corp.
  • Entrepix Inc.
  • Komatsu Ltd.
  • Logomatic GmbH
  • Precision Surfacing Solutions
  • Roper Technologies Inc.
  • Tokyo Seimitsu Co. Ltd.

附錄

目錄
Product Code: IRTNTR45903

Technavio has been monitoring the semiconductor wafer polishing and grinding equipment market and it is poised to grow by $ 289.72 mn during 2020-2024, progressing at a CAGR of 3% during the forecast period. Our reports on semiconductor wafer polishing and grinding equipment market provide a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current global market scenario, latest trends and drivers, and the overall market environment. The market is driven by the incentives and discounts for long-term customers, increase in capital spending, and miniaturization of components. In addition, incentives and discounts for long-term customers is anticipated to boost the growth of the market as well.

The semiconductor wafer polishing and grinding equipment market analysis includes end-user segment, application segment and geographical landscapes.

Technavio's semiconductor wafer polishing and grinding equipment market is segmented as below:

By End-user

  • Foundries
  • Memory manufacturers
  • IDM

By Application

  • 300 mm
  • 200 mm
  • 150 mm

By Geographical Landscapes

  • APAC
  • North America
  • Europe
  • South America
  • MEA

This study identifies the use of NEMs as one of the prime reasons driving the semiconductor wafer polishing and grinding equipment market growth during the next few years. Also, the growth of ULSI and transition toward 3d structures will lead to sizable demand in the market.

Technavio presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters. Our report on semiconductor wafer polishing and grinding equipment market covers the following areas:

  • Semiconductor wafer polishing and grinding equipment market sizing
  • Semiconductor wafer polishing and grinding equipment market forecast
  • Semiconductor wafer polishing and grinding equipment market industry analysis

Technavio's robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading semiconductor wafer polishing and grinding equipment market vendors that include Amtech Systems Inc., Applied Materials Inc., DISCO Corp., Ebara Corp., Entrepix Inc., Komatsu Ltd., Logomatic GmbH, Precision Surfacing Solutions, Roper Technologies Inc., and Tokyo Seimitsu Co. Ltd. Also, the semiconductor wafer polishing and grinding equipment market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage on all forthcoming growth opportunities.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.

Technavio presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. Technavio's market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast an accurate market growth.

Table of Contents

Executive Summary

  • Market Overview

Market Landscape

  • Market ecosystem
  • Market characteristics
  • Value chain analysis

Market Sizing

  • Market definition
  • Market segment analysis
  • Market size 2019
  • Market outlook: Forecast for 2019 - 2024

Five Forces Analysis

  • Five Forces Summary
  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition

Market Segmentation by Application

  • Market segments
  • Comparison by Application
  • 300 mm - Market size and forecast 2019-2024
  • 200 mm - Market size and forecast 2019-2024
  • 150 mm - Market size and forecast 2019-2024
  • Market opportunity by Application

Market Segmentation by End-user

  • Market segments
  • Comparison by End-user
  • Foundries - Market size and forecast 2019-2024
  • Memory manufacturers - Market size and forecast 2019-2024
  • IDM - Market size and forecast 2019-2024
  • Market opportunity by End-user

Customer landscape

  • Customer landscape

Geographic Landscape

  • Geographic segmentation
  • Geographic comparison
  • APAC - Market size and forecast 2019-2024
  • North America - Market size and forecast 2019-2024
  • Europe - Market size and forecast 2019-2024
  • South America - Market size and forecast 2019-2024
  • MEA - Market size and forecast 2019-2024
  • Key leading countries
  • Market opportunity by geography
  • Market drivers
  • Market challenges
  • Market trends

Vendor Landscape

  • Vendor landscape
  • Landscape disruption
  • Competitive scenario

Vendor Analysis

  • Vendors covered
  • Market positioning of vendors
  • Amtech Systems Inc.
  • Applied Materials Inc.
  • DISCO Corp.
  • Ebara Corp.
  • Entrepix Inc.
  • Komatsu Ltd.
  • Logomatic GmbH
  • Precision Surfacing Solutions
  • Roper Technologies Inc.
  • Tokyo Seimitsu Co. Ltd.

Appendix

  • Scope of the report
  • Currency conversion rates for US$
  • Research methodology
  • List of abbreviations

Exhibit

  • 1: Key Finding 1
  • 2: Key Finding 2
  • 3: Key Finding 3
  • 4: Key Finding 5
  • 5: Key Finding 6
  • 6: Key Finding 7
  • 7: Key Finding 8
  • 8: Key Finding 9
  • 9: Parent market
  • 10: Market characteristics
  • 11: Offerings of vendors included in the market definition
  • 12: Market segments
  • 13: Global - Market size and forecast 2019 - 2024 ($ million)
  • 14: Global market: Year-over-year growth 2019 - 2024 (%)
  • 15: Five forces analysis 2019 & 2024
  • 16: Bargaining power of buyers
  • 17: Bargaining power of suppliers
  • 18: Threat of new entrants
  • 19: Threat of substitutes
  • 20: Threat of rivalry
  • 21: Market condition - Five forces 2019
  • 22: Application - Market share 2019-2024 (%)
  • 23: Comparison by Application
  • 24: 300 mm - Market size and forecast 2019-2024 ($ million)
  • 25: 300 mm - Year-over-year growth 2019-2024 (%)
  • 26: 200 mm - Market size and forecast 2019-2024 ($ million)
  • 27: 200 mm - Year-over-year growth 2019-2024 (%)
  • 28: 150 mm - Market size and forecast 2019-2024 ($ million)
  • 29: 150 mm - Year-over-year growth 2019-2024 (%)
  • 30: Market opportunity by Application
  • 31: End user - Market share 2019-2024 (%)
  • 32: Comparison by End user
  • 33: Foundries - Market size and forecast 2019-2024 ($ million)
  • 34: Foundries - Year-over-year growth 2019-2024 (%)
  • 35: Memory manufacturers - Market size and forecast 2019-2024 ($ million)
  • 36: Memory manufacturers - Year-over-year growth 2019-2024 (%)
  • 37: IDM - Market size and forecast 2019-2024 ($ million)
  • 38: IDM - Year-over-year growth 2019-2024 (%)
  • 39: Market opportunity by End user
  • 40: Customer landscape
  • 41: Market share by geography 2019-2024 (%)
  • 42: Geographic comparison
  • 43: APAC - Market size and forecast 2019-2024 ($ million)
  • 44: APAC - Year-over-year growth 2019-2024 (%)
  • 45: North America - Market size and forecast 2019-2024 ($ million)
  • 46: North America - Year-over-year growth 2019-2024 (%)
  • 47: Europe - Market size and forecast 2019-2024 ($ million)
  • 48: Europe - Year-over-year growth 2019-2024 (%)
  • 49: South America - Market size and forecast 2019-2024 ($ million)
  • 50: South America - Year-over-year growth 2019-2024 (%)
  • 51: MEA - Market size and forecast 2019-2024 ($ million)
  • 52: MEA - Year-over-year growth 2019-2024 (%)
  • 53: Key leading countries
  • 54: Market opportunity by geography ($ million)
  • 55: Impact of drivers and challenges
  • 56: Vendor landscape
  • 57: Landscape disruption
  • 58: Industry risks
  • 59: Vendors covered
  • 60: Market positioning of vendors
  • 61: Amtech Systems Inc. - Overview
  • 62: Amtech Systems Inc. - Business segments
  • 63: Amtech Systems Inc. - Key offerings
  • 64: Amtech Systems Inc. - Key customers
  • 65: Amtech Systems Inc. - Segment focus
  • 66: Applied Materials Inc. - Overview
  • 67: Applied Materials Inc. - Business segments
  • 68: Applied Materials Inc. - Key offerings
  • 69: Applied Materials Inc. - Key customers
  • 70: Applied Materials Inc. - Segment focus
  • 71: DISCO Corp. - Overview
  • 72: DISCO Corp. - Business segments
  • 73: DISCO Corp. - Key offerings
  • 74: DISCO Corp. - Key customers
  • 75: DISCO Corp. - Segment focus
  • 76: Ebara Corp. - Overview
  • 77: Ebara Corp. - Business segments
  • 78: Ebara Corp. - Key offerings
  • 79: Ebara Corp. - Key customers
  • 80: Ebara Corp. - Segment focus
  • 81: Entrepix Inc. - Overview
  • 82: Entrepix Inc. - Product and service
  • 83: Entrepix Inc. - Key offerings
  • 84: Entrepix Inc. - Key customers
  • 85: Entrepix Inc. - Segment focus
  • 86: Komatsu Ltd. - Overview
  • 87: Komatsu Ltd. - Business segments
  • 88: Komatsu Ltd. - Key offerings
  • 89: Komatsu Ltd. - Key customers
  • 90: Komatsu Ltd. - Segment focus
  • 91: Logomatic GmbH - Overview
  • 92: Logomatic GmbH - Product and service
  • 93: Logomatic GmbH - Key offerings
  • 94: Logomatic GmbH - Key customers
  • 95: Logomatic GmbH - Segment focus
  • 96: Precision Surfacing Solutions - Overview
  • 97: Precision Surfacing Solutions - Product and service
  • 98: Precision Surfacing Solutions - Key offerings
  • 99: Precision Surfacing Solutions - Key customers
  • 100: Precision Surfacing Solutions - Segment focus
  • 101: Roper Technologies Inc. - Overview
  • 102: Roper Technologies Inc. - Business segments
  • 103: Roper Technologies Inc. - Key offerings
  • 104: Roper Technologies Inc. - Key customers
  • 105: Roper Technologies Inc. - Segment focus
  • 106: Tokyo Seimitsu Co. Ltd. - Overview
  • 107: Tokyo Seimitsu Co. Ltd. - Business segments
  • 108: Tokyo Seimitsu Co. Ltd. - Key offerings
  • 109: Tokyo Seimitsu Co. Ltd. - Key customers
  • 110: Tokyo Seimitsu Co. Ltd. - Segment focus
  • 111: Currency conversion rates for US$
  • 112: Research Methodology
  • 113: Validation techniques employed for market sizing
  • 114: Information sources
  • 115: List of abbreviations