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市場調查報告書

G.fast晶片組的全球市場:2018年∼2022年

Global G.fast Chipset Market 2018-2022

出版商 TechNavio (Infiniti Research Ltd.) 商品編碼 688067
出版日期 內容資訊 英文 117 Pages
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G.fast晶片組的全球市場:2018年∼2022年 Global G.fast Chipset Market 2018-2022
出版日期: 2018年08月24日內容資訊: 英文 117 Pages
簡介

關於G.fast晶片組

G.fast是一種數位用戶線路(DSL)通訊協定規格,其規範已作為ITU-T G.9700和ITU-T G.9701公佈。適用於短於500m的本地迴路,效能目標範圍從100 Mbps到1 Gbps,具體取決於迴路長度。G.fast晶片組將此標準納入CPE和DPU設備。CPE設備放置在客戶端,DPU設備放置在運營商網路的經銷點。

Technavio的分析師預計,從2018年到2022年之間,全球G.fast晶片組市場將記錄114.61%的年複合成長率。

本報告提供全球G.fast晶片組市場相關調查分析,市場規模與成長率,市場趨勢,市場的推動要素與課題,市場機會驗證,主要供應商等相關的系統性資訊。

目錄

第1章 摘要整理

第2章 調查範圍

第3章 調查方法

第4章 市場情形

  • 市場生態系統
  • 市場特性
  • 市場區隔分析

第5章 市場規模

  • 市場定義
  • 市場規模(2017年)
  • 市場規模及預測(2017-2022年)

第6章 波特的五力分析

  • 買主談判力
  • 供應商談判力
  • 新加入廠商的威脅
  • 替代品的威脅
  • 競爭對手的威脅
  • 市場情形

第7章 客戶形勢

第8章 市場區隔:各部署類型

  • 市場區隔:各部署類型(2017-2022年)
  • 比較:各部署類型
  • CPE
  • DPU
  • 市場機會:各部署類型

第9章 市場區隔:各終端用戶

  • 市場區隔:各終端用戶(2017-2022年)
  • 比較:各終端用戶
  • 住宅
  • 企業/商業
  • 市場機會:各終端用戶

第10章 地區形勢

  • 各地區市場區隔(2017-2022年)
  • 地區比較
  • 南北美洲
  • 歐洲、中東、非洲地區
  • 亞太地區
  • 主要國家
  • 市場機會

第11章 決策架構

第12章 成長要素與課題

  • 市場成長要素
  • 市場課題

第13章 市場趨勢

  • 家庭自動化
  • 下一代電訊標準的開發
  • 速度:多Gigabit(MG.fast)

第14章 業者情勢

  • 概要
  • 創造性破壞狀況

第15章 供應商分析

  • 交易廠商
  • 供應商分類
  • 供應商的市場定位
  • Broadcom
  • Intel
  • Metanoia Communications
  • Sckipio Technologies

第16章 附錄

  • 簡稱的清單
目錄
Product Code: IRTNTR23062

About Gfast Chipset

Gfast is a digital subscriber line (DSL) protocol standard whose specifications has been published as ITU-T G.9700 and ITU-T G.9701. It is developed for local loops shorter than 500m, with performance targets ranging from 100 Mbps to 1 Gbps, depending upon the loop length. A Gfast chipset incorporates this standard into CPE and DPU devices. CPE devices are placed at the customer premises and DPU devices are placed at the distribution point of carrier network.

Technavio's analysts forecast the global Gfast chipset market to post a CAGR of 114.61% during the period 2018-2022.

Covered in this report

The report covers the present scenario and the growth prospects of the global Gfast chipset market for 2018-2022. To calculate the market size, the report considers the revenue generated from the use of barley in various end user sectors including residential and enterprise/commercial.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA

Technavio's report, Global Gfast Chipset Market 2018-2022, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

  • Broadcom
  • Intel
  • Metanoia Communications
  • Sckipio Technologies

Market driver

  • Extensive deployment of coper cabling
  • For a full, detailed list, view our report

Market challenge

  • Growth of the VDSL market
  • For a full, detailed list, view our report

Market trend

  • Development of next-generation telecommunication standards
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2022 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Table of Contents

PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

PART 03: RESEARCH METHODOLOGY

PART 04: MARKET LANDSCAPE

  • Market ecosystem
  • Market characteristics
  • Market segmentation analysis

PART 05: MARKET SIZING

  • Market definition
  • Market sizing 2017
  • Market size and forecast 2017-2022

PART 06: FIVE FORCES ANALYSIS

  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition

PART 07: CUSTOMER LANDSCAPE

PART 08: MARKET SEGMENTATION BY DEPLOYMENT TYPE

  • Segmentation by deployment type
  • Comparison by deployment type
  • CPE - Market size and forecast 2017-2022
  • DPU - Market size and forecast 2017-2022
  • Market opportunity by deployment type

PART 09: MARKET SEGMENTATION BY END-USER

  • Segmentation by end-user
  • Comparison by end-user
  • Residential - Market size and forecast 2017-2022
  • Enterprise/commercial - Market size and forecast 2017-2022
  • Market opportunity by end-user

PART 10: REGIONAL LANDSCAPE

  • Geographical segmentation
  • Regional comparison
  • Americas - Market size and forecast 2017-2022
  • EMEA - Market size and forecast 2017-2022
  • APAC - Market size and forecast 2017-2022
  • Key leading countries
  • Market opportunity

PART 11: DECISION FRAMEWORK

PART 12: DRIVERS AND CHALLENGES

  • Market drivers
  • Market challenges

PART 13: MARKET TRENDS

  • Home automation
  • Development of next-generation telecommunication standards
  • Multi-gigabit fast (MG.fast)

PART 14: VENDOR LANDSCAPE

  • Overview
  • Landscape disruption

PART 15: VENDOR ANALYSIS

  • Vendors covered
  • Vendor classification
  • Market positioning of vendors
  • Broadcom
  • Intel
  • Metanoia Communications
  • Sckipio Technologies

PART 16: APPENDIX

  • List of abbreviations

List of Exhibits

  • Exhibit 01: Parent market
  • Exhibit 02: Global semiconductor market
  • Exhibit 03: Market characteristics
  • Exhibit 04: Market segments
  • Exhibit 05: Market definition - Inclusions and exclusions checklist
  • Exhibit 06: Market size 2017
  • Exhibit 07: Validation techniques employed for market sizing 2017
  • Exhibit 08: Global G.fast chipset market - Market size and forecast 2017-2022 ($ mn)
  • Exhibit 09: Distance and speed of G.fast chipsets
  • Exhibit 10: Global G.fast chipset market - Year-over-year growth 2018-2022 (%)
  • Exhibit 11: Five forces analysis 2017
  • Exhibit 12: Five forces analysis 2022
  • Exhibit 13: Bargaining power of buyers
  • Exhibit 14: Bargaining power of suppliers
  • Exhibit 15: Threat of new entrants
  • Exhibit 16: Threat of substitutes
  • Exhibit 17: Threat of rivalry
  • Exhibit 18: Market condition - Five forces 2017
  • Exhibit 19: Customer landscape
  • Exhibit 20: Global G.fast chipset market by deployment type - Market share 2017-2022 (%)
  • Exhibit 21: Comparison by deployment type
  • Exhibit 22: CPE - Market size and forecast 2017-2022 ($ mn)
  • Exhibit 23: CPE - Year-over-year growth 2018-2022 (%)
  • Exhibit 24: DPU - Market size and forecast 2017-2022 ($ mn)
  • Exhibit 25: DPU - Year-over-year growth 2018-2022 (%)
  • Exhibit 26: Market opportunity by deployment type
  • Exhibit 27: Global G.fast chipset market by end-user - Market share 2017-2022 (%)
  • Exhibit 28: Comparison by end-user
  • Exhibit 29: Residential - Market size and forecast 2017-2022 ($ mn)
  • Exhibit 30: Residential - Year-over-year growth 2018-2022 (%)
  • Exhibit 31: Enterprise/commercial - Market size and forecast 2017-2022 ($ mn)
  • Exhibit 32: Enterprise/commercial - Year-over-year growth 2018-2022 (%)
  • Exhibit 33: Market opportunity by end-user
  • Exhibit 34: Global G.fast chipset market by geography - Market share 2017-2022 (%)
  • Exhibit 35: Regional comparison
  • Exhibit 36: Americas - Market size and forecast 2017-2022 ($ mn)
  • Exhibit 37: Americas - Year-over-year growth 2018-2022 (%)
  • Exhibit 38: EMEA - Market size and forecast 2017-2022 ($ mn)
  • Exhibit 39: EMEA - Year-over-year growth 2018-2022 (%)
  • Exhibit 40: APAC - Market size and forecast 2017-2022 ($ mn)
  • Exhibit 41: APAC - Year-over-year growth 2018-2022 (%)
  • Exhibit 42: Key leading countries
  • Exhibit 43: Market opportunity
  • Exhibit 44: Industry uses of FTTH
  • Exhibit 45: Comparison of DSL technologies
  • Exhibit 46: Bandwidth comparison of 1G-5G technologies
  • Exhibit 47: MG.fast transmission speed
  • Exhibit 48: Vendor landscape
  • Exhibit 49: Landscape disruption
  • Exhibit 50: Vendors covered
  • Exhibit 51: Vendor classification
  • Exhibit 52: Market positioning of vendors
  • Exhibit 53: Broadcom: Overview
  • Exhibit 54: Broadcom - Business segments
  • Exhibit 55: Broadcom - Organizational developments
  • Exhibit 56: Broadcom - Geographic focus
  • Exhibit 57: Broadcom - Segment focus
  • Exhibit 58: Broadcom - Key offerings
  • Exhibit 59: Intel: Overview
  • Exhibit 60: Intel - Business segments
  • Exhibit 61: Intel - Organizational developments
  • Exhibit 62: Intel - Geographic focus
  • Exhibit 63: Intel - Segment focus
  • Exhibit 64: Intel - Key offerings
  • Exhibit 65: Metanoia Communications: Overview
  • Exhibit 66: Metanoia Communications - Organizational developments
  • Exhibit 67: Metanoia Communications - Key offerings
  • Exhibit 68: Sckipio Technologies: Overview
  • Exhibit 69: Sckipio Technologies - Organizational developments
  • Exhibit 70: Sckipio Technologies - Key offerings