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半導體蝕刻設備的全球市場:2018年∼2022年

Global Semiconductor Etch Equipment Market 2018-2022

出版商 TechNavio (Infiniti Research Ltd.) 商品編碼 602370
出版日期 內容資訊 英文 125 Pages
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半導體蝕刻設備的全球市場:2018年∼2022年 Global Semiconductor Etch Equipment Market 2018-2022
出版日期: 2018年01月31日 內容資訊: 英文 125 Pages
簡介

關於半導體蝕刻設備

蝕刻是在半導體工業中使用化學品從晶片表面除去層的流程。

Technavio的分析師預測,從2018年年到2022年之間全球半導體蝕刻設備市場將以3.77%的年複合成長率成長。

本報告提供全球半導體蝕刻設備市場相關調查分析,市場規模與成長率,市場趨勢,市場的推動要素與課題,市場機會驗證,主要供應商等相關的系統性資訊。

目錄

第1章 摘要整理

第2章 調查範圍

第3章 調查方法

第4章 市場情形

  • 市場概要
  • 半導體價值鏈
  • 市場生命週期
  • 市場特性
  • 市場區隔分析

第5章 市場規模

  • 市場定義
  • 市場規模:2017年
  • 市場規模及預測:2017-2022年

第6章 波特的五力分析

  • 買主談判力
  • 供應商談判力
  • 新加入廠商的威脅
  • 替代品的威脅
  • 競爭的威脅
  • 市場情形

第7章 市場區隔:各類型

  • 市場區隔:各類型
  • 比較:各類型
  • 高密度蝕刻設備 - 市場規模與預測
  • 低密度蝕刻設備 - 市場規模與預測
  • 市場機會:各類型

第8章 客戶形勢

第9章 市場區隔:各終端用戶

  • 市場區隔:各終端用戶
  • 比較:各終端用戶
  • 晶圓代工廠 - 市場規模與預測
  • 記憶體廠商 - 市場規模與預測
  • IDM - 市場規模與預測
  • 市場機會:各終端用戶

第10章 地區形勢

  • 地理市場區隔
  • 地區比較
  • 亞太地區 - 市場規模與預測
  • 南北美洲 - 市場規模與預測
  • 歐洲、中東、非洲地區 - 市場規模與預測
  • 主要的已開發國家
  • 韓國
  • 台灣
  • 中國
  • 日本
  • 市場機會

第11章 決策架構

第12章 成長要素與課題

  • 市場成長要素
  • 市場課題

第13章 市場趨勢

  • 晶圓尺寸的增加
  • 中國的半導體產業顯著的發展
  • NEMS的使用
  • 改良的FinFET架構
  • 雙鑲嵌蝕刻流程的出現

第14章 業者情勢

  • 概要
  • 創造性破壞
  • 競爭模式

第15章 供應商分析

  • 交易廠商
  • 供應商的分類
  • 供應商的市場定位
  • Applied Materials
  • 日立先端科技
  • Lam Research
  • Tokyo Electron Glass

第16章 附錄

  • 簡稱清單
目錄
Product Code: IRTNTR20469

About Semiconductor Etch Equipment

Etching is a process used in the semiconductor industry to remove layers from the wafer surface using chemicals.

Technavio's analysts forecast the global semiconductor etch equipment market to grow at a CAGR of 3.77% during the period 2018-2022.

Covered in this report

The report covers the present scenario and the growth prospects of the global semiconductor etch equipment market for 2018-2022. To calculate the market size, the report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA

Technavio's report, Global Semiconductor Etch Equipment Market 2018-2022, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

  • Applied Materials
  • Hitachi High-Technologies
  • Lam Research
  • Tokyo Electron

Market driver

  • Increase in capital spending
  • For a full, detailed list, view our report

Market challenge

  • Complexity of technology transitions
  • For a full, detailed list, view our report

Market trend

  • Increase in wafer size
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2022 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Table of Contents

PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

PART 03: RESEARCH METHODOLOGY

PART 04: MARKET LANDSCAPE

  • Market outline
  • Semiconductor value chain
  • Market ecosystem
  • Market characteristics
  • Market segmentation analysis

PART 05: MARKET SIZING

  • Market definition
  • Market sizing 2017
  • Market size and forecast 2017-2022

PART 06: FIVE FORCES ANALYSIS

  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition

PART 07: MARKET SEGMENTATION BY TYPE

  • Segmentation by type
  • Comparison by type
  • High-density etch equipment - Market size and forecast 2017-2022
  • Low-density etch equipment - Market size and forecast 2017-2022
  • Market opportunity by type

PART 08: CUSTOMER LANDSCAPE

PART 09: MARKET SEGMENTATION BY END-USER

  • Segmentation by end-user
  • Comparison by end-user
  • Foundries - Market size and forecast 2017-2022
  • Memory manufacturers- Market size and forecast 2017-2022
  • IDMs - Market size and forecast 2017-2022
  • Market opportunity by end-user

PART 10: REGIONAL LANDSCAPE

  • Geographical segmentation
  • Regional comparison
  • APAC - Market size and forecast 2017-2022
  • Americas - Market size and forecast 2017-2022
  • EMEA - Market size and forecast 2017-2022
  • Key leading countries
  • South Korea
  • Taiwan
  • China
  • Japan
  • Market opportunity

PART 11: DECISION FRAMEWORK

PART 12: DRIVERS AND CHALLENGES

  • Market drivers
  • Market challenges

PART 13: MARKET TRENDS

  • Increase in wafer size
  • Significant development of the Chinese semiconductor industry
  • Use of NEMS
  • Improved FinFET architecture
  • Emergence of dual damascene etch process

PART 14: VENDOR LANDSCAPE

  • Overview
  • Landscape disruption
  • Competitive scenario

PART 15: VENDOR ANALYSIS

  • Vendors covered
  • Vendor classification
  • Market positioning of vendors
  • Applied Materials
  • Hitachi High-Technologies
  • Lam Research
  • Tokyo Electron

PART 16: APPENDIX

  • List of abbreviations

List of Exhibits

  • Exhibit 01: Semiconductor value chain
  • Exhibit 02: Description of semiconductor value chain
  • Exhibit 03: Parent market
  • Exhibit 04: Global semiconductor capital equipment market
  • Exhibit 05: Market characteristics
  • Exhibit 06: Market segments
  • Exhibit 07: Market definition - Inclusions and exclusions checklist
  • Exhibit 08: Market size 2017
  • Exhibit 09: Validation techniques employed for market sizing 2017
  • Exhibit 10: Global - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 11: Global - Year-over-year growth 2018-2022 (%)
  • Exhibit 12: Five forces analysis 2017
  • Exhibit 13: Five forces analysis 2022
  • Exhibit 14: Bargaining power of buyers
  • Exhibit 15: Bargaining power of suppliers
  • Exhibit 16: Threat of new entrants
  • Exhibit 17: Threat of substitutes
  • Exhibit 18: Threat of rivalry
  • Exhibit 19: Market condition - Five forces 2017
  • Exhibit 20: Type - Market share 2017-2022 (%)
  • Exhibit 21: Comparison by type
  • Exhibit 22: High-density etch equipment - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 23: High-density etch equipment - Year-over-year growth 2018-2022 (%)
  • Exhibit 24: Share of metal and silicon etch equipment in high-density etch equipment 2017-2022 (%)
  • Exhibit 25: Low-density etch equipment - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 26: Low-density etch equipment - Year-over-year growth 2018-2022 (%)
  • Exhibit 27: Market opportunity by type
  • Exhibit 28: Customer landscape
  • Exhibit 29: End-user - Market share 2017-2022 (%)
  • Exhibit 30: Comparison by end-user
  • Exhibit 31: Foundries - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 32: Foundries - Year-over-year growth 2018-2022 (%)
  • Exhibit 33: Memory manufacturers - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 34: Memory manufacturers - Year-over-year growth 2018-2022 (%)
  • Exhibit 35: IDMs - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 36: IDMs - Year-over-year growth 2018-2022 (%)
  • Exhibit 37: Market opportunity by end-user
  • Exhibit 38: Global - Market share by geography 2017-2022 (%)
  • Exhibit 39: Regional comparison
  • Exhibit 40: APAC - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 41: APAC - Year-over-year growth 2018-2022 (%)
  • Exhibit 42: Americas - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 43: Americas - Year-over-year growth 2018-2022 (%)
  • Exhibit 44: EMEA - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 45: EMEA - Year-over-year growth 2018-2022 (%)
  • Exhibit 46: Key leading countries
  • Exhibit 47: Market opportunity
  • Exhibit 48: Global semiconductor market trend 1990-2017 ($ bn)
  • Exhibit 49: Timeline of advances in semiconductor wafer size
  • Exhibit 50: Vendor landscape
  • Exhibit 51: Landscape disruption
  • Exhibit 52: Vendors covered
  • Exhibit 53: Vendor classification
  • Exhibit 54: Market positioning of vendors
  • Exhibit 55: Vendor overview
  • Exhibit 56: Applied Materials - Business segments
  • Exhibit 57: Applied Materials - Organizational developments
  • Exhibit 58: Applied Materials - Geographic focus
  • Exhibit 59: Applied Materials - Segment focus
  • Exhibit 60: Applied Materials - Key offerings
  • Exhibit 61: Vendor overview
  • Exhibit 62: Hitachi High-Technologies - Business segments
  • Exhibit 63: Hitachi High-Technologies - Organizational developments
  • Exhibit 64: Hitachi High-Technologies - Geographic focus
  • Exhibit 65: Hitachi High-Technologies - Segment focus
  • Exhibit 66: Hitachi High-Technologies - Key offerings
  • Exhibit 67: Vendor overview
  • Exhibit 68: Lam Research - Business segments
  • Exhibit 69: Lam Research - Organizational developments
  • Exhibit 70: Lam Research - Geographic focus
  • Exhibit 71: Lam Research - Segment focus
  • Exhibit 72: Lam Research - Key offerings
  • Exhibit 73: Vendor overview
  • Exhibit 74: Tokyo Electron - Business segments
  • Exhibit 75: Tokyo Electron - Organizational developments
  • Exhibit 76: Tokyo Electron - Geographic focus
  • Exhibit 77: Tokyo Electron - Segment focus
  • Exhibit 78: Tokyo Electron - Key offerings
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