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市場調查報告書

扇出型晶圓級封裝(FOWLP)技術的全球市場:2019∼2023年

Global Fan-out Wafer Level Packaging (FOWLP) Market 2019-2023

出版商 TechNavio (Infiniti Research Ltd.) 商品編碼 481501
出版日期 內容資訊 英文 114 Pages
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扇出型晶圓級封裝(FOWLP)技術的全球市場:2019∼2023年 Global Fan-out Wafer Level Packaging (FOWLP) Market 2019-2023
出版日期: 2018年11月20日內容資訊: 英文 114 Pages
簡介

面板級封裝的引入降低了晶圓級封裝的整體成本。將整個封裝過程轉變為大尺寸面板格式,降低了封裝的總成本。這允許在同一基板上同時封裝幾個部件。面板級封裝技術顯著降低了基板製造商、IDM、OSAT公司和無晶圓廠公司的製造成本。不同行業對電子產品的需求不斷成長,將進一步推動對面板級封裝的需求,從而推動扇形晶圓級封裝市場的成長。Technavio的分析師預測,扇形晶圓級封裝(FOWLP)市場到2023年的年複合成長率將接近16%。

本報告提供全球扇出型晶圓級封裝(FOWLP)技術市場相關調查分析,市場規模與成長率,市場趨勢,市場的推動要素與課題,市場機會驗證,再加上主要供應商等相關的系統性資訊。

目錄

第1章 摘要整理

第2章 調查範圍

第3章 市場情形

  • 市場生態系統
  • 市場特性
  • 市場區隔分析

第4章 市場規模

  • 市場定義
  • 市場規模(2018年)
  • 市場規模及預測(2018年∼2023年)

第5章 波特的五力分析

  • 買主談判力
  • 供應商談判力
  • 新加入廠商的威脅
  • 替代品的威脅
  • 競爭對手的威脅
  • 市場情形

第6章 市場區隔:各技術

  • 市場區隔:各技術(2018年∼2023年)
  • 比較:各技術
  • 高密度FOWLP
  • 標準密度FOWLP
  • 市場機會:各技術

第7章 客戶形勢

第8章 各地區景觀

  • 各地區市場區隔(2018年∼2023年)
  • 各地區比較
  • 亞太地區
  • 南北美洲
  • 歐洲、中東、非洲地區
  • 主要國家
  • 市場機會

第9章 決策架構

第10章 成長要素與課題

  • 市場成長要素
  • 市場課題

第11章 市場趨勢

  • 汽車半導體IC的採用擴大
  • 面板等級封裝的引進
  • 智慧型手機加入更多的功能

第12章 業者情勢

  • 概要
  • 創造性破壞狀況

第13章 供應商分析

  • 交易廠商
  • 供應商分類
  • 供應商的市場定位
  • Amkor Technology
  • ASE Technology Holding
  • SAMSUNG ELECTRO-MECHANICS
  • STATS ChipPAC
  • Taiwan Semiconductor Manufacturing Company

第14章 附錄

  • 調查方法
  • 簡稱的清單

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目錄
Product Code: IRTNTR30148

About this market

The introduction of panel level packaging has reduced the overall cost of wafer level packaging. The overall cost of packaging is lowered by shifting the whole packaging process to a large size panel format. This allows simultaneous packaging of several components on the same substrate. Panel level packaging technology significantly reduces the manufacturing costs for substrate manufacturers, IDMs, OSAT companies, and fabless companies. The increasing demand for electronics across different industries will further drive the demand for panel level packaging and thereby boost fan-out wafer level packaging market growth. Technavio's analysts have predicted that the fan-out wafer level packaging (FOWLP) market will register a CAGR of almost 16% by 2023.

Market Overview

Increasing demand for compactly designed electronics

The demand for miniaturized semiconductor components is increasing. This is prompting semiconductor companies to develop new packaging technologies such as FOWLP which will reduce the overall size of packaged Ics. FOWLP technology is suitable for applications that require high power and extreme miniaturization. This packaging technology also reduces the packaging and testing costs by allowing the fabrication and testing at wafer level. The growing demand for compact electronics will further drive thee demand for FOWLP technology and thereby boost market growth.

Increased production costs due to warpage

Warping is the deformation of the wafer surface due to differential shrinkage of the material in the molded part. Warping makes the wafers unusable and since it occurs several times during FOWLP, the manufacturing cost of the wafer increases. Warping can occur after post mold cure (PMC), after back grinding of the EMC, or after the fabrication of redistribution layers (RDLs). Warpage increases the overall packaging and manufacturing cost which in turn hampers the growth of FOWLP market.

For the detailed list of factors that will drive and challenge the growth of the fan-out wafer level packaging (FOWLP) market during 2019-2023, view our report.

Competitive Landscape

The market appears to be concentrated and with the presence of few companies including Amkor Technology, and ASE Technology Holding the competitive environment is less intense. Factors such as the growing demand for compactly designed electronics, will provide considerable growth opportunities to fan-out wafer level packaging (FOWLP) companies. Amkor Technology, ASE Technology Holding, SAMSUNG ELECTRO-MECHANICS, STATS ChipPAC, and Taiwan Semiconductor Manufacturing Company are some of the major companies covered in this report.

TABLE OF CONTENTS

PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

PART 03: MARKET LANDSCAPE

  • Market ecosystem
  • Market characteristics
  • Market segmentation analysis

PART 04: MARKET SIZING

  • Market definition
  • Market sizing 2018
  • Market size and forecast 2018-2023

PART 05: FIVE FORCES ANALYSIS

  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition

PART 06: MARKET SEGMENTATION BY TECHNOLOGY

  • Market segmentation by technology
  • Comparison by technology
  • High density FOWLP - Market size and forecast 2018-2023
  • Standard density FOWLP - Market size and forecast 2018-2023
  • Market opportunity by technology

PART 07: CUSTOMER LANDSCAPE

PART 08: GEOGRAPHIC LANDSCAPE

  • Geographic segmentation
  • Geographic comparison
  • APAC - Market size and forecast 2018-2023
  • Americas - Market size and forecast 2018-2023
  • EMEA - Market size and forecast 2018-2023
  • Key leading countries
  • Market opportunity

PART 09: DECISION FRAMEWORK

PART 10: DRIVERS AND CHALLENGES

  • Market drivers
  • Market challenges

PART 11: TRENDS

  • Increasing adoption of semiconductor Ics in automobiles
  • Introduction of panel level packaging
  • Incorporation of more functionalities in smartphones

PART 12: VENDOR LANDSCAPE

  • Overview
  • Landscape disruption

PART 13: VENDOR ANALYSIS

  • Vendors covered
  • Vendor classification
  • Market positioning of vendors
  • Amkor Technology
  • ASE Technology Holding
  • SAMSUNG ELECTRO-MECHANICS
  • STATS ChipPAC
  • Taiwan Semiconductor Manufacturing Company

PART 14: APPENDIX

  • Research methodology
  • List of abbreviations

List of Exhibits

  • Exhibit 01: Global advanced semiconductor packaging market
  • Exhibit 02: Segments of global advanced semiconductor packaging market
  • Exhibit 03: Market characteristics
  • Exhibit 04: Market Segment
  • Exhibit 05: Market definition - Inclusions and exclusions checklist
  • Exhibit 06: Market size 2018
  • Exhibit 07: Global market: Size and forecast 2018-2023 ($ millions)
  • Exhibit 08: Global market: Year-over-year growth 2019-2023 (%)
  • Exhibit 09: Five forces analysis 2018
  • Exhibit 10: Five forces analysis 2023
  • Exhibit 11: Bargaining power of buyers
  • Exhibit 12: Bargaining power of suppliers
  • Exhibit 13: Threat of new entrants
  • Exhibit 14: Threat of substitutes
  • Exhibit 15: Threat of rivalry
  • Exhibit 16: Market condition - Five forces 2018
  • Exhibit 17: Technology - Market share 2018-2023 (%)
  • Exhibit 18: Comparison by technology
  • Exhibit 19: High density FOWLP - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 20: High density FOWLP - Year-over-year growth 2019-2023 (%)
  • Exhibit 21: Standard density FOWLP - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 22: Standard density FOWLP - Year-over-year growth 2019-2023 (%)
  • Exhibit 23: Market opportunity by technology
  • Exhibit 24: Customer landscape
  • Exhibit 25: Market share by geography 2018-2023 (%)
  • Exhibit 26: Geographic comparison
  • Exhibit 27: APAC - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 28: APAC - Year-over-year growth 2019-2023 (%)
  • Exhibit 29: Americas - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 30: Americas - Year-over-year growth 2019-2023 (%)
  • Exhibit 31: EMEA - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 32: EMEA - Year-over-year growth 2019-2023 (%)
  • Exhibit 33: Key leading countries
  • Exhibit 34: Market opportunity
  • Exhibit 35: Impact of drivers and challenges
  • Exhibit 36: Vendor landscape
  • Exhibit 37: Landscape disruption
  • Exhibit 38: Vendors covered
  • Exhibit 39: Vendor classification
  • Exhibit 40: Market positioning of vendors
  • Exhibit 41: Amkor Technology - Vendor overview
  • Exhibit 42: Amkor Technology - Organizational developments
  • Exhibit 43: Amkor Technology - Geographic focus
  • Exhibit 44: Amkor Technology - Key offerings
  • Exhibit 45: ASE Technology Holding - Vendor overview
  • Exhibit 46: ASE Technology Holding - Business segments
  • Exhibit 47: ASE Technology Holding - Organizational developments
  • Exhibit 48: ASE Technology Holding - Geographic focus
  • Exhibit 49: ASE Technology Holding - Segment focus
  • Exhibit 50: ASE Technology Holding - Key offerings
  • Exhibit 51: SAMSUNG ELECTRO-MECHANICS - Vendor overview
  • Exhibit 52: SAMSUNG ELECTRO-MECHANICS - Business segments
  • Exhibit 53: SAMSUNG ELECTRO-MECHANICS - Organizational developments
  • Exhibit 54: SAMSUNG ELECTRO-MECHANICS - Geographic focus
  • Exhibit 55: SAMSUNG ELECTRO-MECHANICS - Segment focus
  • Exhibit 56: SAMSUNG ELECTRO-MECHANICS - Key offerings
  • Exhibit 57: STATS ChipPAC - Vendor overview
  • Exhibit 58: STATS ChipPAC - Organizational developments
  • Exhibit 59: STATS ChipPAC - Geographic focus
  • Exhibit 60: STATS ChipPAC - Key offerings
  • Exhibit 61: Taiwan Semiconductor Manufacturing Company - Vendor overview
  • Exhibit 62: Taiwan Semiconductor Manufacturing Company - Organizational developments
  • Exhibit 63: Taiwan Semiconductor Manufacturing Company - Geographic focus
  • Exhibit 64: Taiwan Semiconductor Manufacturing Company - Key offerings
  • Exhibit 65: Validation techniques employed for market sizing
  • Exhibit 66: List of abbreviations
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