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扇出型晶圓級封裝 (FOWLP)的全球市場:2017年∼2021年

Global Fan-out Wafer Level Packaging Market 2017-2021

出版商 TechNavio (Infiniti Research Ltd.) 商品編碼 481501
出版日期 內容資訊 英文 70 Pages
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扇出型晶圓級封裝 (FOWLP)的全球市場:2017年∼2021年 Global Fan-out Wafer Level Packaging Market 2017-2021
出版日期: 2017年03月10日 內容資訊: 英文 70 Pages

全球扇出型晶圓級封裝 (FOWLP) 市場預測在2017年到2021年間,將以47.76%的年複合成長率 (CAGR) 擴大。

本報告依用途及地區別提供全球扇出型晶圓級封裝 (FOWLP) 市場現狀分析與今後的成長預測,提供您市場成長因素與課題,主要趨勢,主要供應商分析等資訊。

第1章 摘要整理

第2章 本報告的調查範圍

第3章 調查手法

第4章 簡介

  • 主要市場洞察

第5章 技術趨勢

  • 半導體IC的製造流程
  • 晶圓級封裝 (WLP) vs. 晶粒級封裝及集合
  • 半導體封裝產業發展藍圖
  • 半導體IC封裝產業的生態系統

第6章 市場形勢

  • 市場規模與預測
  • 波特的五力分析

第7章 各用途的市場分類

  • 全球FOWLP市場:各用途
  • 類比IC及混合IC
  • 無線連接
  • 邏輯IC及記憶體IC
  • MEMS及感測器
  • CMOS影像感測器

第8章 地理區分

  • 亞太地區
  • 南北美洲
  • 歐洲

第9章 決策架構

第10章 市場成長因素與課題

  • 市場成長因素
  • 主要客戶部門成長因素的影響
  • 市場課題
  • 主要客戶部門課題的影響

第11章 市場趨勢

第12章 業者情勢

  • 競爭模式
  • 主要供應商
  • 其他卓越供應商

第13章 附錄

  • 簡稱清單
Product Code: IRTNTR12201

About Fan-Out Wafer Level Packaging

FOWLP is a chip packaging technology that is used to package an IC, while the IC is still part of the wafer. The technology has a smaller form factor, thinner flip-chip packages, supports I/O density, and allows the use of wafer level packaging with improved semiconductor technology nodes and multi-die package. Wafer-level packages have advantages, in terms of cost and form, in comparison to substrate-based flip-chip packages. The WLP can assemble small to medium pin count Ics in the thinnest and smallest possible footprint at low cost. This is driving its market demand.

Technavio's analysts forecast the global fan-out wafer level packaging market to grow at a CAGR of 47.76% during the period 2017-2021.

Covered in this report

The report covers the present scenario and the growth prospects of the global fan-out wafer level packaging market for 2017-2021. To calculate the market size, the report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA

Technavio's report, Global Fan-Out Wafer Level Packaging Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

  • TSMC
  • Texas Instruments

Other Prominent Vendors

  • Rudolph Technologies
  • SUSS MicroTec
  • STMicroelectronics
  • Ultratech

Market driver

  • Growing application of semiconductor Ics in IoT.
  • For a full, detailed list, view our report

Market challenge

  • Rapid technological changes in wafer processing.
  • For a full, detailed list, view our report

Market trend

  • High adoption of semiconductor Ics in automobiles.
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2021 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Table of Contents

PART 01: Executive summary

PART 02: Scope of the report

PART 03: Research Methodology

PART 04: Introduction

  • Key market highlights

PART 05: Technology landscape

  • Semiconductor IC manufacturing process
  • WLP versus die-level packaging and assembly
  • Roadmap of semiconductor packaging industry
  • Ecosystem of semiconductor IC packaging industry

PART 06: Market landscape

  • Market size and forecast
  • Five forces analysis

PART 07: Market segmentation by application

  • Global FOWLP market by application
  • Analog and mixed IC
  • Wireless connectivity
  • Logic and memory IC
  • MEMS and sensors
  • CMOS image sensors

PART 08: Geographical segmentation

  • APAC
  • Americas
  • Europe

PART 09: Decision framework

PART 10: Drivers and challenges

  • Market drivers
  • Impact of drivers on key customer segments
  • Market challenges
  • Impact of challenges on key customer segments

PART 11: Market trends

  • Increase in wafer size
  • High adoption of semiconductor ICs in automobiles
  • Short replacement cycle of mobile devices

PART 12: Vendor landscape

  • Competitive scenario
  • Key vendors
  • Other prominent vendors

PART 13: Appendix

  • List of abbreviations

List of Exhibits

  • Exhibit 01: Semiconductor IC manufacturing process
  • Exhibit 02: Front-end chip formation steps
  • Exhibit 03: Back-end chip formation steps
  • Exhibit 04: Semiconductor packaging industry
  • Exhibit 05:.5D IC block diagram
  • Exhibit 06:D IC block diagram
  • Exhibit 07: Old semiconductor IC packaging industry supply chain
  • Exhibit 08: New semiconductor IC packaging industry supply chain
  • Exhibit 09: Global FOWLP market 2016-2021 ($ millions)
  • Exhibit 10: Five forces analysis
  • Exhibit 11: Global FOWLP market by application 2016-2021 (% share)
  • Exhibit 12: Global FOWLP market by application 2016-2021 ($ millions)
  • Exhibit 13: Global analog and mixed IC market 2016-2021 ($ millions)
  • Exhibit 14: Global wireless connectivity market 2016-2021 ($ millions)
  • Exhibit 15: Global logic and memory IC market 2016-2021 ($ millions)
  • Exhibit 16: Global MEMS and sensors market 2016-2021 ($ millions)
  • Exhibit 17: Global CMOS image sensor market 2016-2021 ($ billions)
  • Exhibit 18: Global FOWLP market forecast by geography 2016-2021 (% share)
  • Exhibit 19: Global FOWLP market forecast by geography 2016-2021 ($ millions)
  • Exhibit 20: FOWLP market in APAC 2016-2021 ($ millions)
  • Exhibit 21: FOWLP market in Americas 2016-2021 ($ millions)
  • Exhibit 22: FOWLP market in Europe 2016-2021 ($ millions)
  • Exhibit 23: Global MEMS market 2015-2020 ($ billions)
  • Exhibit 24: Global smartphone shipment forecast 2016-2021 (millions of units)
  • Exhibit 25: Impact of drivers
  • Exhibit 26: Impact of drivers
  • Exhibit 27: Impact of challenges
  • Exhibit 28: Impact of challenges
  • Exhibit 29: Timeline for semiconductor wafer size advances
  • Exhibit 30: Growth of car shipments 2015-2020 (%)
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