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市場調查報告書

全球扇入型晶圓級構裝市場:2016年∼2020年

Global Fan-in Wafer Level Packaging Market 2016-2020

出版商 TechNavio (Infiniti Research Ltd.) 商品編碼 382927
出版日期 內容資訊 英文 62 Pages
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全球扇入型晶圓級構裝市場:2016年∼2020年 Global Fan-in Wafer Level Packaging Market 2016-2020
出版日期: 2016年10月25日 內容資訊: 英文 62 Pages
簡介

扇入型晶圓級構裝,是1998年登場的晶片實行解決方案。全球扇入型晶圓級構裝市場,預計從2016年到2020年的預測期間內,年複合成長率成長9.63%。

本報告提供全球扇入型晶圓級構裝市場相關調查分析,市場概要,市場趨勢,市場規模等相關考察,各產品種類、用途、地區的市場分析,競爭情形等相關整體分析彙整。

第1章 摘要整理

第2章 調查的範圍

  • 市場範圍
  • 基準年與預測期間
  • 供應商的市場區隔
  • 市場區隔
  • 各地區市場區隔

第3章 市場調查方法

  • 調查方法
  • 經濟指標
  • PEST分析

第4章 簡介

第5章 技術狀況

第6章 市場的狀況

  • 市場規模與預測
  • 波特的五力分析

第7章 市場區隔:各用途

  • 全球扇入型WLP市場:各用途
  • 類比、混合信號IC
  • 無線連接性
  • Logic,記憶體IC
  • MEMS和感測器
  • CMOS影像感測器

第8章 各地區市場區隔

  • 全球扇入型WLP市場:各地區
  • 亞太地區
  • 北美
  • 歐洲

第9章 推動市場的要素

  • 小型電子設備的需求
  • IoT的半導體IC的用途的成長
  • 半導體IC設計複雜性增加
  • 半導體晶圓的需求增加

第10章 促進要素的影響

第11章 市場課題

第12章 促進要素與課題的影響

第13章 市場趨勢

  • 晶圓尺寸的增加
  • 半導體IC引進汽車的增加
  • 行動裝置的短替換週期

第14章 供應商狀況

  • 競爭模式
  • 主要的供應商
  • 其他主要供應商

第15章 市場摘要

第16章 附錄

第17章 關於Technavio

另紙一覽

目錄
Product Code: IRTNTR10665

About Fan-in WLP

Chip-scale packaging (CSP) emerged in the 1990s. By 1998, wafer-level CSPs emerged as the most preferred form of chip packaging solutions due to their low cost benefits in applications, ranging from application-specific integrated circuits (ASICs) and microprocessors to electrically erasable programmable read-only memory (EEPROM). WLP is one of the key trending technologies used for CSP and is gaining popularity among fabless and foundry companies globally.

Technavio's analysts forecast the global fan-in WLP market to grow at a CAGR of 9.63% during the period 2016-2020.

Covered in this report

The report covers the present scenario and the growth prospects of the global fan-in WLP market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sales of packaged fan-in WLPs in various application segments such as analog and mixed IC, wireless connectivity, logic and memory IC, micro-electro-mechanical systems (MEMS) and sensors, and complementary metal-oxide-semiconductor (CMOS) image sensor

The market is divided into the following segments based on geography:

  • APAC
  • North America
  • Europe

Technavio's report, Global Fan-in WLP Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

  • STATS ChipPAC
  • STMicroelectronics
  • TSMC
  • Texas Instruments

Other Prominent Vendors

  • Rudolph Technologies
  • SEMES
  • SUSS MicroTec
  • Ultratech
  • FlipChip International

Market driver

  • High demand for miniaturized electronics
  • For a full, detailed list, view our report

Market challenge

  • Cyclical nature of semiconductor industry
  • For a full, detailed list, view our report

Market trend

  • Increase in wafer size
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2020 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Table of Contents

PART 01: Executive summary

  • Highlights

PART 02: Scope of the report

  • Market coverage
  • Base year and forecast period
  • Vendor segmentation
  • Market segmentation
  • Geographical segmentation

PART 03: Market research methodology

  • Research methodology
  • Economic indicators
  • PEST analysis

PART 04: Introduction

  • Key market highlights

PART 05: Technology landscape

  • Semiconductor IC manufacturing process
  • WLP versus die-level packaging and assembly
  • Roadmap of semiconductor packaging industry
  • Ecosystem of semiconductor IC packaging industry

PART 06: Market landscape

  • Market size and forecast
  • Five forces analysis

PART 07: Market segmentation by application

  • Global fan-in WLP market by application
  • Analog and mixed ICs
  • Wireless connectivity
  • Logic and memory ICs
  • MEMS and sensors
  • CMOS image sensors

PART 08: Geographical segmentation

  • Global fan-in WLP market by geography 2015-2020
  • APAC
  • North America
  • Europe

PART 09: Market drivers

  • High demand for miniaturized electronics
  • Growing application of semiconductor ICs in IoT
  • Increasing complexity of semiconductor IC designs
  • Surging demand for semiconductor wafers

PART 10: Impact of drivers

PART 11: Market challenges

  • Cyclical nature of semiconductor industry
  • Rapid technological changes in wafer processing

PART 12: Impact of drivers and challenges

PART 13: Market trends

  • Increase in wafer size
  • High adoption of semiconductor ICs in automobiles
  • Short replacement cycle of mobile devices

PART 14: Vendor landscape

  • Competitive scenario
  • Key vendors
  • Other prominent vendors

PART 15: Market summary

PART 16: Appendix

  • List of abbreviations

PART 17: Explore Technavio

List of Exhibits

  • Exhibit 01: Global fan-in WLP market segmentation 2015
  • Exhibit 02: Key regions
  • Exhibit 03: PEST analysis
  • Exhibit 04: Semiconductor IC manufacturing process
  • Exhibit 05: Front-end chip formation steps
  • Exhibit 06: Back-end chip formation steps
  • Exhibit 07: Roadmap of semiconductor packaging industry
  • Exhibit 08:.5D IC block diagram
  • Exhibit 09:D IC block diagram
  • Exhibit 10: Old semiconductor IC packaging industry supply chain
  • Exhibit 11: New semiconductor IC packaging industry supply chain
  • Exhibit 12: Global fan-in WLP market 2015-2020 ($ billions)
  • Exhibit 13: Global fan-in WLP market 2015-2020 (billions of units)
  • Exhibit 14: Five forces analysis
  • Exhibit 15: Global fan-in WLP market by application 2015-2020 (% share of shipments)
  • Exhibit 16: Global fan-in WLP market by application 2015-2020 (billions of units)
  • Exhibit 17: Global fan-in WLP market by analog and mixed IC 2015-2020 (billions of units)
  • Exhibit 18: Global fan-in WLP market by wireless connectivity 2015-2020 (billions of units)
  • Exhibit 19: Global fan-in WLP market by logic and memory IC 2015-2020 (billions of units)
  • Exhibit 20: Global fan-in WLP market by MEMS and sensors 2015-2020 (billions of units)
  • Exhibit 21: Global fan-in WLP market by CMOS image sensor 2015-2020 (billions of units)
  • Exhibit 22: Global fan-in WLP market by geography 2015-2020 (% share of shipment)
  • Exhibit 23: Global fan-in WLP market by geography 2015-2020 (billions of units)
  • Exhibit 24: Fan-in WLP market in APAC 2015-2020 (billions of units)
  • Exhibit 25: Fan-in WLP market in North America 2015-2020 (billions of units)
  • Exhibit 26: Fan-in WLP market in Europe 2015-2020 (billions of units)
  • Exhibit 27: Global MEMS market 2015-2020 ($ billions)
  • Exhibit 28: Global smartphone shipment forecast 2015-2020 (millions of units)
  • Exhibit 29: Impact of drivers
  • Exhibit 30: Impact of drivers (continued)
  • Exhibit 31: Global semiconductor market trend 1992-2014 ($ billions)
  • Exhibit 32: Impact of drivers and challenges
  • Exhibit 33: Timeline for semiconductor wafer-size advances
  • Exhibit 34: Growth of car shipments 2015-2020
  • Exhibit 35: Other prominent vendors in market
  • Exhibit 36: Market snapshot of global fan-in WLP market 2015-2020
  • Exhibit 37: CAGR comparison: Application segments
  • Exhibit 38: CAGR comparison: Geographical segments
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