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市場調查報告書

系統封裝 (SiP)的全球市場 (2016∼2020年)

Global System-in-Package Market 2016-2020

出版商 TechNavio (Infiniti Research Ltd.) 商品編碼 379045
出版日期 內容資訊 英文 67 Pages
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系統封裝 (SiP)的全球市場 (2016∼2020年) Global System-in-Package Market 2016-2020
出版日期: 2016年10月19日 內容資訊: 英文 67 Pages
簡介

SiP (系統封裝) 是半導體的組裝技術的一種,將複數的晶片 - 特殊處理器,DRAM,快閃記憶體等 - 與基板上的被動元件 (電阻器、電容器等) 組合,將追加零件壓在最小限度運作。因此,適合智慧裝置等利用空間狹小的環境。還有可將印刷電路板結構和整體設計簡單化的優點。全球SiP市場2016∼2020年以10.29%的年複合成長率成長。

本報告提供全球系統封裝 (SiP) 市場相關分析,技術概要和市場基本結構,市場規模趨勢 (今後5年的預測值),各用途、各連接技術、各終端用戶、各地區的詳細趨勢,推動、阻礙市場要素與其影響力,主要企業簡介,今後的市場機會等調查評估。

第1章 摘要整理

  • 分析結果的概要

第2章 分析範圍

  • 定義
  • 基準年、預測期間
  • 分析概要
  • 市場區隔
  • 分析對象地區
  • 供應商的分類
  • 匯率
  • 大供應商的主要產品

第3章 市場分析技術

  • 分析方法
  • 經濟指標

第4章 簡介

  • 市場趨勢的概要

第5章 系統封裝 (SiP)的技術概要

  • 後端、晶片的形成
  • 在晶圓等級/晶粒等級的包裝、組合
  • 半導體包裝產業的發展
  • 半導體IC封裝產業的生態系統

第6章 市場環境

  • 市場概要
  • 比較:SoC (晶片系統), SiP (系統封裝), CoB (集成式封裝)
  • 市場規模與其預測
  • 波特的五力分析

第7章 系統封裝 (SiP)的全球市場:各用途的市場區隔

  • 通訊產業
  • 家電產品產業
  • 計算機產業
  • 汽車產業
  • 醫療產業

第8章 系統封裝 (SiP)的全球市場:各互相連接技術的市場區隔

  • 引線接合包裝
  • 翻轉粘合包裝

第9章 系統封裝 (SiP)的全球市場:各終端用戶的市場區隔

  • 晶圓代工廠
  • IDM (垂直整合型設備廠商)

第10章 系統封裝 (SiP)的全球市場:地區區分

  • 亞太地區
  • 南北美洲
  • 歐洲、中東、非洲各國 (EMEA)

第11章 系統封裝 (SiP)的全球市場:推動市場要素

  • 壓制成本上升的必要性
  • 高性能、小型家電產品的登場
  • 晶圓廠企業 (晶圓代工廠)的增加
  • IoT設備的增加
  • SoC的設計的複雜性

第12章 推動因素的影響力

第13章 系統封裝 (SiP)的全球市場:課題

  • 供應鏈內地的庫存水準高
  • 匯率的變動
  • 巨額的投資需要的市場

第14章 推動因素、課題的影響力

第15章 系統封裝 (SiP)的全球市場:趨勢

  • OSAT (以後工程外包) 供應商的增加
  • FOWLP (Fan Out Wafer Level Package) 技術的登場
  • 汽車的自動化

第16章 供應商環境

  • 競爭方案
  • 主要供應商
  • 其他卓越供應商

第17章 附錄

  • 簡稱集

第18章 關於Technavio

目錄
Product Code: IRTNTR10639

About SiP

A SiP contains several chips such as a specialized processor, dynamic random access memory (DRAM), and flash memory. These chips are combined with passive components such as resistors and capacitors, which are placed on one substrate, requiring only a few external components to make it functional. Thus, devices packaged using this technology are ideal for space constrained environments such as smart devices. This reduces integration complexities on the printed circuit board (PCB) as well as making the overall design simpler.

Technavio's analysts forecast the global SiP market to grow at a CAGR of 10.29% during the period 2016-2020.

Covered in this report

The report covers the present scenario and the growth prospects of the global SiP market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sales of SiP systems.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA

Technavio's report, Global SiP Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

  • Amkor Technology
  • ASE
  • JCET
  • SPIL
  • UTAC

Other Prominent Vendors

  • ChipMOS Technology
  • ChipSiP Technology
  • NANIUM
  • Octavo Systems
  • Samsung Electro-Mechanics

Market driver

  • Need to control rising costs
  • For a full, detailed list, view our report

Market challenge

  • High inventory levels in supply chain
  • For a full, detailed list, view our report

Market trend

  • Growth of OSAT vendors
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2020 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Table of Contents

PART 01: Executive summary

  • Highlights

PART 02: Scope of the report

  • Definition
  • Source year and forecast period
  • Market overview
  • Segmentation
  • Geographical coverage
  • Vendor segmentation
  • Common currency conversion rates
  • Top-vendor offerings

PART 03: Market research methodology

  • Research methodology
  • Economic indicators

PART 04: Introduction

  • Key market highlights

PART 05: Technology overview

  • Back-end chip formation
  • Wafer-level versus die-level packaging and assembly
  • Evolution of semiconductor packaging industry
  • Eco-system of semiconductor IC packaging industry

PART 06: Market landscape

  • Market overview
  • Comparison between SoC, SiP, and chip-on-board (CoB)
  • Market size and forecast
  • Five forces analysis

PART 07: Market segmentation by application

  • Communications sector
  • Consumer electronics sector
  • Computers sector
  • Automotive sector
  • Medical sector

PART 08: Market segmentation by interconnect technology

  • Wire bond packaging
  • Flip-chip packaging

PART 09: Market segmentation by end-user

  • Foundries
  • IDMs

PART 10: Geographical segmentation

  • APAC
  • Americas
  • EMEA

PART 11: Market drivers

  • Need to control rising costs
  • Emergence of advanced and compact consumer electronic devices
  • Rise in number of fabs
  • Increasing number of IoT devices
  • Design complexities in SoC

PART 12: Impact of drivers

PART 13: Market challenges

  • High inventory levels in supply chain
  • Fluctuation of foreign exchange rates
  • High investment market

PART 14: Impact of drivers and challenges

PART 15: Market trends

  • Growth of OSAT vendors
  • Emergence of FOWLP technology
  • Automation in automobiles

PART 16: Vendor landscape

  • Competitive scenario
  • Key vendors
  • Other prominent vendors

PART 17: Appendix

  • List of abbreviations

PART 18: Explore Technavio

List of Exhibits

  • Exhibit 01: Global SiP market segmentation
  • Exhibit 02: List of countries in key geographies
  • Exhibit 03: Market vendors
  • Exhibit 04: Currency conversions
  • Exhibit 05: Product offerings
  • Exhibit 06: Back-end chip formation steps
  • Exhibit 07:.5D IC block diagram
  • Exhibit 08:D IC block diagram
  • Exhibit 09: Old semiconductor IC packaging industry supply chain
  • Exhibit 10: New semiconductor IC packaging industry supply chain
  • Exhibit 11: SoC, SiP, and CoB ranking on functioning parameters
  • Exhibit 12: Global SiP market 2015-2020 ($ billions)
  • Exhibit 13: Five forces analysis
  • Exhibit 14: Percentage share of SiP usage in applications (2015-2020)
  • Exhibit 15: Percentage share of SiP usage in applications 2015-2020 ($ billions)
  • Exhibit 16: Global SiP market for communications sector 2015-2020 ($ billions)
  • Exhibit 17: Global SiP market for consumer electronics sector 2015-2020 ($ billions)
  • Exhibit 18: Global SiP market for computer sector 2015-2020 ($ billions)
  • Exhibit 19: Global SiP market for automotive sector 2015-2020 ($ billions)
  • Exhibit 20: Expected automotive shipment forecast y-o-y (%)
  • Exhibit 21: Global SiP market for medical sector 2015-2020 ($ billions)
  • Exhibit 22: Bonding technologies for SiP, 2015-2020 (% share)
  • Exhibit 23: Bonding technologies for SiP, 2015-2020 ($ billions)
  • Exhibit 24: Global SiP market for wire bond packaging 2015-2020 ($ billions)
  • Exhibit 25: Global SiP market for flip-chip packaging 2015-2020 ($ billions)
  • Exhibit 26: Global SiP market by end-user 2015-2020 (% share)
  • Exhibit 27: Global SiP market by end-user 2015-2020 ($ billions)
  • Exhibit 28: Global SiP market of foundries 2015-2020 ($ billions)
  • Exhibit 29: Global SiP market for IDMs 2015-2020 ($ billions)
  • Exhibit 30: Global SiP market by geography 2015-2020 (% share)
  • Exhibit 31: Global SiP market by geography 2015-2020 (% share)
  • Exhibit 32: SiP market in APAC 2015-2020 ($ billions)
  • Exhibit 33: SiP market in Americas 2015-2020 ($ billions)
  • Exhibit 34: SiP market in EMEA 2015-2020 ($ billions)
  • Exhibit 35: Impact of drivers
  • Exhibit 36: Global semiconductor market trend 1992-2015 ($ billions)
  • Exhibit 37: Impact of drivers and challenges
  • Exhibit 38: Other vendors in global SiP market
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