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嵌入式模組電腦的全球市場 - 2016∼2020年

Global Computer on Module Market 2016-2020

出版商 TechNavio (Infiniti Research Ltd.) 商品編碼 361376
出版日期 內容資訊 英文 66 Pages
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嵌入式模組電腦的全球市場 - 2016∼2020年 Global Computer on Module Market 2016-2020
出版日期: 2016年06月02日 內容資訊: 英文 66 Pages

嵌入式模組電腦 (COM)的全球市場從2016年到2020年的期間中預計以17.97%的年複合成長率 持續成長。

本報告以嵌入式模組電腦 (COM)的全球市場為焦點,提供推動市場成長要素和市場課題,透過市場趨勢,以及市場競爭情形的詳細調查,進行從市場現狀分析以及2016年到2020年的未來預測。

第1章 摘要整理

第2章 本報告涵蓋範圍

  • 市場概要
  • 定義
  • 主要供應商產品

第3章 市場調查手法

  • 調查手法
  • 經濟指標

第4章 序論

  • 市場相關重要事項
  • 標準規格
  • 使用COM (嵌入式模組電腦) 的Go-to-market手法: OEM的觀點

第5章 市場概況

  • 市場概要
  • 以出貨量為準的市場規模及未來預測
  • 以收益額為準的市場規模及未來預測
  • 波特的五力分析

第6章 適用各產業領域市場分類

  • 工業自動化領域COM
  • 醫療領域COM
  • 交通運輸領域COM
  • 遊戲領域COM
  • 通訊領域COM
  • 其他產業領域COM

第7章 各標準規格市場分類

  • 支援COM Express規格COM市場
  • 支援SMARC規格COM市場
  • 支援Qseven規格COM市場
  • 支援ETX規格COM市場
  • 支援其他規格的COM市場

第8章 各地區市場分類

  • 歐洲、中東、非洲地區COM市場
  • 南北美洲地區COM市場
  • 亞太地區COM市場

第9章 推動市場成長要素

  • 產品開發高速化的必要性高漲
  • COM的長壽性及可靠性
  • 通過大量銷售通路的銷售

第10章 推動市場成長要素帶來的影響

第11章 市場課題

  • 需求預測的錯誤
  • 前置作業時間長
  • 風險要素的大小

第12章 推動市場成長要素和市場課題帶來的影響

第13章 市場趨勢

  • 電晶體技術的進步
  • IoT的出現
  • 小型、輕量、低功率設計產品市場成長

第14章 業者情勢

  • 市場競爭方案
  • COM的價格設定
  • 公司內部開發COM時的TCO (總持有成本)
  • 部門間的獨立性
  • Congatec
  • Kontron
  • MSC Technologies
  • 其他的有力供應商

第15章 附錄

第16章 關於Technavio

Product Code: IRTNTR9588

About the Computer On Module (COM) Market

A COM, or system on module (SOM), is a single board computer, which is a subtype of an embedded computer system. COMs are used in various embedded applications such as industrial automation, medical equipment, gaming devices (slot machines), servers, workstations, and rackmounts. They are built on a single circuit board and consist of a single processor, random access memory (RAM), and input and output controllers. However, COMs lack the standard connectors required for connecting input/output peripherals to the board. Hence, they need to be mounted on a carrier board to connect to standard peripheral connectors. Certain COMs have peripheral connectors and do not require a carrier board. In certain configurations, the baseboard is connected to a backplane, which allows connectivity to other peripheral devices. Also, some rackmount computer designs that use COMs use backplane connectivity. Backplane connectivity provides many functionalities such as better power connectivity, LAN connectivity from backplane, and improved modular design that allows plug-and-play features to increase computing capacity.

Technavio's analysts forecast the global computer on module (COM) market to grow at a CAGR of 17.97% during the period 2016-2020.

Covered in this report

The report covers the present scenario and the growth prospects of the global computer on module (COM) market for 2016-2020. To calculate the market size, the report considers revenue generated from the shipment of COM based on the following standards:

  • COM express
  • Smart Mobility ARChitecture (SMARC)
  • Qseven
  • Embedded Technology eXtended (ETX)
  • Others

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA

Technavio's report, Global Computer On Module (COM) Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

  • Congatec
  • Kontron
  • MSC Technologies

Other Prominent Vendors

  • Adlinktech
  • Avalue
  • Phytec
  • Portwell

Market driver

  • Longevity and reliability of COMs
  • For a full, detailed list, view our report

Market challenge

  • Failure in forecasting market demand
  • For a full, detailed list, view our report

Market trend

  • Advances in transistor technology
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2020 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Table of Contents

PART 01: Executive summary

  • Highlights

PART 02: Scope of the report

  • Market overview
  • Definitions
  • Top-vendor offerings

PART 03: Market research methodology

  • Research methodology
  • Economic indicators

PART 04: Introduction

  • Key market highlights
  • Standards
  • Go-to-market approach using COM: The OEM's perspective

PART 05: Market landscape

  • Market overview
  • Market size and forecast by shipment
  • Market size and forecast by revenue
  • Five forces analysis

PART 06: Market segmentation by application

  • COM for industrial automation segment
  • COM for medical segment
  • COM for transportation segment
  • COM for gaming segment
  • COM for communication segment
  • COM for others segment

PART 07: Market segmentation by standard

  • COM for COM Express segment
  • COM for SMARC segment
  • COM for Qseven segment
  • COM for ETX segment
  • COM for other standards segment

PART 08: Geographical segmentation

  • COM market in EMEA
  • COM market in Americas
  • COM market in APAC

PART 09: Market drivers

  • Increased demand for fast product development
  • Longevity and reliability of COMs
  • Multichannel retailing

PART 10: Impact of drivers

PART 11: Market challenges

  • Failure in forecasting market demand
  • High lead time
  • High risk factors

PART 12: Impact of drivers and challenges

PART 13: Market trends

  • Advances in transistor technology
  • Emergence of IoT
  • Growing market for small SWaP designs

PART 14: Vendor landscape

  • Competitive scenario
  • Pricing for COMs
  • TCO of developing COMs in-house
  • Sector independence
  • Congatec
  • Kontron
  • MSC Technologies
  • Other prominent vendors

PART 15: Appendix

  • List of abbreviations

PART 16: Explore Technavio

List of Exhibits

  • Exhibit 01: Product offerings
  • Exhibit 02: COM standards
  • Exhibit 03: COM market landscape
  • Exhibit 04: Global COM market 2015-2020 (millions of units)
  • Exhibit 05: Global COM market 2015-2020 ($ billions)
  • Exhibit 06: Five forces analysis
  • Exhibit 07: Segmentation of global COM market by application 2015
  • Exhibit 08: Global COM market by standard 2015
  • Exhibit 09: Different form factors of COM Express
  • Exhibit 10: SMARC module summary
  • Exhibit 11: Pinout configuration for different standards
  • Exhibit 12: Qseven: Minimum and maximum required configurations of the feature set
  • Exhibit 13: Qseven revision history
  • Exhibit 14: Global COM market by standard 2020
  • Exhibit 15: Global COM market by geography 2015
  • Exhibit 16: Global COM market by geography 2015
  • Exhibit 17: Impact of drivers
  • Exhibit 18: Product revenue ($ millions) and growth rate (%) for Congatec
  • Exhibit 19: Lead time resulting in lower revenue conversion and more backlog
  • Exhibit 20: List of microprocessor manufacturers
  • Exhibit 21: Impact of drivers and challenges
  • Exhibit 22: Intel's tri-gate manufacturing roadmap
  • Exhibit 23: Comparison of 14 nm technology with traditional technology
  • Exhibit 24: Normalized cost of transistor on per unit basis (nm)
  • Exhibit 25: Global connected device market by product shipment 2015-2020 (millions of units)
  • Exhibit 26: Kontron: Market potential 2014 ($ millions)
  • Exhibit 27: Tentative pricing list of COM cards ($)
  • Exhibit 28: Comparative break-even calculation for the sale of 2,000 and 3,000 units of COMs
  • Exhibit 29: Impact of Kontron-Ennoconn partnership on Kontron's business strategies
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