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市場調查報告書

晶圓檢查裝置的全球市場:2019年∼2023年

Global Wafer Inspection Equipment Market 2019-2023

出版商 TechNavio (Infiniti Research Ltd.) 商品編碼 350020
出版日期 內容資訊 英文 127 Pages
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晶圓檢查裝置的全球市場:2019年∼2023年 Global Wafer Inspection Equipment Market 2019-2023
出版日期: 2018年11月15日內容資訊: 英文 127 Pages
簡介

全球晶圓檢查裝置市場,在到2023年的期間中,以超過6%的年複合成長率擴大。

本報告提供全球晶圓檢查裝置市場現狀及今後的成長預測,各技術、終端用戶、地區的市場趨勢,市場成長因素與課題,及主要企業簡介等資訊。

第1章 摘要整理

第2章 本報告的調查範圍

第3章 市場形勢

  • 市場生態系統
  • 市場區隔分析
  • 市場特徵

第4章 市場規模

  • 市場定義
  • 市場規模
  • 市場規模與預測

第5章 波特的五力分析

第6章 各技術的市場分類

  • 各技術的市場分類
  • 各技術比較
  • 光學晶圓檢驗 - 市場規模與預測
  • 電子束晶圓檢驗 - 市場規模與預測
  • 市場機會

第7章 客戶形勢

第8章 各終端用戶的市場分類

  • 各終端用戶的市場分類
  • 各終端用戶比較
  • 晶圓代工廠 - 市場規模與預測
  • IDM - 市場規模與預測
  • 市場機會

第9章 地區形勢

  • 地區分類
  • 地區比較
  • 亞太地區 - 市場規模與預測
  • 南北美洲 - 市場規模與預測
  • 歐洲、中東、非洲地區 - 市場規模與預測
  • 主要國家
  • 市場機會

第10章 決策架構

第11章 市場成長因素與課題

  • 市場成長因素
  • 市場課題

第12章 市場趨勢

第13章 業者情勢

  • 概要
  • 創造性破壞狀況

第14章 供應商分析

  • 交易廠商
  • 供應商分類
  • 供應商的市場定位
  • Applied Materials
  • ASML
  • 日立先端科技
  • KLA-Tencor
  • Rudolph Technologies

第15章 附錄

  • 調查手法
  • 簡稱清單

第16章 關於Technavio

目錄
Product Code: IRTNTR30265

About this market:

The size of wafers has increased from 23 mm to 300 mm in the last forty years. The large surface area provided by large diameter wafers allows the manufacturing of high number of chips at low manufacturing costs. A reduction of 30% in manufacturing costs and 20%-50% in device costs can be achieved by increasing wafer size. Moreover, IC production can be optimized in foundries by making changes to the 300 mm wafer fabs. Memory Ics built on 300 mm wafers are being developed by some leading memory manufacturers such as SAMSUNG, Micron Technology, and SK HYNIX. Thus, the increasing focus on large diameter wafer size is identified as a key trend that will fuel the growth of wafer inspection equipment market during the forecast period. Technavio's analysts have predicted that the wafer inspection equipment market will register a CAGR of over 6% by 2023.

Market Overview:

Growing demand for IoT devices

The development in telecommunication standards such as 3G/4G/5G and wired communication standards have led to increased adoption of IoT devices. IoT devices can collect, record, and transmit data between connected devices on a real-time basis without the need for human interaction. The penetration of IoT devices is expected to increase during the forecast period. This will result in increasing demand for semiconductor devices, which in turn will boost the growth of wafer inspection equipment market.

Cyclic nature of the semiconductor industry

The semiconductor industry is highly volatile due to its cyclic nature. Excess production capacity, rapid price erosion of Ics, and obsolete products affects the growth of the semiconductor industry. The fluctuations in the market can lead to high inventory levels during low demand and low inventory levels during high demand. This cyclic nature of the semiconductor industry drastically impacts the demand for wafer inspection equipment and hampers market growth.

For the detailed list of factors that will drive and challenge the growth of the wafer inspection equipment market during 2019-2023, view our report.

Competitive Landscape:

The market appears to be concentrated and with the presence of few companies including Applied Materials, and ASML the competitive environment is less intense. Factors such as the increasing demand for IoT devices, will provide considerable growth opportunities to wafer inspection equipment manufacturers. Applied Materials, ASML, Hitachi High-Technologies, KLA-Tencor, and Rudolph Technologies are some of the major companies covered in this report.

TABLE OF CONTENTS

PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

PART 03: MARKET LANDSCAPE

  • Market ecosystem
  • Market segmentation analysis
  • Market characteristics

PART 04: MARKET SIZING

  • Market definition
  • Market sizing 2018
  • Market size and forecast 2018-2023

PART 05: FIVE FORCES ANALYSIS

  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition

PART 06: MARKET SEGMENTATION BY TECHNOLOGY

  • Market segmentation by technology
  • Comparison by technology
  • Optical wafer inspection - Market size and forecast 2018-2023
  • E-beam wafer inspection - Market size and forecast 2018-2023
  • Market opportunity by technology

PART 07: CUSTOMER LANDSCAPE

PART 08: MARKET SEGMENTATION BY END-USER

  • Market segmentation by end-user
  • Comparison by end-user
  • Foundries - Market size and forecast 2018-2023
  • IDMs - Market size and forecast 2018-2023
  • Market opportunity by end-user

PART 09: GEOGRAPHIC LANDSCAPE

  • Geographic segmentation
  • Geographic comparison
  • APAC - Market size and forecast 2018-2023
  • Americas - Market size and forecast 2018-2023
  • EMEA - Market size and forecast 2018-2023
  • Key leading countries
  • Market opportunity

PART 10: DECISION FRAMEWORK

PART 11: DRIVERS AND CHALLENGES

  • Market drivers
  • Market challenges

PART 12: MARKET TRENDS

  • Increasing focus on large diameter wafer size
  • Growing investments in lower technology node
  • Growing investment in 3D NAND and FinFET technologies

PART 13: VENDOR LANDSCAPE

  • Overview
  • Landscape disruption

PART 14: VENDOR ANALYSIS

  • Vendors covered
  • Vendor classification
  • Market positioning of vendors
  • Applied Materials
  • ASML
  • Hitachi High-Technologies
  • KLA-Tencor
  • Rudolph Technologies

PART 15: APPENDIX

  • Research methodology
  • List of abbreviations

PART 16: EXPLORE TECHNAVIO

List of Exhibits

  • Exhibit 01: Global semiconductor manufacturing equipment market
  • Exhibit 02: Segments of global semiconductor manufacturing equipment market
  • Exhibit 03: Market segments
  • Exhibit 04: Market characteristics
  • Exhibit 05: Market definition - Inclusions and exclusions checklist
  • Exhibit 06: Market size 2018
  • Exhibit 07: Global market: Size and forecast 2018-2023 ($ millions)
  • Exhibit 08: Global market: Year-over-year growth 2019-2023 (%)
  • Exhibit 09: Five forces analysis 2018
  • Exhibit 10: Five forces analysis 2023
  • Exhibit 11: Bargaining power of buyers
  • Exhibit 12: Bargaining power of suppliers
  • Exhibit 13: Threat of new entrants
  • Exhibit 14: Threat of substitutes
  • Exhibit 15: Threat of rivalry
  • Exhibit 16: Market condition - Five forces 2018
  • Exhibit 17: Technology - Market share 2018-2023 (%)
  • Exhibit 18: Comparison by technology
  • Exhibit 19: Optical wafer inspection - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 20: Optical wafer inspection - Year-over-year growth 2019-2023 (%)
  • Exhibit 21: E-beam wafer inspection - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 22: E-beam wafer inspection - Year-over-year growth 2019-2023 (%)
  • Exhibit 23: Market opportunity by technology
  • Exhibit 24: Customer landscape
  • Exhibit 25: End-user - Market share 2018-2023 (%)
  • Exhibit 26: Comparison by end-user
  • Exhibit 27: Foundries - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 28: Foundries - Year-over-year growth 2019-2023 (%)
  • Exhibit 29: IDMs - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 30: IDMs - Year-over-year growth 2019-2023 (%)
  • Exhibit 31: Market opportunity by end-user
  • Exhibit 32: Market share by geography 2018-2023 (%)
  • Exhibit 33: Geographic comparison
  • Exhibit 34: Major semiconductor foundries in APAC
  • Exhibit 35: APAC - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 36: APAC - Year-over-year growth 2019-2023 (%)
  • Exhibit 37: Americas - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 38: Americas - Year-over-year growth 2019-2023 (%)
  • Exhibit 39: Major foundries in EMEA
  • Exhibit 40: EMEA - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 41: EMEA - Year-over-year growth 2019-2023 (%)
  • Exhibit 42: Key leading countries
  • Exhibit 43: Market opportunity
  • Exhibit 44: Impact of drivers and challenges
  • Exhibit 45: Vendor landscape
  • Exhibit 46: Landscape disruption
  • Exhibit 47: Vendors covered
  • Exhibit 48: Vendor classification
  • Exhibit 49: Market positioning of vendors
  • Exhibit 50: Applied Materials - Vendor overview
  • Exhibit 51: Applied Materials - Business segments
  • Exhibit 52: Applied Materials - Organizational developments
  • Exhibit 53: Applied Materials - Geographic focus
  • Exhibit 54: Applied Materials - Segment focus
  • Exhibit 55: Applied Materials - Key offerings
  • Exhibit 56: ASML - Vendor overview
  • Exhibit 57: ASML - Organizational developments
  • Exhibit 58: ASML - Geographic focus
  • Exhibit 59: ASML - Key offerings
  • Exhibit 60: Hitachi High-Technologies - Vendor overview
  • Exhibit 61: Hitachi High-Technologies - Business segments
  • Exhibit 62: Hitachi High-Technologies - Organizational developments
  • Exhibit 63: Hitachi High-Technologies - Segment focus
  • Exhibit 64: Hitachi High-Technologies - Key offerings
  • Exhibit 65: KLA-Tencor - Vendor overview
  • Exhibit 66: KLA-Tencor - Organizational developments
  • Exhibit 67: KLA-Tencor - Geographic focus
  • Exhibit 68: KLA-Tencor - Key offerings
  • Exhibit 69: Rudolph Technologies - Vendor overview
  • Exhibit 70: Rudolph Technologies - Organizational developments
  • Exhibit 71: Rudolph Technologies - Geographic focus
  • Exhibit 72: Rudolph Technologies - Key offerings