表紙
市場調查報告書
商品編碼
1027426

半導體晶圓用切割Thor的全球市場:2021年∼2025年

Global Wafer Dicing Saws Market 2021-2025

出版日期: | 出版商: TechNavio (Infiniti Research Ltd.) | 英文 120 Pages | 訂單完成後即時交付

價格
  • 全貌
  • 簡介
  • 目錄
簡介

全球半導體晶圓用切割Thor的市場規模在2021年∼2025年間,預測將成長到9116萬美元,在預測期間中預計將以3.04%的年複合成長率增長。

市場成長的主要因素有IoT需求的擴大,行動設備,智慧裝置,智慧卡的增加等。

本報告涵括半導體晶圓用切割Thor的全球市場的整體分析,提供市場規模與預測,趨勢,成長要素,課題,及約25供應商的分析。

目錄

摘要整理

市場形勢

  • 市場生態系統
  • 市場特徵
  • 價值鏈分析

市場規模

  • 市場定義
  • 市場區隔分析
  • 2020年的市場規模
  • 市場預測:從2020年∼2025年的預測

波特的五力分析

  • 買方議價能力
  • 供給企業談判力
  • 新加入廠商業者的威脅
  • 替代品的威脅
  • 競爭的威脅
  • 市場情況

市場區隔:各終端用戶

  • 市場區隔
  • 各終端用戶比較
  • Pureplay晶圓代工廠:市場規模與預測(2020年∼2025年)
  • IDM:市場規模與預測(2020年∼2025年)
  • 各終端用戶市場機會

市場區隔:包裝

  • 市場區隔
  • 包裝比較
  • 包裝市場機會

各地區形勢

  • 各地區市場區隔
  • 各地區比較
  • 亞太地區:市場規模與預測(2020年∼2025年)
  • 北美:市場規模與預測(2020年∼2025年)
  • 歐洲:市場規模與預測(2020年∼2025年)
  • 南美:市場規模與預測(2020年∼2025年)
  • 中東·非洲:市場規模與預測(2020年∼2025年)
  • 主要國家
  • 各地區的市場機會
  • 市場推動因素
  • 市場課題
  • 市場趨勢

業者情勢

  • 概要
  • 業者情勢
  • 創造性破壞狀況

供應商分析

  • 交易廠商
  • 供應商的市場定位
  • Advanced Dicing Technologies
  • DISCO Corp.
  • Loadpoint Ltd.
  • Shenyang Heyan Technology Co. Ltd.
  • Tokyo Seimitsu Co. Ltd.
  • TUV NORD AG
  • UKAM Industrial Superhard Tools

附錄

目錄
Product Code: IRTNTR44865

Technavio has been monitoring the wafer dicing saws market and it is poised to grow by $ 91.16 million during 2021-2025, decelerating at a CAGR of 3.04% during the forecast period. Our report on the wafer dicing saws market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current global market scenario, latest trends and drivers, and the overall market environment. The market is driven by growing demand for IoT and increase in the number of mobile devices, smart devices, and smart cards. In addition, growing demand for IoT is anticipated to boost the growth of the market as well.

The wafer dicing saws market analysis includes end-user and packaging segments and geographic landscape.

Technavio's wafer dicing saws market is segmented as below:

By End User

  • Pureplay foundries
  • IDMs

By Packaging

  • BGA
  • QFN

By Geographical Landscape

  • APAC
  • North America
  • Europe
  • South America
  • MEA

This study identifies the increasing number of fabsas one of the prime reasons driving the wafer dicing saws market growth during the next few years.

Technavio presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters. Our report on wafer dicing saws market covers the following areas:

  • Wafer dicing saws market sizing
  • Wafer dicing saws market forecast
  • Wafer dicing saws market industry analysis

Technavio's robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading wafer dicing saws market vendors that include Advanced Dicing Technologies, DISCO Corp., Loadpoint Ltd., Shenyang Heyan Technology Co. Ltd., Tokyo Seimitsu Co. Ltd., TUV NORD AG, and UKAM Industrial Superhard Tools. Also, the wafer dicing saws market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.

Technavio presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. Technavio's market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.

Table of Contents

  • Executive Summary
    • Market overview
  • Market Landscape
    • Market ecosystem
    • Market characteristics
    • Value chain analysis
  • Market Sizing
    • Market definition
    • Market segment analysis
    • Market size 2020
    • Market outlook: Forecast for 2020 - 2025
  • Five Forces Analysis
    • Bargaining power of buyers
    • Bargaining power of suppliers
    • Threat of new entrants
    • Threat of substitutes
    • Threat of rivalry
    • Market condition
  • Market Segmentation by End-user
    • Market segments
    • Comparison by End-user
    • Pureplay foundries - Market size and forecast 2020-2025
    • IDMs - Market size and forecast 2020-2025
    • Market opportunity by End-user
  • Market Segmentation by Packaging
    • Market segments
    • Comparison by Packaging
    • Market opportunity by Packaging
  • Geographic Landscape
    • Geographic segmentation
    • Geographic comparison
    • APAC - Market size and forecast 2020-2025
    • North America - Market size and forecast 2020-2025
    • Europe - Market size and forecast 2020-2025
    • South America - Market size and forecast 2020-2025
    • MEA - Market size and forecast 2020-2025
    • Key leading countries
    • Market opportunity By Geographical Landscape
    • Market drivers
    • Market challenges
    • Market trends
  • Vendor Landscape
    • Overview
    • Vendor landscape
    • Landscape disruption
  • Vendor Analysis
    • Vendors covered
    • Market positioning of vendors
    • Advanced Dicing Technologies
    • DISCO Corp.
    • Loadpoint Ltd.
    • Shenyang Heyan Technology Co. Ltd.
    • Tokyo Seimitsu Co. Ltd.
    • TUV NORD AG
    • UKAM Industrial Superhard Tools
  • Appendix
    • Scope of the report
    • Currency conversion rates for US$
    • Research methodology
    • List of abbreviations

Exhibits

  • 1: Key Finding 1
  • 2: Key Finding 2
  • 3: Key Finding 3
  • 4: Key Finding 5
  • 5: Key Finding 6
  • 6: Key Finding 7
  • 7: Key Finding 8
  • 8: Key Finding 9
  • 9: Parent market
  • 10: Market characteristics
  • 11: Offerings of vendors included in the market definition
  • 12: Market segments
  • 13: Global - Market size and forecast 2020 - 2025 ($ million)
  • 14: Global market: Year-over-year growth 2020 - 2025 (%)
  • 15: Five forces analysis 2020 & 2025
  • 16: Bargaining power of buyers
  • 17: Bargaining power of suppliers
  • 18: Threat of new entrants
  • 19: Threat of substitutes
  • 20: Threat of rivalry
  • 21: Market condition - Five forces 2020
  • 22: End-user - Market share 2020-2025 (%)
  • 23: Comparison by End-user
  • 24: Pureplay foundries - Market size and forecast 2020-2025 ($ million)
  • 25: Pureplay foundries - Year-over-year growth 2020-2025 (%)
  • 26: IDMs - Market size and forecast 2020-2025 ($ million)
  • 27: IDMs - Year-over-year growth 2020-2025 (%)
  • 28: Market opportunity by End-user
  • 29: Packaging - Market share 2020-2025 (%)
  • 30: Comparison by Packaging
  • 31: BGA - Market size and forecast 2020-2025 ($ million)
  • 32: BGA - Year-over-year growth 2020-2025 (%)
  • 33: QFN - Market size and forecast 2020-2025 ($ million)
  • 34: QFN - Year-over-year growth 2020-2025 (%)
  • 35: Market opportunity by Packaging
  • 36: Customer landscape
  • 37: Market share By Geographical Landscape 2020-2025 (%)
  • 38: Geographic comparison
  • 39: APAC - Market size and forecast 2020-2025 ($ million)
  • 40: APAC - Year-over-year growth 2020-2025 (%)
  • 41: North America - Market size and forecast 2020-2025 ($ million)
  • 42: North America - Year-over-year growth 2020-2025 (%)
  • 43: Europe - Market size and forecast 2020-2025 ($ million)
  • 44: Europe - Year-over-year growth 2020-2025 (%)
  • 45: South America - Market size and forecast 2020-2025 ($ million)
  • 46: South America - Year-over-year growth 2020-2025 (%)
  • 47: MEA - Market size and forecast 2020-2025 ($ million)
  • 48: MEA - Year-over-year growth 2020-2025 (%)
  • 49: Key leading countries
  • 50: Market opportunity By Geographical Landscape ($ million)
  • 51: Impact of drivers and challenges
  • 52: Vendor landscape
  • 53: Landscape disruption
  • 54: Industry risks
  • 55: Vendors covered
  • 56: Market positioning of vendors
  • 57: Advanced Dicing Technologies - Overview
  • 58: Advanced Dicing Technologies - Product and service
  • 59: Advanced Dicing Technologies - Key offerings
  • 60: Advanced Dicing Technologies - Key customers
  • 61: Advanced Dicing Technologies - Segment focus
  • 62: DISCO Corp. - Overview
  • 63: DISCO Corp. - Business segments
  • 64: DISCO Corp. - Key offerings
  • 65: DISCO Corp. - Key customers
  • 66: DISCO Corp. - Segment focus
  • 67: Loadpoint Ltd. - Overview
  • 68: Loadpoint Ltd. - Product and service
  • 69: Loadpoint Ltd. - Key offerings
  • 70: Loadpoint Ltd. - Key customers
  • 71: Loadpoint Ltd. - Segment focus
  • 72: Shenyang Heyan Technology Co. Ltd. - Overview
  • 73: Shenyang Heyan Technology Co. Ltd. - Product and service
  • 74: Shenyang Heyan Technology Co. Ltd. - Key offerings
  • 75: Shenyang Heyan Technology Co. Ltd. - Key customers
  • 76: Shenyang Heyan Technology Co. Ltd. - Segment focus
  • 77: Tokyo Seimitsu Co. Ltd. - Overview
  • 78: Tokyo Seimitsu Co. Ltd. - Business segments
  • 79: Tokyo Seimitsu Co. Ltd. - Key offerings
  • 80: Tokyo Seimitsu Co. Ltd. - Key customers
  • 81: Tokyo Seimitsu Co. Ltd. - Segment focus
  • 82: TUV NORD AG - Overview
  • 83: TUV NORD AG - Business segments
  • 84: TUV NORD AG - Key offerings
  • 85: TUV NORD AG - Key customers
  • 86: TUV NORD AG - Segment focus
  • 87: UKAM Industrial Superhard Tools - Overview
  • 88: UKAM Industrial Superhard Tools - Product and service
  • 89: UKAM Industrial Superhard Tools - Key offerings
  • 90: UKAM Industrial Superhard Tools - Key customers
  • 91: UKAM Industrial Superhard Tools - Segment focus
  • 92: Currency conversion rates for US$
  • 93: Research Methodology
  • 94: Validation techniques employed for market sizing
  • 95: Information sources
  • 96: List of abbreviations