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耐放射線性電子產品市場

Global Radiation Hardened & Radiation Tolerant Electronics Market

出版商 IndustryARC 商品編碼 978854
出版日期 內容資訊 英文 192 Pages
商品交期: 2-3個工作天內
價格
耐放射線性電子產品市場 Global Radiation Hardened & Radiation Tolerant Electronics Market
出版日期: 2020年10月08日內容資訊: 英文 192 Pages
簡介

耐放射線性電子設備、零組件市場,受航太市場的高運營成本和小批量生產的影響,防衛和航太市場區隔,過去10年成為支撐了產業的主要原動力。

本報告提供全球耐放射線性電子設備、零組件市場的相關調查,市場規模和趨勢,佔有率,成長及阻礙因素,策略,機會,各產品、材料、產品類型、最終用途產業、地區的市場分析,競爭情形,主要企業的簡介等資訊。

目錄

第1章 耐放射線性電子設備及零組件市場:概要

  • 定義和範圍

第2章 摘要整理

  • 各企業的市場收益,市場規模及主要趨勢
  • 應用的各種類的主要趨勢
  • 各地區市場區隔化的主要趨勢

第3章 耐放射線性電子設備及零組件市場

  • 比較分析
    • 主要十大公司:產品的基準
    • 主要5家公司:財務分析
    • 主要十大公司:各企業市場銷售額的明細
    • 主要十大公司:專利分析
    • 價格分析

第4章 市場動態

  • 成長要素
  • 阻礙因素
  • 課題
  • 波特的五力分析

第5章 策略性分析

  • 價值鏈分析
  • 市場機會分析
  • 產品生命週期
  • 供應商和分銷商的市場佔有率

第6章 市場分析:各產品

  • 市場規模與市場佔有率分析
  • 收益與趨勢調查
  • 市場區隔分析
    • 簡介
    • 類比、混合訊號/數位電子設備
    • 離散半導體
    • 光電
    • 電力管理
    • 感測器
    • 記憶體
    • 微處理器、微控制器
    • FPGA
    • Asics
    • 其他

第7章 市場分析:各材料

  • 碳化矽
  • 氮化鎵
  • 氫化非晶硅

第8章 市場分析:各產品類型

  • 客製化
  • 商用off-the-shelf

第9章 市場分析:各最終用途業界

  • 市場區隔類型:規模與市場佔有率分析
  • 收益與趨勢
  • 市場區隔分析
    • 簡介
    • 航空
    • 軍事
    • 宇宙
    • 核能
    • 醫療
    • 家電
    • 其他

第10章 市場分析:各地區

  • 北美市場區隔調查
  • 北美
  • 南美
  • 歐洲
  • 亞太地區

第11章 市場熵

  • 新產品銷售
  • M&A,合作,合資企業,聯盟

第12章 市場企業分析

  • 市場佔有率,企業的收益,產品,M&A,開發
  • Honeywell Electronics
  • BAE Systems
  • ST Microelectronics and others

第13章 附錄

  • 簡稱
  • 資訊來源
目錄
Product Code: ESR 0014

Radiation Hardened Electronic Devices and Components involve the production of electronic components by hardening through radiation. Insulating substrates such as SOI (Silicon on Insulators), SOS (Sapphire) are used primarily. The hardened components have a special purpose of withstanding otherwise damaging radiations (radiation immunity) particularly a serious problem in the design of components for artificial satellites, spacecraft, military aircraft, nuclear power stations, and nuclear weapons and other computing devices. The market is affected by the high operating costs and low volume nature of the space market. But defense and aerospace are the main driving force that has been holding the industry from collapsing over the past 10 years.

The market has been segmented by geography as North America, Europe, Asia, and the Rest of the World (ROW). Market size and forecast is provided for each of these regions. A detailed qualitative analysis of the factors responsible for driving and restraining the growth of the Radiation Hardened components is discussed in the report. Market shares of the key players for 2020-25 are provided.

Sample Companies Profiled in this Report are:

Honeywell Electronics,

BAE Systems,

ST Microelectronics and others.

10+

Table of Contents

1. Radiation Hardened Electronic Devices and Components Market - Overview

  • 1.1. Definitions and Scope

2. Radiation Hardened Electronic Devices and Components Market - Executive summary

  • 2.1. Market Revenue, Market Size and Key Trends by Company
  • 2.2. Key Trends by type of Application
  • 2.3. Key Trends segmented by Geography

3. Radiation Hardened Electronic Devices and Components Market

  • 3.1. Comparative analysis
    • 3.1.1. Product Benchmarking - Top 10 companies
    • 3.1.2. Top 5 Financials Analysis
    • 3.1.3. Market Value split by Top 10 companies
    • 3.1.4. Patent Analysis - Top 10 companies
    • 3.1.5. Pricing Analysis

4. Radiation Hardened Electronic Devices and Components Market Forces

  • 4.1. Drivers
  • 4.2. Constraints
  • 4.3. Challenges
  • 4.4. Porters five force model
    • 4.4.1. Bargaining power of suppliers
    • 4.4.2. Bargaining powers of customers
    • 4.4.3. Threat of new entrants
    • 4.4.4. Rivalry among existing players
    • 4.4.5. Threat of substitutes

5. Radiation Hardened Electronic Devices and Components Market -Strategic analysis

  • 5.1. Value chain analysis
  • 5.2. Opportunities analysis
  • 5.3. Product life cycle
  • 5.4. Suppliers and distributors Market Share

6. Radiation Hardened Electronic Devices and Components Market - By Products (Market Size -$Million / $Billion)

  • 6.1. Market Size and Market Share Analysis
  • 6.2. Application Revenue and Trend Research
  • 6.3. Product Segment Analysis
    • 6.3.1. Introduction
    • 6.3.2. Analog And Mixed Signal/ Digital Electronic Devices
      • 6.3.2.1. Rad-Hard A/D And D/A Converters
      • 6.3.2.2. Rad-Hard Multiplexers
    • 6.3.3. Discrete Semiconductors
    • 6.3.4. Optoelectronics
    • 6.3.5. Power Management
    • 6.3.6. Sensors
    • 6.3.7. Memory
    • 6.3.8. Microprocessors And Microcontrollers
    • 6.3.9. Fpgas
    • 6.3.10. Asics
    • 6.3.11. Others
      • 6.3.11.1. Radiation Hardened Flip Flop
      • 6.3.11.2. Radiation Hardened Cmos Structure Using An Implanted P Guard Structure

7. Radiation Hardened Electronic Devices and Components Market - By Materials (Market Size -$Million / $Billion)

  • 7.1. Silicon.
  • 7.2. Silicon Carbide
  • 7.3. Gallium Nitride
  • 7.4. Hydrogenated Amorphous Silicon

8. Radiation Hardened Electronic Devices and Components Market - By Product-Type (Market Size -$Million / $Billion)

  • 8.1. Custom-Made
  • 8.2. Commercial-Off-The-Shelf (Cots)

9. Radiation Hardened Electronic Devices and Components - By End Use Industry(Market Size -$Million / $Billion)

  • 9.1. Segment type Size and Market Share Analysis
  • 9.2. Application Revenue and Trends by type of Application
  • 9.3. Application Segment Analysis by Type
    • 9.3.1. Introduction
    • 9.3.2. Aerospace
    • 9.3.3. Military
    • 9.3.4. Space
    • 9.3.5. Nuclear
    • 9.3.6. Medical
    • 9.3.7. Consumer Electronics
    • 9.3.8. Others

10. Radiation Hardened Electronic Devices and Components - By Geography (Market Size -$Million / $Billion)

  • 10.1. Radiation Hardened Electronic Devices and Components Market - North America Segment Research
  • 10.2. North America Market Research (Million / $Billion)
    • 10.2.1. Segment type Size and Market Size Analysis
    • 10.2.2. Revenue and Trends
    • 10.2.3. Application Revenue and Trends by type of Application
    • 10.2.4. Company Revenue and Product Analysis
    • 10.2.5. North America Product type and Application Market Size
      • 10.2.5.1. U.S.
      • 10.2.5.2. Canada
      • 10.2.5.3. Mexico
      • 10.2.5.4. Rest of North America
  • 10.3. Radiation Hardened Electronic Devices and Components - South America Segment Research
  • 10.4. South America Market Research (Market Size -$Million / $Billion)
    • 10.4.1. Segment type Size and Market Size Analysis
    • 10.4.2. Revenue and Trends
    • 10.4.3. Application Revenue and Trends by type of Application
    • 10.4.4. Company Revenue and Product Analysis
    • 10.4.5. South America Product type and Application Market Size
      • 10.4.5.1. Brazil
      • 10.4.5.2. Venezuela
      • 10.4.5.3. Argentina
      • 10.4.5.4. Ecuador
      • 10.4.5.5. Peru
      • 10.4.5.6. Colombia
      • 10.4.5.7. Costa Rica
      • 10.4.5.8. Rest of South America
  • 10.5. Radiation Hardened Electronic Devices and Components - Europe Segment Research
  • 10.6. Europe Market Research (Market Size -$Million / $Billion)
    • 10.6.1. Segment type Size and Market Size Analysis
    • 10.6.2. Revenue and Trends
    • 10.6.3. Application Revenue and Trends by type of Application
    • 10.6.4. Company Revenue and Product Analysis
    • 10.6.5. Europe Segment Product type and Application Market Size
      • 10.6.5.1. U.K
      • 10.6.5.2. Germany
      • 10.6.5.3. Italy
      • 10.6.5.4. France
      • 10.6.5.5. Netherlands
      • 10.6.5.6. Belgium
      • 10.6.5.7. Spain
      • 10.6.5.8. Denmark
      • 10.6.5.9. Rest of Europe
  • 10.7. Radiation Hardened Electronic Devices and Components - APAC Segment Research
  • 10.8. APAC Market Research (Market Size -$Million / $Billion)
    • 10.8.1. Segment type Size and Market Size Analysis
    • 10.8.2. Revenue and Trends
    • 10.8.3. Application Revenue and Trends by type of Application
    • 10.8.4. Company Revenue and Product Analysis
    • 10.8.5. APAC Segment - Product type and Application Market Size
      • 10.8.5.1. China
      • 10.8.5.2. Australia
      • 10.8.5.3. Japan
      • 10.8.5.4. South Korea
      • 10.8.5.5. India
      • 10.8.5.6. Taiwan
      • 10.8.5.7. Malaysia

11. Radiation Hardened Electronic Devices and Components Market - Entropy

  • 11.1. New product launches
  • 11.2. M&A's, collaborations, JVs and partnerships

12. Radiation Hardened Electronic Devices and Components Market Company Analysis

  • 12.1. Market Share, Company Revenue, Products, M&A, Developments
  • 12.2. Honeywell Electronics
  • 12.3. BAE Systems
  • 12.4. ST Microelectronics and others
  • 12.5. Company 4
  • 12.6. Company 5
  • 12.7. Company 6
  • 12.8. Company 7
  • 12.9. Company 8
  • 12.10. Company 9
  • 12.11. Company 10 and more

"*Financials would be provided on a best efforts basis for private companies"

13. Radiation Hardened Electronic Devices and Components Market -Appendix

  • 13.1. Abbreviations
  • 13.2. Sources