市場調查報告書

ET (封包追蹤) 晶片市場預測:蜂巢式·無線·衛星

Envelope Tracking Chips Market - Forecast (2020 - 2025)

出版商 IndustryARC 商品編碼 622665
出版日期 內容資訊 英文 114 Pages
商品交期: 2-3個工作天內
價格
ET (封包追蹤) 晶片市場預測:蜂巢式·無線·衛星 Envelope Tracking Chips Market - Forecast (2020 - 2025)
出版日期: 2020年03月11日內容資訊: 英文 114 Pages
簡介

本報告提供全球ET (封包追蹤) 晶片的市場調查,提供市場定義和概要,競爭環境與市場佔有率,市場的各種影響因素及市場機會分析,價值鏈,產品生命週期分析,各技術·用途·終端用戶產業·地區/主要國家趨勢與市場規模的變化與預測,並彙整主要企業簡介等資訊。

第1章 市場概要

第2章 摘要整理

第3章 市場環境

  • 市場佔有率分析
  • 競爭經營者分析
    • 產品基準
    • 終端用戶的簡介
    • 專利分析
    • 前五名公司的財務分析

第4章 市場影響因素

  • 成長推進因素
  • 阻礙成長要素·課題
  • 產業的魅力

第5章 策略性市場分析

  • 價值鏈分析
  • 價格分析
  • 市場機會分析
  • 產品·市場生命週期
  • 供應商·流通經銷商

第6章 市場分析·預測:各技術

  • 簡介
  • 蜂巢式通訊
    • 4G·LTE
    • 3G·WCDMA
    • 其他
  • 無線通訊
    • Zigbee
    • Bluetooth
    • 其他
  • 衛星通訊

第7章 市場分析·預測:各用途

  • 簡介
  • 智慧型手機
  • 基地台
  • IoT設備 (M2M)
  • 軍用無線電
  • 穿戴式設備
  • 連網家庭設備
  • 平板電腦
  • GPS追蹤系統 (個人·防衛用·船舶用)
  • 其他
    • WNESS
    • 多功能手機

第8章 市場分析·預測:各最終用途產業

  • 簡介
  • CE產品
  • 宇宙·航空·防衛
  • 通訊
  • 汽車
  • 醫療保健
  • 其他

第9章 市場分析·預測:各地區

  • 簡介
  • 北美
    • 美國
    • 加拿大
    • 墨西哥
    • 巴西
    • 其他
  • 歐洲
    • 英國
    • 德國
    • 俄羅斯
    • 法國
    • 其他
  • 亞太地區
    • 中國
    • 日本
    • 澳洲
    • 印度
    • 其他
  • 其他地區
    • 中東
    • 非洲

第10章 市場熵

  • 新產品的開發
  • M&A·聯盟·JV·合作

第11章 企業簡介

  • Qualcomm, Inc.
  • Texas Instruments, Inc.
  • TriQuint Semiconductor, Inc.
  • Samsung Electronics Co., Ltd.
  • R2 Semiconductor, Inc.
  • Analog Devices, Inc.
  • Maxim Integrated
  • Linear Technology Corporation
  • Efficient Power Conversion Corporation
  • Artesyn Embedded Technologies

第12章 附錄

目錄
Product Code: ESR 0513

Envelope tracking is a power management technology for RF based device that assists in improving energy efficiency, enhancing battery life and minimizing power consumption. Globally demand for envelope tracking chips is being driven by growing demand for high end smartphones and tablet PCs and rising growth rate in the wireless platform market. In addition, hefty investments in power management technologies will create greater opportunities for the envelope tracking chips market. However, high band width requirement and complex architecture for designing ET module are key challenges faced by market.

The global envelope tracking chips market has been analyzed with respect to different parameters such as demand, supply and end-users. ET chip market based on technology is classified into cellular communications, wireless communications and satellite communications. The market is further classified based on application, end-user and by geography.

Envelope Tracking Chips Market

Geographically, Asia Pacific dominated the global envelope tracking chips market, and is projected to growth with significant growth rates during the forecast period, owing to high internet penetration, and rising demand for the consumer electronics products in this region. Wireless Communication is projected to grow at the highest rate in the ET chips market, among other technologies, owing to demand for ET to reduce the infrastructure involved in the communication. Owing to the rise in utilization of technologies such as Zigbee for compact and light application devices, the ET chips incorporation is estimated to rise. Among all the end-user the market for healthcare is estimated to have highest growth, owing to huge adoption of IoT and connected devices in medical technology and incorporation of ET chips into these devices to reduce power consumption and thereby, enhancing efficiency.

ET chips market is dominated by five companies, namely:

Qualcomm (U.S)

Samsung (South Korea)

RFMD (U.S)

Texas Instruments (U.S)

Efficient Power Conversion (U.S),

All of the above-mentioned companies combined to hold a majority of the market share in 2015. These companies have significant presence in the envelope tracking chips market with wide service offerings and considerable brand image.

Sample companies profiled in this report are:

Qorvo, Inc. (U.S),

Maxim Integrated Products Inc (U.S),

Analog Devices, Inc (U.S),

10+.

1. Envelope Tracking Chips Market - Overview

  • 1.1. Definitions and Scope

2. Envelope Tracking Chips Market - Executive summary

  • 2.1. Market Revenue, Market Size and Key Trends by Company
  • 2.2. Key Trends by type of Application
  • 2.3. Key Trends segmented by Geography

3. Envelope Tracking Chips Market

  • 3.1. Comparative analysis
    • 3.1.1. Product Benchmarking - Top 10 companies
    • 3.1.2. Top 5 Financials Analysis
    • 3.1.3. Market Value split by Top 10 companies
    • 3.1.4. Patent Analysis - Top 10 companies
    • 3.1.5. Pricing Analysis

4. Envelope Tracking Chips Market Forces

  • 4.1. Drivers
  • 4.2. Constraints
  • 4.3. Challenges
  • 4.4. Porters five force model
    • 4.4.1. Bargaining power of suppliers
    • 4.4.2. Bargaining powers of customers
    • 4.4.3. Threat of new entrants
    • 4.4.4. Rivalry among existing players
    • 4.4.5. Threat of substitutes

5. Envelope Tracking Chips Market - Strategic analysis

  • 5.1. Value chain analysis
  • 5.2. Opportunities analysis
  • 5.3. Product life cycle
  • 5.4. Suppliers and distributors Market Share

6. Envelope Tracking Chips Market - By Technology (Market Size -$Million / $Billion)

  • 6.1. Market Size and Market Share Analysis
  • 6.2. Application Revenue and Trend Research
  • 6.3. Product Segment Analysis
    • 6.3.1. Introduction
    • 6.3.2. Cellular Communications
      • 6.3.2.1. 4G/ LTE
      • 6.3.2.2. 3G/ WCDMA
      • 6.3.2.3. Others
    • 6.3.3. Wireless Communications
      • 6.3.3.1. Zigbee
      • 6.3.3.2. Bluetooth
      • 6.3.3.3. Others
    • 6.3.4. Satellite Communication

7. Envelope Tracking Chips Market - By Applications (Market Size -$Million / $Billion)

  • 7.1. Introduction
  • 7.2. Smart Phones
  • 7.3. Base Stations
  • 7.4. IoT Devices (M2M)
  • 7.5. Tactical Radios
  • 7.6. Wearable Devices
  • 7.7. Connected Home Devices
  • 7.8. Tablets
  • 7.9. GPS Tracking Devices (Personal, Defense, Marine)
  • 7.10. Others
    • 7.10.1. Wireless Network Enabled Surveillance System (WNESS)
    • 7.10.2. Feature phones

8. Envelope Tracking Chips - By End Use Industry(Market Size -$Million / $Billion)

  • 8.1. Segment type Size and Market Share Analysis
  • 8.2. Application Revenue and Trends by type of Application
  • 8.3. Application Segment Analysis by Type
    • 8.3.1. Introduction
    • 8.3.2. Consumer Electronics
    • 8.3.3. Space, Avionics & Defence
    • 8.3.4. Communications and Telecom
    • 8.3.5. Automotive
    • 8.3.6. Healthcare
    • 8.3.7. Others

9. Envelope Tracking Chips - By Geography (Market Size -$Million / $Billion)

  • 9.1. Envelope Tracking Chips Market - North America Segment Research
  • 9.2. North America Market Research (Million / $Billion)
    • 9.2.1. Segment type Size and Market Size Analysis
    • 9.2.2. Revenue and Trends
    • 9.2.3. Application Revenue and Trends by type of Application
    • 9.2.4. Company Revenue and Product Analysis
    • 9.2.5. North America Product type and Application Market Size
      • 9.2.5.1. U.S.
      • 9.2.5.2. Canada
      • 9.2.5.3. Mexico
      • 9.2.5.4. Rest of North America
  • 9.3. Envelope Tracking Chips - South America Segment Research
  • 9.4. South America Market Research (Market Size -$Million / $Billion)
    • 9.4.1. Segment type Size and Market Size Analysis
    • 9.4.2. Revenue and Trends
    • 9.4.3. Application Revenue and Trends by type of Application
    • 9.4.4. Company Revenue and Product Analysis
    • 9.4.5. South America Product type and Application Market Size
      • 9.4.5.1. Brazil
      • 9.4.5.2. Venezuela
      • 9.4.5.3. Argentina
      • 9.4.5.4. Ecuador
      • 9.4.5.5. Peru
      • 9.4.5.6. Colombia
      • 9.4.5.7. Costa Rica
      • 9.4.5.8. Rest of South America
  • 9.5. Envelope Tracking Chips - Europe Segment Research
  • 9.6. Europe Market Research (Market Size -$Million / $Billion)
    • 9.6.1. Segment type Size and Market Size Analysis
    • 9.6.2. Revenue and Trends
    • 9.6.3. Application Revenue and Trends by type of Application
    • 9.6.4. Company Revenue and Product Analysis
    • 9.6.5. Europe Segment Product type and Application Market Size
      • 9.6.5.1. U.K
      • 9.6.5.2. Germany
      • 9.6.5.3. Italy
      • 9.6.5.4. France
      • 9.6.5.5. Netherlands
      • 9.6.5.6. Belgium
      • 9.6.5.7. Spain
      • 9.6.5.8. Denmark
      • 9.6.5.9. Rest of Europe
  • 9.7. Envelope Tracking Chips - APAC Segment Research
  • 9.8. APAC Market Research (Market Size -$Million / $Billion)
    • 9.8.1. Segment type Size and Market Size Analysis
    • 9.8.2. Revenue and Trends
    • 9.8.3. Application Revenue and Trends by type of Application
    • 9.8.4. Company Revenue and Product Analysis
    • 9.8.5. APAC Segment - Product type and Application Market Size
      • 9.8.5.1. China
      • 9.8.5.2. Australia
      • 9.8.5.3. Japan
      • 9.8.5.4. South Korea
      • 9.8.5.5. India
      • 9.8.5.6. Taiwan
      • 9.8.5.7. Malaysia

10. Envelope Tracking Chips Market - Entropy

  • 10.1. New product launches
  • 10.2. M&A's, collaborations, JVs and partnerships

11. Envelope Tracking Chips Market Company Analysis

  • 11.1. Market Share, Company Revenue, Products, M&A, Developments
  • 11.2. Qualcomm (U.S)
  • 11.3. Samsung (South Korea)
  • 11.4. RFMD (U.S)
  • 11.5. Texas Instruments (U.S)
  • 11.6. Efficient Power Conversion (U.S)
  • 11.7. Company 6
  • 11.8. Company 7
  • 11.9. Company 8
  • 11.10. Company 9
  • 11.11. Company 10 and More

"*Financials would be provided on a best efforts basis for private companies"

12. Envelope Tracking Chips Market - Appendix

  • 12.1. Abbreviations
  • 12.2. Sources

13. Envelope Tracking Chips Market - Methodology

  • 13.1. Research Methodology
    • 13.1.1. Company Expert Interviews
    • 13.1.2. Industry Databases
    • 13.1.3. Associations
    • 13.1.4. Company News
    • 13.1.5. Company Annual Reports
    • 13.1.6. Application Trends
    • 13.1.7. New Products and Product database
    • 13.1.8. Company Transcripts
    • 13.1.9. R&D Trends
    • 13.1.10. Key Opinion Leaders Interviews
    • 13.1.11. Supply and Demand Trends