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市場調查報告書

導熱性材料 (TIM)的全球市場:潤滑脂(黃油),黏劑,膠帶,薄膜,間隙填料,金屬基TIM,相變材料

Thermal Interface Materials Market: By Type (Greases & adhesives, Tapes & Films, Gap Fillers, Metal-Based TIMs and Phase Change Materials); By Application (Computers, Telecom, Medical Devices, Others) & By Region - Forecast (2016-2021)

出版商 IndustryARC 商品編碼 422609
出版日期 內容資訊 英文 142 Pages
商品交期: 最快1-2個工作天內
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導熱性材料 (TIM)的全球市場:潤滑脂(黃油),黏劑,膠帶,薄膜,間隙填料,金屬基TIM,相變材料 Thermal Interface Materials Market: By Type (Greases & adhesives, Tapes & Films, Gap Fillers, Metal-Based TIMs and Phase Change Materials); By Application (Computers, Telecom, Medical Devices, Others) & By Region - Forecast (2016-2021)
出版日期: 2017年09月25日 內容資訊: 英文 142 Pages
簡介

本報告提供導熱性材料 (TIM)的全球市場調查,提供您市場結構和主要的促進·阻礙因素及市場機會·課題驗證,種類,用途,各地區的詳細市場趨勢與市場預測,並彙整市場熵和主要企業的簡介等資訊。

第1章 導熱性材料 (TIM)的全球市場概要

第2章 摘要整理

第3章 導熱性材料 (TIM)的全球市場情勢

  • 市場佔有率分析
  • 比較分析
  • 產品基準
  • 終端用戶簡介
  • 前五名公司的財務分析

第4章 市場動態

  • 市場推動因素
    • 電子設備小型化的需求
    • LED (發光半導體) 市場成長
  • 市場阻礙因素
  • 市場機會
  • 市場課題
  • 波特的五力分析

第5章 策略分析

  • 價值鏈分析
  • 價格分析
  • 市場機會分析
  • 產品/市場生命週期分析
  • 供給·流通

第6章 導熱性材料 (TIM)的全球市場:各類型

  • 潤滑脂(黃油)·黏劑
  • 膠帶·薄膜
  • 間隙填料
  • 金屬基導熱性材料 (TIM)
  • 相變材料 (PCM)

第7章 導熱性材料 (TIM)的全球市場:各用途

  • 電腦
  • 通訊
  • 醫療設備
  • 汽車
  • 電子設備
  • 其他

第8章 導熱性材料 (TIM)的全球市場:各地區

  • 歐洲
  • 亞太地區
  • 北美
  • 其他地區

第9章 導熱性材料 (TIM)的全球市場:熵

  • 市場擴大
  • 技術的進步
  • 合併,收購,合資企業
  • 供給契約

第10章 企業簡介

第11章 附錄

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目錄

Thermal interface materials, also shortened as TIMs, consist of any material which is inserted between two parts in order to enhance the thermal coupling between these two components. Majority of those applications are related to the heat dissipation and the TIMs are inserted between the heat producing device (heat source) and the heat dissipation device (heat sink). Globally increasing demand for the smaller and portable electronic devices is expected to remain as one of the major growth factor for the thermal interface materials during the period of study.

Geographically, Asia-Pacific dominates the thermal interface materials market driven by higher applications into wide range of applications into huge industrial base in the region. Asia-Pacific was followed by North America and Europe as second and third largest markets for the thermal interface materials market. Asia Pacific is projected to have the fastest growth, owing to rapidly increasing applications into large and expanding industrial base in the region, especially in developing nations such as China and India in this region.

This report identifies the global thermal interface materials market size in for the year 2014-2016, and forecast of the same for year 2021. It also highlights the market drivers, restraints, growth indicators, challenges, and other key aspects with respect to the thermal interface materials market.

This report segments the thermal interface materials market on the basis of type, application and regional market as follows:

Thermal Interface Materials Market research report is classified on the basis of types. Some of the major types covered in this report are as follows: Greases & adhesives, Tapes & Films, Gap Fillers, Metal-Based TIMs, and Phase Change Materials

Thermal Interface Materials Market research report is classified on the basis of applications. Some of the major applications covered in this report are as follows: Computers, Telecom, Medical Devices, Automotive, Electronics and Others

This report has been further segmented into major regions, which includes detailed analysis of each region such as: North America, Europe, Asia-Pacific (APAC), and Rest of the World (RoW) covering all the major country level markets in each of the region

This report identifies all the major companies operating in the thermal interface materials market. Some of the major companies' profiles in detail are as follows:

3M Company

Henkel AG & Co. KGAA

Parker Hannifin Corporation

DOW Corning Corporation

Laird Technologies, Inc.

1. Thermal Interface Materials Market - Overview

2. Executive Summary

3. Thermal Interface Materials Market Landscape

  • 3.1. Market Share Analysis
  • 3.2. Comparative Analysis
  • 3.3. Product Benchmarking
  • 3.4. End User Profiling
  • 3.5. Top 5 Financials Analysis

4. Thermal Interface Materials Market- Forces

  • 4.1. Drivers
    • 4.1.1. Increasing Demand for Miniaturization of Electronic Devices
    • 4.1.2. Growing LED Market to Drive the Demand for Thermal Interface Materials
  • 4.2. Restraints
  • 4.3. Opportunities
  • 4.4. Challenges
  • 4.5. Porter's Five Forces Analysis
    • 4.5.1. Bargaining Power of Suppliers
    • 4.5.2. Bargaining Power of Buyers
    • 4.5.3. Threat of New Entrants
    • 4.5.4. Threat of Substitutes
    • 4.5.5. Degree of Competition

5. Thermal Interface Materials Market- Strategic Analysis

  • 5.1. Value Chain Analysis
  • 5.2. Pricing Analysis
  • 5.3. Opportunities Analysis
  • 5.4. Product/Market Life Cycle Analysis
  • 5.5. Suppliers and Distributors

6. Thermal Interface Materials Market, By Type

  • 6.1. Greases & adhesives
  • 6.2. Tapes & Films
  • 6.3. Gap Fillers
  • 6.4. Metal-Based TIMs
  • 6.5. Phase Change Materials
  • 6.6. Others

7. Thermal Interface Materials Market, By Application

  • 7.1. Computers
  • 7.2. Telecom
  • 7.3. Medical Devices
  • 7.4. Automotive
  • 7.5. Electronics
  • 7.6. Others

8. Thermal Interface Materials Market, By Geography

  • 8.1. Europe
    • 8.1.1. Germany
    • 8.1.2. France
    • 8.1.3. Italy
    • 8.1.4. Spain
    • 8.1.5. Russia
    • 8.1.6. U.K.
    • 8.1.7. Rest of Europe
  • 8.2. Asia Pacific
    • 8.2.1. China
    • 8.2.2. India
    • 8.2.3. Japan
    • 8.2.4. South Korea
    • 8.2.5. Rest of Asia-Pacific
  • 8.3. North America
    • 8.3.1. U.S.
    • 8.3.2. Canada
    • 8.3.3. Mexico
  • 8.4. Rest of the World (RoW)
    • 8.4.1. Brazil
    • 8.4.2. Rest of RoW

9. Thermal Interface Materials Market - Entropy

  • 9.1. Expansion
  • 9.2. Technological Developments
  • 9.3. Merger & Acquisitions, and Joint Ventures
  • 9.4. Supply- Contract

10. Company Profiles (Overview, Financials, SWOT Analysis, Developments, Product Portfolio)

  • 10.1. 3M Company
  • 10.2. Henkel AG & Co. KGAA
  • 10.3. Parker Hannifin Corporation
  • 10.4. DOW Corning Corporation
  • 10.5. Laird Technologies, Inc.
  • 10.6. Momentive Performance Materials Inc.
  • 10.7. The Bergquist Company, Inc.
  • 10.8. Indium Corporation
  • 10.9. Wakefield-Vette, Inc.
  • 10.10. Zalman Tech Co., Ltd.

More than 40 Companies are profiled in this Research Report, Complete List available on Request*

"*Financials would be provided on a best efforts basis for private companies"

11. Appendix

  • 11.1. Abbreviations
  • 11.2. Sources
  • 11.3. Research Methodology
  • 11.4. Bibliography
  • 11.5. Compilation of Expert Insights
  • 11.6. Disclaimer
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