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市場調查報告書

濺鍍用靶材及汽化材料的全球市場 - 濺鍍法 (直流濺鍍,反應性濺鍍,射頻濺鍍),沉澱法 (熱沉澱,真空蒸發),各類型材料,各用途的預測:2015-2020年

Sputtering Targets & Evaporation Materials Market: By Sputtering Method (DC, Reactive, RF, Others); By Evaporation Method (Thermal, Vacuum, Others); By Material (Pure Metals, Alloys, Compounds); By Application and By Geography - (2014-2020)

出版商 IndustryARC 商品編碼 351168
出版日期 內容資訊 英文 203 Pages
商品交期: 最快1-2個工作天內
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濺鍍用靶材及汽化材料的全球市場 - 濺鍍法 (直流濺鍍,反應性濺鍍,射頻濺鍍),沉澱法 (熱沉澱,真空蒸發),各類型材料,各用途的預測:2015-2020年 Sputtering Targets & Evaporation Materials Market: By Sputtering Method (DC, Reactive, RF, Others); By Evaporation Method (Thermal, Vacuum, Others); By Material (Pure Metals, Alloys, Compounds); By Application and By Geography - (2014-2020)
出版日期: 2017年10月17日 內容資訊: 英文 203 Pages
簡介

濺鍍用靶材及汽化材料 (ST&EM) 是以各種方法在基材上形成薄膜層所用的技術。濺鍍·沉澱法是用於商業·科學研究等目的的物理性氣相成長法 (PVD) 的一種,其形成品廣泛用於半導體部件,顯示器,感測器,數據存儲設備,光伏發電電池單元,電池,工業工具,光學,汽車鏡子,裝飾品及其它上。由於其在多元化最終利用產業上用途之重要性,讓市場擁有成長基調,2014年全球整體收益為28億2060萬美元。預測今後連續數年將展現出2.2%的年複合成長率,到2020年達到32億2670萬美元的規模。

本報告以濺鍍用靶材及汽化材料的全球市場為焦點,依濺鍍法,沉澱法,各類型材料,用途及地區別預測2015-2020年這段期間之轉變,再彙整發展的推動要素與課題,產業趨勢,競爭環境等相關之分析資訊。

第1章 濺鍍用靶材及汽化材料的全球市場 - 概要

第2章 摘要整理

第3章 濺鍍用靶材及汽化材料的全球市場 - 市場環境

  • 市場佔有率分析
  • 比較分析
    • 產品基準
    • 終端用戶分析
    • 專利分析
    • 前五名公司財務分析

第4章 濺鍍用靶材及汽化材料的全球市場 - 市場趨勢

  • 市場推動要素
  • 阻礙市場要素
  • 市場課題
  • 濺鍍用靶材及汽化材料產業的向心力
    • 供給者的力量
    • 客戶的力量
    • 新加入廠商者的威脅
    • 替代品·技術的威脅
    • 競爭度

第5章 濺鍍用靶材及汽化材料的全球市場 - 策略性分析

  • 價值鏈分析
  • 價格分析
  • 機會分析
  • 產品生命週期分析
  • 供給企業和流通企業

第6章 濺鍍用靶材及汽化材料的全球市場 - 濺鍍法別

  • 簡介
  • 直流 (DC) 濺鍍
  • 反應性濺鍍
  • 射頻 (RF) 濺鍍
  • 6.1。 介紹濺鍍
  • 磁控管濺鍍
  • 氣體流量濺鍍

第7章 濺鍍用靶材及汽化材料的全球市場 - 沉澱法別

  • 簡介
  • 熱沉澱
  • 電子束沉澱
  • 真空蒸發
  • 反應性沉澱

第8章 濺鍍用靶材及汽化材料的全球市場 - 各材料類型

  • 簡介
  • 純金屬
  • 元素半導體
  • 合金
  • 化合物 (氧化物,氮化物,硫化物,炭化物)

第9章 濺鍍用靶材及汽化材料的全球市場 - 各用途

  • 電子
    • 磁資料儲存
    • 顯示器
    • 半導體
    • 感測器
  • 工業
    • 耐摩耗材
    • 耐蝕材
    • 耐熱材料
  • 能源
    • 光伏發電電池單元
    • 太陽熱能吸收設備
    • 電池
  • 光學
    • 顯微鏡
    • 相機鏡頭
    • 汽車鏡子
  • 其他

第10章 濺鍍用靶材及汽化材料的全球市場 - 各地區

  • 簡介
  • 北美
    • 美國
    • 加拿大
    • 其他
  • 歐洲
    • 英國
    • 德國
    • 法國
    • 瑞士
    • 其他
  • 亞太地區
    • 中國
    • 日本
    • 印度
    • 澳洲
    • 其他
  • 其他地區
    • 南非
    • 中東·非洲

第11章 市場熵

  • 新產品銷售
  • M&A,企業間合作,聯盟關係,合資企業

第12章 企業簡介

  • Heraeus Holding
  • Umicore AG&Co.
  • 日立金屬株式會社
  • Treibacher Industrie AG
  • KAMIS Inc
  • The Kurt J.Leskar Company
  • AJA International Inc
  • ACI alloys Inc
  • Soleras Advanced Coatings
  • Evochem Advanced Materials
  • American Elements
  • ULVAC GmbH
  • ADVANTIV Technologies Inc
  • SCI Engineered Materials
  • Able Target Limited
  • International Advanced Materials
  • Oerlikon balzers
  • Plasmaterials Inc
  • Leadmat Advanced Materials Co., Ltd
  • 株式會社Huruya金屬

第13章 附錄

  • 簡稱集
  • 出處 (資訊來源)
  • 調查方法
  • 經歷資訊
  • 專家考察集
  • 免責聲明
目錄

Sputtering targets and evaporation materials (ST&EM) are target materials which are used to deposit thin film or layer on desired substrate by employing various methods. Basically, sputtering and evaporation are variants of physical vapor deposition (PVD) processes which are used for various commercial and scientific purposes. Sputtering targets and evaporation materials have wide range of applications in semiconductor components, displays, sensors, data storage devices, photovoltaic cells, batteries, industrial tools, optics, automobile mirrors, decorative and many more. Owing to their significant applications in diverse end user industries, sputtering targets and evaporation materials market is set to grow at a considerable pace in the coming years. As per IndustryARC analysis, for the period of 2015 until 2020, the global sputtering targets and evaporation materials market is estimated to grow at a CAGR of 2.2% to reach $3.2 billion.

This market has been segmented into methods of sputtering and evaporation, materials used as targets, application sectors and geography. The geography segmentation includes North America, Europe, APAC and RoW and market revenue is provided with respect to each region. Additionally, detailed qualitative and quantitative analysis of the factors responsible for driving and restraining growth of the ST&EM market along with future opportunities have been analyzed in the market forces chapter.

This report also includes profiles of the major companies such as:

Heraeus Holding,

Umicore Thin Film Products,

Hitachi Metals,

KAMIS Inc.,

The Kurt J.Leskar Company,

ULVAC GmbH and many more.

The global ST&EM market is set to experience considerable growth in the coming years, due to constant demand from dedicated end user sectors, especially electronics, energy, industrial, optical and others. APAC region is the major shareholder with more than 45% share in the global ST&EM market, due to the presence of numerous targets and materials providers and end user sectors. In the global ST&EM market, North America held the second major share followed by Europe and RoW. Overall, this market will find steady demand from dedicated end used industries.

1. Global Sputtering Targets and Evaporation Materials Market Overview

2. Executive Summary

3. Global Sputtering Targets and Evaporation Materials Market Landscape

  • 3.1. Market share Analysis
  • 3.2. Comparative Analysis
    • 3.2.1. Product Benchmarking
    • 3.2.2. End-User Profiling
    • 3.2.3. Patent Analysis
    • 3.2.4. Top 5 Financial Analysis

4. Global Sputtering Targets and Evaporation Materials - Market Forces

  • 4.1. Market Drivers
  • 4.2. Market Constraints
  • 4.3. Market Challenges
  • 4.4. Attractiveness of the Sputtering Targets and Evaporation Materials Industry
    • 4.4.1. Power of Suppliers
    • 4.4.2. Power of Customers
    • 4.4.3. Threat of New entrants
    • 4.4.4. Threat of Substitution
    • 4.4.5. Degree of Competition

5. Global Sputtering Targets and Evaporation Materials Market - Strategic Analysis

  • 5.1. Value Chain Analysis
  • 5.2. Pricing Analysis
  • 5.3. Opportunity Analysis
  • 5.4. Product Life Cycle Analysis
  • 5.5. Suppliers & Distributors

6. Global Sputtering Targets and Evaporation Materials Market - By Sputtering Method

  • 6.1. Introduction
  • 6.2. DC sputtering
  • 6.3. Reactive sputtering
  • 6.4. RF sputtering
  • 6.5. Ion assisted sputtering
  • 6.6. Magnetron sputtering
  • 6.7. Gas flow sputtering

7. Global Sputtering Targets and Evaporation Materials Market - By Evaporation Method

  • 7.1. Introduction
  • 7.2. Thermal evaporation
  • 7.3. Electron-beam evaporation
  • 7.4. Vacuum evaporation
  • 7.5. Reactive evaporation

8. Global Sputtering Targets and Evaporation Materials Market - By Material Type

  • 8.1. Introduction
  • 8.2. Pure metals
  • 8.3. Elemental semiconductors
  • 8.4. Alloys
  • 8.5. Compounds (oxides, nitrides, sulphides and carbides)

9. Global Sputtering Targets and Evaporation Materials Market - By Application

  • 9.1. Electronics
    • 9.1.1. Magnetic data storage
    • 9.1.2. Displays
    • 9.1.3. Semiconductors
    • 9.1.4. Sensors
  • 9.2. Industrial
    • 9.2.1. Wear Resistant
    • 9.2.2. Corrosion Resistant
    • 9.2.3. Heat Resistant
  • 9.3. Energy
    • 9.3.1. Photovoltaic cells
    • 9.3.2. Solar thermal collectors
    • 9.3.3. Batteries
  • 9.4. Optics
    • 9.4.1. Microscopes
    • 9.4.2. Camera lenses
    • 9.4.3. Automobile mirrors
  • 9.5. Others

10. Global Sputtering Targets and Evaporation Materials Market - By Geography

  • 10.1. Introduction
  • 10.2. North America
    • 10.2.1. U.S.
    • 10.2.2. Canada
    • 10.2.3. Others
  • 10.3. Europe
    • 10.3.1. U.K.
    • 10.3.2. Germany
    • 10.3.3. France
    • 10.3.4. Switzerland
    • 10.3.5. Others
  • 10.4. APAC
    • 10.4.1. China
    • 10.4.2. Japan
    • 10.4.3. India
    • 10.4.4. Australia
    • 10.4.5. Others
  • 10.5. RoW
    • 10.5.1. South America
    • 10.5.2. Middle East & Africa

11. Market Entropy

  • 11.1. New Product Launches
  • 11.2. M&As, Collaborations, Partnerships & JVs

12. Company Profiles

  • 12.1. Heraeus Holding
  • 12.2. Umicore AG&Co.
  • 12.3. Hitachi Metals
  • 12.4. Treibacher Industrie AG
  • 12.5. KAMIS Inc
  • 12.6. The Kurt J.Leskar Company
  • 12.7. AJA International Inc
  • 12.8. ACI alloys Inc
  • 12.9. Soleras Advanced Coatings
  • 12.10. Evochem Advanced Materials
  • 12.11. American Elements
  • 12.12. ULVAC GmbH
  • 12.13. ADVANTIV Technologies Inc
  • 12.14. SCI Engineered Materials
  • 12.15. Able Target Limited
  • 12.16. International Advanced Materials
  • 12.17. Oerlikon balzers
  • 12.18. Plasmaterials Inc
  • 12.19. Leadmat Advanced Materials Co., Ltd
  • 12.20. FURAYA Metals Co., Ltd

More than 40 Companies are profiled in this Research Report, Complete List available on Request*

"*Financials would be provided on a best efforts basis for private companies"

13. Appendix

  • 13.1. Abbreviations
  • 13.2. Sources
  • 13.3. Research Methodology
  • 13.4. Bibliography
  • 13.5. Compilation of Expert Insights
  • 13.6. Disclaimer
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