市場調查報告書

射頻市場上三大蜂窩基帶IC供應商的發展及其專利組合

Three Major Cellular Baseband IC Vendors' Development in the RF Market and Their Patent Portfolios

出版商 MIC - Market Intelligence & Consulting Institute 商品編碼 967612
出版日期 內容資訊 英文 19 Pages
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射頻市場上三大蜂窩基帶IC供應商的發展及其專利組合 Three Major Cellular Baseband IC Vendors' Development in the RF Market and Their Patent Portfolios
出版日期: 2020年09月18日內容資訊: 英文 19 Pages
簡介

RF(射頻)模塊是用於發送和接收無線電信號的主要組件。射頻模塊的專有設計和製造工藝創造了主導市場,但是許多主要的基帶處理器供應商正在進入射頻市場。

本報告調查並分析了RF市場上的三個主要蜂窩基帶IC供應商,高通,華為和三星的市場策略,並提供了有關最新趨勢和專利組合的系統信息。

目錄

第1章全球射頻市場的發展

  • 對傳統RF供應商的潛在威脅

第2章當前的射頻市場狀況和主要基帶IC供應商的發展

  • 市場發展和進入動機
    • 通過全面的通訊系統解決方案提高了銷量
    • 高級RF模塊化可擴展市場規模
    • 受國際政治迫使廠商擴大射頻市場
  • 主要基帶IC供應商的發展
    • 高通:儘早進入立足點
    • 華為:因美國禁令而專注於內部開發
    • 三星:從基站進入市場

第3章主要基帶IC供應商的專利組合

  • 三大供應商發佈的專利分配
    • 三星和華為的部署策略相似
    • 高通公司擁有多項PA專利,華為專注於高頻波導
    • 與高通和三星相比,華為擁有非常集中的專利組合

第4章MIC展望

附錄

  • 公司列表
目錄
Product Code: MCRPT20082501

An RF (Radio Frequency) module is a key component used to receive and transmit radio signals. The unique design and manufacturing processes of RF modules have resulted in an oligopolistic market. However, an increasing number of leading baseband processor vendors has made inroads into the RF market. This report analyzes the market strategies of the top three vendors: Qualcomm, Huawei, and Samsung and explores their recent developments and their patent portfolios.

Table of Contents

1.Development of the Global RF Market

  • 1.2 Potential Threats to Traditional RF Vendors

2.Current RF Market Status and Leading Baseband IC Vendors’ Development

  • 2.1 Market Development and Entry Motivation
    • 2.1.1 Increase Sales with a Comprehensive Communications System Solutions
    • 2.1.2 High Levels of RF Modularity to Enlarge Market Size
    • 2.1.3 International Politics Forces Vendors to Expand Reach to the RF Market
  • 2.2 Development of Leading Baseband IC Vendors
    • 2.2.1 Qualcomm: Gains a Foothold with Early Entry
    • 2.2.2 Huawei: US Ban Forces the Company to Focus on In-house Development
    • 2.2.3 Samsung: Cuts into the Market from Base Stations

3.Leading Baseband IC Vendors’ Patent Portfolios

  • 3.1 Distribution of Patents Published by Top Three Vendors
    • 3.1.1 Samsung and Huawei Have Similar Deployment Strategies
    • 3.1.2 Qualcomm Holds More PA Patents While Huawei Focuses on High-frequency Waveguide
    • 3.1.3 Huawei has Highly Concentrated Patent Portfolios Compared to Qualcomm and Samsung

4. MIC Perspective

Appendix

  • List of Companies

List of Tables

  • Table 1. Milestones of Qualcomm, Huawei, and Samsung in RF Front-end Solutions

List of Figures

  • Figure 1. III-V Compound Semiconductor Industry Chain
  • Figure 2. Division of Work across Wireless Communications System Industry Chain
  • Figure 3. Integration of Front-end Modules
  • Figure 4. Number of Patens Published by Qualcomm, Huawei, and Samsung between 2017 and 2019
  • Figure 5. Distribution of Patents Published by Qualcomm, Huawei, and Samsung by Class

List of Topics

  • Development of the global RF market and analyzes newcomers’ potential threats to traditional RF market
  • Three major baseband IC brands, Qualcomm, Huawei, and Samsung, and includes their development and motivation to expand reach to the RF market
  • Three major brands’ patent deployment strategies and includes their patent portfolios related to RF

Companies covered

  • Amkor
  • Apple
  • ASE
  • ASUS
  • AWSC
  • Broadcom
  • Chengdu HiWafer Technology
  • Cree Inc.
  • Dynax Semiconductor
  • Epcos
  • GCS Holding
  • Hisilicon
  • Huawei
  • II-VI Incorporated
  • IntelliEPI
  • IQE PLC
  • LG
  • LMOC
  • MediaTek
  • Mitsubishi
  • Motorola
  • Murata
  • NXP
  • Oppo
  • Qorvo
  • Qualcomm
  • RF360
  • RichWave
  • Samsung
  • Skyworks
  • SPIL
  • Sumitomo
  • TDK
  • Visual Photonics Epitaxy
  • Wavetek
  • Win Semiconductor
  • Xiamen Sanan IC