市場調查報告書

全球IC封裝與測試產業的發展趨勢展望 (2019年以後)

Development of the Global IC Packaging and Testing Industry, 2019 and Beyond

出版商 MIC - Market Intelligence & Consulting Institute 商品編碼 922704
出版日期 內容資訊 英文 30 Pages
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全球IC封裝與測試產業的發展趨勢展望 (2019年以後) Development of the Global IC Packaging and Testing Industry, 2019 and Beyond
出版日期: 2020年01月17日內容資訊: 英文 30 Pages
簡介

全球各國OSAT企業 (外包半導體組裝與測試) 企業 - 從事IC實裝/測試服務的企業 - 於2018年出貨額大幅成長。其背後原因包含記憶體產量的持續擴大、以及預測美中貿易戰導致關稅成長而進行的庫存補給和出貨額增加等。 2018年全球IC封裝與測試產業出貨額總計達294億6200萬美元,比2017年成長7.69%。

本報告研究全球IC封裝與測試產業與主要企業業績,並預測未來業績趨勢展望。

第1章 全球整體產業出貨額

  • 2018年穩定成長
    • OSAT企業市場占比:受貿易戰打擊
    • 全球OSAT市場於2019年減速,出貨額與2018年相似
  • 台灣IC封裝與測試產業:出貨額為全球第一,其次為中國
    • 前6名地位不變:前3名差距縮小
    • 台灣IC封裝與測試產業成長率:2018年超越全球平均創下8.4%的紀錄

第2章 全球領導OSAT企業趨勢

  • Amkor:保持穩定成長率、持續專注車用電子設備
  • JCET:持續透過企業併購綜效受益、推動高端市場占比
  • Tianshui Huatian Technology:2018年並未實現期望
  • Tongfu Microelectronics:受國際客戶支持維持高度成長

第3章 台灣領導OSAT企業趨勢

  • ASE:透過企業併購綜效受益,專注於SiP技術
    • 積極開發SiP技術協助降低客戶成本
  • PTI:擴張非記憶體業務努力實現產品差異化
  • CoF封裝成為主流,推動Chipbond與Chipmos收入成長

第4章 MIC觀點

附錄

  • 術語表
  • 企業一覽
目錄
Product Code: SCRPT20011701

Abstract

Worldwide OSAT (Outsourced Semiconductor Assembly and Test) companies who perform IC packaging and testing services registered significant shipment value growth in 2018, thanks to a continued increase in memory production and an advanced inventory replenishment in anticipation of potential tariff increases from the US-China trade war. Worldwide IC packaging and testing industry shipment value in 2018 totaled US$29.462 billion in 2018, up by 7.69% compared to 2017. This report reviews the performance of the worldwide IC packaging and testing industry in 2018 and analyzes its development in 2019 and beyond.

Table of Contents

1.Worldwide Industry Shipment Value

  • 1.1 Steady Growth in 2018
    • 1.1.1 OSAT Companies’ Market Share Struck by Trade War
    • 1.1.2 Worldwide OSAT Market Slows Down in 2019 with Shipment Value Similar to 2018
  • 1.2 Taiwan Ranked No.1 in 2018 IC Packaging and Testing Shipment Value, Followed by China
    • 1.2.1 Top Six OSAT Companies’ Spots Remain Unchanged While Gap between Top Three Narrowing
    • 1.2.2 Taiwanese IC packaging and testing industry Posts Higher-than-Global-Average Growth at 8.4% in 2018

2.Development of Leading International OSAT Companies

  • 2.1 Amkor Remain Steady Growth with Continued Focus on Automotive Electronics
  • 2.2 JCET’s M&A Continues to Deliver Synergy, Boosting High-end Packaging Share
  • 2.3 Tianshui Huatian Technology Did Not Live Up to Expectation in 201814
  • 2.4 Tongfu Microelectronics Maintains High Growth Fueled by International Customers

3. Development of Leading Taiwanese OSAT Companies

  • 3.1 ASE Benefits from M&A Synergy with Focus on SiP Technology
    • 3.1.1 ASE Aggressively Develops SiP to Help Customers Reduce Costs
  • 3.2 PTI Strives for Product Diversification by Expanding Non-Memory Business
  • 3.3 CoF Packaging Becomes Mainstream, Driving up Chipbond and Chipmos Revenues

4. MIC Perspective

Appendix

  • Glossary of Terms
  • List of Companies

List of Tables

  • Table 1 M&A of Leading OSAT Companies over Past Five Years
  • Table 2 ASE Revenues by Business Types
  • Table 3 Milestones of ASE-SPIL Merger
  • Table 4 PTI Revenue by Business Type

List of Figures

  • Figure 1 Worldwide IC Packaging and Testing Industry Shipment Value and Growth Rates, 2016-2019
  • Figure 2 World’s Top Ten OSAT Companies by Revenue in 2018
  • Figure 3 Taiwanese IC Packaging and Testing Industry Shipment Value and Growth Rates, 2016-2019

List of Topics

Development of the global IC packaging and testing industry and includes shipment value and year-on-year growth rate for the period 2016-2019

Analysis of leading OSAT (Outsourced Semiconductor Assembly and Test) companies, including Amkor, JCET, Tianshui Huatain Technology, Tongfu Microelectronics

Companies covered

AMD

Amkor

ASE

Asus

Chipbond

ChipMOS

FCI

Hisilicon

Hynix

J-Device

JCET

JSCK

KYEC

MediaTek

Nanium

NVidia

Panasonic

PTI

Qorvo

Qualcomm

Samsung

Sigurd

SJSemi

Skyworks

SMIC

SPIL

STATS ChipPAC

Tainshui Huatian Technology

Tera Probe

Tongu Microelectronics

TSI

Tsinghua Unigroup

TSMC

Unisem

UTAC

Winste

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