市場調查報告書

世界和台灣的IC設計產業:最新形勢與未來展望

Recap and Outlook for Global and Taiwanese IC Design Industries in 2019

出版商 MIC - Market Intelligence & Consulting Institute 商品編碼 699008
出版日期 內容資訊 英文 30 Pages
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世界和台灣的IC設計產業:最新形勢與未來展望 Recap and Outlook for Global and Taiwanese IC Design Industries in 2019
出版日期: 2019年10月14日內容資訊: 英文 30 Pages
簡介

2018年全球IC設計行業受到智慧型手機市場低迷和PC市場持續萎縮的嚴重影響。但是無晶圓廠IC設計行業仍通過開發新的應用領域取得了積極的增長,這些領域包括:大型和高分辨率面板,人工智能(AI),5G等。此外,中國的無晶圓廠IC設計公司也正在持續增長並進入新的發展階段。

本報告提供世界和台灣的積體電路 (IC) 設計產業相關分析,彙整全球整體及台灣國內的整體市場規模 (出貨量·市場收益額)的趨勢預測,及近來的產業主要動向,大供應商的市場排行榜 (前十大企業),中國的IC設計企業趨勢 (政府支援,企業合併·收購 (M&A) 及其他),IC設計產業的今後的市場機會·課題等資訊,為您概述為以下內容。

第1章 概要

  • 全球半導體市場趨勢
  • 全球IC設計產業趨勢
    • 全球市場的成長動向 (2018年)
  • 世界各地的無晶圓廠IC設計產業
    • 中國的IC設計產業:全球市場佔有率的持續性擴大
  • 主要的IC設計企業趨勢
  • 中國的無晶圓廠IC設計產業:出貨收益的持續增加

第2章 台灣的IC設計產業趨勢

  • 台灣的無晶圓廠IC設計產業的出貨收益
  • 產品組合分析
    • 電腦/通訊設備/家電用無晶圓廠IC
    • 通訊設備IC現在也是主流
  • 台灣的主要IC設計企業
  • IC設計產業趨勢
    • 面板控制器/TDDI用IC,主導智慧型手機的演進
    • 藉由新的產品·用途,開拓未來的市場機會

第3章 機會與課題

  • 美國和中國貿易糾紛的影響
    • 無晶圓廠IC設計:中國的重要投資領域
    • 中美貿易戰加速了中國半導體產業的本土化
    • 不確定性導致新產業重組
  • AI Edge Computing改變了IC設計行業的商業模式

第4章 MIC的見解

附錄

  • 用語一覽
  • 企業一覽

分析對象企業

  • AMD
  • Apple
  • Beijing Horizon Robotics Technology
  • Beijing ISSI
  • Beijing Smartchip Microelectronics
  • Broadcom
  • Cambrian
  • China Electronics Corporation
  • DeePhi Technology
  • Elite
  • GalaxyCore
  • Giga Solution
  • Global Unichip
  • Hikvision
  • Himax
  • HiSilicon
  • Huawei
  • Huiding Technology
  • Marvell
  • MediaTek
  • Nokia
  • Novatek Microelectronics
  • NVidia
  • OmniVision
  • OnePlus
  • Oppo
  • Phison
  • Qualcomm
  • Raydium
  • Realtek
  • Rockchip
  • Samsung
  • Silicon Motion
  • Sitronix
  • TSMC
  • Unisoc
  • Vivo
  • Xiaomi
  • Xilinx
  • Zhejiang Dahua
  • ZTE
  • ZTE Microelectronic

本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

目錄
Product Code: SCRPT19101401

Abstract

In 2018, the global IC design demand was affected by the slowdown of the smartphone market and seven consecutive years of declines in personal computers. Despite so, the global fabless IC design industry was still able to continue growth in 2018, driven mainly by the rise of emerging applications involved large-size high-resolution panels, AI (Artificial Intelligence), and 5G technology, which are shaping the industry trend from high computing efficiency toward high quality. In 2019, the continued demand for driver ICs and high-efficiency computing power is expected to slow the decline of the global fabless IC industry, ushering in a new development stage of China’s fabless IC design industry. This report recaps the fabless IC industry development in 2018 from global and Taiwan perspectives, and analyzes key trends in 2019 and beyond.

Table of Contents

1. Overview

  • 1.1 Global Semiconductor Market Development
  • 1.2 Development of the Global IC Design Industry
    • 1.2.1 Global Industry Value Witness Growth in 2018
  • 1.3 The Fabless IC Design Industry by Region
    • 1.3.1 Chinese IC Design Industry’s Global Share is Increasing Constantly
  • 1.4 Development of Major IC Design Companies
  • 1.5 Shipment Value of the Chinese Fabless IC Design Industry Continues to Grow

2.Taiwan IC Design Industry Development

  • 2.1 Shipment Value of the Taiwanese Fabless IC Design Industry
  • 2.2 Product Mix Analysis
    • 2.2.1 Fabless Ics for Computing, Communication, and Consumer Applications
    • 2.2.2 Communication Ics Remain Mainstream
  • 2.3 Major Taiwan IC Design Companies
  • 2.4 IC Design Industry Development
    • 2.4.1 Panel Driver and TDDI Ics to Lead the Evolution on Smartphones
    • 2.4.2 New Products and Applications to Drive Future Opportunity

3. Opportunities and Challenges

  • 3.1 Impact of the China-US Trade Fight
    • 3.1.1 Fabless IC Design is China’s Key Investment Focus
    • 3.1.2 US-China Trade War Speeding Up Localization of the Semiconductor Industry in China
    • 3.1.3 Uncertainties Lead to New Industry Reorganization
  • 3.2 AI Edge Computing Changing the IC Design Industry’s Business Model

4. MIC Perspective

Appendix

  • Glossary of Terms
  • List of Companies

List of Tables

  • Table 1 Global Top 10 IC Design Companies
  • Table 2 China’s Top 10 Fabless IC Design Companies
  • Table 3 Taiwan Top 10 IC Design Companies in 2018

List of Figures

  • Figure 1 Global Semiconductor Market Value, 2013-2019
  • Figure 2 Global IC Design Industry Shipment Value, 2013-2019
  • Figure 3 Global IC Design Industry Market Share by Production Base, 2015 - 2019
  • Figure 4 Shipment Value of the Taiwan Fabless IC Design Industry, 2013-2019
  • Figure 5 Taiwan IC Design Industry Shipment Share by Application
  • Figure 6 Taiwan IC Design Industry Shipment Share by Product Mix

List of Topics

Development of the global IC design industry, touching on market and industry value forecasts for 2019, shipment share by region, and latest trends

Current and future developments of leading global IC design houses, as well as the top 10 world rankings, including the top 10 in China and Taiwan

Development of Chinese IC design houses, touching on the government's incentives, and M&A deals in recent years

Opportunities and challenges facing the IC design industry

Companies covered

  • AMD
  • Apple
  • Beijing Horizon Robotics Technology
  • Beijing ISSI
  • Beijing Smartchip Microelectronics
  • Broadcom
  • Cambrian
  • China Electronics Corporation
  • DeePhi Technology
  • Elite
  • GalaxyCore
  • Giga Solution
  • Global Unichip
  • Hikvision
  • Himax
  • HiSilicon
  • Huawei
  • Huiding Technology
  • Marvell
  • MediaTek
  • Nokia
  • Novatek Microelectronics
  • NVidia
  • OmniVision
  • OnePlus
  • Oppo
  • Phison
  • Qualcomm
  • Raydium
  • Realtek
  • Rockchip
  • Samsung
  • Silicon Motion
  • Sitronix
  • TSMC
  • Unisoc
  • Vivo
  • Xiaomi
  • Xilinx
  • Zhejiang Dahua
  • ZTE
  • ZTE Microelectronic
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