Global Trends in SiP Technology Development
|出版商||MIC - Market Intelligence & Consulting Institute||商品編碼||353117|
|出版日期||內容資訊||英文 18 Pages
|SiP技術開發的全球趨勢 Global Trends in SiP Technology Development|
|出版日期: 2016年02月26日||內容資訊: 英文 18 Pages||
近幾年，隨著輕量行動裝置和穿戴式設備的需求逐漸增加，SiP (系統級封裝) 技術愈來愈受關心。
本報告提供全球SiP開發，3個方面 (技術開發，市場應用開發，產業趨勢) 的驗證之系統性資訊。
Under the global trends where electronic products are getting thinner, multi-functional and low power, the SiP (System in Package) technology has grabbed increasing attention, especially in recent years where the demand for lightweight mobile devices and wearables rises. With the IoT (Internet of Things) era approaching, multi-functional integration and low power consumption are considered essential when selecting an electronic product. Hence, SiP is playing an increasingly important role in the development of packaging technology. This report provides an in-depth analysis of global SiP development from three dimensions: technology development, market application development, and industry trends; examines how SiP shapes up and influences the semiconductor industry, particularly packaging and testing service providers, IC substrate manufacturers, and foundries.
Amkor, Apple, ASE, ChipPAC, Inotera Memories, JCET, Kansu, Nan Ya PCB, SPIL, TAM, TDK, Unimicron, USI.