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全球3D IC市場與台灣的主要供應鏈企業

The Worldwide 3D IC Market and Major Supply Chain Players in Taiwan

出版商 MIC - Market Intelligence & Consulting Institute 商品編碼 345436
出版日期 內容資訊 英文 48 Pages
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全球3D IC市場與台灣的主要供應鏈企業 The Worldwide 3D IC Market and Major Supply Chain Players in Taiwan
出版日期: 2015年11月17日 內容資訊: 英文 48 Pages

3維IC (3D IC) ,具有高密度且功率損耗少、高性能這些優點。台灣由於半導體取向各產業領域供應鏈完善,適合3維堆疊技術產品的開發,半導體產業及技術路由的整合是有效的。

本報告提供全球3D IC市場相關調查分析、主要的應用與地區市場、主要零組件的台灣供應商相關的系統性資訊。

第1章 全球3D IC市場

  • 應用領域
    • 家用電器產品
    • ICT
    • 運輸 (汽車、航太)
    • 軍事
    • 其他
  • 地區市場
    • 北美
    • 歐洲
    • 亞太地區
    • 其他
  • 概要

第2章 主要3D IC零組件技術和台灣供應商的發展

  • 光刻
    • 技術概要
    • 供應鏈企業
  • 乾式蝕刻
    • 技術概要
    • 供應鏈企業
  • 濕式蝕刻/清潔
    • 技術概要
    • 供應鏈企業
  • 塗料
    • 技術概要
    • 供應鏈企業
  • 粘結
    • 技術概要
    • 供應鏈企業
  • 包裝、試驗
    • 技術概要
    • 供應鏈企業
  • 概要



  • 詞彙表
  • 企業清單
Product Code: SCRPT15111701

3D IC has the advantages of high density, low power loss and high performance; it utilizes three-dimensional stack architecture to meet the future demand for compact and slim electronic products, and continues Moore's Law of the semiconductor industry. As Taiwan possesses the complete vertical supply chain for semiconductors, the country is suitable for developing three-dimensional stacking technology products, and is helpful in the integration of the semiconductor industry and technology rooting. This report provides an overview of the worldwide 3D IC market, touching on major application and regional markets, and major vendors of 3D IC key components in Taiwan.

Table of Contents

1. Worldwide 3D IC Market

  • 1.1. Application Sectors
    • 1.1.1. Consumer Electronics
    • 1.1.2. ICT
    • 1.1.3. Transportation (Automobiles and Aerospace)
    • 1.1.4. Military
    • 1.1.5. Others (Biomedical applications and R&D)
  • 1.2. Regional Markets
    • 1.2.1. North America
    • 1.2.2. Europe
    • 1.2.3. Asia Pacific
    • 1.2.4. Rest of the World
  • 1.3. Summary of the Worldwide 3D IC Market

2. Development of Key 3D IC Component Technologies and Vendors in Taiwan

  • 2.1. Photolithography
    • 2.1.1. Overview of the Technology
    • 2.1.2. Supply Chain Players
  • 2.2. Dry Etching
    • 2.2.1. Overview of the Technology
    • 2.2.2. Supply Chain Players
  • 2.3. Wet Etching/Cleaning
    • 2.3.1. Overview of the Technology
    • 2.3.2. Supply Chain Players
  • 2.4. Coating
    • 2.4.1. Overview of the Technology
    • 2.4.2. Supply Chain Players
  • 2.5. Bonding
    • 2.5.1. Overview of the Technology
    • 2.5.2. Supply Chain Players
  • 2.6. Packaging and Testing
    • 2.6.1. Overview of the Technology
    • 2.6.2. Supply Chain Players
  • 2.7. Summary
  • Conclusion
  • Appendix
  • Glossary of Terms
  • List of Companies

List of Topics

  • Overview of the worldwide 3D IC market, touching on the major development trends and market value by application and by region
  • Profile of major Taiwanese 3D IC equipment vendors across the supply chain, including an overview of technology and vendors' deployment at various segments of the supply chain, such as photolithography, dry etching, wet etching, coating, bonding, packaging and testing

List of Figures

  • Figure 1: Worldwide 3D IC Market Value Contributed by Consumer Electronics Sector
  • Figure 2: Worldwide 3D IC Market Value Contributed by ICT Sector
  • Figure 3: Worldwide 3D IC Market Value Contributed by Transportation Sector
  • Figure 4: Worldwide 3D IC Market Value Contributed by Military Sector
  • Figure 5: Worldwide 3D IC Market Value Contributed by Other Sectors
  • Figure 6: Worldwide 3D IC Market in 2012 and 2019 by Application Market
  • Figure 7: Taiwanese 3D IC Equipment Supply Chain
  • Figure 8: Temporary Bonding
  • Figure 9: Laser De-bonding
  • Figure 10: Illustration of CoWoS

Companies covered

Ad-STAC, Air Liquide, Air Product, All Ring Technology, AMAT, Amkore, Apex International, Ares Green Technology, Asahi Pretec Taiwan, Asahi Shih Her Technologies, ASE, ASML, AST, AUO, BOC Edwards, Bosch, C Sun MFG, Camtek, Career Technology, ChangChun PetroChemical, Chemleader, Chilisin Electronics, Chin Poon Industrial, ChipMOS, Compeq Manufacturing, Cyantek, DNP, DNS, Domino Automation Technology, Dow Chemical, Dupont, Dynamic, ECIC, ELS System Technology, EMAX TECH, Epistar, Eternal Materials, Everlight Chemical, EVG, Feedpool Technology, First Hi-tec Enterprise, Founder Technology, Foxconn, Foxsemicon, GMT, Gold Circuit Electronics, Gongin Precision Industrial, GoWorld, GPM, GPTC, HannStar Board, Hermes Microvision, Hermes-Epitek, HiKE, Holtek, Honghow, Hua Jung, Hwasun Quartek, IBM, Innolux, Inotera Memories, INPAQ Technology, ITRI, IV Technologies, Junze, Kaijo, Kaylu Industrial, King Core, Kingyoup, Kinik Company, Kinsus Interconnect Technology, KYO, L&K Engineering, Lasertec, Lextar, Lite-On Technology, LPI, Machvision, Macronix, Marketech International Corp., Maxchip, MEIKO, Merk, Messier-Dowty, MiTAC, Mitsubishi, Mosel Vitelic, MTC, Nan Ya PCB, Nano-Architect Research Corporation, National Cheng Kung University, National Tsing Hua University, NEE, Nichia, Omron, Orbotech, Photronics, Powerchip, Prosys Technology Integration, PSMC, PTI, Rippy, S.E.S. Co. Ltd., Samsung Electro-Mechanics, Scientech, Screen, Shin Her Technology, Shinko, Shira, SHT, Shuz Tung, SMIC, Song Jaan Technology, Sonix, SPIL, Sumitomo, Sun Rise E&T, Sunplus, SUSS, T.N.E.T., Taiwan PCB Techvest, Taiwan Union Technology, TCE, TEL, Tengsen, Tesla Motors, TMC, Top Creation Machines, Toppan, Tripod Technology, TSMC, TSR (Tekstarter), UMC, Unimicron Technology, Unitech, United Integrated Services, UTECHZONE, VIS, VisEra, Walsin, Win Semiconductor, Winbond Electronics, Xintec, YAGEO, Yuhchang Electric, Yulon Group, Zhen Ding Tech.

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