全球TSV 3D IC產業的未來趨勢
Future Trends of the Worldwide TSV 3D IC Industry
|出版商||MIC - Market Intelligence & Consulting Institute||商品編碼||320893|
|出版日期||內容資訊||英文 16 Pages
|全球TSV 3D IC產業的未來趨勢 Future Trends of the Worldwide TSV 3D IC Industry|
|出版日期: 2014年12月11日||內容資訊: 英文 16 Pages||
Electronics devices are developing towards more compact form factors, more versatility, higher performance, and lower power consumption, driving IC packaging technologies towards SiP (System-in-Package) from single chip package. Among various SiP technologies, TSV 3D IC (Through-Silicon-Via) which vertically interconnects stacked dies using TSV technology has been considered the future packaging technology due to its high space efficiency and performance. Up to now, TSV 3D IC technology has only been applied to the integration of homogeneous chips, resulting in a low industrial value. However, the situation is about to change as some foreign vendors are projected to make technological progress. This report provides the overview development of TSV 3D IC from the aspects of technology, market, and industry.
Overview of the development of global packaging technology SiP (System-in-Package), in particular TSV (Through-Silicon-Via) 3D IC technology; four major production processes and existing challenges of TSV 3D IC in stacking, circuit, stress, heat dissipation, yield and cost are also covered.
Development of the TSV 3D IC market and industry, including the global industry value forecast up to 2017 and major players' development plan in 2015 and 2016; also provided are those players' mass production timetable for TSV 3D IC.
Overview of the deployment of TSV 3D IC industry alliances, covering upstream to downstream segments of fabless, foundry, memeory, packaging and IDM; also included are the position of US, UK, Korean, Singaporean, and Taiwanese players in the TSV 3D IC supply chain.
Altera, AMD, Amkor, ARM Holding, ASE Kaohsiung, GlobalFoundry, HMCC, Hynix, Inotera Memories, Micron, Samsung, STATS ChipPAC, STMicro, Toshiba, TSMC, UMC, Xilinx.