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The Future of eNVM: Application Markets, Market Forecasts and Major Trends

出版商 MIC - Market Intelligence & Consulting Institute 商品編碼 315363
出版日期 內容資訊 英文 16 Pages
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eNVM的未來:應用市場、市場預測以及主要趨勢 The Future of eNVM: Application Markets, Market Forecasts and Major Trends
出版日期: 2014年09月29日 內容資訊: 英文 16 Pages



第1章 eNVM應用市場的發展

  • 智慧穿戴式應用
  • 智慧網路應用

第2章 eNVM技術的發展

第3章 eNVM解決方案供應商的發展

第4章 eNVM面臨的潛在課題

第5章 結論

  • eNVM解決方案供應商間的競爭激烈
  • MTP解決方案的需求主要推動因素



Product Code: NARPT14092601

The rapid rise of smart handheld devices, smart wearables, and IoT (Internet of Things) has driven the need for chipsets that have high integration and low power consumption capabilities. In addition to SiP (System in Package) and SoC (System on Chip), the industry has been seeking other embedded memory technologies and eNVM (embedded Non-Volatile Memory) solutions in particular have been drawing significant attention. This report investigates the development of logic eNVM including OTP/MTP solutions, in smart wearables and IoT and examines its future potential thereof.

Table of Contents

1. Development of eNVM Application Markets

  • 1.1 Smart Wearable Applications
  • 1.2 Smart Network Applications

2. Development of eNVM Technology

3. Development of eNVM Solution Providers

4. Potential Challenges Facing eNVM

5. Conclusion

  • 5.1 Competition Heating Up Among All eNVM Solution Providers
  • 5.2 Demand for MTP Solutions to be Key Growth Driver


List of Topics

Development of eNVM technology and its application markets covering smart wearable devices and smart networks, known as IOT

Highlight of eNVM OTP and MTP technology solutions, touching on how much OTP and MTP differ in term of cell structure, erase format, storage volume, technology maturity, and reprehensive firms

Rankings of top-20 patent applicants filed for eNVM and includes the number of applications per individual applicant

Pros and cons of eNVM technology development in the future

List of Figures

  • Figure 1 Worldwide Smart Wearable Market Volume, 2013 - 2018
  • Figure 2 Market Volume of Smart Handheld Devices and IOT Devices in 2009 versus. 2020
  • Figure 3 Top 20 eNVM Patent Applicants, 1998 - 2013

List of Tables

  • Table 1 Comparison of NVM Technology Solutions
  • Table 2 Rankings of Top-20 eNVM Patent Applicants

Companies covered

  • Apple, Atmel, Broadcom, Cambridge Enterprise, Chingus, eMemory, Epson, ESMT, Etron, FlashSilicon, Freescale Semiconductor, GlobalFoundries, Headwater Partners, IBM, Identifi Technologies, Impinj, Infineon, Inotera, Intel, Kilopass, Koninkl Philips, Lattice Semiconductor, Macronix, Mag Instrument, Marvell Technology, Micron Technology, Microsoft, Monolithic, Monolithic System, MoSys, Motorola, Nanya, Novocell Semiconductor, NXP BV, Panasonic, Parker Hannifin, Philips, Phison Electronics, R828 LLC, Renesas, Samsung, SanDisk, SenCal LLC, Sidense, SMIC, Socket Mobile, Sony, Spansion, SST, STMicro, Synopsys, Texas Instruments, Tower Semiconductor, TSMC, UMC, Unity Semiconductor, Virage Logic, Winbond, Xilinx, YMC, Zilog
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