Taiwanese IC Packaging & Testing Industry, 2Q 2019
|出版商||MIC - Market Intelligence & Consulting Institute||商品編碼||291079|
|出版日期||內容資訊||英文 18 Pages
|台灣的IC封裝、檢驗產業 Taiwanese IC Packaging & Testing Industry, 2Q 2019|
|出版日期: 2019年06月21日||內容資訊: 英文 18 Pages||
本報告提供台灣的IC封裝產業及檢驗產業的趨勢相關分析，整體出貨收益變化 (以季度為基礎，) ，及供應商的規模 (各等級)、各出貨地 (各用戶)的詳細趨勢過去3年份，各供應商的出貨收益排行榜等資訊，為您概述為以下內容。
This report finds that shipment value of the Taiwanese IC packaging and testing industry arrived over USD 3.4 billion in the first quarter of 2019, down both year-on-year and sequentially. While the demand for smartphones is likely to persist, HPC (High Performance Computing) and AI applications are expected to be major growth drivers to bolster high-end wafer-level packaging service demand thus the industry is anticipated to have grown about 8% in 2018 compared to 2017. Amid the slowdown in shipment growth in the first quarter of 2019, the industry is anticipated to have seen a modest pickup in shipmentsin the second quarter of 2019.
This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry.
Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world.
The content of this report is based on primary data obtained from interviews, and publicly available information.