市場調查報告書

台灣的IC封裝、檢驗產業

Taiwanese IC Packaging & Testing Industry, 2Q 2019

出版商 MIC - Market Intelligence & Consulting Institute 商品編碼 291079
出版日期 內容資訊 英文 18 Pages
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台灣的IC封裝、檢驗產業 Taiwanese IC Packaging & Testing Industry, 2Q 2019
出版日期: 2019年06月21日內容資訊: 英文 18 Pages
簡介

本報告提供台灣的IC封裝產業及檢驗產業的趨勢相關分析,整體出貨收益變化 (以季度為基礎,) ,及供應商的規模 (各等級)、各出貨地 (各用戶)的詳細趨勢過去3年份,各供應商的出貨收益排行榜等資訊,為您概述為以下內容。

目錄

  • 台灣的IC封裝、檢驗產業的出貨收益:服務的各類型
  • 台灣的IC封裝產業的出貨收益
  • 台灣的IC檢驗產業的出貨收益
  • 台灣的IC封裝、檢驗產業的出貨收益
  • 台灣的IC封裝產業的出貨收益排行榜
  • 台灣的IC封裝產業的出貨收益:供應商的各規模
  • 台灣的IC檢驗產業的出貨收益排行榜
  • 台灣的IC檢驗產業的出貨收益:供應商的各規模
  • 台灣的IC封裝產業的出貨收益:各出貨地
  • 台灣的IC封裝產業的出貨收益佔有率:各出貨地
  • 台灣的IC檢驗產業的出貨收益:各出貨地
  • 台灣的IC檢驗產業的出貨收益佔有率:各出貨地
  • 匯率
  • 分析方法,定義

分析對象企業

  • Ardentec
  • ASE
  • Chipbond
  • ChipMOS
  • FATC
  • KYEC
  • OSE
  • PTI
  • Sigurd
  • SPIL
  • Walto

本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

目錄
Product Code: SCSTL19062001

Abstract

This report finds that shipment value of the Taiwanese IC packaging and testing industry arrived over USD 3.4 billion in the first quarter of 2019, down both year-on-year and sequentially. While the demand for smartphones is likely to persist, HPC (High Performance Computing) and AI applications are expected to be major growth drivers to bolster high-end wafer-level packaging service demand thus the industry is anticipated to have grown about 8% in 2018 compared to 2017. Amid the slowdown in shipment growth in the first quarter of 2019, the industry is anticipated to have seen a modest pickup in shipmentsin the second quarter of 2019.

Table of Contents

  • Taiwanese IC Packaging and Testing Industry Shipment Value, 2Q 2016 - 3Q 2019
  • Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 2Q 2016 - 3Q 2019
  • Taiwanese IC Packaging Industry Shipment Value , 2Q 2016 -3Q 2019
  • Taiwanese IC Testing Industry Shipment Value , 2Q 2016 - 3Q 2019
  • Taiwanese IC Packaging Industry Shipment Value Rankings, 2Q 2016 - 1Q 2019
  • Taiwanese IC Packaging Industry Shipment Value by Vendors' Tier, 2Q 2016 - 1Q 2019
  • Taiwanese IC Testing Industry’s Shipment Value Rankings, 2Q 2016 - 1Q 2019
  • Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 2Q 2016 - 1Q 2019
  • Taiwanese IC Packaging Industry Shipment Value by Customer Origin, 2Q 2016 - 1Q 2019
  • Taiwanese IC Packaging Industry Shipment Value Share by Customer Origin, 2Q 2016 - 1Q 2019
  • Taiwanese IC Testing Industry Shipment Value by Customers' Origin, 2Q 2016 - 1Q 2019
  • Taiwanese IC Testing Industry Shipment Value Share by Customers' Origin, 2Q 2016 - 1Q 2019
  • Exchange Rate, 2Q 2016 - 4Q 2018
  • Research Scope & Definitions

List of Topics

This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry.

Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world.

The content of this report is based on primary data obtained from interviews, and publicly available information.

Companies covered

  • Arima
  • Compal
  • Foxconn
  • HTC
  • IAC
  • Inventec
  • Pegatron
  • Qisda
  • Wistro
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