表紙
市場調查報告書

台灣的半導體製造業:最新趨勢(季報數據)

Taiwanese Semiconductor Manufacturing Industry, 4Q 2019

出版商 MIC - Market Intelligence & Consulting Institute 商品編碼 286405
出版日期 內容資訊 英文 23 Pages
訂單完成後即時交付
價格
台灣的半導體製造業:最新趨勢(季報數據) Taiwanese Semiconductor Manufacturing Industry, 4Q 2019
出版日期: 2020年01月17日內容資訊: 英文 23 Pages
簡介

台灣的半導體製造業,2014年第一季的出貨量約為81億7000萬美元,與前期比減少3.7%。可是預計第2季將為復甦基調。

本報告提供台灣的半導體製造業(IC晶圓代工廠、DRAM供應商、IDM(整合元件製造商))等最新趨勢相關分析、整體市場的出貨量、出貨收益(以季度為基礎)的調查,並將其結果依產品的種類和尺寸、企業形態等彙整,為您概述為以下內容。

目錄

  • 台灣的半導體製造業的出貨收益(過去2年半份)
  • 台灣的半導體製造業的出貨收益:企業的各類型(過去2年半份)
  • 半導體製造業的8英吋形式相當晶圓的出貨量與使用率(過去2年半份)
  • 晶圓出貨量:各尺寸(過去2年半份)
  • 12英吋形式晶圓的出貨量和使用率(過去2年份)
  • 12英吋形式晶圓的出貨量:供應商的各類型(過去2年份)
  • 8英吋形式以下的晶圓的出貨量和使用率(過去2年份)
  • 8英吋形式以下晶圓的出貨量:供應商的各類型(過去2年份)
  • 台灣的晶圓代工廠產業:出貨收益排行榜(過去2年份)
  • 晶圓代工廠產業的出貨收益:各加工技術(過去2年份)
  • 晶圓代工廠產業的出貨收益佔有率:各加工技術(過去2年份)
  • 台灣的DRAM產業:出貨收益排行榜(過去2年份)
  • DRAM產業的8英吋形式相當晶圓的出貨量與使用率(過去2年份)
  • DRAM產業的8英吋形式相當晶圓的出貨量佔有率:各加工技術(過去2年份)
  • 匯率(過去2年份)
  • 分析範圍、定義

本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

目錄
Product Code: SCSTL20011702

Abstract

The report finds that shipment value of the Taiwanese semiconductor manufacturing industry - comprising mainly of foundry, DRAM, flash memory, and IDM sectors - reached US$ 11.5 billion, growing 17.6% sequentially in the third quarter of 2019. The decline in the frist half of 2019 was mainly attributed to relatively high inventory levels. As the inventory levels have reached the optimal level and TSMC’s advanced processes have entered mass production, the industry’s shipment performance in the second half of 2019 is expected to witness year-on-year growth. The market demand is anticipated to regain momentum in the second half of 2020 thanks to the surging demand for 5G applications and 8K TVs.

Table of Contents

  • The report finds that shipment value of the Taiwanese IC packaging and testing industry arrived over USD 4.15 billion in the third first quarter of 2019, up 12.1% sequentially and 1.7% year-on-year. While the demand for smartphones is likely to persist, HPC (High Performance Computing) and AI applications are expected to be major growth drivers to bolster high-end wafer-level packaging service demand thus the industry is anticipated to continue on the growth trajectorTaiwanese Semiconductor Manufacturing Industry Shipment Value, 1Q 2017 - 1Q 2020
  • Taiwanese Semiconductor Manufacturing Industry Shipment Value by Business Type, 1Q 2017 - 1Q 2020
  • Taiwanese Semiconductor Manufacturing Industry 8"-equiv. Wafer Shipment Volume and Utilization Rate, 1Q 2017 - 1Q 2020
  • Taiwanese Semiconductor Manufacturing Industry Wafer Shipment Volume by Wafer Dimension, 1Q 2017 - 1Q 2020
  • Taiwanese Semiconductor Manufacturing Industry 12-inch Wafer Shipment Volume and Utilization Rate, 1Q 2017 - 3Q 2019
  • Taiwanese Semiconductor Manufacturing Industry 12-inch Wafer Shipment Volume by Vendor's Business Type, 1Q 2017 - 3Q 2019
  • Taiwanese Semiconductor Manufacturing Industry 8-inch and below Wafer Shipment Volume and Utilization Rate, 1Q 2017 - 3Q 2019
  • Taiwanese Semiconductor Manufacturing Industry 8-inch and below Wafer Shipment Volume by Business Type, 1Q 2017 - 3Q 2019
  • Taiwanese Foundry Industry’s Shipment Value Ranking, 1Q 2017 - 3Q 2019
  • Taiwanese Foundry Industry Shipment Value by Process Technology, 1Q 2017 - 3Q 2019
  • Taiwanese Foundry Industry Shipment Value Share by Process Technology, 1Q 2017 - 3Q 2019
  • Taiwanese DRAM Industry's Shipment Value Ranking, 1Q 2017 - 3Q 2019
  • Taiwanese DRAM Industry's 8"-equiv. Wafwer Shipment Volume by Process, 1Q 2017 - 3Q 2019
  • Taiwanese DRAM Industry's 8"-equiv. Wafer Shipment Volume Share by Process, 1Q 2017 - 3Q 2019
  • Exchange Rate, 1Q 2017 - 3Q 2019
  • Research Scope & Definitions

List of Topics

This research report presents shipment value forecast and recent quarter review of the Taiwanese semiconductor manufacturing industry.

Companies surveyed in this research are those owning facilities to make MOS (Metal Oxide Semiconductor) wafers in Taiwan, including foundries, DRAM (Dynamic Random Access Memory) makers, flash memory makers, and IDMs (Integrated Device Manufacturers).

The content of this report is based on primary data obtained from interviews and publicly available information.

Companies covered

Inotera

Nanya

Powerchip

TSMC

UMC

Winbon