市場調查報告書
商品編碼
1073181

全球半導體產業趨勢與晶圓代工廠能力的發展

Global Semiconductor Industry Trends and Foundry Capacity Deployment

出版日期: | 出版商: MIC - Market Intelligence & Consulting Institute | 英文 34 Pages | 訂單完成後即時交付

價格
  • 全貌
  • 簡介
  • 目錄
簡介

2022年半導體的供給持續窘迫,晶圓代工廠和OSAT的服務供應商致力於生產能力的擴大。預計2023年供不應求將緩和,不過,世界各國的政府認識半導體產業的策略性重要性,開始促進地方和地區的供應鏈整備。

本報告提供全球半導體產業的相關調查,市場及台灣的半導體輔助產業領域的發展,在地區的半導體供應鏈的發展,Samsung,TSMC,UMC等的晶圓代工廠,Samsung,Intel,Micron等的晶片廠商,Infineon,NXP,STMicro等類比/自動半導體供應商等發展的主要相關利益者的考察等資訊。

目錄

第1章 世界及台灣的半導體產業趨勢

第2章 地區的半導體供應鏈的開發

第3章 主要利害關係者的全球展開

第4章 結論

目錄
Product Code: SCSYM22041401

As the supply crunch of semiconductors continues in 2022, foundries and OSAT service providers are striving to expand production capacity. Although it is expected the shortage will be eased by 2023, governments around the world have acknowledged the strategic importance of semiconductor industry and have started to promote the development of local and regional supply chains. This report provides an overview of the development of the global semiconductor market and three Taiwanese three semiconductor sub-industry sectors; looks into the development of regional semiconductor supply chains and the deployment major stakeholders such as foundries like Samsung, TSMC, and UMC, chipmakers like Samsung, Intel, and Micron, and analog/auto semiconductor suppliers like Infineon, NXP, and STMicro.

Table of Contents

1.Global and Taiwan Semiconductor Industry Trends

2.Development of Regional Semiconductor Supply Chains

3.Global Deployment of Major Stakeholders

4.Conclusion

List of Topics

Development of the global and Taiwan semiconductor industry, touching on their market value for the period 2015-2022.

Key incidents affecting the industry’s supply chains such as chip shortage, the ongoing U.S.-China and Russia-Ukraine conflicts, China’s dual control policy, and the impact on the automotive chip industry is also included.

Development of regional semiconductor supply chains, including global foundry production capacity share by major supplier and the capacity expansion plan of individual countries such as the U.S., China, Korea, Europe, and Japan, and of IDMs (Infineon, Intel, Samsung, etc), and foundries (TSMC, Powerchip, VIS, SIMC, GlobalFoundries, etc.)

Deployment of major foundries, touching on production capacity with breakdown by product type (analog IC/discrete/foundry/logic IC/memory/microprocessor/MEMS/photonic) and by region; wafer capacity share by process nodes (12”, 8”, and other advanced nodes)

Overall deployment of leading brands such as Samsung, Intel, and TowerJazz; leading memory manufacturers such as Samsung, Intel, Micron, SK Hynix, Kioxia, Western Digit, and Nanya; leading analog/auto semiconductor manufacturers such as Infineon, NXP, STMicroelectronics, Renesas, Rohm, TI, and Onsemi; leading Chinese foundries such as SMIC, Hua Hong, ASMC, Nexchip, YMTC, and CXMT

Deployment of four leading foundries in Taiwan, including TSMC, UMC, PSMC, and VIS, and includes monthly capacity of their fabs and their deliverables

Companies covered

Amazon
AMD
Amkor Technology
Apple
Arm
ASE Group
ASML
Bosch
Broadcom
Cerebras
DB HiTek
Denso
Facebook
Flash Alliance
Fuji Electric
Fujitsu
GlobalFoundries
Google
Halio
Hua Hong
Hynix
Infineon
Kioxia
Kneron
MediaTek
Microchip
Micron
Mitsubishi Electric
Murata Manufacturing
Nuvoton
Nvidia
NXP
Olympus
Onsemi
Phenitec Semiconductor
Powerchip
Qualcomm
Renesas
Rohm
Sanken Electric
Seiko Epson
Sharp
Sony
Skorpios
Skyworks
STMicroelectronics
Sumitomo Electric
TDK
TI
Toshiba
Tower Partners
TowerJazz
TSMC
UMC
Wave Computing
WD
Western Digit
Xilinx