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IC最新趨勢:人工智能 (AI) 、5G,CMOS影像感測器 (CIS) 、及記憶體晶片市場分析

Hot ICs: A Market Analysis of AI, 5G, CMOS Image Sensors, and Memory Chips

出版商 Information Network 商品編碼 805202
出版日期 內容資訊 英文
商品交期: 2-3個工作天內
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IC最新趨勢:人工智能 (AI) 、5G,CMOS影像感測器 (CIS) 、及記憶體晶片市場分析 Hot ICs: A Market Analysis of AI, 5G, CMOS Image Sensors, and Memory Chips
出版日期: 2019年06月01日內容資訊: 英文
簡介

本報告提供使用人工智能 (AI) 、5G,CMOS影像感測器 (CIS) 、及記憶體晶片 (DRAM, NAND, NVM) 等IC的各技術市場與其用途的相關分析,市場預測,市場佔有率,及IC製造商簡介等。

第1章 摘要整理

第2章 CMOS影像感測器 (CIS)

  • CMOS感應技術、趨勢
  • 用途
    • 汽車/先進駕駛輔助系統 (ADAS)
    • 智慧型手機
    • 其他
  • 市場分析
    • 簡介
    • 汽車
    • 智慧型手機
    • 其他
  • CMOS影像感測器供應商的產品、簡介
    • 佳能
    • Galaxycore
    • HAMAMATSU PHOTONICS
    • LG Electronics
    • Newsight Imaging
    • ON Semiconductor
    • Omnivision
    • Pixelplus
    • Samsung Electronics
    • SK Hynix
    • SONY
    • TowerJazz Panasonic

第3章 5G

  • 5G晶片技術、趨勢
  • 用途
    • 行動終端
    • 學問時候的連接
  • 市場分析
    • 市場預測
    • 中國的行動電信業者
    • 日本的行動電信業者
    • 美國的行動電信業者
  • 5G晶片供應商的產品、簡介
    • Analog Devices
    • Anokiware
    • Apple
    • Broadcom
    • Huawei
    • Infineon
    • Intel
    • Inphi
    • Microchip
    • MediaTek
    • Marvell
    • M/A-Com
    • NXP Semiconductor
    • On Semiconductor
    • Qualcomm
    • Qorvo
    • Samsung Electronics
    • Sivers IMA
    • Skyworks Solutions
    • STMicroelectronics
    • Teradyne
    • Texas Instruments
    • Win Semiconduc

第4章 人工智能 (AI)

  • 人工智能 (AI) 技術、趨勢
    • 雲端AI運算
    • 邊AI運算
  • 用途
    • AI的產業用途
    • AI裝載設備
  • 市場分析
    • 簡介
    • 中國的AI計劃
    • AI晶片的收益預測
  • AI晶片技術
    • Graphics Processing Unit (GPU)
    • Field Programmable Gate Array (FPGA)
    • Application Specific Integrated Circuits (ASIC)
    • 神經形態晶片
  • 5G晶片供應商的產品、簡介
    • IC供應商
    • 雲端供應商:技術領導者
    • IP供應商
    • 全球新興企業
    • 中國的新興企業

第5章 記憶體晶片

  • 記憶體晶片技術、趨勢
    • DRAM
    • NAND
    • NVRAM - MRAM, RRAM, 及 FERAM
  • 用途
    • DRAM
    • NAND
  • 市場分析
  • 記憶體晶片供應商的產品、簡介
    • Fujian
    • Innotron
    • Intel
    • Micron Technology
    • Nanya
    • Powerchip
    • Samsung Electronics
    • SK Hynix
    • Toshiba
    • Western Digital
    • Winbond
    • YMTC
目錄

This report examines in detail Artificial Intelligence (AI), 5G, CMOS Image Sensor, and Memory Chips (DRAM, NAND, NVM). Markets for the ICs and their applications are forecast to 2025, and market shares given in each sector. A profile of the IC manufacturers for each sector is presented.

Table of Contents

1.0. Executive Summary

2.0. CMOS Image Sensors (CIS)

  • 2.1. CMOS Sensors Technology and Trends
  • 2.2. Applications
    • 2.2.1. Automotive/Advanced Driver Assistance Systems (ADAS)
    • 2.2.2. Smartphones
    • 2.2.3. Others
  • 2.3. Market Analysis
    • 2.3.1. Introduction
    • 2.3.2. Automotive
    • 2.3.3. Smartphones
    • 2.3.4. Others
  • 2.4. CMOS Image Sensor Supplier Products and Profiles
    • Canon
    • Galaxycore
    • Hanamatsu
    • LG Electronics
    • Newsight Imaging
    • ON Semiconductor
    • Omnivision
    • Pixelplus
    • Samsung Electronics
    • SK Hynix
    • Sony
    • TowerJazz Panasonic

3.0. 5G

  • 3.1. 5G Chip Technology and Trends
  • 3.2. Applications
    • 3.2.1. Mobile Handsets
    • 3.2.2. Interdisciplinary Connections
  • 3.3. Market Analysis
    • 3.3.1. Market Forecasts
    • 3.3.2. China Mobile Carriers
    • 3.3.3. Japan Mobile Carriers
    • 3.3.4. U.S. Mobile Carriers
  • 3.4. 5G Chip Supplier Products and Profiles
    • Analog Devices
    • Anokiware
    • Apple
    • Broadcom
    • Huawei
    • Infineon
    • Intel
    • Inphi
    • Microchip
    • MediaTek
    • Marvell
    • M/A-Com
    • NXP Semiconductor
    • On Semiconductor
    • Qualcomm
    • Qorvo
    • Samsung Electronics
    • Sivers IMA
    • Skyworks Solutions
    • STMicroelectronics
    • Teradyne
    • Texas Instruments
    • Win Semiconductors
    • Xilinx

4.0. Artificial Intelligence (AI)

  • 4.1. AI Technology and Trends
    • 4.1.1. Cloud AI Computing
    • 4.1.2. Edge AI Computing
  • 4.2. Applications
    • 4.2.1. Industry Applications of AI
      • 4.2.1.1. Smart Healthcare
      • 4.2.1.2. Smart Security
      • 4.2.1.3. Smart Finance
      • 4.2.1.4. Smart Grid
      • 4.2.1.5. Smart Phone
    • 4.2.2. AI-Powered Devices
      • 4.2.2.1. Smart Speakers
      • 4.2.1.2. Drones
      • 4.2.1.3. Intelligent Robots
  • 4.3. Market Analysis
    • 4.3.1. Introduction
    • 4.3.2. China's AI Plan
      • 4.3.2.1. Driverless Vehicles
      • 4.3.2.2. Computer Chips
      • 4.3.2.3. Financial
      • 4.3.2.4. Facial Recognition
      • 4.3.2.5. Retail
      • 4.3.2.6. Robots
    • 4.3.3. AI Chip Revenue Forecast
  • 4.4. AI Chip Technology
    • 4.4.1. Graphics Processing Unit (GPU)
    • 4.4.2. Field Programmable Gate Array (FPGA)
    • 4.4.3. Application Specific Integrated Circuits (ASIC)
    • 4.4.4. Neuromorphic Chips
  • 4.5. AI Chip Supplier Products and Profiles
    • 4.5.1. IC Vendors
      • AMD
      • HiSilicon
      • IBM
      • Intel
      • MediaTek
      • Nvidia
      • NXP
      • Qualcomm
      • Rockchip
      • Samsung Electronics
      • STMicroelectronics
      • Xilinx
    • 4.5.2. Cloud Providers - Tech Leaders
      • Alibaba
      • Alibaba Cloud
      • Amazon
      • Apple
      • Baidu
      • Facebook
      • Fujitsu
      • Google
      • HuaweI Cloud
      • Microsoft
      • Nokia
      • Tencent Cloud
      • Tesla
    • 4.5.3. IP Vendors
      • ARM
      • CEVA
      • Imagination
      • VeriSilicon
      • Videantis
    • 4.5.4. Startups Worldwide
      • Adapteva
      • aiCTX
      • AImotive
      • AlphaICs
      • BrainChip
      • Cornami
      • DeepScale
      • Esperanto Technologies
      • Graphcore
      • GreenWaves Technology
      • KAIST
      • Kalray
      • Kneron
      • Knowm
      • Koniku
      • Mythic
      • SambaNova Systems
      • Videantis
      • Wave Computing
    • 4.5.5. Startups in China
      • AISpeech
      • Bitmain
      • Cambricon
      • Chipintelli
      • DeePhi Tech
      • Horizon Robotics
      • NextVPU
      • Rokid
      • Thinkforce
      • Unisound

5.0. Memory Chips

  • 5.1. Memory Technology and Trends
    • 5.1.1. DRAM
    • 5.1.2. NAND
    • 5.1.3. NVRAM - MRAM, RRAM, and FERAM
  • 5.2. Applications
    • 5.2.1. DRAM
      • 5.2.1.1. Server
      • 5.2.1.2. PC
      • 5.2.1.3. Graphics
      • 5.2.1.4. Mobile
      • 5.2.1.5. Consumer
    • 5.2.2. NAND
      • 5.2.2.1. SSD
      • 5.2.2.2. PC
      • 5.2.2.3. TV
      • 5.2.2.4. Mobile
      • 5.2.2.5. USB
  • 5.3. Market Analysis
  • 5.4. Memory Chip Supplier Products and Profiles
    • Fujian
    • Innotron
    • Intel
    • Micron Technology
    • Nanya
    • Powerchip
    • Samsung Electronics
    • SK Hynix
    • Toshiba
    • Western Digital
    • Winbond
    • YMTC

List of Figures

  • 2.1. Five Levels of Autonomous Driving
  • 2.2. Average Semiconductor Content Per Car by Level of Automation
  • 2.3. Automotive Imaging Segments
  • 2.4. Market Shares of CMOS Image Sensor Manufacturers
  • 2.5. Semiconductor Market Forecast for ADAS
  • 2.6. IC Content Used in ADAS Systems - 2015
  • 2.7. Market Shares of Automotive CMOS Image Sensor Manufacturers
  • 2.8. CMOS Image Sensor Market Forecast For Smartphones
  • 2.9. CMOS Image Sensor Market Forecast For Other Applications
  • 3.1. RF Chip Market Forecast by Network Generation
  • 4.1. Performance Comparison of TPU, GPU, and CUP
  • 4.2. AI Training and Inference
  • 4.3. AI Training and Inference Chip Forecast - Revenue
  • 4.4. AI Training and Inference Chip Forecast by Type - Units
  • 5.1. DRAM Scaling
  • 5.2. Memory Industry Shrink Roadmap and EUV Insertion
  • 5.3. Quadruple Patterning Technology
  • 5.4. Ultra-Thin Dielectric Layer Deposition
  • 5.5. Proprietary Circuit Design Technology
  • 5.6. Transition from SLC to QLC NAND
  • 5.7. Comparison Of Non-Volatile Ram Write Times
  • 5.8. Competition In Dissipation Speed And Memory Capacity
  • 5.9. Comparison Of Non-Volatile RAM Technology
  • 5.10. Total Available Market for SST MRAM
  • 5.11. Total Available Market for Toggle MRAM

List of Tables

  • 2.1. Levels of Autonomous Driving
  • 2.2. Market Forecast of CMOS Image Sensors by Application
  • 2.3. Aotomotive Image Sensor Market by Application
  • 2.4. Forecast of ADAS Market by Systems
  • 3.1. Feature Comparison of Smartphone Power Amplifiers by Generations
  • 3.2. Smartphone Subscription Forecast by Geographic Region
  • 3.3. Smartphone Subscription Forecast by Technology
  • 3.4. 5G Smartphone Subscription Forecast by Geographic Region
  • 3.5. 5G Smartphone Plans by Geographic Region
  • 3.6. 5G Smartphone Mobile Semiconductor Forecast
  • 3.6. Top Wireless Carriers
  • 4.1. Smart Speaker Products
  • 4.2. AI Training and Inference Chip Forecast
  • 4.3. AI Chip Forecast by Chip Type
  • 4.4. Characteristics of CPU, FPGA, CPU, and ASIC
  • 4.5. Characteristics of CPU, FPGA, CPU, and ASIC
  • 5.1. DRAM Bit Growth Supply Forecast by Company
  • 5.2. DRAM Bit Growth Demand Forecast by Application
  • 5.3. DRAM Wafer Capacity Forecast by Fab - Wafers
  • 5.4. DRAM Market Shares
  • 5.5. DRAM Capex Forecast by Company
  • 5.6. NAND Bit Growth Supply Forecast by Company
  • 5.7. NAND Bit Growth Demand Forecast by Application
  • 5.8. NAND Wafer Capacity by Company Fab
  • 5.9. 3D NAND Wafer Capacity Forecast by Fab
  • 5.10. Cloud Capex Spend
  • 5.11. DRAM Content of Chinese Smartphones
  • 5.12. NAND Content of Chinese Smartphones
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