全球微機電(MEMS)裝置及材料市場:銷售企業及晶圓代工廠預測與策略

本報告提供全球微機電(MEMS)裝置及材料市場的相關概述，供應商趨勢，晶圓代工廠的成功主要原因，無晶圓廠企業的機會，以及市場課題，為您概述為以下內容。

第1章 介紹

第2章 與主要的用途市場預測

• 微機電(MEMS)裝置市場預測
  • 噴墨頭
  • 壓力感應器
  • 矽晶麥克風
  • 加速度計
  • 陀螺儀
  • MOEMS
  • 微顯示器
  • 微流體
  • RF MEMS
  • 超小型燃料電池
  • 新興的用途
• 微機電(MEMS)系統市場預測

第3章 裝置及材料供應商市場

• 介紹
• 微機電(MEMS)設備市場
  • 組織
  • 黏合
  • 沖洗
  • 沉澱
  • 切割
  • 蝕刻
  • 雷射微加工
  • 光刻
  • 檢驗
  • 檢驗
  • 熱處理
  • 晶圓薄化
• 微機電(MEMS)材料市場
  • 化學物質
  • 光罩
  • 基板

第4章 微機電(MEMS)晶圓代工廠

• 晶圓代工廠簡介和策略
• 市場區隔

第5章 晶圓代工廠成功主要原因

第6章 有關微機電(MEMS)的重要事項

• 3Dinter連接和包裝
• 晶片尺寸
• 微機電(MEMS)檢驗
• 無晶圓廠企業的機會

圖表

This vision of MEMS whereby microsensors, microactuators and microelectronics and other technologies, can be integrated onto a single microchip is expected to be one of the most important technological breakthroughs of the future. A significant portion of MEMS manufacturing technology has come from the IC industry. MEMS devices can be made using silicon wafers and the manufacturing process can incorporates semiconductor manufacturing processes such as sputtering, deposition, etching and lithography.

This report analyzes the market for MEMS by devices and systems. The equipment and materials to make them are analyzed and forecast.

Table of Contents

Chapter 1: The MEMS Market Infrastructure

Chapter 2: Forecast Of The Key Applications And Markets

• 2.1. MEMS Device Market Forecast
  • 2.1.1. Ink Jet Head
  • 2.1.2. Pressure Sensor
  • 2.1.3. Silicon Microphone
  • 2.1.4. Accelerometer
  • 2.1.5. Gyroscope
  • 2.1.6. Micro Display
  • 2.1.7. Other MOEMS
  • 2.1.8. Microfluidics
  • 2.1.9. RF MEMS
  • 2.1.10. Digital Compass
  • 2.1.11. Inertial Sensor
  • 2.1.12. Emerging Applications
• 2.2. MEMS System Market Forecast
  • 2.2.1. Automotive Systems
  • 2.2.2. Aeronautics Systems
  • 2.2.3. Consumer Systems
  • 2.2.4. Defense Systems
  • 2.2.5. Industrial Systems
  • 2.2.6. Medical/Life Sciences Systems
  • 2.2.7. Telecom Systems

Chapter 3: Markets for Equipment and Materials Suppliers

• 3.1. Introduction
• 3.2. MEMS Equipment Markets
  • 3.2.1. Assembly
  • 3.2.2. Bonding
  • 3.2.3. Cleaning
  • 3.2.4. Deposition
  • 3.2.5. Dicing
  • 3.2.6. Etching
  • 3.2.7. Laser Micromachining
  • 3.2.8. Lithography
  • 3.2.9. Metrology/Inspection
  • 3.2.10. Testing
  • 3.2.11. Thermal Treatment
  • 3.2.12. Wafer Thinning
• 3.3. MEMS Material Markets
  • 3.3.1. Chemicals
  • 3.3.2. Photomasks
  • 3.3.3. Substrates

Chapter 4: MEMS Foundries

• 4.1. Foundry Profiles and Strategies
  • 4.1.1. Advanced Microsensors
  • 4.1.2. Agiltron
  • 4.1.3. Asia Pacific Microsystems
  • 4.1.4. Beijing First MEMS
  • 4.1.5. Bosch
  • 4.1.6. China Resources Semiconductor
  • 4.1.7. Colibrys
  • 4.1.8. C2V
  • 4.1.9. Dai-Nippon Printing
  • 4.1.10. Dalso
  • 4.1.11. Freescale
  • 4.1.12. GLOBALFOUNDRIES
  • 4.1.13. Honeywell MEMSplus
  • 4.1.14. Infineon Technologies SensoNor As
  • 4.1.15. Institute of Microelectronics
  • 4.1.16. Innovative Micro Tech
  • 4.1.17. Integrated Sensing Systems Inc. (ISSYS)
  • 4.1.18. LioniX
  • 4.1.19. MEMS Engineering and Material
  • 4.1.20. MEMSCAP
  • 4.1.21. Micralayne
  • 4.1.22. Micrel
  • 4.1.23. Midwest MicroDevices, LLC
  • 4.1.24. Nanostructures Inc
  • 4.1.25. Norcada Inc.
  • 4.1.26. Olympus
  • 4.1.27. Omron
  • 4.1.28. Proton Mikrotechnik
  • 4.1.29. Semiconductor Manufacturing International Corporation
  • 4.1.30. SEMEFAB
  • 4.1.31. Silex Microsystems
  • 4.1.32. Sony
  • 4.1.33. ST Microelectronics
  • 4.1.34. Taiwan Semiconductor Manufacturing Co Ltd (TSMC)
  • 4.1.35. Texas Instruments
  • 4.1.36. Touch Microsystems
  • 4.1.37. Tronics Microsystems
  • 4.1.38. X-Fab
• 4.2. Small-Mid-Sized Companies

Chapter 5: Factors for Foundry Success

• 5.1.1. Achieving Economies Of Scale
• 5.1.2. Competitive Advantages
• 5.1.3. Core Strengths
• 5.1.4. Employee Commitment
• 5.1.5. Expansion Plans
• 5.1.6. Financial Objectives:
• 5.1.7. Groundbreaking MEMS Solutions
• 5.1.8. In- House Expertise in MEMS Testing And Reliability
• 5.1.9. Leadership in Technology
• 5.1.10. Manufacturing Excellence
• 5.1.11. Manufacturing Process
• 5.1.12. Mastering Process and Production Technology
• 5.1.13. Patent Protection
• 5.1.14. Partnerships
• 5.1.15. Products
• 5.1.16. Proprietary Development Processes
• 5.1.17. Sales Organization
• 5.1.18. Sales Process and Customer Base
• 5.1.19. Strong Customer Relations
• 5.1.20. Vision and Goal

Chapter 6: Critical MEMS Issues

• 6.1. 3-D Interconnects and Packaging
• 6.2. Wafer Size
• 6.3. MEMS Testing
• 6.4. Opportunities For Fabless MEMS Companies

List Of Tables

• 4.1. Top MEMS Foundries by Revenues

List of Figures

• 2.1. MEMS Markets
• 2.2. Ink Jet Head Sales Forecast
• 2.3. Pressure Sensor Sales Forecast
• 2.4. Silicon Microphone Sales Forecast
• 2.5. Accelerometer Sales Forecast
• 2.6. Gyroscope Sales Forecast
• 2.7. Micro Display Sales Forecast
• 2.8. Other MOEMS Sales Forecast
• 2.9. Microfluidics Sales Forecast
• 2.10. RF MEMS Sales Forecast
• 2.11. Digital Compass Sales Forecast
• 2.12. Inertial Sensor Sales Forecast
• 2.131. Emerging Applications Sales Forecast
• 2.12. Automotive System Sales Forecast
• 2.15. Aeronautics System Sales Forecast
• 2.16. Consumer System Sales Forecast
• 2.17. Defense System Sales Forecast
• 2.18. Industrial System Sales Forecast
• 2.19. Medical System Sales Forecast
• 2.20. Telecom System Sales Forecast
• 3.1. Discrete Assembly of MEMS
• 3.2. Assembly Equipment Sales Forecast
• 3.3. Bonding Equipment Sales Forecast
• 3.4. Cleaning Equipment Sales Forecast
• 3.5. Deposition Equipment Sales Forecast
• 3.6. Dicing Equipment Sales Forecast
• 3.7. Schematic Of DRIE
• 3.8. Etching Equipment Sales Forecast
• 3.9. Laser Micromachining Equipment Sales Forecast
• 3.10. Driving Principle Of The MOR (a) Parallel State (B) Tilted State
• 3.11. Lithography Equipment Sales Forecast
• 3.12. Metrology/Inspection Equipment Sales Forecast
• 3.13. Testing Equipment Sales Forecast
• 3.14. Thermal Treatment Equipment Sales Forecast
• 3.15. Wafer Thinning Equipment Sales Forecast
• 3.16. Chemicals Sales Forecast
• 3.17. Photomasks Sales Forecast
• 3.18. Substrates Sales Forecast
• 3.19. Wafer Starts By Substrate Size
• 6-1. Process For Capping MEMS
• 6-2. Examples Of Thermoplastic Cavity Packages
• 6.3. Fluidic Packaging System
• 6.4. Forecast of Wafer Size
• 6-5. Fluidic Packaging System