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市場調查報告書

薄膜沈積技術:趨勢、課題、市場分析

Thin Film Deposition: Trends, Key Issues, Market Analysis

出版商 Information Network 商品編碼 5774
出版日期 內容資訊 英文 160 PAGES
商品交期: 2-3個工作天內
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薄膜沈積技術:趨勢、課題、市場分析 Thin Film Deposition: Trends, Key Issues, Market Analysis
出版日期: 2021年05月01日內容資訊: 英文 160 PAGES
簡介

本報告為,針對PVD、CVD、ECD等各種薄膜沈積技術之概要、特性、供應商面臨之課題及今後市場進行預測,以下列摘要形式闡述。

第1章 簡介

第2章 實施概要

第3章 PVD(物理蒸鍍)

  • 概要
  • 測鍍技術
  • 電漿技術
  • 反應設計
    • 長投法
    • 準直濺鍍
    • 噴灑沈積
    • 離子化PVD
  • 半導體加工
    • 薄膜
    • 間隙填充
  • 目標

第4章 CVD(化學蒸鍍)

  • 概要
  • CVD技術
    • APCVD
    • LPCVD
    • PECVD
    • HDPCVD
    • ALD

第5章 ECD(電化學沈積)

  • 概要
  • 反應設計
  • 課題
  • 添加劑
  • 處理
    • 超級填充
    • 高深寬比
  • 陰極銅
  • 潤濕銅晶種層

第6章 薄膜沈積及薄膜特性

  • 概要
  • 介電層沈積
    • 二氧化矽
    • 氮化矽
    • High-K介電層
    • Low-K介電層
  • 金屬沈積
    • 鎢/鎢矽化物
    • 氮化鈦

第7章 供應商課題

  • 概要
  • 300mm處理
  • 整合處理
  • 測量
  • ESD
  • 參數測試

第8章 市場預測

  • 概要
  • 主要課題
  • 市場預測假想
  • 市場預測
    • CVD
    • PVD
    • 鍍銅市場
    • 原子層沉積市場

圖表

目錄

CVD (Chemical Vapor Deposition) is used to deposit materials in various forms, including monocrystalline, polycrystalline, amorphous, and epitaxial. By subtypes, there are mainly LPCVD (low pressure), PECVD (plasma enhanced), and ALD. PVD deposition techniques include sputtering and eBeam and thermal evaporation.

The CVD process involves mixing the source material with one or more volatile precursors using a plasma to chemically interact and breakdown the source material. The processes use heat with higher pressures leading to a more reproducible film where the film thicknesses could be managed by time/power. These films are more stoichiometric, they are denser and are capable of growing higher quality insulator films. The PVD processing uses a solid precursor metal that is gasified through some electrical energy. The gasified atoms are then transferred to the substrate. These processes manages thicknesses using a quartz crystal rate monitor to control rate and thickness of the film.

ALD films are very conformal approaching 2000:1 aspect ratios, thus providing excellent step coverage over features. The process is repeatable and can grow thinner layers under 10nm thickness predictably. Films include Alumina oxide (AL2O3), Hafnium oxide (HfO2) and Titanium oxide (TiO2). Its use in the semiconductor industry has advanced ALD rapidly in recent years to develop thin, high-K gate dielectric layers.

The PECVD process offers good step coverage over features. Films include Silicon Dioxide (SiO2), Silicon Nitride (Si3N4) and lower stress Oxynitride (SiON) films. The PECVD films offer more flexibility than ALD with higher deposition rates leading to higher throughputs.

This report discusses the technology trends, products, applications, and suppliers of deposition materials and equipment. It also gives insights to suppliers for future user needs and should assist them in long range planning, new product development and product improvement. Market shares and a market forecast for each sector of thin film deposition tools is presented.

Table of Contents

Chapter 1. Introduction

Chapter 2. Executive Summary

Chapter 3. Physical Vapor Deposition

  • 3.1. Introduction
  • 3.2. Sputtering Technology
  • 3.3. Plasma Technology
  • 3.4. Reactor Designs
    • 3.4.1. Long-Throw Deposition
    • 3.4.2. Collimated Sputter Deposition
    • 3.4.3. Showerhead Deposition
    • 3.4.4. Ionized PVD
  • 3.5. Semiconductor Processing
  • 3.6. Targets

Chapter 4. Chemical Vapor Deposition

  • 4.1. Introduction
  • 4.2. Chemical Vapor Deposition (CVD) Techniques
    • 4.2.1. APCVD
    • 4.2.2. LPCVD
    • 4.2.3. PECVD
    • 4.2.4. HDPCVD
    • 4.2.5. ALD

Chapter 5. Electrochemical Deposition

  • 5.1. Introduction
  • 5.2. Reactor Design
  • 5.3. Challenges
  • 5.4. Additives
  • 5.5. Processing
    • 5.5.1. Superfilling
    • 5.5.2. Aspect Ratios
  • 5.6. Copper Cathodes
  • 5.7. Wet Copper Seed-Layer

Chapter 6. Film Deposition And Film Properties

  • 6.1. Introduction
  • 6.2. Dielectric Deposition
    • 6.2.1. Silicon Dioxide
      • 6.2.1.1. Thermal CVD
      • 6.2.1.2. PECVD
      • 6.2.1.3. HDPCVD
    • 6.2.2. Silicon Nitride
      • 6.2.2.1. Thermal CVD
      • 6.2.2.2. PECVD
      • 6.2.2.3. HDPCVD
    • 6.2.3. High-K Dielectrics
    • 6.2.4. Low-K Dielectrics
  • 6.3. Metal Deposition
    • 6.3.1. Aluminum
    • 6.3.2. Tungsten/Tungsten Silicide
    • 6.3.3. Titanium Nitride

Chapter 7. Vendor Issues

  • 7.1. Introduction
  • 7.2. 450mm Processing
  • 7.3. Integrated Processing
  • 7.4. Copper
  • 7.5. Metrology
  • 7.6. ESD
  • 7.7. Parametric Test

Chapter 8. Market Forecast

  • 8.1. Introduction
  • 8.2. Key Issues
    • 8.2.1. Interconnect Architectures
      • 8.2.1.1. Logic (MPU/ASIC)
      • 8.2.1.2. Memory (Flash)
    • 8.2.2. Processing Trends
      • 8.2.2.1. Dielectric Film Trends
      • 8.2.2.2. Barrier Film Trends
      • 8.2.2.3. Conductor Film Trends
    • 8.2.3. Through-Si-Via (TSV), 3d Stacking Technology
      • 8.2.3.1. Introduction
      • 8.2.3.2. Through Si Via Technologies
    • 8.2.4. Emerging Interconnect Solutions
      • 8.2.4.1. Overview
      • 8.2.4.2. Cu Replacements
  • 8.3. Market Forecast Assumptions
  • 8.4. Market Forecast
    • 8.4.1. Chemical Vapor Deposition
    • 8.4.2. Physical Vapor Deposition
    • 8.4.3. Copper Electroplating Market
    • 8.4.4. Atomic Layer Deposition Market

FIGURES

  • 3.1. Schematic Of Sputtering System
  • 3.2. Magnetron Sputtering Design
  • 3.3. Showerhead Reactor Design
  • 3.4. Ionized PVD
  • 4.1. APCVD Reactor
  • 4.2. Tube CVD Reactor
  • 4.3. HDPCVD Reactor
  • 4.4. ALD Versus PVD Copper Barrier
  • 5.1. Copper Electroplating System
  • 7.1. Comparison Between Semiconductor and Equipment Revenues
  • 8.1. Worldwide MCVD Market Shares
  • 8.2. Worldwide DCVD Market Shares
  • 8.3. Worldwide DCVD Market By Sectors
  • 8.4. Worldwide HDHCVD Market Shares
  • 8.5. Worldwide PECVD Market Shares
  • 8.6. Worldwide SACVD Market Shares
  • 8.7. Worldwide LPCVD Market Shares
  • 8.8. Worldwide PVD Market Shares
  • 8.9. Worldwide ECD Market Shares
  • 8.10. Worldwide ALD Market Shares

TABLES

  • 8.1. Cu Replacements And Native Device
  • 8.2. Worldwide CVD Market Forecast
  • 8.3. Worldwide MCVD Market Shares
  • 8.4. Worldwide DCVD Market Shares
  • 8.5. Worldwide HDPCVD Market Forecast
  • 8.6. Worldwide HDPCVD Market Shares
  • 8.7. Worldwide PECVD Market Forecast
  • 8.8. Worldwide PECVD Market Shares
  • 8.9. Worldwide SACVD Market Forecast
  • 8.10. Worldwide SACVD Market Shares
  • 8.11. Worldwide LPCVD Market Forecast
  • 8.12. Worldwide LPCVD Market Shares
  • 8.13. Worldwide PVD Market Forecast
  • 8.14. Worldwide PVD Market Shares
  • 8.15. Worldwide ECD Market Forecast
  • 8.16. Worldwide ALD Market Forecast
  • 8.16. ALD Applications