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市場調查報告書

Sub100nm微影術:市場分析及策略性課題

Sub-100nm Lithography: Market Analysis and Strategic Issues

出版商 Information Network 商品編碼 4961
出版日期 內容資訊 英文 150 PAGES
商品交期: 2-3個工作天內
價格
Sub100nm微影術:市場分析及策略性課題 Sub-100nm Lithography: Market Analysis and Strategic Issues
出版日期: 2021年05月01日內容資訊: 英文 150 PAGES
簡介

本報告提供光學系統,X光掃描系統,等電子束和離子束系統的各種微影術技術的趨勢與課題,供應商的策略和今後的預測等相關彙整。

第1章 簡介

第2章 摘要整理

第3章 微影術的課題與趨勢

  • 光學系統
    • 簡介
    • 階段&反復符、微影術機
    • 遠紫外線 (DUV)
  • EUV
  • 奈米界內印刷微影術
  • X光掃描微影術
  • 電子束微影術
  • 離子束微影術

第4章 供應商的策略

  • 對微影術的需求定義
  • 供應商的基準
    • 價格
    • 供應商的配合措施與其態度
    • 供應商的能力
    • 系統性能
    • 設備評估中的供應商回饋
    • 設備生產中的供應商回饋
  • 競爭環境
  • 1級無塵室用設備
  • 未來型工廠設備
  • 市場機會

第5章 市場預測

  • 影響因素
    • 技術趨勢
    • 經濟趨勢
    • 光學技術的限制
  • 市場預測相關假設
  • 市場預測
目錄

Lithography tools are essential if chipmakers are to follow their shrinkage roadmap. Intel, Samsung and TSMC have all set out shrinkage roadmaps for 5nm nodes and below, aiming to deliver chips with superior performance at a lower cost.

ASML is the dominant leader in the semiconductor lithography sector, with Nikon and Canon its chief competitors, and the only manufacturer of EUV lithography.

Chipmakers remain committed to their leading-edge roadmap: ASML's main business drivers are chipmakers' leading-edge roadmaps, which detail the timeline for the development of smaller and more complex semiconductors. We believe chipmakers will increasingly use ASML's extreme ultraviolet lithography (EUV) tool in their manufacturing processes. Our research has found that the main buyers of EUV this year and next year will be TSMC, Samsung and, potentially, Intel: all three are still committed to their roadmaps.

Foundry / logic some customers are leveraging EUV to reduce the number of steps for specific layer; however other layers continue to add additional steps. For DRAM, our conversation highlighted that more complex patterning schemes (vs. foundry / logic) should result in EUV adoption targeted at very specific layers that can provide cost reductions. We note that this will be more vendor dependent and based on design schemes.

Table of Contents

Chapter 1: Introduction

  • 1.1. The Need For This Report

Chapter 2: Executive Summary

  • 2.1. Summary of Major Issues
  • 2.2. Summary of Market Opportunities

Chapter 3: Lithography Issues And Trends

  • 3.1. Optical Systems
    • 3.1.1. Introduction
    • 3.1.2. Deep Ultraviolet (DUV)
  • 3.2. EUV
  • 3.3. Nano-Imprint Lithography
  • 3.4. X-Ray Lithography
  • 3.3. Electron Beam Lithography
  • 3.4. Ion Beam Lithography

Chapter 4: User - Supplier Strategies

  • 4.1. Determining Lithography Needs
  • 4.2. Benchmarking a Vendor
    • 4.2.1. Pricing
    • 4.2.2. Vendor Commitment and Attitudes
    • 4.2.3. Vendor Capabilities
    • 4.2.4. System Capabilities
    • 4.2.5. Vendor Feedback During Equipment Evaluation
    • 4.2.6. Vendor Feedback During Device Production
  • 4.3. Competitive Environment
  • 4.4. Equipment For Class 1 Cleanrooms
  • 4.5. Equipment For the Factory of the Future
  • 4.6. Opportunities

Chapter 5: Market Forecast

  • 5.1. Driving Forces
    • 5.1.1. Technical Trends
    • 5.1.2. Economic Trends
    • 5.1.3. Optical Limitations
  • 5.2. Market Forecast Assumptions
  • 5.3. Market Forecast
    • 5.3.1. Background
    • 5.3.2. Lithography Market Forecast
    • 5.3.3. Market Shares
  • 5.4. EUV Customer Insertion

LIST OF TABLES

  • 2.1. Comparison Between DUV And EUV For Multiple Patterning
  • 3.1. Characteristics Of I-Line Stepper
  • 3.2. Comparison Of Different DUV Lithography Systems
  • 3.2. Characteristics of X-Ray Systems
  • 5.1 . Worldwide Capital Spending
  • 5.2. DRAM Lithographic Requirements
  • 5.3. Worldwide Optical Stepper Market Forecast - Revenues
  • 5.4. Worldwide Optical Stepper Market Forecast - Units
  • 5.5. Worldwide Optical Stepper Market Forecast - ASPs
  • 5.6. Worldwide Stepper Market Shares
  • 5.7. EUV Customer's Technology Roadmaps

LIST OF FIGURES

  • 3.1. Evolution Of Lithography Systems
  • 3.2. Excimer Laser Evolution
  • 3.3. Schematic Of EUV System
  • 3.4. Thermoplastic Nanoimprint Lithography Process
  • 3.5. Step and Flash Nanoimprint Lithography Process
  • 3.6. Illustration of X-Ray Lithography
  • 3.7. Schematic Of Scalpel Electron Beam System
  • 3.8. Multi-Source E-Beam Lithography
  • 3.9. Ion Projection Lithography System
  • 4.1. Technology Nodes Through 2027
  • 4.2. EUV Cost Of Ownership
  • 4.3. Imprint Cost Of Ownership
  • 5.1. Lithography Market Vs Equipment Market
  • 5.2. DUV Immersion Vs EUV
  • 5.3. Lithography Extensions
  • 5.4. Lithography Cost of Ownership
  • 5.5. Segmentation of Stepper/Scan Shipments
  • 5.6. Market Shares of Vendors (Units)
  • 5.7. Unit Market Shares of Vendors
  • 5.8. Worldwide I-Line Market Shares
  • 5.9. Worldwide 248nm Market Shares
  • 5.10. Worldwide 193nm Dry Market Shares
  • 5.11. Worldwide 193nm Wet Market Shares
  • 5.12. Market Shares of Vendors (Revenues)