市場調查報告書

Sub100nm微影術:市場分析及策略性課題

Sub 100-nm Lithography: Market Analysis and Strategic Issues

出版商 Information Network 商品編碼 4961
出版日期 內容資訊 英文 150 PAGES
商品交期: 2-3個工作天內
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Sub100nm微影術:市場分析及策略性課題 Sub 100-nm Lithography: Market Analysis and Strategic Issues
出版日期: 2019年10月01日內容資訊: 英文 150 PAGES
簡介

本報告提供光學系統,X光掃描系統,等電子束和離子束系統的各種微影術技術的趨勢與課題,供應商的策略和今後的預測等相關彙整。

第1章 簡介

第2章 摘要整理

第3章 微影術的課題與趨勢

  • 光學系統
    • 簡介
    • 階段&反復符、微影術機
    • 遠紫外線 (DUV)
  • EUV
  • 奈米界內印刷微影術
  • X光掃描微影術
  • 電子束微影術
  • 離子束微影術

第4章 供應商的策略

  • 對微影術的需求定義
  • 供應商的基準
    • 價格
    • 供應商的配合措施與其態度
    • 供應商的能力
    • 系統性能
    • 設備評估中的供應商回饋
    • 設備生產中的供應商回饋
  • 競爭環境
  • 1級無塵室用設備
  • 未來型工廠設備
  • 市場機會

第5章 市場預測

  • 影響因素
    • 技術趨勢
    • 經濟趨勢
    • 光學技術的限制
  • 市場預測相關假設
  • 市場預測

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目錄

The continued improvements in lithography have been the driving force that has upheld Moore's Law. Shorter wavelengths, better lenses, and adaptive optics have all contributed to this success story, which has allowed commercial chips to be fabricated with 14nm feature sizes

This report examines and projects the technologies involved, their likely developments, what problems and choices are facing users, and where the opportunities and pitfalls are. The worldwide lithography markets are analyzed and projected by type (EUV, DUV, and optical), and market shares by vendor for each type.

Table of Contents

Chapter 1 Introduction

  • 1.1 The Need For This Report

Chapter 2 Executive Summary

  • 2.1 Summary of Major Issues
  • 2.2 Summary of Market Opportunities

Chapter 3 Lithography Issues And Trends

  • 3.1 Optical Systems
    • 3.1.1 Introduction
    • 3.1.2 Step-and-Repeat Aligners
    • 3.1.3 Deep Ultraviolet (DUV)
  • 3.2 EUV
    • 3.5 Nano-Imprint Lithography
    • 3.4 X-Ray Lithography
    • 3.3 Electron Beam Lithography
    • 3.4 Ion Beam Lithography

Chapter 4 User - Supplier Strategies

  • 4.1 Determining Lithography Needs
  • 4.2 Benchmarking a Vendor
    • 4.2.1 Pricing
    • 4.2.2 Vendor Commitment and Attitudes
    • 4.2.3 Vendor Capabilities
    • 4.2.4 System Capabilities
    • 4.2.5 Vendor Feedback During Equipment Evaluation
    • 4.2.6 Vendor Feedback During Device Production
  • 4.3 Competitive Environment
  • 4.4 Equipment For Class 1 Cleanrooms
  • 4.5 Equipment For the Factory of the Future
  • 4.6 Opportunities

Chapter 5 Market Forecast

  • 5.1 Driving Forces
    • 5.1.1 Technical Trends
    • 5.1.2 Economic Trends
    • 5.1.3 Optical Limitations
    • 5.2 Market Forecast Assumptions
    • 5.3 Market Forecast

List of Tables

  • 3.1 Wavelength "Generations"
  • 3.2 Characteristics of X-Ray Systems
  • 5.1 Worldwide Capital Spending
  • 5.2 DRAM Lithographic Requirements
  • 5.3 Worldwide Optical Stepper Market
  • 5.4 Worldwide Stepper Market Shares

List of Figures

  • 1.1 Lithographic Equipment Requirements for DRAMs
  • 3.1 Lithography Options For MPUs/DRAMs
  • 3.2 Lithography Options For Flash
  • 3.3 Illustration of Stepper Exposure System
  • 3.4 Lens Arrangement For Submicron Features
  • 3.5 Excimer Laser Evolution
  • 3.6 EUV Lithography
  • 3.7 Thermoplastic Nanoimprint Lithography Process
  • 3.8 Step And Flash Nanoimprint Lithography Process
  • 3.9 Illustration of X-Ray Lithography
  • 3.10 Schematic Of Scalpel Electron Beam System
  • 3.11 Multi-Source E-Beam Lithography
  • 3.12 Ion Projection Lithography System
  • 4.1 Manufacturing Costs Per Exposure Station
  • 5.1 Lithography Market Vs Equipment Market
  • 5.2 Lithography Double Exposure Technique
  • 5.3 Lithography Requirements
  • 5.4 Lithography Extensions
  • 5.5 Lithography Cost of Ownership
  • 5.6 Segmentation of Stepper/Scan Shipments
  • 5.7 Market Shares of Vendors (Units)
  • 5.8 Unit Market Shares of Vendors
  • 5.9 Worldwide I-Line Market Shares
  • 5.10 Worldwide 248nm Market Shares
  • 5.11 Worldwide 193nm Dry Market Shares
  • 5.12 Worldwide 193nm Wet Market Shares
  • 5.13 Market Shares of Vendors (Revenues)
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