The report is segmented in two chapters. In Chapter 2 we identify high-tech applications that are fabricated on 300mm wafers. This is the realm of the large equipment manufacturers, and so the focus of the chapter is on how a small or mid-sized company can compete - namely in the area of niche processing capabilities from a technology point of view.
In Chapter 3 we discuss high-tech applications that are built on non- 300mm wafers. These should be the focal point of a small and mid-size company because often the large companies will address applications on 300mm wafers and ignore niche applications where the size of the market does not represent a need for the semiconductor manufacturer to invest in a 300mm fab or utilize a foundry for small runs. In-house manufacturing is performed on 150mm and 200mm wafer sizes.
In this report we identify areas of semiconductor-related technologies where a small or mid-sized company can compete. These high-tech applications segmented include Wafer Level Processing (WLP), 3-D TSV, Non-volatile Memory Devices MRAM, RRAM and FeRAM, Ultrathin Wafers, MEMs, HB-LEDs, Compound Semiconductors, Thin Film Read/Write Heads for HDD, and SAW Vs. BAW filters. Each of these applications is analyzed and forecast.
Table of Contents
Chapter Introduction
Chapter 2 Niche Markets for PROCESSES for 300mm Wafers
- 2.1. Introduction
- 2.2. Wafer Level Processing (WLP)
- 2.2.1. Introduction
- 2.2.2. Flip Chip/WLP Processing Issues and Trends
- Wafer Bumping
- Wafer Level Packaging
- Pad Redistribution
- Wafer Bumping Costs
- 2.2.3. Lithography Issues And Trends
- 2.2.4. UBM Etch Issues And Trends
- 2.2.5. Metallization Issues and Trends
- Gold Bumping Metallization
- Solder Bumping Metallization
- 2.2.6. Analysis of WLP Market
- 2.3. 3-D TSV
- 2.3.1. Insight Into Critical Issues
- 2.3.2. Cost Structure
- 2.3.3. Critical Processing Technologies
- 2.3.4. Evaluation Of Critical Development Segments
- 2.3.5. TSV Device Forecast
- 2.4. Non-volatile Memory Devices MRAM, RRAM and FeRAM
- 2.4.1. Processing Requirements for MRAMs
- 2.4.2. Processing Requirements for RRAMs
- 2.4.3. Processing Requirements for FeRAMs
- 2.4.4. Roadmap for Commercialization
- 2.5. Ultrathin Wafers
- 2.5.1. Applications for Ultrathin Wafers
- 2.5.2. Substrate Thinning
- 2.5.3. Backside Metallization Requirements
- 2.5.4. Surface Stress Relief
- 2.5.5. Ultrathin Wafer Market
Chapter 3 Niche Markets for EQUIPMENT for SUB 300mm Wafers
- 3.1. Introduction
- 3.2. MEMs
- 3.2.1. The MEMS Market Infrastructure
- 3.2.2. Forecast Of The Key Applications And Markets
- MEMS Device Market Forecast
- MEMS System Market Forecast
- 3.2.3. Markets for Equipment and Materials Suppliers
- 3.3. HB-LEDs
- 3.3.1. Recent Progress in High Brightness LED Technology and Applications
- 3.3.2. LED Manufacturing Process. 3.
- 3.3.3. OLED Manufacturing Process
- 3.3.4. Outlook for the Worldwide HB-LED Market
- 3.4. Compound Semiconductors
- 3.4.1. GaAs Devices
- 3.4.2. Equipment Trends
- 3.4.3. Wafer Sizes
- 3.4.4. GaAs IC Market Forecast
- 3.4.5. Competing Against SiGe
- 3.4.6. Competing Against Gallium Nitride
- Costs
- Starting Material
- Epitaxial Growth
- Challenges
- R&D Needs
- 3.5. Thin Film Read/Write Heads for HDD
- 3.5.1. Trends in HDDs
- 3.5.2. Recording Head Market Forecast
- 3.5.3. Head Processing
- 3.5.4. Head Fabrication - CMP, Deposition, Lithography
- 3.5.5. CMP Challenges
- 3.5.6. Lithography Challenges
- 3.6 The Filtering Options Across Spectrum: SAW Vs. BAW
- 3.6.1 Surface Acoustic Wave (SAW) Filtering
- 3.6.2 Temperature Compensated SAW (TC-SAW)
- 3.6.3 Bulk Acoustic Wave (BAW) Filtering
- 3.6.4 Film Bulk Acoustic Resonator (FBAR)
- 3.6.5 Filter Market
TABLES
- 2.1. Common UBM Stacks For Solder And Gold Bumping
- 2.2. Solder Bumping Guidelines
- 2.3. ITRS Pin Counts For Different Applications
- 2.4. Pillar-WLP CSP Guidelines
- 2.5. Pad Redistribution Guidelines
- 2.6. UBM Film Etchants
- 2.7. Common UBM Stacks For Gold And Solder Bumping
- 2.8. WLP Demand By Device (Units)
- 2.9. WLP Demand By Device (Wafers)
- 2.10. Cost Of Ownership Comparison
- 2.11. Forecast Of TSV Devices By Wafers
- 3.1. MEMS Device Markets
- 3.2. MEMS System Markets
- 3.3. MEMS Equipment Markets
- 3.4. Current Status And Cost Targets For Panels Produced By Traditional Methods
- 3.5. Worldwide Led Market Forecast
- 3.6. GaAs IC Market Forecast
- 3.7. 5G Handset and RF Content Forecast
FIGURES
- 2.1. Solder Bumping Process
- 2.2. Pillar-WLPCSP Process
- 2.3. Pad Redistribution Process
- 2.4. Cost Of Ownership For 5 X 50 TSV VIA Middle
- 2.5. Cost Of CMP For TSV VIA Middle Process
- 2.6. Cost Of Ownership For 10 X 100 TSV Via Middle
- 2.7. Cost Structure Of TSVs 5 X 50 μm
- 2.8. Interposer TSV: Upscaling To 10 X 100 μm
- 2.9. TSV Downscaling To 3x50 μm
- 2.10. Cost Structure Of Different Vias And Tools
- 2.11. Via First Cost Of Ownership
- 2.12. Via First Cost Of Ownership Front And Back Side
- 2.13. Via First Process Flow
- 2.14. iTSV Versus pTSV Cost Of Ownership
- 2.15. Effect Of TSV Depth And Diameter On Cost
- 2.16. Illustration Of Bosch Process
- 2.17. Via First, Middle, And Last Process Flows
- 2.18. Via First TSV Process Flow
- 2.19. Forecast Of TSV Devices By Wafers
- 2.20. Comparison Of Non-Volatile RAM Write Times
- 2.21. Competition In Dissipation Speed And Memory Capacity
- 2.22. Comparison Of Non-Volatile RAM Technology
- 2.23. Comparison Of MRAM Technologies
- 2.24. Tunneling Magnetoresistive (TMR) Device For MRAM
- 2.25. Al / TiOx / Al "Sandwich Of An RRAM
- 2.26. Different FeERAM Cell Designs
- 2.27. MRAM Market Size
- 2.28. Wafer Thinning Forecast
- 3.1. LED-Based SSL Manufacturing Supply Chain
- 3.2. High-Power, Mid-Power, Chip-On-Board, And Chip Scale LED Packages
- 3.3. OLED-Based SSL Manufacturing Supply Chain
- 3.4. Schematic of GaAs MESFET
- 3.5. Schematic of GaAs HEMT Device
- 3.6. Schematic of GaAs HBT Device
- 3.7. Schematic of GaAs HBT Device
- 3.8. pHEMT MMIC Process Flow Chart
- 3.9. 0.15 Micron 3MI Process Cross Section
- 3.10. InGaP HBT Process
- 3.11. Hard Disk Drive Roadmap
- 3.12. Change In Average Price Of Storage
- 3.13. Heads Per Drive
- 3.14. Increase In Areal Density
- 3.15. Market Forecast Of Recording Head Consumption
- 3.16. Thin Film Head Structure
- 3.17. Critical Features In Thin Film Head Structure
- 3.18. Spin Valve Head Structure
- 3.19. Cross-Sectional View TFH Stacks
- 3.20. Cross-Sectional View Of A TFH Design
- 3.21. CMP Slurry System For TFH wafer Polishing
- 3.22. Critical Feature Trends In Thin Film Heads
- 3.23. SAW Filter Market Shares
- 3.24. BAW Filter Market Shares
- 3.25. Adaption Of Filters In Smartphone By Communications Generation
