利基市場上的化學物質及材料供應商市場和策略

本報告書內容包括:太陽能、MEMS、高亮度LED、HDD用薄膜導線／頭燈、晶圓加工等領域中的化學物質及材料供應商市場的趨勢彙整、各市場的趨勢和今後的預測和展望、內容綱要摘記如下:

第1章　介紹

第2章　太陽能

• 介紹
• 結晶・多結晶電池的製造
  • 矽成長和載體媒介搬運工具
  • 蝕刻和噴砂
  • 防止反射鍍膜
• 薄膜電池的製造
  • 微結晶矽氣相沉積
  • 微結晶矽氣相沉積
  • CdTe
  • CIGS
  • GaA
• 材料供應商市場
  • 結晶・多結晶電池
  • 薄膜電池
  • 化學物質及材料
• 奈米材料
  • 無機奈米結晶
  • CdSe及CdTe奈米管
  • 量子點
  • 奈米複合材料和量子點的合成
  • 量子井
  • 有機聚合物 - 富勒烯
  • 離子有機聚合物
  • CIGS
  • 色素増感太陽能電池
  • 太陽能電池專用奈米材料市場的分析

第3章　MEMS

• MEMS市場基礎建設
• 主要用途和市場預測
  • MEMS設備市場預測
  • MEMS系統市場預測
  • 材料供應商市場

第4章　高亮度LED（HB-LED）

• 高亮度LED技術及應用上近年的進歩
• 結構材料
  • 螢光物質
  • 基板
• OLED的製造
• 全球的OLED市場展望
• 全球的高亮度LED市場展望

第5章　HDD用薄膜導線／頭燈

• HDD趨勢
• 墨頭市場預測
• 頭燈加工
• 頭燈製造
• 氣相沉積課題
• CMP的課題
• CMP研磨墊市場

第6章　晶圓等級過程

• 介紹
• 生產覆晶晶片／WLP加工上的課題和趨勢
• 金屬化的課題和趨勢
• UBM蝕刻的課題和趨勢
  • 蝕刻過程
  • 蝕刻物質
• WLP市場分析

圖表

In this report we identify areas of related technologies where a small or mid-sized chemical and material companies can compete against larger competitors: Solar, MEMS, LEDs, HDD, and WLP.

Table of Contents

Chapter 1: Introduction

Chapter 2 Solar

• 2.1 Introduction
• 2.2 Crystalline and Polycrystalline Cell Manufacturing
  • 2.2.1 Silicon Growing and Wafering
  • 2.2.2 Etching and Texturing
  • 2.2.3 Anti-Reflection Coatings
• 2.3 Thin Film Cell Manufacturing
  • 2.3.1 Amorphous Silicon Deposition
  • 2.3.2 Microcrystalline Silicon Deposition
  • 2.3.3 CdTe - Cadmium Telluride Deposition
  • 2.3.4 CIGS - Copper Indium Gallium Selenide Deposition
  • 2.3.5 GaAs - Gallium Arsenide
• 2.4 Markets for Materials Suppliers
  • 2.4.1 Crystalline and Polycrystalline Cell Forecast
  • 2.4.2 Thin Film Cell Forecast
  • 2.4.3 Chemicals and Materials Forecast
• 2.5 Nanomaterials As Solar Conversion
  • 2.5.1 Inorganic Nanocrystals
  • 2.5.2 CdSe And CdTe Nanorods
  • 2.5.3 Quantum Dots
  • 2.5.4 Nanocomposite - Quantum Dot Combination
  • 2.5.5 Quantum Wells
  • 2.5.6 Organic Polymers - Fullerenes
  • 2.5.7 Ionic Organic Polymers
  • 2.5.8 CIGS
  • 2.5.9 Dye-Sensitized Solar Cells
  • 2.5.10 Analysis Of Nanomaterial Markets For Solar Cells

Chapter 3 MEMs

• 3.1 The MEMS Market Infrastructure
• 3.2 Forecast Of The Key Applications And Markets
  • 3.2.1 MEMS Device Market Forecast
  • 3.2.2 MEMS System Market Forecast
  • 3.3.2 Markets for Materials Suppliers

Chapter 4 HB-LEDs

• 4.1 Recent Progress in High Brightness LED Technology and Applications
• 4.2 Materials of Construction
  • 4.2.1 Phosphor
  • 4.2.2 Substrate
• 4.3 OLED Manufacturing
• 4.4 Outlook for the Worldwide OLED Market
• 4.5 Outlook for the Worldwide HB-LED Market

Chapter 5 Thin Film Read/Write Heads for HDD

• 5.1 Trends in HDDs
• 5.2 Recording Head Market Forecast
• 5.3 Head Processing
• 5.4 Head Fabrication -
• 5.5 Deposition Challenges
• 5.6 CMP Challenges
• 5.7 CMP Slurry Market
  • 5.7.1 Ceria Slurry For Glass Disk Market
  • 5.7.2 Oxide Slurry For Metal Disk Market
  • 5.7.3 Oxide Slurry For Thin Film Head Market

Chapter 6 Wafer Level Processing (WLP)

• 6.1 Introduction
• 6.2 Flip Chip/WLP Processing Issues and Trends
  • 6.2.1 Wafer Bumping
  • 6.2.2 Wafer Level Packaging
  • 6.2.3 Pad Redistribution
  • 6.2.4 Wafer Bumping Costs
• 6.3 Metallization Issues and Trends
  • 6.3.1 Gold Bumping Metallization
  • 6.3.2 Solder Bumping Metallization
• 6.4 UBM Etch Issues And Trends
  • 6.4.1 Etch Process
  • 6.4.2 Etch Chemistry
• 6.5 Analysis of WLP Market

List of Figures

• 2.1 Diagram Of Solar Cell
• 2.2 Cross Section Of A Solar Cell Under Illumination
• 2.3 Polysilicon Manufacturing And Supply Chain
• 2.4 Cross-Sectional Schematic Diagram Of The InGaP/InGaAs/Ge/ATJ Cell
• 2.5 Percentage Gas Costs For Amorphous Silicon Solar Cell
• 3.1 MEMs Chemicals Forecast
• 3.2 MEMs Photomasks Forecast
• 3.3 MEMs Substrate Forecast
• 3.4 Forecast of MEMs Wafer Size
• 4.1 Operation of LED
• 4.2 Market drivers for LED Biz and Applications
• 4.3 SSL vs. Classical Technologies
• 4.4 LED Performance vs. Traditional Light Sources
• 4.5 Regular LED (white) Front-End Steps
• 4.6 Packaged LED Cost Basis - 2009
• 4.7 Packaged LED Cost Basis - 2013
• 4.8 Regular LED (White) Production Costs For 100k Wafers/Year
• 4.9 HB LED (White) Production Costs For 100k Wafers/Year
• 4.10 LED Cost Model: Impact Of Substrate Choice
• 4.11 Main Manufacturing Steps For GaN-Based Led
• 4.12 Schematic Of AMOLED
• 4-13 Active Matrix OLED Capacity And Demand Forecast
• 5.1 Hard Disk Drive Roadmap
• 5.2 Decrease In Average Price Of Storage
• 5.3 Heads Per Drive
• 5.4 Market Forecast Of Recording Head Consumption
• 5.5 Heads Per Drive Forecast
• 5.6 Thin Film Head Structure
• 5.7 Critical Features In Thin Film Head Structure
• 5.8 Spin Valve Head Structure
• 5.9 Cross-Sectional View TFH Stacks
• 5.10 Cross-Sectional View Of A TFH Design
• 5.11 CMP Slurry System For TFH Wafer Polishing
• 5-12 Total Slurry Consumption For HDD Forecast
• 6.1 Solder Bumping Process
• 6.2 Pillar-WLP CSP Process
• 6.3 Pad Redistribution Process

List of Tables

• 2.1 Historic Solar Cell Production By Region
• 2.2 Solar Cell Forecast
• 2.3 Market Share Of Solar Cells By Technology
• 2.4 Cost Comparison Of Thin Film Technologies
• 2.5 Polysilicon Production Capacities By Company
• 2.6 Affect Of Substrate Material On Cigs Solar Efficiency
• 2.7 Forecast Of Transparent Electrodes For Photovoltaics
• 2.8 Solar Materials Forecast - Crystalline Silicon Cells
• 3.1 MEMS Device Market Forecast
• 3.2 MEMS System Markets Forecast
• 4.1 Color, Wavelength Material Of LED
• 4.2 Comparison of LED, HB-LED, UHB-LED Characteristics
• 4.3 Production Method for Various LEDs
• 4.4 Comparison Of $/Klm For LED Made On Various 2" Substrates
• 4.5 Forecast Of Sapphire Substrate Size Distribution By Area
• 4.6 Sapphire Substrate Market Forecast
• 4.7 Projected Costs Of OLED Lighting Panels (Sheet Processed) Stage
• 4.8 Projected Costs Of OLED Lighting Panels (Web Processed) Stage
• 4.9 Global LED Market Forecast
• 5.1 Slurry And Abrasive Suppliers And Products
• 5.2 Worldwide Ceria Slurry For Glass Media Market Forecast
• 5.3 Worldwide Oxide Slurry For Metal Market Forecast
• 5.4 Worldwide Oxide Slurry For Thin Film Heads Market Forecast
• 6.1 Common UBM Stacks For Solder And Gold Bumping
• 6.2 Solder Bumping Guidelines
• 6.3 ITRS Pin Counts For Different Applications
• 6.4 Pillar-WLP CSP Guidelines
• 6.5 Pad Redistribution Guidelines
• 6.6 Common UBM Stacks For Gold And Solder Bumping
• 6.7 UBM Film Etchants
• 6.8 WLP Demand By Device (Units)
• 6.9 WLP Demand By Device (Wafers)