市場調查報告書

半導體新型包裝的全球市場

Semiconductor Advanced Packaging

出版商 Global Industry Analysts, Inc. 商品編碼 941223
出版日期 內容資訊 英文 184 Pages
商品交期: 最快1-2個工作天內
價格
半導體新型包裝的全球市場 Semiconductor Advanced Packaging
出版日期: 2020年07月01日內容資訊: 英文 184 Pages
簡介

COVID-19危機中,2020年估算為320億美元的半導體新型包裝全球市場被預測,預測在2020年∼2027年間將以4.7%的年複合成長率增長,2027年之前達到442億美元的規模。市場區隔之一的覆晶部門在分析期間結束前預測將以4.5%的年複合成長率增長,達到344億美元的規模。

本報告提供半導體新型包裝的市場調查,彙整市場定義和概要,市場成長的各種影響因素分析,市場規模的變化與預測,各種區分·地區·各主要國家的詳細分析,競爭環境,主要企業簡介等資料。

調查對象企業範例

  • Amkor Technology, Inc.
  • ASE Technology Holding, Co., Ltd.
  • China Wafer Level CSP Co., Ltd.
  • ChipMOS Technologies, Inc.
  • FlipChip International LLC
  • HANA Micron Inc.
  • Jiangsu Changjiang Electronics Technology Co., Ltd.
  • King Yuan Electronics Corp. (KYEC)
  • Nepes Corporation
  • Powertech Technology, Inc.
  • Samsung Semiconductor, Inc.
  • SIGNETICS
  • Tianshui Huatian Technology Co., Ltd.
  • TongFu Microelectronics Co., Ltd.
  • TSMC Ltd.
  • UTAC Holdings Ltd.
  • Veeco Instruments Inc.

目錄

I. 簡介,調查手法 、 調查範圍

II. 摘要整理

第1章 市場概要

  • 全球其他競爭公司的市場佔有率
  • 全球半導體新型包裝的其他競爭公司的市場佔有率方案(%):2019年及2025年
  • Covid-19的影響和即將到來的全球景氣衰退

第2章 主要企業

第3章 市場趨勢與推動因素

第4章 全球市場預測

III. 市場分析

  • 各地區市場分析
  • 美國
  • 加拿大
  • 日本
  • 中國
  • 歐洲
  • 法國
  • 德國
  • 義大利
  • 英國
  • 其他歐洲
  • 亞太地區
  • 其他地區

IV. 競爭

  • 企業簡介:46
目錄
Product Code: MCP14658

Global Semiconductor Advanced Packaging Market to Reach $44.2 Billion by 2027

Amid the COVID-19 crisis, the global market for Semiconductor Advanced Packaging estimated at US$32 Billion in the year 2020, is projected to reach a revised size of US$44.2 Billion by 2027, growing at a CAGR of 4.7% over the analysis period 2020-2027. Flip Chip Packaging, one of the segments analyzed in the report, is projected to record a 4.5% CAGR and reach US$34.4 Billion by the end of the analysis period. After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the FI WLP segment is readjusted to a revised 5.9% CAGR for the next 7-year period.

The U.S. Market is Estimated at $9.4 Billion, While China is Forecast to Grow at 4.5% CAGR

The Semiconductor Advanced Packaging market in the U.S. is estimated at US$9.4 Billion in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$7.8 Billion by the year 2027 trailing a CAGR of 4.5% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 4.4% and 4% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 4.5% CAGR.

2.5D/3D Packaging Segment to Record 6.3% CAGR

In the global 2.5D/3D Packaging segment, USA, Canada, Japan, China and Europe will drive the 6.5% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$1.7 Billion in the year 2020 will reach a projected size of US$2.7 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$4.9 Billion by the year 2027.We bring years of research experience to this 9th edition of our report. The 184-page report presents concise insights into how the pandemic has impacted production and the buy side for 2020 and 2021. A short-term phased recovery by key geography is also addressed.

Competitors identified in this market include, among others,

  • Amkor Technology, Inc.
  • ASE Technology Holding, Co., Ltd.
  • China Wafer Level CSP Co., Ltd.
  • ChipMOS Technologies, Inc.
  • FlipChip International LLC
  • HANA Micron Inc.
  • Jiangsu Changjiang Electronics Technology Co., Ltd.
  • King Yuan Electronics Corp. (KYEC)
  • Nepes Corporation
  • Powertech Technology, Inc.
  • Samsung Semiconductor, Inc.
  • SIGNETICS
  • Tianshui Huatian Technology Co., Ltd.
  • TongFu Microelectronics Co., Ltd.
  • TSMC Ltd.
  • UTAC Holdings Ltd.
  • Veeco Instruments Inc.

TABLE OF CONTENTS

I. INTRODUCTION, METHODOLOGY & REPORT SCOPE

II. EXECUTIVE SUMMARY

1. MARKET OVERVIEW

  • Global Competitor Market Shares
  • Semiconductor Advanced Packaging Competitor Market Share Scenario Worldwide (in %): 2019 & 2025
  • Impact of Covid-19 and a Looming Global Recession

2. FOCUS ON SELECT PLAYERS

3. MARKET TRENDS & DRIVERS

4. GLOBAL MARKET PERSPECTIVE

  • TABLE 1: Semiconductor Advanced Packaging Global Market Estimates and Forecasts in US$ Million by Region/Country: 2020-2027
  • TABLE 2: Semiconductor Advanced Packaging Global Retrospective Market Scenario in US$ Million by Region/Country: 2012-2019
  • TABLE 3: Semiconductor Advanced Packaging Market Share Shift across Key Geographies Worldwide: 2012 VS 2020 VS 2027
  • TABLE 4: Flip Chip Packaging (Packaging Technology) World Market by Region/Country in US$ Million: 2020 to 2027
  • TABLE 5: Flip Chip Packaging (Packaging Technology) Historic Market Analysis by Region/Country in US$ Million: 2012 to 2019
  • TABLE 6: Flip Chip Packaging (Packaging Technology) Market Share Breakdown of Worldwide Sales by Region/Country: 2012 VS 2020 VS 2027
  • TABLE 7: FI WLP (Packaging Technology) Potential Growth Markets Worldwide in US$ Million: 2020 to 2027
  • TABLE 8: FI WLP (Packaging Technology) Historic Market Perspective by Region/Country in US$ Million: 2012 to 2019
  • TABLE 9: FI WLP (Packaging Technology) Market Sales Breakdown by Region/Country in Percentage: 2012 VS 2020 VS 2027
  • TABLE 10: 2.5D/3D Packaging (Packaging Technology) Geographic Market Spread Worldwide in US$ Million: 2020 to 2027
  • TABLE 11: 2.5D/3D Packaging (Packaging Technology) Region Wise Breakdown of Global Historic Demand in US$ Million: 2012 to 2019
  • TABLE 12: 2.5D/3D Packaging (Packaging Technology) Market Share Distribution in Percentage by Region/Country: 2012 VS 2020 VS 2027
  • TABLE 13: FO WLP (Packaging Technology) World Market Estimates and Forecasts by Region/Country in US$ Million: 2020 to 2027
  • TABLE 14: FO WLP (Packaging Technology) Market Historic Review by Region/Country in US$ Million: 2012 to 2019
  • TABLE 15: FO WLP (Packaging Technology) Market Share Breakdown by Region/Country: 2012 VS 2020 VS 2027
  • TABLE 16: Analog & Mixed ICs (Device) World Market by Region/Country in US$ Million: 2020 to 2027
  • TABLE 17: Analog & Mixed ICs (Device) Historic Market Analysis by Region/Country in US$ Million: 2012 to 2019
  • TABLE 18: Analog & Mixed ICs (Device) Market Share Distribution in Percentage by Region/Country: 2012 VS 2020 VS 2027
  • TABLE 19: MEMS & Sensors (Device) World Market Estimates and Forecasts in US$ Million by Region/Country: 2020 to 2027
  • TABLE 20: MEMS & Sensors (Device) Market Worldwide Historic Review by Region/Country in US$ Million: 2012 to 2019
  • TABLE 21: MEMS & Sensors (Device) Market Percentage Share Distribution by Region/Country: 2012 VS 2020 VS 2027
  • TABLE 22: Other Devices (Device) Market Opportunity Analysis Worldwide in US$ Million by Region/Country: 2020 to 2027
  • TABLE 23: Other Devices (Device) Global Historic Demand in US$ Million by Region/Country: 2012 to 2019
  • TABLE 24: Other Devices (Device) Market Share Distribution in Percentage by Region/Country: 2012 VS 2020 VS 2027

III. MARKET ANALYSIS

  • GEOGRAPHIC MARKET ANALYSIS
  • UNITED STATES
    • Market Facts & Figures
    • US Semiconductor Advanced Packaging Market Share (in %) by Company: 2019 & 2025
    • Market Analytics
    • TABLE 25: United States Semiconductor Advanced Packaging Market Estimates and Projections in US$ Million by Packaging Technology: 2020 to 2027
    • TABLE 26: Semiconductor Advanced Packaging Market in the United States by Packaging Technology: A Historic Review in US$ Million for 2012-2019
    • TABLE 27: United States Semiconductor Advanced Packaging Market Share Breakdown by Packaging Technology: 2012 VS 2020 VS 2027
    • TABLE 28: United States Semiconductor Advanced Packaging Market Estimates and Projections in US$ Million by Device: 2020 to 2027
    • TABLE 29: Semiconductor Advanced Packaging Market in the United States by Device: A Historic Review in US$ Million for 2012-2019
    • TABLE 30: United States Semiconductor Advanced Packaging Market Share Breakdown by Device: 2012 VS 2020 VS 2027
  • CANADA
    • TABLE 31: Canadian Semiconductor Advanced Packaging Market Estimates and Forecasts in US$ Million by Packaging Technology: 2020 to 2027
    • TABLE 32: Canadian Semiconductor Advanced Packaging Historic Market Review by Packaging Technology in US$ Million: 2012-2019
    • TABLE 33: Semiconductor Advanced Packaging Market in Canada: Percentage Share Breakdown of Sales by Packaging Technology for 2012, 2020, and 2027
    • TABLE 34: Canadian Semiconductor Advanced Packaging Market Estimates and Forecasts in US$ Million by Device: 2020 to 2027
    • TABLE 35: Canadian Semiconductor Advanced Packaging Historic Market Review by Device in US$ Million: 2012-2019
    • TABLE 36: Semiconductor Advanced Packaging Market in Canada: Percentage Share Breakdown of Sales by Device for 2012, 2020, and 2027
  • JAPAN
    • TABLE 37: Japanese Market for Semiconductor Advanced Packaging: Annual Sales Estimates and Projections in US$ Million by Packaging Technology for the Period 2020-2027
    • TABLE 38: Semiconductor Advanced Packaging Market in Japan: Historic Sales Analysis in US$ Million by Packaging Technology for the Period 2012-2019
    • TABLE 39: Japanese Semiconductor Advanced Packaging Market Share Analysis by Packaging Technology: 2012 VS 2020 VS 2027
    • TABLE 40: Japanese Market for Semiconductor Advanced Packaging: Annual Sales Estimates and Projections in US$ Million by Device for the Period 2020-2027
    • TABLE 41: Semiconductor Advanced Packaging Market in Japan: Historic Sales Analysis in US$ Million by Device for the Period 2012-2019
    • TABLE 42: Japanese Semiconductor Advanced Packaging Market Share Analysis by Device: 2012 VS 2020 VS 2027
  • CHINA
    • TABLE 43: Chinese Semiconductor Advanced Packaging Market Growth Prospects in US$ Million by Packaging Technology for the Period 2020-2027
    • TABLE 44: Semiconductor Advanced Packaging Historic Market Analysis in China in US$ Million by Packaging Technology: 2012-2019
    • TABLE 45: Chinese Semiconductor Advanced Packaging Market by Packaging Technology: Percentage Breakdown of Sales for 2012, 2020, and 2027
    • TABLE 46: Chinese Semiconductor Advanced Packaging Market Growth Prospects in US$ Million by Device for the Period 2020-2027
    • TABLE 47: Semiconductor Advanced Packaging Historic Market Analysis in China in US$ Million by Device: 2012-2019
    • TABLE 48: Chinese Semiconductor Advanced Packaging Market by Device: Percentage Breakdown of Sales for 2012, 2020, and 2027
  • EUROPE
    • Market Facts & Figures
    • European Semiconductor Advanced Packaging Market: Competitor Market Share Scenario (in %) for 2019 & 2025
    • Market Analytics
    • TABLE 49: European Semiconductor Advanced Packaging Market Demand Scenario in US$ Million by Region/Country: 2020-2027
    • TABLE 50: Semiconductor Advanced Packaging Market in Europe: A Historic Market Perspective in US$ Million by Region/Country for the Period 2012-2019
    • TABLE 51: European Semiconductor Advanced Packaging Market Share Shift by Region/Country: 2012 VS 2020 VS 2027
    • TABLE 52: European Semiconductor Advanced Packaging Market Estimates and Forecasts in US$ Million by Packaging Technology: 2020-2027
    • TABLE 53: Semiconductor Advanced Packaging Market in Europe in US$ Million by Packaging Technology: A Historic Review for the Period 2012-2019
    • TABLE 54: European Semiconductor Advanced Packaging Market Share Breakdown by Packaging Technology: 2012 VS 2020 VS 2027
    • TABLE 55: European Semiconductor Advanced Packaging Market Estimates and Forecasts in US$ Million by Device: 2020-2027
    • TABLE 56: Semiconductor Advanced Packaging Market in Europe in US$ Million by Device: A Historic Review for the Period 2012-2019
    • TABLE 57: European Semiconductor Advanced Packaging Market Share Breakdown by Device: 2012 VS 2020 VS 2027
  • FRANCE
    • TABLE 58: Semiconductor Advanced Packaging Market in France by Packaging Technology: Estimates and Projections in US$ Million for the Period 2020-2027
    • TABLE 59: French Semiconductor Advanced Packaging Historic Market Scenario in US$ Million by Packaging Technology: 2012-2019
    • TABLE 60: French Semiconductor Advanced Packaging Market Share Analysis by Packaging Technology: 2012 VS 2020 VS 2027
    • TABLE 61: Semiconductor Advanced Packaging Market in France by Device: Estimates and Projections in US$ Million for the Period 2020-2027
    • TABLE 62: French Semiconductor Advanced Packaging Historic Market Scenario in US$ Million by Device: 2012-2019
    • TABLE 63: French Semiconductor Advanced Packaging Market Share Analysis by Device: 2012 VS 2020 VS 2027
  • GERMANY
    • TABLE 64: Semiconductor Advanced Packaging Market in Germany: Recent Past, Current and Future Analysis in US$ Million by Packaging Technology for the Period 2020-2027
    • TABLE 65: German Semiconductor Advanced Packaging Historic Market Analysis in US$ Million by Packaging Technology: 2012-2019
    • TABLE 66: German Semiconductor Advanced Packaging Market Share Breakdown by Packaging Technology: 2012 VS 2020 VS 2027
    • TABLE 67: Semiconductor Advanced Packaging Market in Germany: Recent Past, Current and Future Analysis in US$ Million by Device for the Period 2020-2027
    • TABLE 68: German Semiconductor Advanced Packaging Historic Market Analysis in US$ Million by Device: 2012-2019
    • TABLE 69: German Semiconductor Advanced Packaging Market Share Breakdown by Device: 2012 VS 2020 VS 2027
  • ITALY
    • TABLE 70: Italian Semiconductor Advanced Packaging Market Growth Prospects in US$ Million by Packaging Technology for the Period 2020-2027
    • TABLE 71: Semiconductor Advanced Packaging Historic Market Analysis in Italy in US$ Million by Packaging Technology: 2012-2019
    • TABLE 72: Italian Semiconductor Advanced Packaging Market by Packaging Technology: Percentage Breakdown of Sales for 2012, 2020, and 2027
    • TABLE 73: Italian Semiconductor Advanced Packaging Market Growth Prospects in US$ Million by Device for the Period 2020-2027
    • TABLE 74: Semiconductor Advanced Packaging Historic Market Analysis in Italy in US$ Million by Device: 2012-2019
    • TABLE 75: Italian Semiconductor Advanced Packaging Market by Device: Percentage Breakdown of Sales for 2012, 2020, and 2027
  • UNITED KINGDOM
    • TABLE 76: United Kingdom Market for Semiconductor Advanced Packaging: Annual Sales Estimates and Projections in US$ Million by Packaging Technology for the Period 2020-2027
    • TABLE 77: Semiconductor Advanced Packaging Market in the United Kingdom: Historic Sales Analysis in US$ Million by Packaging Technology for the Period 2012-2019
    • TABLE 78: United Kingdom Semiconductor Advanced Packaging Market Share Analysis by Packaging Technology: 2012 VS 2020 VS 2027
    • TABLE 79: United Kingdom Market for Semiconductor Advanced Packaging: Annual Sales Estimates and Projections in US$ Million by Device for the Period 2020-2027
    • TABLE 80: Semiconductor Advanced Packaging Market in the United Kingdom: Historic Sales Analysis in US$ Million by Device for the Period 2012-2019
    • TABLE 81: United Kingdom Semiconductor Advanced Packaging Market Share Analysis by Device: 2012 VS 2020 VS 2027
  • REST OF EUROPE
    • TABLE 82: Rest of Europe Semiconductor Advanced Packaging Market Estimates and Forecasts in US$ Million by Packaging Technology: 2020-2027
    • TABLE 83: Semiconductor Advanced Packaging Market in Rest of Europe in US$ Million by Packaging Technology: A Historic Review for the Period 2012-2019
    • TABLE 84: Rest of Europe Semiconductor Advanced Packaging Market Share Breakdown by Packaging Technology: 2012 VS 2020 VS 2027
    • TABLE 85: Rest of Europe Semiconductor Advanced Packaging Market Estimates and Forecasts in US$ Million by Device: 2020-2027
    • TABLE 86: Semiconductor Advanced Packaging Market in Rest of Europe in US$ Million by Device: A Historic Review for the Period 2012-2019
    • TABLE 87: Rest of Europe Semiconductor Advanced Packaging Market Share Breakdown by Device: 2012 VS 2020 VS 2027
  • ASIA-PACIFIC
    • TABLE 88: Semiconductor Advanced Packaging Market in Asia-Pacific by Packaging Technology: Estimates and Projections in US$ Million for the Period 2020-2027
    • TABLE 89: Asia-Pacific Semiconductor Advanced Packaging Historic Market Scenario in US$ Million by Packaging Technology: 2012-2019
    • TABLE 90: Asia-Pacific Semiconductor Advanced Packaging Market Share Analysis by Packaging Technology: 2012 VS 2020 VS 2027
    • TABLE 91: Semiconductor Advanced Packaging Market in Asia-Pacific by Device: Estimates and Projections in US$ Million for the Period 2020-2027
    • TABLE 92: Asia-Pacific Semiconductor Advanced Packaging Historic Market Scenario in US$ Million by Device: 2012-2019
    • TABLE 93: Asia-Pacific Semiconductor Advanced Packaging Market Share Analysis by Device: 2012 VS 2020 VS 2027
  • REST OF WORLD
    • TABLE 94: Rest of World Semiconductor Advanced Packaging Market Estimates and Forecasts in US$ Million by Packaging Technology: 2020 to 2027
    • TABLE 95: Rest of World Semiconductor Advanced Packaging Historic Market Review by Packaging Technology in US$ Million: 2012-2019
    • TABLE 96: Semiconductor Advanced Packaging Market in Rest of World: Percentage Share Breakdown of Sales by Packaging Technology for 2012, 2020, and 2027
    • TABLE 97: Rest of World Semiconductor Advanced Packaging Market Estimates and Forecasts in US$ Million by Device: 2020 to 2027
    • TABLE 98: Rest of World Semiconductor Advanced Packaging Historic Market Review by Device in US$ Million: 2012-2019
    • TABLE 99: Semiconductor Advanced Packaging Market in Rest of World: Percentage Share Breakdown of Sales by Device for 2012, 2020, and 2027

IV. COMPETITION

  • Total Companies Profiled: 46