表紙
市場調查報告書

3D晶片(3D IC)的全球市場

3D Chips (3D IC)

出版商 Global Industry Analysts, Inc. 商品編碼 912793
出版日期 內容資訊 英文 108 Pages
商品交期: 最快1-2個工作天內
價格
3D晶片(3D IC)的全球市場 3D Chips (3D IC)
出版日期: 2020年07月01日內容資訊: 英文 108 Pages
簡介

本報告提供全球3D晶片(3D IC)市場調查,提供市場概要,各產品(存儲裝置,LED,感測器,MEMS),各地區的市場佔有率,需求趨勢,銷售額的變化與預測,市場成長要素,競爭情形,主要企業的簡介等全面性資訊。

第1章 調查手法

第2章 摘要整理

  • 市場概要
    • 競爭企業的市場佔有率
    • 競爭企業的市場佔有率:方案
  • 關注企業
  • 市場趨勢和成長要素
  • 全球市場預測

第3章 市場分析

  • 地區市場分析
  • 美國
    • 市場概要
    • 市場佔有率:各企業
  • 加拿大
  • 日本
  • 中國
  • 歐洲
  • 法國
  • 德國
  • 義大利
  • 英國
  • 其他歐洲各國
  • 亞太地區
  • 其他地區

第4章 競爭情形

  • ASE TECHNOLOGY HOLDING, CO., LTD.
  • TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TSMC)
  • 東芝
  • AMKOR TECHNOLOGY, INC.
  • APPLIED MATERIALS, INC.
  • MICRON TECHNOLOGY, INC.
  • NVIDIA CORPORATION
  • Renesas Electronics
  • STATS CHIPPAC PTE.
  • STMICROELECTRONICS NV

第5章 調查資料

目錄
Product Code: MCP-6575

Global 3D Chips (3D IC) Market to Reach $22.4 Billion by 2027

Amid the COVID-19 crisis, the global market for 3D Chips (3D IC) estimated at US$7.2 Billion in the year 2020, is projected to reach a revised size of US$22.4 Billion by 2027, growing at a CAGR of 17.7% over the analysis period 2020-2027. Memory, one of the segments analyzed in the report, is projected to record a 18.9% CAGR and reach US$10.7 Billion by the end of the analysis period. After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the LEDs segment is readjusted to a revised 17.9% CAGR for the next 7-year period.

The U.S. Market is Estimated at $2.1 Billion, While China is Forecast to Grow at 17% CAGR

The 3D Chips (3D IC) market in the U.S. is estimated at US$2.1 Billion in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$3.9 Billion by the year 2027 trailing a CAGR of 17% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 15.8% and 15.2% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 13% CAGR.

Sensors Segment to Record 16.3% CAGR

In the global Sensors segment, USA, Canada, Japan, China and Europe will drive the 16.2% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$994.4 Million in the year 2020 will reach a projected size of US$2.8 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$2.7 Billion by the year 2027.We bring years of research experience to this 19th edition of our report. The 108-page report presents concise insights into how the pandemic has impacted production and the buy side for 2020 and 2021. A short-term phased recovery by key geography is also addressed.

Competitors identified in this market include, among others,

  • Amkor Technology, Inc.
  • Applied Materials, Inc.
  • ASE Technology Holding, Co., Ltd.
  • Micron Technology, Inc.
  • NVIDIA Corporation
  • Renesas Electronics Corporation
  • STATS ChipPAC Pte., Ltd.
  • STMicroelectronics NV
  • Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC)
  • Toshiba Corporation

TABLE OF CONTENTS

  • I. INTRODUCTION, METHODOLOGY & REPORT SCOPE

II. EXECUTIVE SUMMARY

1. MARKET OVERVIEW

  • Global Competitor Market Shares
  • 3D Chips (3D IC) Competitor Market Share Scenario Worldwide (in %): 2019 & 2028
  • Impact of Covid-19 and a Looming Global Recession

2. FOCUS ON SELECT PLAYERS

3. MARKET TRENDS & DRIVERS

4. GLOBAL MARKET PERSPECTIVE

  • TABLE 1: 3D Chips (3D IC) Global Market Estimates and Forecasts in US$ Million by Region/Country: 2020-2027
  • TABLE 2: 3D Chips (3D IC) Market Share Shift across Key Geographies Worldwide: 2020 VS 2027
  • TABLE 3: Memory (Product) World Market by Region/Country in US$ Million: 2020 to 2027
  • TABLE 4: Memory (Product) Market Share Breakdown of Worldwide Sales by Region/Country: 2020 VS 2027
  • TABLE 5: LEDs (Product) Potential Growth Markets Worldwide in US$ Million: 2020 to 2027
  • TABLE 6: LEDs (Product) Market Sales Breakdown by Region/Country in Percentage: 2020 VS 2027
  • TABLE 7: Sensors (Product) Geographic Market Spread Worldwide in US$ Million: 2020 to 2027
  • TABLE 8: Sensors (Product) Market Share Distribution in Percentage by Region/Country: 2020 VS 2027
  • TABLE 9: MEMS (Product) World Market Estimates and Forecasts by Region/Country in US$ Million: 2020 to 2027
  • TABLE 10: MEMS (Product) Market Share Breakdown by Region/Country: 2020 VS 2027

III. MARKET ANALYSIS

  • GEOGRAPHIC MARKET ANALYSIS
  • UNITED STATES
    • Market Facts & Figures
    • US 3D Chips (3D IC) Market Share (in %) by Company: 2019 & 2025
    • Market Analytics
    • TABLE 11: United States 3D Chips (3D IC) Market Estimates and Projections in US$ Million by Product: 2020 to 2027
    • TABLE 12: United States 3D Chips (3D IC) Market Share Breakdown by Product: 2020 VS 2027
  • CANADA
    • TABLE 13: Canadian 3D Chips (3D IC) Market Estimates and Forecasts in US$ Million by Product: 2020 to 2027
    • TABLE 14: 3D Chips (3D IC) Market in Canada: Percentage Share Breakdown of Sales by Product for 2020 and 2027
  • JAPAN
    • TABLE 15: Japanese Market for 3D Chips (3D IC): Annual Sales Estimates and Projections in US$ Million by Product for the Period 2020-2027
    • TABLE 16: Japanese 3D Chips (3D IC) Market Share Analysis by Product: 2020 VS 2027
  • CHINA
    • TABLE 17: Chinese 3D Chips (3D IC) Market Growth Prospects in US$ Million by Product for the Period 2020-2027
    • TABLE 18: Chinese 3D Chips (3D IC) Market by Product: Percentage Breakdown of Sales for 2020 and 2027
  • EUROPE
    • Market Facts & Figures
    • European 3D Chips (3D IC) Market: Competitor Market Share Scenario (in %) for 2019 & 2025
    • Market Analytics
    • TABLE 19: European 3D Chips (3D IC) Market Demand Scenario in US$ Million by Region/Country: 2018-2025
    • TABLE 20: European 3D Chips (3D IC) Market Share Shift by Region/Country:
  • 2020 VS 2027
    • TABLE 21: European 3D Chips (3D IC) Market Estimates and Forecasts in US$ Million by Product: 2020-2027
    • TABLE 22: European 3D Chips (3D IC) Market Share Breakdown by Product:
  • 2020 VS 2027
  • FRANCE
    • TABLE 23: 3D Chips (3D IC) Market in France by Product: Estimates and Projections in US$ Million for the Period 2020-2027
    • TABLE 24: French 3D Chips (3D IC) Market Share Analysis by Product: 2020 VS 2027
  • GERMANY
    • TABLE 25: 3D Chips (3D IC) Market in Germany: Recent Past, Current and Future Analysis in US$ Million by Product for the Period 2020-2027
    • TABLE 26: German 3D Chips (3D IC) Market Share Breakdown by Product: 2020 VS 2027
  • ITALY
    • TABLE 27: Italian 3D Chips (3D IC) Market Growth Prospects in US$ Million by Product for the Period 2020-2027
    • TABLE 28: Italian 3D Chips (3D IC) Market by Product: Percentage Breakdown of Sales for 2020 and 2027
  • UNITED KINGDOM
    • TABLE 29: United Kingdom Market for 3D Chips (3D IC): Annual Sales Estimates and Projections in US$ Million by Product for the Period 2020-2027
    • TABLE 30: United Kingdom 3D Chips (3D IC) Market Share Analysis by Product: 2020 VS 2027
  • REST OF EUROPE
    • TABLE 31: Rest of Europe 3D Chips (3D IC) Market Estimates and Forecasts in US$ Million by Product: 2020-2027
    • TABLE 32: Rest of Europe 3D Chips (3D IC) Market Share Breakdown by Product: 2020 VS 2027
  • ASIA-PACIFIC
    • TABLE 33: 3D Chips (3D IC) Market in Asia-Pacific by Product: Estimates and Projections in US$ Million for the Period 2020-2027
    • TABLE 34: Asia-Pacific 3D Chips (3D IC) Market Share Analysis by Product: 2020 VS 2027
  • REST OF WORLD
    • TABLE 35: Rest of World 3D Chips (3D IC) Market Estimates and Forecasts in US$ Million by Product: 2020 to 2027
    • TABLE 36: 3D Chips (3D IC) Market in Rest of World: Percentage Share Breakdown of Sales by Product for 2020 and 2027

IV. COMPETITION

  • Total Companies Profiled: 38