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市場調查報告書

覆晶技術的全球市場

Flip Chip Technology

出版商 Global Industry Analysts, Inc. 商品編碼 906854
出版日期 內容資訊 英文 151 Pages
商品交期: 最快1-2個工作天內
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覆晶技術的全球市場 Flip Chip Technology
出版日期: 2019年10月01日內容資訊: 英文 151 Pages
簡介

本報告提供全球覆晶技術市場調查,提供市場概要,各市場區隔(用途·晶圓凸塊(晶圓植球)工程)·各地區的市場佔有率,市場成長要素,競爭情形,主要企業的簡介等全面性資訊。

第1章 調查手法

第2章 摘要整理

  • 市場概要
    • 競爭企業的市場佔有率
    • 競爭企業的市場佔有率:方案
  • 關注企業
  • 市場趨勢和成長要素
  • 全球市場預測

第3章 市場分析

  • 地區市場分析
  • 美國
    • 市場概要
    • 市場佔有率:各企業
  • 加拿大
  • 日本
  • 中國
  • 歐洲
  • 法國
  • 德國
  • 義大利
  • 英國
  • 其他歐洲各國
  • 亞太地區
  • 其他地區

第4章 競爭情形

  • ASE GROUP
  • AMKOR TECHNOLOGY
  • INTEL CORPORATION
  • JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY
  • POWERTECH TECHNOLOGY
  • STATS CHIPPAC PTE.
  • SAMSUNG ELECTRONICS CO., LTD.
  • SILICONWARE PRECISION INDUSTRIES CO., LTD. (SPIL)
  • TAIWAN SEMICONDUCTOR MANUFACTURING
  • UNITED MICROELECTRONICS CORPORATION

第5章 調查資料

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目錄
Product Code: MCP11997

Flip Chip Technology market worldwide is projected to grow by US$13.1 Billion, driven by a compounded growth of 6.8%. Copper (Cu) Pillar, one of the segments analyzed and sized in this study, displays the potential to grow at over 7.3%. The shifting dynamics supporting this growth makes it critical for businesses in this space to keep abreast of the changing pulse of the market. Poised to reach over US$17.1 Billion by the year 2025, Copper (Cu) Pillar will bring in healthy gains adding significant momentum to global growth.

Representing the developed world, the United States will maintain a 7.8% growth momentum. Within Europe, which continues to remain an important element in the world economy, Germany will add over US$598.3 Million to the region's size and clout in the next 5 to 6 years. Over US$611.5 Million worth of projected demand in the region will come from Rest of Europe markets. In Japan, Copper (Cu) Pillar will reach a market size of US$1.4 Billion by the close of the analysis period. As the world's second largest economy and the new game changer in global markets, China exhibits the potential to grow at 6.5% over the next couple of years and add approximately US$2.3 Billion in terms of addressable opportunity for the picking by aspiring businesses and their astute leaders. Presented in visually rich graphics are these and many more need-to-know quantitative data important in ensuring quality of strategy decisions, be it entry into new markets or allocation of resources within a portfolio. Several macroeconomic factors and internal market forces will shape growth and development of demand patterns in emerging countries in Asia-Pacific. All research viewpoints presented are based on validated engagements from influencers in the market, whose opinions supersede all other research methodologies.

Competitors identified in this market include, among others, Amkor Technology, Inc.; ASE Group; Intel Corporation; Jiangsu Changjiang Electronics Technology Co., Ltd.; Powertech Technology, Inc.; Samsung Electronics Co., Ltd.; Siliconware Precision Industries Co., Ltd. (SPIL); STATS ChipPAC Pte., Ltd.; Taiwan Semiconductor Manufacturing Co., Ltd.; United Microelectronics Corporation

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

1. MARKET OVERVIEW

  • Global Competitor Market Shares
  • Flip Chip Technology Competitor Market Share Scenario Worldwide (in %): 2019 & 2025

2. FOCUS ON SELECT PLAYERS

3. MARKET TRENDS & DRIVERS

4. GLOBAL MARKET PERSPECTIVE

  • TABLE 1: Flip Chip Technology Global Market Estimates and Forecasts in US$ Million by Region/Country: 2018-2025
  • TABLE 2: Flip Chip Technology Global Retrospective Market Scenario in US$ Million by Region/Country: 2009-2017
  • TABLE 3: Flip Chip Technology Market Share Shift across Key Geographies Worldwide: 2009 VS 2019 VS 2025
  • TABLE 4: Copper (Cu) Pillar (Wafer Bumping Process) World Market by Region/Country in US$ Million: 2018 to 2025
  • TABLE 5: Copper (Cu) Pillar (Wafer Bumping Process) Historic Market Analysis by Region/Country in US$ Million: 2009 to 2017
  • TABLE 6: Copper (Cu) Pillar (Wafer Bumping Process) Market Share Breakdown of Worldwide Sales by Region/Country: 2009 VS 2019 VS 2025
  • TABLE 7: Lead-Free (Wafer Bumping Process) Potential Growth Markets Worldwide in US$ Million: 2018 to 2025
  • TABLE 8: Lead-Free (Wafer Bumping Process) Historic Market Perspective by Region/Country in US$ Million: 2009 to 2017
  • TABLE 9: Lead-Free (Wafer Bumping Process) Market Sales Breakdown by Region/Country in Percentage: 2009 VS 2019 VS 2025
  • TABLE 10: Tin/Lead Eutectic Solder (Wafer Bumping Process) Geographic Market Spread Worldwide in US$ Million: 2018 to 2025
  • TABLE 11: Tin/Lead Eutectic Solder (Wafer Bumping Process) Region Wise Breakdown of Global Historic Demand in US$ Million: 2009 to 2017
  • TABLE 12: Tin/Lead Eutectic Solder (Wafer Bumping Process) Market Share Distribution in Percentage by Region/Country: 2009 VS 2019 VS 2025
  • TABLE 13: Gold Stud+ Plated Solder (Wafer Bumping Process) World Market Estimates and Forecasts by Region/Country in US$ Million: 2018 to 2025
  • TABLE 14: Gold Stud+ Plated Solder (Wafer Bumping Process) Market Historic Review by Region/Country in US$ Million: 2009 to 2017
  • TABLE 15: Gold Stud+ Plated Solder (Wafer Bumping Process) Market Share Breakdown by Region/Country: 2009 VS 2019 VS 2025
  • TABLE 16: Consumer Electronics (Application) Worldwide Latent Demand Forecasts in US$ Million by Region/Country: 2018-2025
  • TABLE 17: Consumer Electronics (Application) Global Historic Analysis in US$ Million by Region/Country: 2009-2017
  • TABLE 18: Consumer Electronics (Application) Distribution of Global Sales by Region/Country: 2009 VS 2019 VS 2025
  • TABLE 19: Telecommunication (Application) Sales Estimates and Forecasts in US$ Million by Region/Country for the Years 2018 through 2025
  • TABLE 20: Telecommunication (Application) Analysis of Historic Sales in US$ Million by Region/Country for the Years 2009 to 2017
  • TABLE 21: Telecommunication (Application) Global Market Share Distribution by Region/Country for 2009, 2019, and 2025
  • TABLE 22: Automotive (Application) Global Opportunity Assessment in US$ Million by Region/Country: 2018-2025
  • TABLE 23: Automotive (Application) Historic Sales Analysis in US$ Million by Region/Country: 2009-2017
  • TABLE 24: Automotive (Application) Percentage Share Breakdown of Global Sales by Region/Country: 2009 VS 2019 VS 2025
  • TABLE 25: Industrial Sector (Application) Worldwide Sales in US$ Million by Region/Country: 2018-2025
  • TABLE 26: Industrial Sector (Application) Historic Demand Patterns in US$ Million by Region/Country: 2009-2017
  • TABLE 27: Industrial Sector (Application) Market Share Shift across Key Geographies: 2009 VS 2019 VS 2025
  • TABLE 28: Medical Devices (Application) Global Market Estimates & Forecasts in US$ Million by Region/Country: 2018-2025
  • TABLE 29: Medical Devices (Application) Retrospective Demand Analysis in US$ Million by Region/Country: 2009-2017
  • TABLE 30: Medical Devices (Application) Market Share Breakdown by Region/Country: 2009 VS 2019 VS 2025
  • TABLE 31: Smart Technologies (Application) Demand Potential Worldwide in US$ Million by Region/Country: 2018-2025
  • TABLE 32: Smart Technologies (Application) Historic Sales Analysis in US$ Million by Region/Country: 2009-2017
  • TABLE 33: Smart Technologies (Application) Share Breakdown Review by Region/Country: 2009 VS 2019 VS 2025
  • TABLE 34: Military & Aerospace (Application) Worldwide Latent Demand Forecasts in US$ Million by Region/Country: 2018-2025
  • TABLE 35: Military & Aerospace (Application) Global Historic Analysis in US$ Million by Region/Country: 2009-2017
  • TABLE 36: Military & Aerospace (Application) Distribution of Global Sales by Region/Country: 2009 VS 2019 VS 2025

III. MARKET ANALYSIS

  • GEOGRAPHIC MARKET ANALYSIS
  • UNITED STATES
    • Market Facts & Figures
    • US Flip Chip Technology Market Share (in %) by Company: 2019 & 2025
    • TABLE 37: United States Flip Chip Technology Market Estimates and Projections in US$ Million by Wafer Bumping Process: 2018 to 2025
    • TABLE 38: Flip Chip Technology Market in the United States by Wafer Bumping Process: A Historic Review in US$ Million for 2009-2017
    • TABLE 39: United States Flip Chip Technology Market Share Breakdown by Wafer Bumping Process: 2009 VS 2019 VS 2025
    • TABLE 40: United States Flip Chip Technology Latent Demand Forecasts in US$ Million by Application: 2018 to 2025
    • TABLE 41: Flip Chip Technology Historic Demand Patterns in the United States by Application in US$ Million for 2009-2017
    • TABLE 42: Flip Chip Technology Market Share Breakdown in the United States by Application: 2009 VS 2019 VS 2025
  • CANADA
    • TABLE 43: Canadian Flip Chip Technology Market Estimates and Forecasts in US$ Million by Wafer Bumping Process: 2018 to 2025
    • TABLE 44: Canadian Flip Chip Technology Historic Market Review by Wafer Bumping Process in US$ Million: 2009-2017
    • TABLE 45: Flip Chip Technology Market in Canada: Percentage Share Breakdown of Sales by Wafer Bumping Process for 2009, 2019, and 2025
    • TABLE 46: Canadian Flip Chip Technology Market Quantitative Demand Analysis in US$ Million by Application: 2018 to 2025
    • TABLE 47: Flip Chip Technology Market in Canada: Summarization of Historic Demand Patterns in US$ Million by Application for 2009-2017
    • TABLE 48: Canadian Flip Chip Technology Market Share Analysis by Application: 2009 VS 2019 VS 2025
  • JAPAN
    • TABLE 49: Japanese Market for Flip Chip Technology: Annual Sales Estimates and Projections in US$ Million by Wafer Bumping Process for the Period 2018-2025
    • TABLE 50: Flip Chip Technology Market in Japan: Historic Sales Analysis in US$ Million by Wafer Bumping Process for the Period 2009-2017
    • TABLE 51: Japanese Flip Chip Technology Market Share Analysis by Wafer Bumping Process: 2009 VS 2019 VS 2025
    • TABLE 52: Japanese Demand Estimates and Forecasts for Flip Chip Technology in US$ Million by Application: 2018 to 2025
    • TABLE 53: Japanese Flip Chip Technology Market in US$ Million by Application: 2009-2017
    • TABLE 54: Flip Chip Technology Market Share Shift in Japan by Application: 2009 VS 2019 VS 2025
  • CHINA
    • TABLE 55: Chinese Flip Chip Technology Market Growth Prospects in US$ Million by Wafer Bumping Process for the Period 2018-2025
    • TABLE 56: Flip Chip Technology Historic Market Analysis in China in US$ Million by Wafer Bumping Process: 2009-2017
    • TABLE 57: Chinese Flip Chip Technology Market by Wafer Bumping Process: Percentage Breakdown of Sales for 2009, 2019, and 2025
    • TABLE 58: Chinese Demand for Flip Chip Technology in US$ Million by Application: 2018 to 2025
    • TABLE 59: Flip Chip Technology Market Review in China in US$ Million by Application: 2009-2017
    • TABLE 60: Chinese Flip Chip Technology Market Share Breakdown by Application: 2009 VS 2019 VS 2025
  • EUROPE
    • Market Facts & Figures
    • European Flip Chip Technology Market: Competitor Market Share Scenario (in %) for 2019 & 2025
    • TABLE 61: European Flip Chip Technology Market Demand Scenario in US$ Million by Region/Country: 2018-2025
    • TABLE 62: Flip Chip Technology Market in Europe: A Historic Market Perspective in US$ Million by Region/Country for the Period 2009-2017
    • TABLE 63: European Flip Chip Technology Market Share Shift by Region/Country: 2009 VS 2019 VS 2025
    • TABLE 64: European Flip Chip Technology Market Estimates and Forecasts in US$ Million by Wafer Bumping Process: 2018-2025
    • TABLE 65: Flip Chip Technology Market in Europe in US$ Million by Wafer Bumping Process: A Historic Review for the Period 2009-2017
    • TABLE 66: European Flip Chip Technology Market Share Breakdown by Wafer Bumping Process: 2009 VS 2019 VS 2025
    • TABLE 67: European Flip Chip Technology Addressable Market Opportunity in US$ Million by Application: 2018-2025
    • TABLE 68: Flip Chip Technology Market in Europe: Summarization of Historic Demand in US$ Million by Application for the Period 2009-2017
    • TABLE 69: European Flip Chip Technology Market Share Analysis by Application: 2009 VS 2019 VS 2025
  • FRANCE
    • TABLE 70: Flip Chip Technology Market in France by Wafer Bumping Process: Estimates and Projections in US$ Million for the Period 2018-2025
    • TABLE 71: French Flip Chip Technology Historic Market Scenario in US$ Million by Wafer Bumping Process: 2009-2017
    • TABLE 72: French Flip Chip Technology Market Share Analysis by Wafer Bumping Process: 2009 VS 2019 VS 2025
    • TABLE 73: Flip Chip Technology Quantitative Demand Analysis in France in US$ Million by Application: 2018-2025
    • TABLE 74: French Flip Chip Technology Historic Market Review in US$ Million by Application: 2009-2017
    • TABLE 75: French Flip Chip Technology Market Share Analysis: A 17-Year Perspective by Application for 2009, 2019, and 2025
  • GERMANY
    • TABLE 76: Flip Chip Technology Market in Germany: Recent Past, Current and Future Analysis in US$ Million by Wafer Bumping Process for the Period 2018-2025
    • TABLE 77: German Flip Chip Technology Historic Market Analysis in US$ Million by Wafer Bumping Process: 2009-2017
    • TABLE 78: German Flip Chip Technology Market Share Breakdown by Wafer Bumping Process: 2009 VS 2019 VS 2025
    • TABLE 79: Flip Chip Technology Market in Germany: Annual Sales Estimates and Forecasts in US$ Million by Application for the Period 2018-2025
    • TABLE 80: German Flip Chip Technology Market in Retrospect in US$ Million by Application: 2009-2017
    • TABLE 81: Flip Chip Technology Market Share Distribution in Germany by Application: 2009 VS 2019 VS 2025
  • ITALY
    • TABLE 82: Italian Flip Chip Technology Market Growth Prospects in US$ Million by Wafer Bumping Process for the Period 2018-2025
    • TABLE 83: Flip Chip Technology Historic Market Analysis in Italy in US$ Million by Wafer Bumping Process: 2009-2017
    • TABLE 84: Italian Flip Chip Technology Market by Wafer Bumping Process: Percentage Breakdown of Sales for 2009, 2019, and 2025
    • TABLE 85: Italian Demand for Flip Chip Technology in US$ Million by Application: 2018 to 2025
    • TABLE 86: Flip Chip Technology Market Review in Italy in US$ Million by Application: 2009-2017
    • TABLE 87: Italian Flip Chip Technology Market Share Breakdown by Application: 2009 VS 2019 VS 2025
  • UNITED KINGDOM
    • TABLE 88: United Kingdom Market for Flip Chip Technology: Annual Sales Estimates and Projections in US$ Million by Wafer Bumping Process for the Period 2018-2025
    • TABLE 89: Flip Chip Technology Market in the United Kingdom: Historic Sales Analysis in US$ Million by Wafer Bumping Process for the Period 2009-2017
    • TABLE 90: United Kingdom Flip Chip Technology Market Share Analysis by Wafer Bumping Process: 2009 VS 2019 VS 2025
    • TABLE 91: United Kingdom Demand Estimates and Forecasts for Flip Chip Technology in US$ Million by Application: 2018 to 2025
    • TABLE 92: United Kingdom Flip Chip Technology Market in US$ Million by Application: 2009-2017
    • TABLE 93: Flip Chip Technology Market Share Shift in the United Kingdom by Application: 2009 VS 2019 VS 2025
  • REST OF EUROPE
    • TABLE 94: Rest of Europe Flip Chip Technology Market Estimates and Forecasts in US$ Million by Wafer Bumping Process: 2018-2025
    • TABLE 95: Flip Chip Technology Market in Rest of Europe in US$ Million by Wafer Bumping Process: A Historic Review for the Period 2009-2017
    • TABLE 96: Rest of Europe Flip Chip Technology Market Share Breakdown by Wafer Bumping Process: 2009 VS 2019 VS 2025
    • TABLE 97: Rest of Europe Flip Chip Technology Addressable Market Opportunity in US$ Million by Application: 2018-2025
    • TABLE 98: Flip Chip Technology Market in Rest of Europe: Summarization of Historic Demand in US$ Million by Application for the Period 2009-2017
    • TABLE 99: Rest of Europe Flip Chip Technology Market Share Analysis by Application: 2009 VS 2019 VS 2025
  • ASIA-PACIFIC
    • TABLE 100: Flip Chip Technology Market in Asia-Pacific by Wafer Bumping Process: Estimates and Projections in US$ Million for the Period 2018-2025
    • TABLE 101: Asia-Pacific Flip Chip Technology Historic Market Scenario in US$ Million by Wafer Bumping Process: 2009-2017
    • TABLE 102: Asia-Pacific Flip Chip Technology Market Share Analysis by Wafer Bumping Process: 2009 VS 2019 VS 2025
    • TABLE 103: Flip Chip Technology Quantitative Demand Analysis in Asia-Pacific in US$ Million by Application: 2018-2025
    • TABLE 104: Asia-Pacific Flip Chip Technology Historic Market Review in US$ Million by Application: 2009-2017
    • TABLE 105: Asia-Pacific Flip Chip Technology Market Share Analysis: A 17-Year Perspective by Application for 2009, 2019, and 2025
  • REST OF WORLD
    • TABLE 106: Rest of World Flip Chip Technology Market Estimates and Forecasts in US$ Million by Wafer Bumping Process: 2018 to 2025
    • TABLE 107: Rest of World Flip Chip Technology Historic Market Review by Wafer Bumping Process in US$ Million: 2009-2017
    • TABLE 108: Flip Chip Technology Market in Rest of World: Percentage Share Breakdown of Sales by Wafer Bumping Process for 2009, 2019, and 2025
    • TABLE 109: Rest of World Flip Chip Technology Market Quantitative Demand Analysis in US$ Million by Application: 2018 to 2025
    • TABLE 110: Flip Chip Technology Market in Rest of World: Summarization of Historic Demand Patterns in US$ Million by Application for 2009-2017
    • TABLE 111: Rest of World Flip Chip Technology Market Share Analysis by Application: 2009 VS 2019 VS 2025

IV. COMPETITION

  • ASE GROUP
  • AMKOR TECHNOLOGY
  • INTEL CORPORATION
  • JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY
  • POWERTECH TECHNOLOGY
  • STATS CHIPPAC PTE.
  • SAMSUNG ELECTRONICS CO., LTD.
  • SILICONWARE PRECISION INDUSTRIES CO., LTD. (SPIL)
  • TAIWAN SEMICONDUCTOR MANUFACTURING
  • UNITED MICROELECTRONICS CORPORATION

V. CURATED RESEARCH

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