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市場調查報告書

半導體封裝的全球市場

3D Semiconductor Packaging

出版商 Global Industry Analysts, Inc. 商品編碼 892588
出版日期 內容資訊 英文 112 Pages
商品交期: 最快1-2個工作天內
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半導體封裝的全球市場 3D Semiconductor Packaging
出版日期: 2020年02月01日內容資訊: 英文 112 Pages
簡介

本報告以半導體封裝的全球市場為焦點,依提地區及各產品領域供今後期間交易規模的轉變,再加上參與企業的競爭情形,未來發展趨勢與推動要素分析,並闡明各國市場情形之相關調查。

第1章 調查方法

第2章 摘要整理

  • 市場概要
    • 參與企業的全球市場佔有率
    • 半導體封裝參與企業的全球市場佔有率情形
    • 參與企業的各市場區隔全球市場佔有率
    • 3D PoP(疊合式封裝)參與企業的市場佔有率排行榜
    • 3D封裝主要加入企業的市場佔有率
    • 3D扇出參與企業的收益佔有率
    • 3D TSV(穿矽通孔)各企業市場佔有率變化
  • 主要加入企業
  • 市場趨勢與推動要素
  • 全球市場展望

第3章 市場分析

  • 各地區市場分析
  • 美國
  • 加拿大
  • 中國
  • 歐洲
  • 法國
  • 德國
  • 義大利
  • 英國
  • 其他歐洲
  • 亞太地區
  • 其他地區

第4章 競爭企業

  • AMKOR TECHNOLOGY
  • EV GROUP
  • RUDOLPH TECHNOLOGIES, INC.
  • SEMES
  • SUSS MICROTEC AG
  • ULVAC

第5章 精選的調查手法

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目錄
Product Code: MCP10022

3D Semiconductor Packaging market worldwide is projected to grow by US$8.4 Billion, driven by a compounded growth of 15.5%. 3D package-on-package, one of the segments analyzed and sized in this study, displays the potential to grow at over 15.2%. The shifting dynamics supporting this growth makes it critical for businesses in this space to keep abreast of the changing pulse of the market. Poised to reach over US$2.5 Billion by the year 2025, 3D package-on-package will bring in healthy gains adding significant momentum to global growth.

Representing the developed world, the United States will maintain a 16.5% growth momentum. Within Europe, which continues to remain an important element in the world economy, Germany will add over US$330.9 Million to the region's size and clout in the next 5 to 6 years. Over US$403.4 Million worth of projected demand in the region will come from Rest of Europe markets. In Japan, 3D package-on-package will reach a market size of US$270.9 Million by the close of the analysis period. As the world's second largest economy and the new game changer in global markets, China exhibits the potential to grow at 15.2% over the next couple of years and add approximately US$1.5 Billion in terms of addressable opportunity for the picking by aspiring businesses and their astute leaders. Presented in visually rich graphics are these and many more need-to-know quantitative data important in ensuring quality of strategy decisions, be it entry into new markets or allocation of resources within a portfolio. Several macroeconomic factors and internal market forces will shape growth and development of demand patterns in emerging countries in Asia-Pacific. All research viewpoints presented are based on validated engagements from influencers in the market, whose opinions supersede all other research methodologies.

Competitors identified in this market include, among others,

  • Amkor Technology, Inc.
  • EV Group
  • Rudolph Technologies, Inc.
  • Semes Co., Ltd.
  • Suss MicroTec AG
  • Ulvac, Inc.

TABLE OF CONTENTS

I. INTRODUCTION, METHODOLOGY & REPORT SCOPE

II. EXECUTIVE SUMMARY

1. MARKET OVERVIEW

  • Global Competitor Market Shares
  • 3D Semiconductor Packaging Competitor Market Share Scenario Worldwide (in %): 2019 & 2025

2. FOCUS ON SELECT PLAYERS

3. MARKET TRENDS & DRIVERS

4. GLOBAL MARKET PERSPECTIVE

  • TABLE 1: 3D Semiconductor Packaging Global Market Estimates and Forecasts in US$ Million by Region/Country: 2018-2025
  • TABLE 2: 3D Semiconductor Packaging Market Share Shift across Key Geographies Worldwide: 2019 VS 2025
  • TABLE 3: 3D package-on-package (Segment) World Market by Region/Country in US$ Million: 2018 to 2025
  • TABLE 4: 3D package-on-package (Segment) Market Share Breakdown of Worldwide Sales by Region/Country: 2019 VS 2025
  • TABLE 5: 3D wire-bonded (Segment) Potential Growth Markets Worldwide in US$ Million: 2018 to 2025
  • TABLE 6: 3D wire-bonded (Segment) Market Sales Breakdown by Region/Country in Percentage: 2019 VS 2025
  • TABLE 7: 3D Fan-out based (Segment) Geographic Market Spread Worldwide in US$ Million: 2018 to 2025
  • TABLE 8: 3D Fan-out based (Segment) Market Share Distribution in Percentage by Region/Country: 2019 VS 2025
  • TABLE 9: 3D through-silicon-via (Segment) World Market Estimates and Forecasts by Region/Country in US$ Million: 2018 to 2025
  • TABLE 10: 3D through-silicon-via (Segment) Market Share Breakdown by Region/Country: 2019 VS 2025
  • TABLE 11: Other Segments (Segment) World Market by Region/Country in US$ Million: 2018 to 2025
  • TABLE 12: Other Segments (Segment) Market Share Distribution in Percentage by Region/Country: 2019 VS 2025
  • TABLE 13: Industrial (End-Use) Sales Estimates and Forecasts in US$ Million by Region/Country for the Years 2018 through 2025
  • TABLE 14: Industrial (End-Use) Global Market Share Distribution by Region/Country for 2019 and 2025
  • TABLE 15: Electronics (End-Use) Global Opportunity Assessment in US$ Million by Region/Country: 2018-2025
  • TABLE 16: Electronics (End-Use) Percentage Share Breakdown of Global Sales by Region/Country: 2019 VS 2025
  • TABLE 17: Healthcare (End-Use) Worldwide Sales in US$ Million by Region/Country: 2018-2025
  • TABLE 18: Healthcare (End-Use) Market Share Shift across Key Geographies: 2019 VS 2025
  • TABLE 19: IT & telecommunication (End-Use) Global Market Estimates & Forecasts in US$ Million by Region/Country: 2018-2025
  • TABLE 20: IT & telecommunication (End-Use) Market Share Breakdown by Region/Country: 2019 VS 2025
  • TABLE 21: Automotive & transport (End-Use) Demand Potential Worldwide in US$ Million by Region/Country: 2018-2025
  • TABLE 22: Automotive & transport (End-Use) Share Breakdown Review by Region/Country: 2019 VS 2025
  • TABLE 23: Aerospace & Defense (End-Use) Worldwide Latent Demand Forecasts in US$ Million by Region/Country: 2018-2025
  • TABLE 24: Aerospace & Defense (End-Use) Distribution of Global Sales by Region/Country: 2019 VS 2025
  • TABLE 25: Other End-Uses (End-Use) Sales Estimates and Forecasts in US$ Million by Region/Country for the Years 2018 through 2025
  • TABLE 26: Other End-Uses (End-Use) Global Market Share Distribution by Region/Country for 2019 and 2025

III. MARKET ANALYSIS

  • GEOGRAPHIC MARKET ANALYSIS
  • UNITED STATES
    • Market Facts & Figures
    • US 3D Semiconductor Packaging Market Share (in %) by Company: 2019 & 2025
    • Market Analytics
    • TABLE 27: United States 3D Semiconductor Packaging Market Estimates and Projections in US$ Million by Segment: 2018 to 2025
    • TABLE 28: United States 3D Semiconductor Packaging Market Share Breakdown by Segment: 2019 VS 2025
    • TABLE 29: United States 3D Semiconductor Packaging Latent Demand Forecasts in US$ Million by End-Use: 2018 to 2025
    • TABLE 30: 3D Semiconductor Packaging Market Share Breakdown in the United States by End-Use: 2019 VS 2025
  • CANADA
    • TABLE 31: Canadian 3D Semiconductor Packaging Market Estimates and Forecasts in US$ Million by Segment: 2018 to 2025
    • TABLE 32: 3D Semiconductor Packaging Market in Canada: Percentage Share Breakdown of Sales by Segment for 2019 and 2025
    • TABLE 33: Canadian 3D Semiconductor Packaging Market Quantitative Demand Analysis in US$ Million by End-Use: 2018 to 2025
    • TABLE 34: Canadian 3D Semiconductor Packaging Market Share Analysis by End-Use: 2019 VS 2025
  • JAPAN
    • TABLE 35: Japanese Market for 3D Semiconductor Packaging: Annual Sales Estimates and Projections in US$ Million by Segment for the Period 2018-2025
    • TABLE 36: Japanese 3D Semiconductor Packaging Market Share Analysis by Segment: 2019 VS 2025
    • TABLE 37: Japanese Demand Estimates and Forecasts for 3D Semiconductor Packaging in US$ Million by End-Use: 2018 to 2025
    • TABLE 38: 3D Semiconductor Packaging Market Share Shift in Japan by End-Use: 2019 VS 2025
  • CHINA
    • TABLE 39: Chinese 3D Semiconductor Packaging Market Growth Prospects in US$ Million by Segment for the Period 2018-2025
    • TABLE 40: Chinese 3D Semiconductor Packaging Market by Segment: Percentage Breakdown of Sales for 2019 and 2025
    • TABLE 41: Chinese Demand for 3D Semiconductor Packaging in US$ Million by End-Use: 2018 to 2025
    • TABLE 42: Chinese 3D Semiconductor Packaging Market Share Breakdown by End-Use: 2019 VS 2025
  • EUROPE
    • Market Facts & Figures
    • European 3D Semiconductor Packaging Market: Competitor Market Share Scenario (in %) for 2019 & 2025
    • Market Analytics
    • TABLE 43: European 3D Semiconductor Packaging Market Demand Scenario in US$ Million by Region/Country: 2018-2025
    • TABLE 44: European 3D Semiconductor Packaging Market Share Shift by Region/Country: 2019 VS 2025
    • TABLE 45: European 3D Semiconductor Packaging Market Estimates and Forecasts in US$ Million by Segment: 2018-2025
    • TABLE 46: European 3D Semiconductor Packaging Market Share Breakdown by Segment: 2019 VS 2025
    • TABLE 47: European 3D Semiconductor Packaging Addressable Market Opportunity in US$ Million by End-Use: 2018-2025
    • TABLE 48: European 3D Semiconductor Packaging Market Share Analysis by End-Use: 2019 VS 2025
  • FRANCE
    • TABLE 49: 3D Semiconductor Packaging Market in France by Segment: Estimates and Projections in US$ Million for the Period 2018-2025
    • TABLE 50: French 3D Semiconductor Packaging Market Share Analysis by Segment: 2019 VS 2025
    • TABLE 51: 3D Semiconductor Packaging Quantitative Demand Analysis in France in US$ Million by End-Use: 2018-2025
    • TABLE 52: French 3D Semiconductor Packaging Market Share Analysis: A 7-Year Perspective by End-Use for 2019 and 2025
  • GERMANY
    • TABLE 53: 3D Semiconductor Packaging Market in Germany: Recent Past, Current and Future Analysis in US$ Million by Segment for the Period 2018-2025
    • TABLE 54: German 3D Semiconductor Packaging Market Share Breakdown by Segment: 2019 VS 2025
    • TABLE 55: 3D Semiconductor Packaging Market in Germany: Annual Sales Estimates and Forecasts in US$ Million by End-Use for the Period 2018-2025
    • TABLE 56: 3D Semiconductor Packaging Market Share Distribution in Germany by End-Use: 2019 VS 2025
  • ITALY
    • TABLE 57: Italian 3D Semiconductor Packaging Market Growth Prospects in US$ Million by Segment for the Period 2018-2025
    • TABLE 58: Italian 3D Semiconductor Packaging Market by Segment: Percentage Breakdown of Sales for 2019 and 2025
    • TABLE 59: Italian Demand for 3D Semiconductor Packaging in US$ Million by End-Use: 2018 to 2025
    • TABLE 60: Italian 3D Semiconductor Packaging Market Share Breakdown by End-Use: 2019 VS 2025
  • UNITED KINGDOM
    • TABLE 61: United Kingdom Market for 3D Semiconductor Packaging: Annual Sales Estimates and Projections in US$ Million by Segment for the Period 2018-2025
    • TABLE 62: United Kingdom 3D Semiconductor Packaging Market Share Analysis by Segment: 2019 VS 2025
    • TABLE 63: United Kingdom Demand Estimates and Forecasts for 3D Semiconductor Packaging in US$ Million by End-Use: 2018 to 2025
    • TABLE 64: 3D Semiconductor Packaging Market Share Shift in the United Kingdom by End-Use: 2019 VS 2025
  • REST OF EUROPE
    • TABLE 65: Rest of Europe 3D Semiconductor Packaging Market Estimates and Forecasts in US$ Million by Segment: 2018-2025
    • TABLE 66: Rest of Europe 3D Semiconductor Packaging Market Share Breakdown by Segment: 2019 VS 2025
    • TABLE 67: Rest of Europe 3D Semiconductor Packaging Addressable Market Opportunity in US$ Million by End-Use: 2018-2025
    • TABLE 68: Rest of Europe 3D Semiconductor Packaging Market Share Analysis by End-Use: 2019 VS 2025
  • ASIA-PACIFIC
    • TABLE 69: 3D Semiconductor Packaging Market in Asia-Pacific by Segment: Estimates and Projections in US$ Million for the Period 2018-2025
    • TABLE 70: Asia-Pacific 3D Semiconductor Packaging Market Share Analysis by Segment: 2019 VS 2025
    • TABLE 71: 3D Semiconductor Packaging Quantitative Demand Analysis in Asia-Pacific in US$ Million by End-Use: 2018-2025
    • TABLE 72: Asia-Pacific 3D Semiconductor Packaging Market Share Analysis: A 7-Year Perspective by End-Use for 2019 and 2025
  • REST OF WORLD
    • TABLE 73: Rest of World 3D Semiconductor Packaging Market Estimates and Forecasts in US$ Million by Segment: 2018 to 2025
    • TABLE 74: 3D Semiconductor Packaging Market in Rest of World: Percentage Share Breakdown of Sales by Segment for 2019 and 2025
    • TABLE 75: Rest of World 3D Semiconductor Packaging Market Quantitative Demand Analysis in US$ Million by End-Use: 2018 to 2025
    • TABLE 76: Rest of World 3D Semiconductor Packaging Market Share Analysis by End-Use: 2019 VS 2025

IV. COMPETITION

  • AMKOR TECHNOLOGY
  • EV GROUP
  • RUDOLPH TECHNOLOGIES, INC.
  • SEMES
  • SUSS MICROTEC AG
  • ULVAC
  • ADVANCED MICRO DEVICES, INC.
  • ASE TECHNOLOGY HOLDING, CO., LTD.
  • APPLIED MATERIALS, INC.
  • AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AG
  • CHINA WAFER LEVEL CSP CO., LTD.
  • GLOBALFOUNDRIES
  • INTEL CORPORATION
  • JCET GROUP CO., LTD.
  • MICRALYNE
  • QUALCOMM TECHNOLOGIES, INC.
  • SAMSUNG ELECTRONICS CO., LTD.
  • SILICONWARE PRECISION INDUSTRIES CO., LTD. (SPIL)
  • STATS CHIPPAC, INC.
  • STMICROELECTRONICS
  • TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TSMC)
  • TELEDYNE DALSA, INC.
  • TEZZARON SEMICONDUCTOR CORPORATION
  • TOKYO ELECTRON
  • UNITED MICROELECTRONICS CORPORATION
  • UTAC HOLDINGS LTD.
  • XILINX, INC.

V. CURATED RESEARCH

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