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市場調查報告書

半導體封裝的全球市場

3D Semiconductor Packaging

出版商 Global Industry Analysts, Inc. 商品編碼 892588
出版日期 內容資訊 英文 156 Pages
商品交期: 最快1-2個工作天內
價格
半導體封裝的全球市場 3D Semiconductor Packaging
出版日期: 2020年07月01日內容資訊: 英文 156 Pages
簡介

本報告以半導體封裝的全球市場為焦點,依提地區及各產品領域供今後期間交易規模的轉變,再加上參與企業的競爭情形,未來發展趨勢與推動要素分析,並闡明各國市場情形之相關調查。

第1章 調查方法

第2章 摘要整理

  • 市場概要
    • 參與企業的全球市場佔有率
    • 半導體封裝參與企業的全球市場佔有率情形
    • 參與企業的各市場區隔全球市場佔有率
    • 3D PoP(疊合式封裝)參與企業的市場佔有率排行榜
    • 3D封裝主要加入企業的市場佔有率
    • 3D扇出參與企業的收益佔有率
    • 3D TSV(穿矽通孔)各企業市場佔有率變化
  • 主要加入企業
  • 市場趨勢與推動要素
  • 全球市場展望

第3章 市場分析

  • 各地區市場分析
  • 美國
  • 加拿大
  • 中國
  • 歐洲
  • 法國
  • 德國
  • 義大利
  • 英國
  • 其他歐洲
  • 亞太地區
  • 其他地區

第4章 競爭企業

  • AMKOR TECHNOLOGY
  • EV GROUP
  • RUDOLPH TECHNOLOGIES, INC.
  • SEMES
  • SUSS MICROTEC AG
  • ULVAC

第5章 精選的調查手法

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目錄
Product Code: MCP10022

Global 3D Semiconductor Packaging Market to Reach US$14.7 Billion by the Year 2027

Amid the COVID-19 crisis, the global market for 3D Semiconductor Packaging estimated at US$5.6 Billion in the year 2020, is projected to reach a revised size of US$14.7 Billion by 2027, growing at a CAGR of 14.6% over the analysis period 2020-2027.3D package-on-package, one of the segments analyzed in the report, is projected to grow at a 14.4% CAGR to reach US$2.7 Billion by the end of the analysis period.After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the 3D wire-bonded segment is readjusted to a revised 15.9% CAGR for the next 7-year period. This segment currently accounts for a 43.4% share of the global 3D Semiconductor Packaging market.

The U.S. Accounts for Over 29.6% of Global Market Size in 2020, While China is Forecast to Grow at a 14.1% CAGR for the Period of 2020-2027

The 3D Semiconductor Packaging market in the U.S. is estimated at US$1.7 Billion in the year 2020. The country currently accounts for a 29.55% share in the global market. China, the world second largest economy, is forecast to reach an estimated market size of US$2.6 Billion in the year 2027 trailing a CAGR of 14.1% through 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 12.8% and 12.7% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 10.8% CAGR while Rest of European market (as defined in the study) will reach US$2.6 Billion by the year 2027.

3D Fan-out based Segment Corners a 15.3% Share in 2020

In the global 3D Fan-out based segment, USA, Canada, Japan, China and Europe will drive the 14.7% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$690.3 Million in the year 2020 will reach a projected size of US$1.8 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$1.8 Billion by the year 2027.We bring years of research experience to this 9th edition of our report. The 156-page report presents concise insights into how the pandemic has impacted production and the buy side for 2020 and 2021. A short-term phased recovery by key geography is also addressed.

Competitors identified in this market include, among others,

  • Amkor Technology, Inc.
  • EV Group
  • Rudolph Technologies, Inc.
  • Semes Co., Ltd.
  • Suss MicroTec AG
  • Ulvac, Inc.

TABLE OF CONTENTS

I. INTRODUCTION, METHODOLOGY & REPORT SCOPE

II. EXECUTIVE SUMMARY

1. MARKET OVERVIEW

  • Global Competitor Market Shares
  • 3D Semiconductor Packaging Competitor Market Share Scenario Worldwide (in %): 2019 & 2025
  • Impact of Covid-19 and a Looming Global Recession

2. FOCUS ON SELECT PLAYERS

3. MARKET TRENDS & DRIVERS

4. GLOBAL MARKET PERSPECTIVE

  • TABLE 1: 3D Semiconductor Packaging Global Market Estimates and Forecasts in US$ Million by Region/Country: 2020-2027
  • TABLE 2: 3D Semiconductor Packaging Market Share Shift across Key Geographies Worldwide: 2020 VS 2027
  • TABLE 3: 3D package-on-package (Segment) World Market by Region/Country in US$ Million: 2020 to 2027
  • TABLE 4: 3D package-on-package (Segment) Market Share Breakdown of Worldwide Sales by Region/Country: 2020 VS 2027
  • TABLE 5: 3D wire-bonded (Segment) Potential Growth Markets Worldwide in US$ Million: 2020 to 2027
  • TABLE 6: 3D wire-bonded (Segment) Market Sales Breakdown by Region/Country in Percentage: 2020 VS 2027
  • TABLE 7: 3D Fan-out based (Segment) Geographic Market Spread Worldwide in US$ Million: 2020 to 2027
  • TABLE 8: 3D Fan-out based (Segment) Market Share Distribution in Percentage by Region/Country: 2020 VS 2027
  • TABLE 9: 3D through-silicon-via (Segment) World Market Estimates and Forecasts by Region/Country in US$ Million: 2020 to 2027
  • TABLE 10: 3D through-silicon-via (Segment) Market Share Breakdown by Region/Country: 2020 VS 2027
  • TABLE 11: Other Segments (Segment) World Market by Region/Country in US$ Million: 2020 to 2027
  • TABLE 12: Other Segments (Segment) Market Share Distribution in Percentage by Region/Country: 2020 VS 2027
  • TABLE 13: Industrial (End-Use) Sales Estimates and Forecasts in US$ Million by Region/Country for the Years 2020 through 2027
  • TABLE 14: Industrial (End-Use) Global Market Share Distribution by Region/Country for 2020 and 2027
  • TABLE 15: Electronics (End-Use) Global Opportunity Assessment in US$ Million by Region/Country: 2020-2027
  • TABLE 16: Electronics (End-Use) Percentage Share Breakdown of Global Sales by Region/Country: 2020 VS 2027
  • TABLE 17: Healthcare (End-Use) Worldwide Sales in US$ Million by Region/Country: 2020-2027
  • TABLE 18: Healthcare (End-Use) Market Share Shift across Key Geographies: 2020 VS 2027
  • TABLE 19: IT & telecommunication (End-Use) Global Market Estimates & Forecasts in US$ Million by Region/Country: 2020-2027
  • TABLE 20: IT & telecommunication (End-Use) Market Share Breakdown by Region/Country: 2020 VS 2027
  • TABLE 21: Automotive & transport (End-Use) Demand Potential Worldwide in US$ Million by Region/Country: 2020-2027
  • TABLE 22: Automotive & transport (End-Use) Share Breakdown Review by Region/Country: 2020 VS 2027
  • TABLE 23: Aerospace & Defense (End-Use) Worldwide Latent Demand Forecasts in US$ Million by Region/Country: 2020-2027
  • TABLE 24: Aerospace & Defense (End-Use) Distribution of Global Sales by Region/Country: 2020 VS 2027
  • TABLE 25: Other End-Uses (End-Use) Sales Estimates and Forecasts in US$ Million by Region/Country for the Years 2020 through 2027
  • TABLE 26: Other End-Uses (End-Use) Global Market Share Distribution by Region/Country for 2020 and 2027

III. MARKET ANALYSIS

  • GEOGRAPHIC MARKET ANALYSIS
  • UNITED STATES
    • Market Facts & Figures
    • US 3D Semiconductor Packaging Market Share (in %) by Company: 2019 & 2025
    • Market Analytics
    • TABLE 27: United States 3D Semiconductor Packaging Market Estimates and Projections in US$ Million by Segment: 2020 to 2027
    • TABLE 28: United States 3D Semiconductor Packaging Market Share Breakdown by Segment: 2020 VS 2027
    • TABLE 29: United States 3D Semiconductor Packaging Latent Demand Forecasts in US$ Million by End-Use: 2020 to 2027
    • TABLE 30: 3D Semiconductor Packaging Market Share Breakdown in the United States by End-Use: 2020 VS 2027
  • CANADA
    • TABLE 31: Canadian 3D Semiconductor Packaging Market Estimates and Forecasts in US$ Million by Segment: 2020 to 2027
    • TABLE 32: 3D Semiconductor Packaging Market in Canada: Percentage Share Breakdown of Sales by Segment for 2020 and 2027
    • TABLE 33: Canadian 3D Semiconductor Packaging Market Quantitative Demand Analysis in US$ Million by End-Use: 2020 to 2027
    • TABLE 34: Canadian 3D Semiconductor Packaging Market Share Analysis by End-Use: 2020 VS 2027
  • JAPAN
    • TABLE 35: Japanese Market for 3D Semiconductor Packaging: Annual Sales Estimates and Projections in US$ Million by Segment for the Period 2020-2027
    • TABLE 36: Japanese 3D Semiconductor Packaging Market Share Analysis by Segment: 2020 VS 2027
    • TABLE 37: Japanese Demand Estimates and Forecasts for 3D Semiconductor Packaging in US$ Million by End-Use: 2020 to 2027
    • TABLE 38: 3D Semiconductor Packaging Market Share Shift in Japan by End-Use: 2020 VS 2027
  • CHINA
    • TABLE 39: Chinese 3D Semiconductor Packaging Market Growth Prospects in US$ Million by Segment for the Period 2020-2027
    • TABLE 40: Chinese 3D Semiconductor Packaging Market by Segment: Percentage Breakdown of Sales for 2020 and 2027
    • TABLE 41: Chinese Demand for 3D Semiconductor Packaging in US$ Million by End-Use: 2020 to 2027
    • TABLE 42: Chinese 3D Semiconductor Packaging Market Share Breakdown by End-Use: 2020 VS 2027
  • EUROPE
    • Market Facts & Figures
    • European 3D Semiconductor Packaging Market: Competitor Market Share Scenario (in %) for 2019 & 2025
    • Market Analytics
    • TABLE 43: European 3D Semiconductor Packaging Market Demand Scenario in US$ Million by Region/Country: 2018-2025
    • TABLE 44: European 3D Semiconductor Packaging Market Share Shift by Region/Country: 2020 VS 2027
    • TABLE 45: European 3D Semiconductor Packaging Market Estimates and Forecasts in US$ Million by Segment: 2020-2027
    • TABLE 46: European 3D Semiconductor Packaging Market Share Breakdown by Segment: 2020 VS 2027
    • TABLE 47: European 3D Semiconductor Packaging Addressable Market Opportunity in US$ Million by End-Use: 2020-2027
    • TABLE 48: European 3D Semiconductor Packaging Market Share Analysis by End-Use: 2020 VS 2027
  • FRANCE
    • TABLE 49: 3D Semiconductor Packaging Market in France by Segment: Estimates and Projections in US$ Million for the Period 2020-2027
    • TABLE 50: French 3D Semiconductor Packaging Market Share Analysis by Segment: 2020 VS 2027
    • TABLE 51: 3D Semiconductor Packaging Quantitative Demand Analysis in France in US$ Million by End-Use: 2020-2027
    • TABLE 52: French 3D Semiconductor Packaging Market Share Analysis: A 7-Year Perspective by End-Use for 2020 and 2027
  • GERMANY
    • TABLE 53: 3D Semiconductor Packaging Market in Germany: Recent Past, Current and Future Analysis in US$ Million by Segment for the Period 2020-2027
    • TABLE 54: German 3D Semiconductor Packaging Market Share Breakdown by Segment: 2020 VS 2027
    • TABLE 55: 3D Semiconductor Packaging Market in Germany: Annual Sales Estimates and Forecasts in US$ Million by End-Use for the Period 2020-2027
    • TABLE 56: 3D Semiconductor Packaging Market Share Distribution in Germany by End-Use: 2020 VS 2027
  • ITALY
    • TABLE 57: Italian 3D Semiconductor Packaging Market Growth Prospects in US$ Million by Segment for the Period 2020-2027
    • TABLE 58: Italian 3D Semiconductor Packaging Market by Segment: Percentage Breakdown of Sales for 2020 and 2027
    • TABLE 59: Italian Demand for 3D Semiconductor Packaging in US$ Million by End-Use: 2020 to 2027
    • TABLE 60: Italian 3D Semiconductor Packaging Market Share Breakdown by End-Use: 2020 VS 2027
  • UNITED KINGDOM
    • TABLE 61: United Kingdom Market for 3D Semiconductor Packaging: Annual Sales Estimates and Projections in US$ Million by Segment for the Period 2020-2027
    • TABLE 62: United Kingdom 3D Semiconductor Packaging Market Share Analysis by Segment: 2020 VS 2027
    • TABLE 63: United Kingdom Demand Estimates and Forecasts for 3D Semiconductor Packaging in US$ Million by End-Use: 2020 to 2027
    • TABLE 64: 3D Semiconductor Packaging Market Share Shift in the United Kingdom by End-Use: 2020 VS 2027
  • REST OF EUROPE
    • TABLE 65: Rest of Europe 3D Semiconductor Packaging Market Estimates and Forecasts in US$ Million by Segment: 2020-2027
    • TABLE 66: Rest of Europe 3D Semiconductor Packaging Market Share Breakdown by Segment: 2020 VS 2027
    • TABLE 67: Rest of Europe 3D Semiconductor Packaging Addressable Market Opportunity in US$ Million by End-Use: 2020-2027
    • TABLE 68: Rest of Europe 3D Semiconductor Packaging Market Share Analysis by End-Use: 2020 VS 2027
  • ASIA-PACIFIC
    • TABLE 69: 3D Semiconductor Packaging Market in Asia-Pacific by Segment: Estimates and Projections in US$ Million for the Period 2020-2027
    • TABLE 70: Asia-Pacific 3D Semiconductor Packaging Market Share Analysis by Segment: 2020 VS 2027
    • TABLE 71: 3D Semiconductor Packaging Quantitative Demand Analysis in Asia-Pacific in US$ Million by End-Use: 2020-2027
    • TABLE 72: Asia-Pacific 3D Semiconductor Packaging Market Share Analysis: A 7-Year Perspective by End-Use for 2020 and 2027
  • REST OF WORLD
    • TABLE 73: Rest of World 3D Semiconductor Packaging Market Estimates and Forecasts in US$ Million by Segment: 2020 to 2027
    • TABLE 74: 3D Semiconductor Packaging Market in Rest of World: Percentage Share Breakdown of Sales by Segment for 2020 and 2027
    • TABLE 75: Rest of World 3D Semiconductor Packaging Market Quantitative Demand Analysis in US$ Million by End-Use: 2020 to 2027
    • TABLE 76: Rest of World 3D Semiconductor Packaging Market Share Analysis by End-Use: 2020 VS 2027

IV. COMPETITION

  • Total Companies Profiled: 44