市場調查報告書

光子積體電路全球市場

Photonic Integrated Circuit (PIC)

出版商 Global Industry Analysts, Inc. 商品編碼 352656
出版日期 內容資訊 英文 412 Pages
商品交期: 最快1-2個工作天內
價格
光子積體電路全球市場 Photonic Integrated Circuit (PIC)
出版日期: 2020年09月01日內容資訊: 英文 412 Pages
簡介

光子積體電路(PIC)市場,將會以22.3%的年複合成長率增長,預計在全世界有24億美金的成長。作為該調查分析、評估對像之一的厚膜混合積體電路(Hybrid IC)也有超過21.9%的成長潛力。業界的業者必須從支撐成長的變動環境中對瞬息萬變的市場做出立即的應變。2025年,厚膜混合積體電路的交易規模將達到16億美金,對整體市場帶來優異貢獻,對於所帶來的良好機運也讓人期待。

此報告關注光子積體電路全球市場,除了展望至2025年為止的交易規模演變,考察企業的競爭格局、未來發展的趨勢及促進成長因素等,提供各國市場狀況的調查資訊。

第1章 簡介、調查方法、對像範圍

第2章 重點摘要

  • 市場概要
    • 簡介 - 光子積體電路(PIC)
    • 製程所使用材料
    • 模組積體
    • 用途
    • 光子積體電路 - 市場現況與未來展望
    • 磷化銦
    • 矽基板仍然存在爭議
    • 混合積體:廣泛使用的PIC製造方法
    • 單片積體成為增長最快的製造方法
    • 競爭環境
    • 光子積體電路 - 專門化市場
    • 最新市場趨勢
  • 主要參與企業
  • 市場趨勢與推動成長因素
    • 光通訊:PIC 最大應用市場
    • 光通訊領域中影響PIC普及的重要趨勢
    • Ultra-100G及100G OTN(Optical Transport Network:光傳輸網路)
    • FTTx網路的普及擴大
    • 寬頻需求的增長推動光纖網絡的發展,引導PIC需求
    • 關於影響IP流量增長和寬頻需求的因素說明
    • 網路用戶數量急增
    • 支持IP設備的高普及率
    • 寬頻的速度更快了
    • 寬頻密集型應用的激增
    • 基礎設施產業將繼續維持高度的遠距通訊投資
    • 長距離網路
    • 大都市圈網路(MANs)
    • 連接網路
    • 光訊號處理成為增長最快的應用領域
    • 生物光子學:PIC的細分市場
    • 由於生物光子學的應用基礎擴大,也為PIC帶來商機
    • 對於體外診斷醫藥的高度注目帶來市場發展良好機會
    • 光纖感測器產業的北移軌跡推動市場擴展
    • DCI在數據中心中的作用不斷擴大,創造了潛在的市場機會
    • 影響DCI實施的數據中心主要趨勢
    • 數據中心流量的快速增長
    • 雲端數據中心的急劇擴展
    • 數據中心流量的設備類型細項
    • 向數據中心整合過渡
    • 虛擬化的角色越來越吃重
    • Wi-Fi設備設置的風潮顯示良好商機
    • 智慧城市的概念將支撐未來數年的銷售成長
    • 智能居家加速PIC的需求
    • 即將到來的量子計算模型將注入新的增長機會
    • OEO(光□電□光)轉換電子積體電路上在收入上的不穩定,因而將重點放在光子積體回路上
    • 光子積體電路 vs. 電子積體電路 - 簡要比較分析
    • 減少光學封裝的數量並減少對光纖耦合的需求,增強了PIC的印象
    • 技術創新:高成長和穩定需求的關鍵
    • 下個世代基於矽光子學和聚合物的光子基體電路強化了速度、頻寬以及可擴展性
    • 合作事業促進創新產品的開發
  • 全球市場展望

第3章 市場分析

  • 各地區市場分析
  • 美國
  • 加拿大
  • 日本
  • 中國
  • 歐洲
  • 法國
  • 德國
  • 義大利
  • 英國
  • 西班牙
  • 俄羅斯
  • 其他歐洲地區
  • 亞太地區
  • 印度
  • 韓國
  • 台灣
  • 其他亞洲太平洋地區
    • 澳洲/紐西蘭
    • 新加坡
    • 香港
  • 中南美洲
  • 巴西
  • 墨西哥

第4章 競爭格局

  • 分析企業:36家(若包含相關事業部門、子公司 37家)

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目錄
Product Code: MCP-7068

The global market for Photonic Integrated Circuit (PIC) is projected to reach US$3.1 billion by 2025, driven by the growing interest in the ability to exploit the properties of light to transmit information at speeds millions of times faster than either copper or laser, especially against the backdrop of the insatiable need for bandwidth and communication speeds. The growing opportunity in optical communications therefore bodes well for the growth of PICs. Optical communication, also known as optical telecommunication, is growing in popularity driven by factors such as demand for faster internet broadband speeds, ubiquity of data communications networks, and growing use of bandwidth intensive applications such as provision of high speed internet (HSI) and triple play bundled services that includes voice, data, and video streaming. Investments in optical network infrastructures are therefore witnessing robust gains. In addition to telecommunication service providers and MNOs, even companies are rapidly shifting to fibre-optic enabled enterprise networks to handle ever-increasing big data loads and leverage benefits of technologies like IoT, cloud and artificial intelligence. While migration from copper wires to optical fibre access networks begins to mature, there is currently a strong undercurrent of change in the optical networking industry. The industry is witnessing a shift from Passive Optical Networks (PON) technology to Active Optical Network (AON). PON technology utilizes optical splitters to separate light signals of different wavelengths as they are transmitted through the network. AON, on the other hand, utilizes electrical switching equipment like routers, switch aggregator, amplifiers and repeaters, for signal distribution, management and delivery.

Increased deployment of agile optical networks (AON) by network service providers is expected to open up new opportunities for the use of PICs in enabling dynamic scaling of network infrastructures in response to fluctuating data traffic. Few of the factors that will help widen the application and adoption of PICs include breakthroughs in the development of application specific photonic integrated circuits (ASPICs) for new generation optoelectronic devices; innovations in fabrication technologies of ASPICs; surging investments in advanced telecom infrastructure; progressive improvements in photonic integration with conventional technology processes; emphasis on optical signal processing in fiber optic networks; high tide in Wi-Fi equipment installations; and emerging era of quantum computing, among others.

Integration of silicon photonics devices with traditional electronics will unleash new opportunities in on-chip and on-board communication; chip-to-chip interconnections; optical sensing and biophotonics. As we inch closer to exascale computing, optical interconnections will offer an alternative to the otherwise dense network of copper interconnections that will be needed. Photonic Integrated Circuit (PIC) integrates multiple photonic functions and hence is more suitable for exascale processing. While electronic integrated circuits are dense, they can never match the speed offered by PICs. PICs have higher bandwidth; higher levels of immunity to electromagnetic interference; and are compatible with current CMOS fabrication technologies. A PIC comprises of optical devices such as modulators, optical amplifiers, lasers and multiplexers. Asia-Pacific including China is a major market led by developing telecom and electronics industries and rapid shift of the global semiconductor manufacturing base to Southeast Asian countries.

Competitors identified in this market include, among others,

  • Broadcom Inc.
  • Ciena Corporation
  • Ciena Corporation
  • Enablence Technologies, Inc.
  • Huawei Technologies Co. Ltd.
  • Infinera Corporation
  • Kaiam Corporation
  • Lumentum Operations LLC
  • NeoPhotonics Corporation
  • Nokia Networks
  • Oclaro, Inc.

TABLE OF CONTENTS

I. INTRODUCTION, METHODOLOGY & REPORT SCOPE

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • An Introduction to Photonic Integrated Circuit (PIC)
    • Materials Used in Making PIC
    • Integration Models for PIC
    • Applications
    • Photonic Integrated Circuit (PIC): Current Market Scenario and Outlook
    • Indium Phosphide: Largest & Fastest Growing Material Type
    • Silicon Substrates Remain in Contention
    • Hybrid Integration: The Widely Used PIC Fabrication Method
    • Monolithic Integration Emerges as Fastest Growing Fabrication Approach
  • COMPETITIVE LANDSCAPE
    • Photonic Integrated Circuit (PIC): Fragmented Marketplace
    • Photonic Integrated Circuit (PIC) Competitor Market Share Scenario Worldwide (in %):
    • Recent Market Activity
    • Impact of Covid-19 and a Looming Global Recession
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Optical Communications: Largest Application Market for PIC
    • Key Trends Influencing the Uptake of PICs in Optical Communication Space
    • Soaring Deployments of 100G & Ultra-100G OTNs
    • Growing Uptake of FTTx Networks
    • Growing Bandwidth Needs Bring Fiber Optic Networks to the Fore, Steering PIC Demand
    • Global IP Traffic Volume in Exabytes for the Years 2019 and
    • Global IP Traffic Scenario (2019): Percentage Breakdown of Data Usage by Consumer Segment
    • A Note on Factors Influencing IP Traffic Growth & Bandwidth Needs
    • Sharp Increase in Number of Internet Subscribers
    • Breakdown of Number of Internet Users Worldwide, by Region (in Millions): H1
    • High Penetration of IP-enabled Devices
    • Smartphone Adoption Worldwide by Region (in %): 2018 &
    • Number of Smartphone Users Worldwide (in Billion): 2016
    • Global Wireless Communication Market (2018 & 2020): Percentage Breakdown of Traffic Volume by Mobile Device Type
    • Faster Broadband Speeds
    • Proliferation of Bandwidth-Intensive Applications
    • Breakdown of Global IP Traffic by Application Type (in %): 2019 &
    • Infrastructure Verticals Where Telecom Investments Continue to Remain High
    • Long-Haul Networks
    • Metropolitan Area Networks (MANs)
    • Access Networks
    • Optical Signal Processing Emerges as Fastest Growing Application Segment
    • Biophotonics: A Niche Market Segment for PIC
    • Global Biophotonics Market (2019): Percentage Breakdown of Revenues by Geographic Region
    • Expanding Application Base for Biophotonics Generates Parallel Opportunities for PIC
    • Increased Focus on Optical In-Vitro Diagnostics Augurs Well
    • Northbound Trajectory in Fiber Optic Sensors Vertical Gives Impetus to Market Expansion
    • Global Fiber Optic Sensors Market (2019 & 2024): Breakdown of Sales in US$ Million by Geographic Region
    • Expanding Role of DCI in Data Centers Creates Potential Market Opportunities
    • Major Data Center Trends Influencing DCI Implementations
    • Rapid Growth in Data Center Traffic
    • Data Center New Floor Space Capacity Additions (in '000 Sq. ft.) Worldwide for the Years 2013, 2015, 2017, and
    • Sharp Expansion in Cloud Data Center
    • Global Data Center Traffic Scenario (2018, 2020 & 2022): Percentage Breakdown of Data Center Traffic by Equipment Type
    • Global Cloud Data Center Market (2018 & 2022): Percentage Breakdown of Data Center Traffic by Cloud Type
    • Transition towards Data Center Consolidation
    • Growing Role of Virtualization
    • High Tide in Wi-Fi Equipment Installations Bodes Well
    • Smart Cities Concept to Underpin Sales Growth in the Coming Years
    • World Smart City Investments (in US$ Billion) for the Years 2018 through
    • Breakdown of World Smart City Investments (in %) by Country/Region for the Year
    • Smart Homes to Drive Demand for PICs
    • Global Smart Homes Market (In US$ Billion) for the Years 2019, 2021, 2023 &
    • Upcoming Quantum Computing Model to Infuse New Growth Opportunities
    • Economic Unviability of Electronic IC in OEO Conversion Puts Focus on Photonic IC
    • Photonic IC vs. Electronic IC: A Brief Comparative Analysis
    • Reduced Number of Optical Packages & Decreased Need for Fiber Coupling Enhance the Image of PIC
    • Technology Innovations: Key to High Growth and Consistent Demand
    • Next Generation Silicon Photonics & Polymer Based Photonic ICs Enhance Speed, Bandwidth and Scalability
    • Collaborative Initiatives Foster Development of Innovative Products
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Current & Future Analysis for Photonic Integrated Circuit (PIC) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through
    • TABLE 2: World 7-Year Perspective for Photonic Integrated Circuit (PIC) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets for Years 2020 & 2027
    • TABLE 3: World Current & Future Analysis for Hybrid Integration by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through
    • TABLE 4: World 7-Year Perspective for Hybrid Integration by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2020 & 2027
    • TABLE 5: World Current & Future Analysis for Monolithic Integration by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through
    • TABLE 6: World 7-Year Perspective for Monolithic Integration by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2020 & 2027
    • TABLE 7: World Current & Future Analysis for Module Integration by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through
    • TABLE 8: World 7-Year Perspective for Module Integration by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2020 & 2027
    • TABLE 9: World Current & Future Analysis for Indium Phosphide (InP) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through
    • TABLE 10: World 7-Year Perspective for Indium Phosphide (InP) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2020 & 2027
    • TABLE 11: World Current & Future Analysis for Silicon-on-Insulator (SOI) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through
    • TABLE 12: World 7-Year Perspective for Silicon-on-Insulator (SOI) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2020 & 2027
    • TABLE 13: World Current & Future Analysis for Gallium Arsenide (GaAs) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through
    • TABLE 14: World 7-Year Perspective for Gallium Arsenide (GaAs) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2020 & 2027
    • TABLE 15: World Current & Future Analysis for Silicon (Si) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through
    • TABLE 16: World 7-Year Perspective for Silicon (Si) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2020 & 2027
    • TABLE 17: World Current & Future Analysis for Other Raw Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through
    • TABLE 18: World 7-Year Perspective for Other Raw Materials by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2020 & 2027
    • TABLE 19: World Current & Future Analysis for Optical Communications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through
    • TABLE 20: World 7-Year Perspective for Optical Communications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2020 & 2027
    • TABLE 21: World Current & Future Analysis for Optical Signal Processing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through
    • TABLE 22: World 7-Year Perspective for Optical Signal Processing by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2020 & 2027
    • TABLE 23: World Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through
    • TABLE 24: World 7-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2020 & 2027

III. MARKET ANALYSIS

  • GEOGRAPHIC MARKET ANALYSIS
  • UNITED STATES
    • The United States: Largest Market for PIC Solutions
    • Telecom Industry's Focus on High-Speed Fiber Networks Builds Momentum
    • Fiber Optic Deployments Register Steady Growth
    • Fiber Optics Industry Benefits from Telecom Regulatory Act,
    • Percentage (%) of Population Covered by Fiber Networks in Select States
    • Novel Use Case of Biophotonics in Medical Devices Augurs Well
    • Mainstream Image of Fiber Optic Sensors to Underpin Market Expansion
    • Market Analytics
    • TABLE 25: USA Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 26: USA 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 27: USA Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 28: USA 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 29: USA Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 30: USA 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • CANADA
    • Uptrend in the Telecom Sector Encourages PIC Market
    • Growing Use of Fiber Optic Sensors Revs Up PIC Demand
    • Market Analytics
    • TABLE 31: Canada Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 32: Canada 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 33: Canada Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 34: Canada 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 35: Canada Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 36: Canada 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • JAPAN
    • Being a Major Fiber Optics Consumer, Japan Continues to Extend Opportunities
    • Market Analytics
    • TABLE 37: Japan Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 38: Japan 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 39: Japan Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 40: Japan 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 41: Japan Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 42: Japan 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • CHINA
    • China Emerges as the Fastest Growing Regional Market
    • Uptrend in Fiber Optic Deployments Enthuses PIC Market in China
    • Increased Adoption of Fiber Optic Sensors Infuses Market Momentum
    • Sensors Manufacturing Scenario in China
    • Market Analytics
    • TABLE 43: China Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 44: China 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 45: China Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 46: China 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 47: China Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 48: China 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • EUROPE
    • Stable Expansion in Fiber Optic Networks Bodes Well for PIC Market in Europe
    • Healthy Home Entertainment Sector Spurs Demand for Fiber Optic Networks
    • Household Penetration of FTTH & FTTB (in %) in Select European Countries:
    • Market Analytics
    • TABLE 49: Europe Current & Future Analysis for Photonic Integrated Circuit (PIC) by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through
    • TABLE 50: Europe 7-Year Perspective for Photonic Integrated Circuit (PIC) by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets for Years 2020 & 2027
    • TABLE 51: Europe Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 52: Europe 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 53: Europe Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 54: Europe 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 55: Europe Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 56: Europe 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • FRANCE
    • TABLE 57: France Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 58: France 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 59: France Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 60: France 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 61: France Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 62: France 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • GERMANY
    • TABLE 63: Germany Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 64: Germany 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 65: Germany Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 66: Germany 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 67: Germany Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 68: Germany 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • ITALY
    • TABLE 69: Italy Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 70: Italy 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 71: Italy Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 72: Italy 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 73: Italy Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 74: Italy 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • UNITED KINGDOM
    • Robust Expansion on the Cards amid Soaring Investments on Fiber Optic Networks
    • Market Analytics
    • TABLE 75: UK Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 76: UK 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 77: UK Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 78: UK 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 79: UK Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 80: UK 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • SPAIN
    • TABLE 81: Spain Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 82: Spain 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 83: Spain Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 84: Spain 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 85: Spain Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 86: Spain 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • RUSSIA
    • TABLE 87: Russia Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 88: Russia 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 89: Russia Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 90: Russia 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 91: Russia Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 92: Russia 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • REST OF EUROPE
    • TABLE 93: Rest of Europe Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 94: Rest of Europe 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 95: Rest of Europe Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 96: Rest of Europe 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 97: Rest of Europe Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 98: Rest of Europe 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • ASIA-PACIFIC
    • Healthy Trajectory in Telecommunications Sector Augurs Well
    • Pan Asian Continental Terrestrial Fiber Optic Network
    • A Note on Submarine Cables in Asia
    • Market Analytics
    • TABLE 99: Asia-Pacific Current & Future Analysis for Photonic Integrated Circuit (PIC) by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through
    • TABLE 100: Asia-Pacific 7-Year Perspective for Photonic Integrated Circuit (PIC) by Geographic Region - Percentage Breakdown of Value Sales for Australia, India, South Korea and Rest of Asia-Pacific Markets for Years 2020 & 2027
    • TABLE 101: Asia-Pacific Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 102: Asia-Pacific 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 103: Asia-Pacific Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 104: Asia-Pacific 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 105: Asia-Pacific Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 106: Asia-Pacific 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • AUSTRALIA
    • TABLE 107: Australia Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 108: Australia 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 109: Australia Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 110: Australia 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 111: Australia Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 112: Australia 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • INDIA
    • India: Novel Opportunities Identified
    • Market Analytics
    • TABLE 113: India Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 114: India 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 115: India Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 116: India 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 117: India Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 118: India 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • SOUTH KOREA
    • TABLE 119: South Korea Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 120: South Korea 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 121: South Korea Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 122: South Korea 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 123: South Korea Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 124: South Korea 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • REST OF ASIA-PACIFIC
  • REVIEW OF SELECT REGIONAL MARKETS
    • Australia & New Zealand
    • Singapore
    • Hong Kong
    • Market Analytics
    • TABLE 125: Rest of Asia-Pacific Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 126: Rest of Asia-Pacific 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 127: Rest of Asia-Pacific Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 128: Rest of Asia-Pacific 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 129: Rest of Asia-Pacific Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 130: Rest of Asia-Pacific 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • LATIN AMERICA
    • Latin America: PIC Market to Benefit from Telecom Infrastructure Development Projects
    • Accelerated FTTH Deployments: Opportunities for Fiber Optic Components
    • Market Analytics
    • TABLE 131: Latin America Current & Future Analysis for Photonic Integrated Circuit (PIC) by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through
    • TABLE 132: Latin America 7-Year Perspective for Photonic Integrated Circuit (PIC) by Geographic Region - Percentage Breakdown of Value Sales for Argentina, Brazil, Mexico and Rest of Latin America Markets for Years 2020 & 2027
    • TABLE 133: Latin America Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 134: Latin America 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 135: Latin America Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 136: Latin America 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 137: Latin America Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 138: Latin America 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • ARGENTINA
    • TABLE 139: Argentina Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 140: Argentina 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 141: Argentina Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 142: Argentina 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 143: Argentina Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 144: Argentina 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • BRAZIL
    • Market Overview
    • Market Analytics
    • TABLE 145: Brazil Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 146: Brazil 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 147: Brazil Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 148: Brazil 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 149: Brazil Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 150: Brazil 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • MEXICO
    • Market Overview
    • Market Analytics
    • TABLE 151: Mexico Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 152: Mexico 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 153: Mexico Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 154: Mexico 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 155: Mexico Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 156: Mexico 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • REST OF LATIN AMERICA
    • TABLE 157: Rest of Latin America Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 158: Rest of Latin America 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 159: Rest of Latin America Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 160: Rest of Latin America 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 161: Rest of Latin America Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 162: Rest of Latin America 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • MIDDLE EAST
    • TABLE 163: Middle East Current & Future Analysis for Photonic Integrated Circuit (PIC) by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through
    • TABLE 164: Middle East 7-Year Perspective for Photonic Integrated Circuit (PIC) by Geographic Region - Percentage Breakdown of Value Sales for Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets for Years 2020 & 2027
    • TABLE 165: Middle East Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 166: Middle East 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 167: Middle East Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 168: Middle East 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 169: Middle East Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 170: Middle East 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • IRAN
    • TABLE 171: Iran Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 172: Iran 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 173: Iran Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 174: Iran 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 175: Iran Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 176: Iran 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • ISRAEL
    • TABLE 177: Israel Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 178: Israel 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 179: Israel Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 180: Israel 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 181: Israel Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 182: Israel 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • SAUDI ARABIA
    • TABLE 183: Saudi Arabia Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 184: Saudi Arabia 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 185: Saudi Arabia Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 186: Saudi Arabia 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 187: Saudi Arabia Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 188: Saudi Arabia 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • UNITED ARAB EMIRATES
    • TABLE 189: UAE Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 190: UAE 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 191: UAE Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 192: UAE 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 193: UAE Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 194: UAE 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • REST OF MIDDLE EAST
    • TABLE 195: Rest of Middle East Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 196: Rest of Middle East 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 197: Rest of Middle East Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 198: Rest of Middle East 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 199: Rest of Middle East Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 200: Rest of Middle East 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • AFRICA
    • TABLE 201: Africa Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 202: Africa 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 203: Africa Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 204: Africa 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 205: Africa Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through
    • TABLE 206: Africa 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027

IV. COMPETITION

  • Total Companies Profiled: 36