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熱傳導黏著劑:技術影響分析

Thermoconductive Adhesives--Technology Impact Analysis

出版商 Frost & Sullivan 商品編碼 921037
出版日期 內容資訊 英文 42 Pages
商品交期: 最快1-2個工作天內
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熱傳導黏著劑:技術影響分析 Thermoconductive Adhesives--Technology Impact Analysis
出版日期: 2019年12月26日內容資訊: 英文 42 Pages
簡介

電子零件的接合通常使用焊接或線鍵合等方法,目前熱傳導黏著劑被視為一項高成本效益且環保的具潛力替代方法。

本報告研究熱傳導黏著劑技術趨勢與對各產業的影響,彙整技術及產品類型和概要、技術開發焦點、主要產業需求、影響需求的因素分析、導入擴大展望等情報。

第1章 摘要整理

  • 研究範圍
  • 研究方法
  • 主要研究結果

第2章 技術概要與趨勢

  • 熱傳導黏著劑:由於功能性提升提升受容度
  • 對更高熱阻材料的需求:推動熱傳導黏著劑的採用
  • 熱傳導黏著劑的製造程序
  • 聚合物黏著劑:於硬質、軟質應用皆理想
  • 銀填料:最理想的散熱裝置填料材料
  • 石墨烯填料:越來越重要
  • 陶瓷填料:用於航空航天應用
  • 亞太地區:參與了可滿足廣泛應用的產品開發

第3章 創新生態系統

  • 研發聚焦:提升傳熱性能
  • 全球智慧財產權趨勢:來自亞太地區的申請數特別多
  • 電子回路:關鍵應用領域
  • 聚合物複合材料的金屬填料:最廣泛採用的製造法
  • 學術領域:對基礎與應用研究積極
  • 針對熱傳導黏著劑開發的資金投入:聚焦最終產品開發

第4章 各種應用

  • 電子領域的需求最多
  • 電子領域廣泛採用因素:有助零組件小型化
  • 航空航天及國防領域:最早導入熱傳導黏著劑的產業之一
  • 汽車領域:由於電動車及混合動力車應用的需求增加,預估採用率將升高
  • 儲能領域的採用:隨著對高性能電池的關注日益增長
  • 照明領域:熱傳導黏著劑的效率提升帶來成長
  • 醫療保健領域:由於其生物惰性推動採用

第5章 技術影響

  • 標竿評分指標
  • 電子領域:具高度應用潛力
  • IP產品組合和滿足應用的能力:採用拓展的重要關鍵

第6章 產業聯絡資訊

第7章 附錄

目錄
Product Code: D8E8

Thermally Conductive Adhesives Expected to Have a High Impact in the Electronics Industry

With the increasing importance of integrated circuits, the need to self-contained units in the electrical and electronic systems are observed to be significant. The electronic components were conventionally connected by soldering or by wire bonding techniques. Thermally conductive adhesives proves to be a promising alternative for these conventional methods as a cost effective and environment-friendly alternative (as most conventional soldering techniques contain lead).

This research service titled, “Thermoconductive Adhesives- Technology Impact Analysis,” provides an understanding of various types of thermally conductive adhesives/ thermoconductive Adhesives, including epoxy, polyurethane, polyimide, and silicon-based adhesive resins along with metal, carbon, and ceramic-based fillers.

This research service describes the technology capabilities, manufacturing processes, and future prospects of thermally conductive adhesives. Additionally, it also captures the various factors that influence adoption and the application prospects in various industries. This research service also highlights the emerging innovations that will enable the use of these adhesives to meet the requirements of various applications.

Table of Contents

1.0. Executive Summary

  • 1.1. Research Scope
  • 1.2. Research Methodology
  • 1.3. Key Findings

2.0. Technology Snapshot and Trends

  • 2.1. Thermally Conductive Adhesives Gaining Acceptance Due to Enhanced Functionality
  • 2.2. Need for Materials with Higher Thermal Resistance Propels the Adoption of Thermoconductive Adhesives
  • 2.3. Manufacturing Processes of Thermally Conductive Adhesives
  • 2.4. Polymer-based Adhesives are Highly Desirable due to its Ability to Cater to Both Rigid and Flexible Applications
  • 2.5. Silver Metal-based Fillers are the most Desirable Filler Material for Heat Sinks
  • 2.6. Graphene-based Fillers are Gaining Importance
  • 2.7. Ceramic Fillers Targeted for Use in Aerospace Applications
  • 2.8. APAC Region is Involved in Development of Thermally Conductive Adhesives that can Cater to a Broad Spectrum of Applications

3.0. Innovation Ecosystem

  • 3.1. R&D Activity is Predominantly Focused on Enhancing the Heat Transfer Properties
  • 3.2. Global IP filling Trend is Experiencing an Upward Trend due to Significant Number of Patent Filling from Asia-Pacific
  • 3.3. Electronic Circuits Observed to be a Key Application Area for Thermally Conductive Adhesives
  • 3.4. Metal Fillers in Polymer Composites is the Most Widely adopted Method for Manufacturing Thermally Conductive Adhesives
  • 3.5. Academia Active in Basic and Applied Research
  • 3.6. Funding for Thermally Conductive Adhesive Development is Directed Towards End Product Development

4.0. Application Landscape

  • 4.1. Demand from Electronics Sector is the Highest for Thermally Conductive Adhesives
  • 4.2. Electronics Sector Expected to have High Adoption due to the Adhesives' Ability to Help in Miniaturization of Components
  • 4.3. Aerospace and Defense Sector is one of the Earliest Sectors to Adopt Thermally Conductive Adhesives
  • 4.4. Automotive Sector will Experience a High Adoption Rate due to the Surge in the Demand for Hybrid and Electric Vehicles
  • 4.5. Adoption in the Energy Storage Sector to Rise with Growing Focus on High Performance Batteries
  • 4.6. Lighting Sector is Gaining Traction due to Enhanced Efficiency of Thermally Conductive Adhesives
  • 4.7. Healthcare will Experience a Significant Adoption of Thermally Conductive Adhesives due to its Bio-inert Characteristics

5.0. Technology Impact

  • 5.1. Benchmarking Rubrics
  • 5.2. Electronics Sector is Observed to have the Highest Application Potential
  • 5.3. IP Portfolio and Ability to Meet Application Needs Play an Important Role in Adoption

6. Key Contacts

  • 6.1. Key Contacts

7. Appendix

  • Benchmarking Matrix Data- Justification of Ratings
  • Benchmarking Matrix Data- Justification of Ratings (contd.)
  • Legal Disclaimer
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