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市場調查報告書
商品編碼
652577

光子積體電路 (PIC) 的發展

Developments in Photonic Integrated Circuits

出版日期: | 出版商: Frost & Sullivan | 英文 45 Pages | 商品交期: 最快1-2個工作天內

價格
  • 全貌
  • 簡介
  • 目錄
簡介

本報告針對光子積體電路 (PIC) 市場調查、提供技術情況、應用評價、發展、引進影響因素、世界動向創新指標、未來晶體管展望技術、應用藍圖、市場、新興動向相關策略考察。

第1章 摘要整理

第2章 技術情況評價

  • 光子積體電路 (PIC) 技術的重要性
  • PIC區分
  • 高速數據傳送需求與數據中心的進步促進PIC成長
  • PIC製造的進步與節能促進PIC發展
  • 阻礙PIC引進的因素

第3章 材料、製造、與設備發展

  • 光波導概念
  • PIC開發用材料
  • PIC製造、光整合
  • PIC內建設備
  • PIC供應鏈模式

第4章 世界創新指標、應用情況

  • 專利動向分析
  • 專利分析推論:主要充填領域
  • 促進創新的主要專利擁有者
  • PIC資金狀況
  • 通訊、醫療與數據中心影響力巨大部門
  • 電子產業的PIC實行

第5章 促進PIC發展與創新

  • 聲波基礎的光通訊
  • 光子積體電路 (PIC) 的量子點雷射
  • 矽PIC製造技術
  • 使用氮化矽的光學相位陣列開發
  • 高速數據移動的光收發器
  • 量子光子電路
  • 使用光梳來源系統的光通信
  • 使用玻璃系3D PIC平台光的光互連開發

第6章 未來成長機會、策略展望

第7章 產業契約

目錄
Product Code: D81B

Telecom, Healthcare, and Datacentres Drive Opportunities for PICs

Photonic integrated circuit (PIC) is an optical chip which accommodates multiple photonic functions and is being developed as an alternative for electronic integrated circuits. Their capability to transmit data in optical medium unlike electronic ICs make them effective medium for communication in telecom and datacentre sectors. In case of sensors, light is an effective medium for material detection. PICs can be leveraged for sensing applications as well. Research and development toward improving the performance parameters of PICs and to determine new materials apart III-V materials is an on-going process. PICs are being developed in order to support the rapid advancements in technology such as wireless charging and energy conversion.

This technology and innovation research report offers insights on recent innovations in PIC technology. The research report focuses mainly on the innovations in the value chain of PICs, i.e., developments pertaining to materials, fabrication and integration of PICs. This research report also offers insights on applications that might evolve in the next 5 to 6 years.

The report captures the following modules:

  • Technology landscape
  • Applications assessment
  • Factors influencing development and adoption-Key drivers and challenges
  • Global trends and innovation indicators
  • Breadth of applications impacted
  • Technology and application roadmaps showing the future prospect of transistors
  • Strategic insights about market and emerging trends

Table of Contents

1.0. EXECUTIVE SUMMARY

  • 1.1. Research Scope
  • 1.2. Research Methodology
  • 1.2. Research Methodology (continued)
  • 1.3. High Speed Data Transmission and Manufacturing Innovations are Key to Developments in PICs
  • 1.4. Telecom and Datacentres are Major Beneficiaries of PICs

2.0. TECHNOLOGY LANDSCAPE ASSESSMENT

  • 2.1. Technological Significance of Photonic Integrated Circuits
  • 2.2. Segmentation of PICs
  • 2.3. Demand for High Speed Data Transmission and Advancements in Datacentres Enable Growth of PICs
  • 2.4. Advancements in PIC Manufacturing and Energy Savings Propel the Development of PICs
  • 2.5. Challenges Hindering the Adoption of PICs

3.0. DEVELOPMENTS IN MATERIALS, FABRICATION, AND DEVICES

  • 3.1. Concept of Optical Waveguides
  • 3.2. Materials Used in Development of PICs
  • 3.3. Fabrication and Photonic Integration of PICs
  • 3.4. Devices Incorporating PICs
  • 3.5. Supply Chain Model for PICs

4.0. GLOBAL INNOVATION INDICATOR AND APPLICATION LANDSCAPE

  • 4.1. Patent Trend Analysis
  • 4.2. Inference from Patent Analysis: Key Focus Areas
  • 4.3. Key Patent Holders Driving Innovation
  • 4.4. Funding Scenarios in PICs
  • 4.5. Telecom, Healthcare, and Datacenters are High Impact Sectors
  • 4.6. Implementation of PICs in the Electronics Industry

5.0. INNOVATIONS DRIVING THE DEVELOPMENTS IN PICS

  • 5.1. Optical Communication based on Sound Waves
  • 5.2. Quantum Dot Lasers for Photonic Integrated Circuits (PICs)
  • 5.3. Silicon- based PICs Fabrication Technology
  • 5.4. Optical Phased Arrays Developed using Silicon Nitride
  • 5.5. Optical Transceivers for High-speed Data Movement
  • 5.6. Quantum Photonic Circuits
  • 5.7. Optical Communication Using Optical Comb Source System
  • 5.8. Optical Interconnects Developed using Glass-based 3D PIC Platform

6.0. FUTURE GROWTH OPPORTUNITIES AND STRATEGIC PERSPECTIVES

  • 6.1. The Road Ahead - 2022 Forecast
  • 6.2. From the Analyst's Desk: What is the Nature of Competition and Global Adoption Scenario for PICs?
  • 6.3. From the Analyst's Desk: What are the Key Attractive Applications and Future Opportunities for PICs?

7.0. INDUSTRY CONTACTS

  • 7.1. Key Contacts
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